MPC860ENZQ50D4R2518 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
N.º de pieza: MPC860ENZQ50D4R2518 ⚠ Última compraMPC860ENZQ50D4R2518 Descripción general
Background: The PowerQUICC (MPC8xx) family is a line of integrated communications microprocessors that combine a PowerPC embedded core with one or more independent RISC communications engines (the CPM). They sit in the taxonomy of embedded microprocessors -> microcontrollers -> PowerPC architecture -> PowerQUICC, and they target telecom and networking equipment where on-chip protocol handling offloads the main CPU.
Key features: 50 MHz core / CPM clock, 4 KDMA channels, four SCCs (Serial Communication Controllers), two SMCs (Serial Management Controllers), one SPI and one I2C port, integrated 10/100 Ethernet MAC (the EN suffix), and a 32-bit data bus to external memory. The PBGA-357 (25x25 mm, 1.27 mm pitch) package provides the dense I/O needed to expose the external memory bus and the communications peripherals simultaneously.
Technical depth: The MPC860ENZQ50D4R2518 separates control-plane processing (PowerPC core) from data-plane communications (CPM) using dual Harvard-architecture engines sharing a common system bus. This makes the device efficient for routing, bridging, and protocol-conversion tasks where deterministic serial handling is required alongside general-purpose code.
Typical applications include telecom line cards, industrial routers, ISDN terminal adapters, H.110 bus bridges, and SCADA protocol converters. Designers select the 50 MHz EN grade when Ethernet connectivity and industrial temperature are mandatory and the application can tolerate the thermal envelope of a 25x25 mm PBGA.
Design consideration: Route the external memory bus with matched impedance and keep trace lengths matched within the MPC860 datasheet's set-up and hold budgets; decouple each power pin with a 100 nF ceramic placed within 3 mm of the ball, and provide a continuous ground pour under the package for thermal dissipation.
This page consolidates distributor pricing, lifecycle status, drop-in package-compatible alternates, and practical design notes that complement the manufacturer datasheet.
Alternativas directas para MPC860ENZQ50D4R2518 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC860ENZQ50D4R2518 (mismo factor de forma y huella) — difiere en Core Architecture, Mounting Type, Package.
MPC860ENZQ50D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860ENZQ66D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860DTZQ50D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860SRCZQ50D4
✅ Sustitución directaConsulte el precio
Ver hoja de datos →MPC860ENZQ80D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860ENZQ50D4R2518 Valores máximos y características eléctricas
| Core Architecture | PowerPC |
| Core Count | 1 |
| Ancho del bus de datos | 32-bit |
| Maximum Core Frequency | 50 MHz |
| Family | MPC8xx (PowerQUICC) |
| Communications Module | CPM with 4 KDMA channels |
| Serial Communication Controllers (SCC) | 4 |
| Serial Management Controllers (SMC) | 2 |
| Ethernet MAC | Integrated 10/100 (EN feature) |
| SPI / I2C | 1 / 1 |
| Encapsulado | 357-PBGA, 25 x 25 mm, 1.27 mm pitch |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Tipo de montaje | Surface Mount (BGA) |
| Customer Code Suffix | R2518 (per part marking) |
Guía de configuración de pines de MPC860ENZQ50D4R2518 357-pbga, 25 x 25 mm, 1.27 mm pitch
Configuración de pines para MPC860ENZQ50D4R2518 (encapsulado 357-pbga, 25 x 25 mm, 1.27 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC860ENZQ50D4R2518.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC860ENZQ50D4R2518 es adecuado para 6 aplicacións: Telecom Line Cards, Industrial Router / Bridge, ISDN Terminal Adapter, H.110 Bus Bridge, SCADA Protocol Converter, Legacy Maintenance / Field Replacement.
