MPC860DTVR50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
N.º de pieza: MPC860DTVR50D4 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $99.1 | $99,10 |
| 10 | $89.5 | $895,00 |
| 100 | $78.2 | $7.820,00 |
| 500 | $68.4 | $34.200,00 |
| 1.000 | $59.8 | $59.800,00 |
MPC860DTVR50D4 Descripción general
A microprocessor (MPU) is an integrated circuit that contains the central processing unit, instruction decoding, register files, and cache/memory management logic for a complete computing engine, typically integrated with peripherals onto a single die. Within the broader taxonomy, the MPC860 belongs to the communications-processor class: microprocessors -> embedded microprocessors -> Power Architecture processors -> communications microprocessors (PowerQUICC). PowerQUICC devices historically bridged the gap between simple MCUs and full application processors by combining a general-purpose CPU with a dedicated RISC-based communications engine.
Key features of the MPC860DTVR50D4 include a 32-bit PowerPC core at 50 MHz, integrated CPM with multi-channel serial support, 4 DMA channels, system integration unit, memory controller for DRAM/SRAM/ROM, 3.3V I/O supply, and a 357-pin PBGA package. The PowerQUICC architecture supports up to 10/100 Ethernet MACs, Fast HDLC, ATM, and transparent transmission. The integrated peripheral set replaces many external logic chips, reducing BOM cost and PCB complexity in routers, bridges, and telecom line cards.
Architecturally, the MPC860 uses a 0.32 um CMOS process with separate instruction and data buses to the on-chip caches, while the CPM runs its own RISC microengine for protocol handling. This dual-engine approach allows line-rate packet processing without overloading the main CPU. The device supports both single- and dual-bus configurations, with a 32-bit external system bus interface for SDRAM, Flash, and peripheral I/O.
Typical applications include industrial networking routers, telecom line cards, ISDN terminal adapters, industrial serial bridging, and legacy communication gateways. Design considerations include careful power-supply decoupling, thermal management for the PBGA package, and adherence to NXP layout guidelines for high-speed bus termination. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that complement the manufacturer datasheet.
Alternativas directas para MPC860DTVR50D4 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC860DTVR50D4 (mismo factor de forma y huella) — difiere en Core Architecture, Package, RoHS Status, Communications Processor Module (CPM), Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC860TVR50D4
✅ Sustitución directa✓ En stock
$58 / unidad
Ver hoja de datos →MPC860ENVR50D4R2
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860ENCVR50D4
✅ Sustitución directa✓ En stock
$52.4 / unidad
Ver hoja de datos →MPC860SRCVR50D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860ENZQ50D4R2
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860DTVR50D4 Valores máximos y características eléctricas
| Processor Type | MPC8xx PowerQUICC |
| Core Architecture | 32-bit PowerPC |
| Number of Cores | 1 |
| Speed | 50 MHz |
| Tensión de alimentación | 3.3 V |
| Encapsulado / Carcasa | 357-PBGA (25 x 25 mm) |
| Tipo de montaje | Surface Mount |
| Packaging | Tray |
| Estado RoHS | RoHS Compliant |
| Lead Free Status | Lead Free |
| Process Technology | 0.32 um CMOS |
| Communications Processor Module (CPM) | Integrated (RISC-based) |
| DMA Channels | 4 |
| Temperatura de funcionamiento | 0C to +95C |
| External Memory Bus | 32-bit (single/dual bus) |
Configuración de pines de MPC860DTVR50D4
| Pin A1 | VDD — 3.3V core supply |
| Pin B12 | GND — Ground reference |
| Pin C5 | MDH[0] — Memory Data High bus |
| Pin D20 | MDL[31] — Memory Data Low bus |
| Pin F15 | A[0] — External address bus bit 0 |
| Pin K20 | TS — Transfer Start signal |
| Pin M5 | BR — Bus Request |
| Pin P15 | BG — Bus Grant |
| Pin R3 | PORESET — Power-on reset input |
| Pin T18 | HRESET — Hard reset input |
| Pin U10 | IRQ[0] — Interrupt request line 0 |
| Pin W5 | TCLK — Test clock (factory use) |
| Pin AA20 | TRST — JTAG test reset |
| Pin AB12 | TMS — JTAG test mode select |
| Pin AC7 | TDI — JTAG test data input |
| Pin AD2 | TDO — JTAG test data output |
| Pin AE15 | TCK — JTAG test clock |
| Pin AF22 | RXD1 — SCC1 receive data (CPM) |
| Pin AG18 | TXD1 — SCC1 transmit data (CPM) |
| Pin AH25 | PA[0] — Parallel I/O port A bit 0 |
Aplicaciones típicas
MPC860DTVR50D4 es adecuado para 6 aplicacións: Industrial Networking Router, Telecom Line Card Controller, ISDN Terminal Adapter, Industrial Serial Bridge, Legacy Communication Gateway, T1/E1 Multiplexer.
