NXP Semiconductors

MPC885CVR66-FR - 66MHz PowerQUICC MPU, 357-PBGA | NXP

N.º de pieza: MPC885CVR66-FR ✓ Activo
En stock Se envía en 1-3 días hábiles
3.3 V Vdss 357-PBGA (25 x 25 mm) Package 66 MHz Speed SDRAM, SRAM, EPROM, Flash support Memory
Desde $12.1 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-15
Precios por volumen
Cant. Precio unitario Total
1 $18.5 $18,50
10 $16.85 $168,50
100 $14.95 $1.495,00
250 $13.4 $3.350,00
500 $12.1 $6.050,00
ℹ️ Todos los precios están en USD

MPC885CVR66-FR Descripción general

The NXP MPC885CVR66-FR is a PowerQUICC communications processor built on Power Architecture technology, integrating an MPC8xx 32-bit core running at 66 MHz (delivering 87 MIPS per the manufacturer data) into a 357-ball PBGA (25x25 mm) package. It supports a 3.3 V supply domain with an internal core voltage of 1.9 V, and is qualified for an extended -40 C to +100 C operating range targeting industrial and communications infrastructure.

Background: A PowerQUICC (PowerPC QUICC) MPU is an embedded microprocessor that combines a Power Architecture CPU core with on-chip peripherals originally designed for networking, telecom, and industrial control. The MPC8xx family pioneered the integration of a communications processor module (CPM) with a general-purpose core, enabling a single chip to handle both protocol processing and control-plane tasks. The MPC885 sits within the broader taxonomy: microprocessor -> embedded MPU -> PowerQUICC family -> communications processor -> Power Architecture device -> semiconductor.

Key differentiating features of the MPC885CVR66-FR include the integrated CPM supporting multiple serial channels (FCCs, SCCs, SMC, SPI, I2C), a 32-bit RISC communications engine, dual 10/100 Ethernet MAC support via the FCCs, a 32-channel DMA controller, and memory control for SDRAM, SRAM, EPROM, and flash. The integrated peripherals eliminate external protocol bridges and reduce BOM cost in router, switch, and access-multiplexer designs.

From an architectural perspective, the MPC885CVR66-FR uses a 0.18 micrometer process and separates the 3.3 V I/O supply from the 1.9 V core supply, allowing low core power dissipation while maintaining 5 V-tolerant I/O on selected interfaces. The CPM offloads serial DMA, HDLC/PPP framing, and ATM SAR work from the core, freeing CPU cycles for routing and management-plane software.

Typical applications include WAN access routers, ISDN terminal adapters, xDSL modems and CPE, industrial serial-to-Ethernet gateways, and legacy telecom control boards. The combination of 87 MIPS core performance and integrated communications controllers makes it suitable for low-to-mid throughput edge devices where a single-chip solution lowers cost and board area.

When designing with this part, ensure the 1.9 V core regulator is sequenced correctly relative to the 3.3 V I/O rail, observe the 357-ball PBGA ballout for power/ground ball distribution to maintain signal integrity, and verify that the CPM firmware matches the silicon revision. Refer to the manufacturer hardware specifications for the exact thermal design current per supply domain.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that extend beyond the manufacturer datasheet.

Alternativas directas para MPC885CVR66-FR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con MPC885CVR66-FR (mismo factor de forma y huella) — difiere en Operating Temperature, Manufacturer, Core Architecture, Memory Controller, Package.

NXP Semiconductors
Operating Temperature: -40C to +100C
Manufacturer: NXP Semiconductors
Core Architecture: Power Architecture, 32-bit
Comparar con MPC885CVR66-FR →
NXP Semiconductors
Operating Temperature: 0 C to +95 C (commercial)
Core Architecture: Power Architecture
Memory Controller: SDRAM, DRAM, SRAM, Flash, ROM
Comparar con MPC885CVR66-FR →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

MPC885CVR66

✅ Sustitución directa
📦 357-PBGA (25x25)
no -FR tape/reel suffix; identical 357-PBGA footprint, same 66 MHz core, same silicon

📋 Alternativa de referencia (no en el catálogo)

MPC885CZP66

✅ Sustitución directa
NXP Semiconductors
📦 357-PBGA (25x25)
NXP Semiconductors · PowerQUICC, MPC8xx · Power Architecture, 32-bit · 1 · 32 bit · 66 MHz · 0.18 micrometer CMOS · 3.3 V (typical)

✓ En stock

$18.4 / unidad

Ver hoja de datos →

MPC880CVR66

✅ Sustitución directa
📦 357-PBGA (25x25)
same 357-PBGA, 66 MHz; MPC880 omits dual Ethernet MACs vs MPC885 - check CPM pinout masks for Ethernet use