Industrial Networking Router
The MPC860DTVR50D4 fits industrial router designs thanks to its integrated CPM offload for HDLC, Ethernet, and serial protocols at 50 MHz. The 32-bit PowerPC core handles routing table lookups and management plane traffic, while the CPM handles line-rate packet processing on multiple SCC/SMC channels. The 357-PBGA package supports the dense 32-bit external memory bus needed for high-throughput router designs. Unlike discrete CPU-plus-MAC designs, the integrated CPM eliminates the need for an external communication controller, reducing BOM cost. The part's 0C to 95C operating range supports industrial cabinet deployment.
Recomendado
Telecom Line Card Controller
The MPC860DTVR50D4's PowerQUICC architecture was purpose-built for telecom line cards where T1/E1 framing, HDLC, and ATM segmentation need hardware offload. The 50 MHz CPU plus dedicated CPM microengine maintains line-rate processing for multi-channel DS0 aggregation. The integrated DRAM controller and 32-bit memory bus directly interface to the line card's shared memory without glue logic. Engineers should note the 3.3V-only I/O simplifies the line card power tree compared to mixed-voltage legacy designs. The PBGA package supports the dense PCB layouts typical of telecom backplane line cards.
Recomendado
ISDN Terminal Adapter
The MPC860DTVR50D4 handles ISDN terminal adapter duties by using the CPM's HDLC controllers for D-channel signaling and the SCC channels for B-channel data. The 50 MHz PowerPC core runs the upper-layer protocol stack and management interface, while the CPM microengine manages the lower-layer framing. The part's small footprint in the 357-PBGA package allows compact ISDN terminal designs. The integrated peripheral set removes the need for an external protocol controller IC. As an EOL part, designers should verify stock with authorized distributors before committing to a new ISDN adapter design.
Recomendado
Industrial Serial Bridge
The MPC860DTVR50D4 is well suited to industrial serial bridging applications where multiple UART, SPI, or HDLC channels need to be aggregated onto an Ethernet or higher-speed backhaul link. The CPM's multiple SCC/SMC channels can run concurrently, offloading protocol conversion from the main CPU. The 50 MHz core easily handles Modbus TCP/RTU conversion or EtherNet/IP bridging. The 357-PBGA package and industrial temperature range support deployment in factory floor cabinets. Designers often pair the MPC860 with an external PHY for the Ethernet uplink.
Recomendado
Legacy Communication Gateway
The MPC860DTVR50D4 acts as the control plane processor in legacy communication gateways that aggregate serial links onto IP networks. The CPM's multi-channel protocol offload frees the 50 MHz PowerPC core for routing, security, and management functions. The integrated 32-bit memory controller interfaces directly to SDRAM and Flash, eliminating external glue logic. The 357-PBGA package's high pin count supports parallel bus designs for legacy peripheral attachment. The part's EOL status means gateway manufacturers should plan a migration path to the MPC8xx successors or to ARM-based communications processors.
Recomendado
T1/E1 Multiplexer
The MPC860DTVR50D4 handles T1/E1 multiplexing duties using the CPM's HDLC controllers and bit-clock recovery for multiple E1/T1 links. The 50 MHz PowerPC core manages the higher-layer multiplexing and channel aggregation logic. The part's on-chip DMA controllers move data between the T1/E1 framer and system memory without CPU intervention. The 3.3V supply rail matches modern framer IC requirements, simplifying power design. The 357-PBGA package's thermal performance supports continuous full-load operation in the multiplexer chassis.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC860DTVR50D4 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC860TVR50D4 | MPC860ENVR50D4R2 | MPC860ENCVR50D4 | MPC860SRCVR50D4 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Core Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Architecture | 32-bit PowerPC | 32-bit PowerPC | 32-bit PowerPC | 32-bit PowerPC | 32-bit PowerPC |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Ethernet Emphasis | Standard CPM | Standard CPM | Enhanced (EN) | Enhanced (EN) | Reduced (SR) |
| Operating Temperature | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
Diferenciadores clave
- Integrated Communications Processor Module (frente a MPC860TVR50D4)
- Wide software and tool ecosystem (frente a MPC860ENVR50D4R2)
- 357-PBGA package compatibility across MPC8xx family (frente a MPC860SRCVR50D4)
Notas de diseño
The MPC860DTVR50D4 requires a clean 3.3V supply rail with bulk decoupling of at least 22uF tantalum plus 0.1uF ceramic per supply pin cluster. Place the decoupling capacitors as close to the PBGA balls as possible to minimize parasitic inductance. The internal core voltage is generated on-chip, but the 3.3V rail noise directly impacts the external memory bus timing margins. Use a low-noise LDO or switching regulator with output ripple under 50 mVpp for the analog portion of the design.
The 357-PBGA package dissipates heat primarily through the solder balls and internal thermal vias to inner PCB copper planes. At full load with all CPM channels active and the 50 MHz core at 100% utilization, the device can draw up to 1W. Place a continuous ground plane directly under the PBGA with at least 4 thermal vias per ball cluster to provide adequate heat spreading. Avoid placing high-power components within 25 mm of the BGA to prevent thermal hot spots.
Follow NXP AN-2730 layout guidelines for high-density BGA breakout. Use microvia or via-in-pad technology to escape the 1.27 mm pitch BGA balls to inner signal layers. Keep the external memory bus length-matched within 25 mil across all byte lanes to preserve bus timing. Series termination resistors on the address and data bus may be required for impedance matching, particularly when using 50 ohm controlled-impedance traces. The JTAG signals (TCK, TMS, TDI, TDO, TRST) must be brought out to a test header for boundary-scan access.
Do not skip the PORESET and HRESET capacitor network - the part requires a minimum 10 ms reset pulse for proper PLL lock. The 32 kHz reference clock must be stable before the system clock is applied, or the part will fail to initialize. Ensure the CPM firmware is loaded into memory before the CPM microengine starts processing - the BDs (Buffer Descriptors) must be initialized in valid RAM regions, not Flash. Watch for bus contention during reset when external bus masters may try to access memory before the MPC860 has configured its memory controller.
The external memory bus can operate at 50 MHz with SDRAM, but signal integrity demands controlled impedance routing. Use 8 mil or wider traces with 50 ohm single-ended impedance to the SDRAM. Place SDRAM chips within 50 mm of the BGA to minimize propagation delay. Add source termination in series with each data lane for SDRAM loads exceeding two devices per byte lane. The bus grant/acknowledge handshake signals (BR, BG, BD, BB) must be pulled up externally to prevent spurious bus requests during power-up sequencing.
Información de cumplimiento
RoHS compliant and lead-free per distributor listings at DigiKey and Mouser. AEC-Q100 not applicable as the part targets industrial communications, not automotive. REACH compliance declared by NXP. Halogen-free status not explicitly stated in the provided data.