📋 Alternativa de referencia (no en el catálogo)

MPC885ZP66

✅ Sustitución directa
NXP Semiconductors
📦 357-PBGA (25x25)
NXP Semiconductors (formerly Freescale Semiconductor) · Microprocessors (MPU) · PowerQUICC MPC8xx · Power Architecture · 1 · 32 bit · 66 MHz · 4 KB

✓ En stock

$18.3 / unidad

Ver hoja de datos →

MPC885CVR50

✅ Sustitución directa
📦 357-PBGA (25x25)
same 357-PBGA footprint; 50 MHz vs 66 MHz core (-24% clock, -24% MIPS) - firmware-safe drop-in if throughput budget allows

📋 Alternativa de referencia (no en el catálogo)

MPC885CVR66-FR Valores máximos y características eléctricas

Manufacturer NXP Semiconductors (formerly Freescale Semiconductor)
Processor Type MPC8xx PowerQUICC, 32-bit Power Architecture
Core Count 1
Core Speed 66 MHz
Core Performance 87 MIPS
Process Technology 0.18 micrometer
Supply Voltage (I/O) 3.3 V
Supply Voltage (Core) 1.9 V
Temperatura de funcionamiento -40 C to +100 C
Encapsulado 357-PBGA (25 x 25 mm)
Tipo de montaje Surface Mount
Lead Free Status Lead Free
Estado RoHS RoHS Compliant
Packaging Tray
Communications Processor Module (CPM) Integrated, with RISC engine
Ethernet MAC Dual 10/100 Mbps via FCCs
Memory Controller SDRAM, SRAM, EPROM, Flash support
DMA Controller 32-channel

Configuración de pines de MPC885CVR66-FR

BGA-324 Package Pinout Diagram BGA-324 19x19mm, 18x18, P0.8mm, JEDEC MO-192. A1 BGA-324 18x18 grid
Pin A1 [DATA_NEEDED] — Per-die ball assignment documented in NXP/Freescale hardware specifications manual
Pin A2 [DATA_NEEDED] — Per-die ball assignment documented in NXP/Freescale hardware specifications manual
Pin B1 [DATA_NEEDED] — Per-die ball assignment documented in NXP/Freescale hardware specifications manual
Pin B2 [DATA_NEEDED] — Per-die ball assignment documented in NXP/Freescale hardware specifications manual

Aplicaciones típicas

MPC885CVR66-FR es adecuado para 6 aplicacións: WAN Access Router, ISDN Terminal Adapter / xDSL CPE, Industrial Serial-to-Ethernet Gateway, Legacy Telecom Control Board, Embedded Linux Router / Firewall Appliance, Point-of-Sale Terminal Controller.

🌐

WAN Access Router

The MPC885CVR66-FR's integrated dual 10/100 Ethernet MACs via the FCCs and its 87 MIPS Power Architecture core make it a fit for low-to-mid throughput WAN access routers. The CPM offloads PPP, HDLC, and Ethernet framing from the core, freeing cycles for routing-table lookups and management protocols. In a typical design the MPC885 sits between an external PHY on the LAN side and an xDSL or ISDN transceiver on the WAN side, while the 32-bit memory bus drives 32 to 64 MB of SDRAM and 4 to 16 MB of flash. The 66 MHz clock is sufficient for T1/E1-rate and basic ADSL2+ forwarding, though VDSL2 line rates require the faster MPC866/MPC8272 family.

🏭

ISDN Terminal Adapter / xDSL CPE

The MPC885CVR66-FR is a long-standing platform for ISDN terminal adapters and xDSL CPE where the integrated CPM handles HDLC, V.110, and PPP framing without an external bridge. Its 3.3 V I/O and 1.9 V core supplies simplify the bill of materials when paired with an integrated line driver. The 87 MIPS core comfortably runs PPPoE, IP routing, and a small web management stack at ADSL2+ rates. The 357-PBGA offers the ground-ball density needed for the multiple serial interfaces typical in this application class, and the industrial temperature grade suits outdoor DSLAM-side deployments.

🏭

Industrial Serial-to-Ethernet Gateway

Industrial serial-to-Ethernet gateways leverage the MPC885CVR66-FR's rich serial channel set (FCCs, SCCs, SMC, SPI, I2C) to bridge RS-232, RS-485, and Modbus devices onto a 10/100 Ethernet network. The -40 C to +100 C operating range supports factory-floor enclosures, and the 357-PBGA's thermal mass handles continuous CPM activity. Designers typically pair the MPC885 with a supervisory reset IC and 32 MB of SDRAM, then load embedded Linux or a small RTOS with a TCP-to-serial daemon. The integrated DMA controller moves serial data with minimal CPU overhead, which keeps the latency budget tight for Modbus polling.

🌐

Legacy Telecom Control Board

Telecom control boards for switching systems, cross-connects, and access multiplexers use the MPC885CVR66-FR as a low-cost control-plane processor. The CPM's TDM support and HDLC controllers connect directly to framer devices, while the core runs the management software. The dual 3.3 V / 1.9 V supply scheme matches legacy telecom power rails, simplifying integration into existing -48 VDC systems. Compared with newer PowerQUICC III devices, the MPC885 draws less power and costs less, which matters for densely populated control shelves. The 357-PBGA footprint remains footprint-compatible with the broader MPC8xx family for board reuse.

🖥️

Embedded Linux Router / Firewall Appliance

The MPC885CVR66-FR runs embedded Linux distributions with available BSPs and is therefore a viable platform for small-office router/firewall appliances. The 87 MIPS core is adequate for stateful packet filtering and NAT at sub-100 Mbps throughput; designs that need gigabit throughput must move to MPC8272 or Layerscape devices. The 357-PBGA package and the 32-bit SDRAM controller support the standard Linux memory map and flash file systems (JFFS2, UBI), while the dual Ethernet MACs allow WAN/LAN segmentation. The integrated DMA and CPM reduce driver complexity in the Linux kernel tree.

💰

Point-of-Sale Terminal Controller

POS terminals with mixed serial peripherals (cash drawer, receipt printer, magnetic-stripe reader, keypad) benefit from the MPC885CVR66-FR's multiple SCC/SMC channels and integrated Ethernet. The -40 C to +100 C range covers retail back-room and kiosk environments, and the 357-PBGA provides enough ground balls for clean EMC on the Ethernet PHY side. A typical design pairs the MPC885 with 32 MB SDRAM, 8 MB NOR flash, a small TFT controller, and a 10/100 Ethernet PHY for backend reporting. The CPM's DMA keeps printer and reader latency predictable under load.

Resumen de productos recomendados

MPC866PC Higher-throughput successor for VDSL2 line-rate forwarding Se usa en: WAN Access Router KSZ8041 Single-port 10/100 Ethernet PHY companion Se usa en: WAN Access Router MT48LC16M16A2 32 MB SDRAM for routing-table working memory Se usa en: WAN Access Router MPC852T Lower-cost sibling for cost-sensitive CPE designs Se usa en: ISDN Terminal Adapter / xDSL CPE AM29LV320 Boot flash for firmware and configuration storage Se usa en: ISDN Terminal Adapter / xDSL CPE MAX3232 RS-232 level translator for SCC channels Se usa en: Industrial Serial-to-Ethernet Gateway MAX3485 RS-485 transceiver for industrial bus Se usa en: Industrial Serial-to-Ethernet Gateway DS21354 T1/E1 framer paired with CPM serial channels Se usa en: Legacy Telecom Control Board TPS76701 1.9 V core buck regulator with power-good sequencing Se usa en: Legacy Telecom Control Board MPC8272 Higher-MIPS upgrade path for gigabit routing Se usa en: Embedded Linux Router / Firewall Appliance M29W320 NOR boot flash for Linux uImage and U-Boot Se usa en: Embedded Linux Router / Firewall Appliance KSZ8721 10/100 Ethernet PHY for backend reporting link Se usa en: Point-of-Sale Terminal Controller AT24C256 I2C EEPROM for transaction log persistence Se usa en: Point-of-Sale Terminal Controller
What is the core clock speed and performance of the MPC885CVR66-FR?
The MPC885CVR66-FR runs the MPC8xx core at 66 MHz, delivering 87 MIPS of integer performance per the NXP/Mouser listing. This places the part within the lower-frequency PowerQUICC tier intended for cost-sensitive networking and industrial control, not for high-throughput packet forwarding at line rate.
What is the supply voltage requirement for MPC885CVR66-FR?
The MPC885CVR66-FR requires a 3.3 V I/O supply and a separate 1.9 V core supply generated by an onboard regulator. The dual-rail design is verified by the Freescale/NXP datasheet and must be sequenced correctly to avoid latch-up; the 1.9 V rail must not exceed the 3.3 V rail during power-up.
What package does MPC885CVR66-FR use?
The MPC885CVR66-FR is supplied in a 357-ball Plastic BGA (PBGA) measuring 25 mm x 25 mm, with a 1.27 mm ball pitch typical of the family. The PBGA offers the thermal mass and ground-ball distribution needed for the integrated CPM at industrial temperature grades.
What is the operating temperature range of MPC885CVR66-FR?
Per the verified Freescale/NXP specifications, the MPC885CVR66-FR operates from -40 C to +100 C junction temperature. This industrial-grade range suits outdoor telecom cabinets, factory-floor controllers, and vehicle-mounted equipment.
Where can I download the MPC885CVR66-FR datasheet?
The official NXP/Freescale hardware specifications document for the MPC885 family is available as a PDF on Alldatasheet (alldatasheet.com datasheet 188090) and through authorized distributors. The file is approximately 1 MB and 92 pages per the Alldatasheet listing and covers power, DC/AC electricals, and AC timing.
What is the pinout of the MPC885CVR66-FR 357-PBGA?
The 357-PBGA pin assignment is documented in the Freescale/NXP MPC885 hardware specifications manual. The package groups power and ground balls across the array for low-inductance delivery, with dedicated balls for the 3.3 V and 1.9 V rails and a thermal pad array beneath the die. [DATA_NEEDED: full pin-by-pin map]
How much does the MPC885CVR66-FR cost?
As of 2026-10-16, distributor unit pricing for the MPC885CVR66-FR is approximately USD 18.50 at qty 1, dropping to USD 12.10 at qty 500 per tier schedule. Authorized distributors and brokers such as Heisener and Rochester Electronics stock or quote the part; lead time varies by trace.
Is the MPC885CVR66-FR in stock and what is the lead time?
Stock for the MPC885CVR66-FR fluctuates because the part is mature; Heisener lists the part as 'To be Confirmed' with an estimated delivery of Jun 18 to Jun 23 in their last quote. Rochester Electronics and ampheo also list it. Request a current quote from authorized channels for the most accurate availability.
What is the best drop-in replacement for the MPC885CVR66-FR?
The closest drop-in equivalents are other NXP MPC885CVR66 speed/package grades such as the MPC885CVR66 (no -FR suffix) and the MPC880CVR66 family, which share the same 357-PBGA footprint. Cross-check silicon revision against your firmware image before substituting, since some revisions differ in CPM feature masks.
MPC885CVR66-FR vs MPC880CVR66 - which should I use?
The MPC885 adds the dual 10/100 Ethernet MAC capability and additional FCC channels over the MPC880, while both share the 357-PBGA and 66 MHz core. Choose the MPC880CVR66 if your design only needs basic serial connectivity, and the MPC885CVR66-FR if you need integrated Ethernet MACs without an external PHY controller.
Can the MPC885CVR66-FR be used in new designs in 2026?
Yes, the MPC885CVR66-FR remains orderable through authorized distributors and authorized aftermarket channels such as Rochester Electronics. For new high-volume designs, however, evaluate NXP's current PowerQUICC and Layerscape families first, as the MPC8xx line is mature and long-term support is limited to legacy industrial and telecom niches.
What companion chips pair with the MPC885CVR66-FR?
Typical companions are NXP 32-Mbit to 128-Mbit SDRAM devices, SPI flash, an Ethernet PHY (such as an NXP/Freescale KSZ8xxx), and a 1.9 V core buck regulator. A real-time clock and a supervisory reset IC complete the reference platform. Choose SDRAM that matches the MPC8xx bus width (32-bit) and timing.
Does the MPC885CVR66-FR support Linux or any RTOS?
Yes, the MPC885CVR66-FR runs embedded Linux (with a BSP), VxWorks, Green Hills INTEGRITY, and several smaller RTOSes targeted at PowerQUICC. The integrated CPM and dual Ethernet MACs make it a common platform for low-MIPS router firmware and serial-protocol gateways.
What is the RoHS and lead-free status of MPC885CVR66-FR?
Per DigiKey/Freescale-NXP product listings, the MPC885CVR66-FR is RoHS compliant and lead-free. The PBGA finish is matte tin over a copper substrate suitable for standard lead-free reflow profiles up to 245 C peak per JEDEC J-STD-020.
Is there an AEC-Q100 automotive variant of MPC885CVR66-FR?
No, the MPC885CVR66-FR is not AEC-Q100 qualified. Its industrial-grade -40 C to +100 C operating range is suitable for non-automotive harsh environments. For AEC-Q100 networking needs, evaluate NXP's automotive-grade MPC5xxx or S32K families as a modern alternative.

Datos de referencia de ingeniería para MPC885CVR66-FR — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the MPC885CVR66-FR when your design needs an industrial-temperature PowerQUICC with integrated dual 10/100 Ethernet MACs and you are comfortable with the mature 0.18 micrometer 3.3 V/1.9 V platform. Choose the MPC885CVR66 (no -FR suffix) if you are okay with tray-versus-tape-and-reel logistics on the same die. Choose the MPC880CVR66 if you do not need the dual Ethernet MACs and want to save power. Choose the MPC885ZP66 for commercial-temperature products only. Choose the MPC885CVR50 if your firmware can tolerate 50 MHz and you need lower core power. All five options share the same 357-PBGA footprint, so PCB layout reuse is straightforward - just verify silicon revision and CPM feature masks against your firmware image before substitution.

Comparación con alternativas

Parámetro Este producto MPC885CVR66 MPC885CZP66 MPC880CVR66 MPC885ZP66 MPC885CVR50
Brand NXP Semiconductors (formerly Freescale) NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 357-PBGA (25x25 mm) 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same
Core Speed 66 MHz 66 MHz 66 MHz 66 MHz 66 MHz 50 MHz
Core Performance 87 MIPS 87 MIPS 87 MIPS 87 MIPS 87 MIPS ~66 MIPS
Operating Temperature -40 C to +100 C (industrial) -40 C to +100 C -40 C to +100 C -40 C to +100 C -40 C to +85 C (commercial) -40 C to +100 C
Dual 10/100 Ethernet MAC Yes Yes Yes No (MPC880 omits dual Ethernet) Yes Yes
Supply Voltage (I/O) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Supply Voltage (Core) 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
RoHS Compliance Compliant Compliant Compliant Compliant Compliant Compliant

Diferenciadores clave

  • Integrated dual 10/100 Ethernet MAC over the MPC880 family (frente a MPC880CVR66)
  • Industrial temperature range with same 357-PBGA footprint as commercial variants (frente a MPC885ZP66)
  • Higher 87 MIPS throughput than the 50 MHz MPC885 grade (frente a MPC885CVR50)

Notas de diseño

The MPC885CVR66-FR requires two supplies: 3.3 V for I/O and 1.9 V for the core. Sequence the 1.9 V rail before or simultaneously with the 3.3 V rail; never allow the 3.3 V rail to come up while the 1.9 V core rail is off. A small buck regulator such as the TPS76701 with power-good output tied to a voltage supervisor prevents latch-up and brown-out issues. Decouple each supply domain with 100 nF X7R caps placed within 5 mm of every power/ground ball pair, plus a 10 uF bulk cap per rail.

Estimated: at 66 MHz full activity on the CPM and core, typical core current is on the order of 150 mA at 1.9 V plus CPM I/O current at 3.3 V. Total dissipation is roughly 0.5 to 0.8 W in worst-case CPM-heavy workloads. The 357-PBGA exposes a thermal pad array; stitch thermal vias to inner ground planes on the PCB to keep junction temperature below the +100 C limit in sealed enclosures. Use a 4-layer board with a 1 oz copper inner plane as a baseline.

Do not substitute the MPC880 family in place of the MPC885 if your firmware relies on the dual 10/100 Ethernet MACs - the MPC880 omits these MACs and uses different CPM masks. Also verify silicon revision against your BSP/RTOS image; some revisions disable specific FCC or SCC channels. When laying out the 357-PBGA, keep at least 8 ground balls in a checker pattern under the die to control ground bounce on the parallel memory bus, and use matched-length traces for the SDRAM clock, clock-enable, and data strobes.

Información de cumplimiento

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Qualified
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Unknown

RoHS compliant and lead-free per DigiKey/Freescale-NXP product listings. Not AEC-Q100 qualified - for automotive applications use NXP's MPC5xxx or S32K families. REACH, halogen-free, and conflict-minerals status not stated in the verified data.

Datos verificados el: 2026-10-16 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

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Componentes & términos relacionados

NXP Semiconductors Freescale Semiconductor MPC885CVR66-FR MPC885CVR66 MPC885CZP66 MPC880CVR66 MPC885ZP66 MPC885CVR50 PowerQUICC MPC8xx Power Architecture MPU microprocessor embedded MPU communications processor module (CPM) 357-PBGA BGA PBGA RoHS JEDEC J-STD-020 SDRAM Ethernet MAC FCC SCC SMC SPI I2C HDLC PPP industrial temperature range AEC-Q100 PowerPC DSP V.110 T1/E1 framer xDSL ISDN POS terminal Modbus RS-485 RS-232 Linux BSP VxWorks RTOS PowerQUICC III MPC8272 MPC866 MPC852 S32K Layerscape TPS76701 KSZ8041 KSZ8721 DS21354 MAX3232 MAX3485 AM29LV320 M29W320 AT24C256 MT48LC16M16A2
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