Telecom Line Cards
The MPC860ENZQ50D4R2518 fits telecom line cards because its PowerPC core handles control-plane signaling while the CPM's four SCCs run HDLC or transparent protocols on T1/E1 framers without CPU intervention. At 50 MHz the device comfortably processes per-channel signaling for 4 to 8 DS0 channels. Placed on a line-card PCB with a T1 framer and a quad SLIC, it provides a deterministic, low-latency data path. Compared with newer QorIQ devices, it has lower power consumption for legacy 5W slot budgets but lacks modern security acceleration. Recommended companions include the NXP MC145572 framer and an IDT 71V016 SRAM for CPM descriptor storage.
Recomendado
Industrial Router / Bridge
The on-chip 10/100 Ethernet MAC makes the MPC860ENZQ50D4R2518 a natural fit for industrial routers bridging Ethernet to serial fieldbuses. Its CPM offloads PPP, HDLC, and frame-relay handling, freeing the PowerPC core for routing-table updates. At 50 MHz it can sustain wire-rate bridging for 10BASE-T and most 100BASE-TX traffic patterns in SCADA-class networks. Designers typically pair it with a PHY like the LXT972 and a 16-bit Flash/ROM bank for firmware. The wide -40C to +85C industrial range suits outdoor cabinet installations.
Recomendado
ISDN Terminal Adapter
ISDN terminal adapters benefit from the MPC860ENZQ50D4R2518's combination of two SMCs, one SCC, and the integrated Ethernet MAC, which together terminate the BRI U-interface and present an Ethernet or USB port to the host. The CPM's per-channel DMA keeps the BRI B- and D-channel latency bounded regardless of host CPU load. The 50 MHz speed grade is sufficient for NT and TE modes of BRI operation. Pair the MPU with an ISDN transceiver such as the Motorola MC145574 and an EEPROM for configuration storage.
Recomendado
H.110 Bus Bridge
The H.110 CT bus standard carries TDM voice channels between telecom boards; the MPC860ENZQ50D4R2518's CPM can be programmed as an H.110 master or slave, and its four SCCs are enough to bridge 4 to 8 TDM streams between backplanes. Its 50 MHz clock is adequate for H.110's 8 MHz bus plus overhead. Designers place the device on a CompactPCI or VME bridge card with a PEB 20534 H.110 controller companion. Compared with newer DSP-based bridges, the MPC860 solution is more deterministic but draws more power.
Recomendado
SCADA Protocol Converter
SCADA gateways converting between Modbus, DNP3, and IEC 60870-5 use the MPC860ENZQ50D4R2518's serial channels to talk to multiple RTUs simultaneously while presenting Ethernet to the SCADA master. The CPM's per-channel DMA sustains deterministic serial response times at 50 MHz, and the industrial -40C to +85C range supports outdoor or substation environments. Place the MPU between an RS-485 transceiver bank and an Ethernet PHY. Its 32-bit bus is fast enough to handle aggregate polling of 32 to 64 RTUs at 1-second update rates.
Recomendado
Legacy Maintenance / Field Replacement
Because the MPC860ENZQ50D4R2518 is in last-time-buy status, the most common application today is maintaining installed telecom and industrial equipment that cannot be economically redesigned. Drop-in package compatibility with the rest of the MPC860 family at 50 MHz makes it a safe replacement for failed boards in the field. Stock held by Rochester Electronics supports long-tail maintenance for the next 10 to 15 years. Designers should validate firmware compatibility when swapping EN, DT, or SRC variants because peripheral mixes differ even though the pinout is identical.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC860ENZQ50D4R2518 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC860ENZQ50D4 | MPC860ENZQ66D4 | MPC860DTZQ50D4 | MPC860SRCZQ50D4 | MPC860ENZQ80D4 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Core Frequency | 50 MHz | 50 MHz | 66 MHz | 50 MHz | 50 MHz | 80 MHz |
| Ethernet MAC | Yes (EN) | Yes (EN) | Yes (EN) | No (DT dual UART) | No (SRC variant) | Yes (EN) |
| SCC Count | 4 | 4 | 4 | 4 | 4 (SCC-rich emphasis) | 4 |
| Customer Suffix | R2518 | None | None | None | None | None |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Lifecycle Status | Last time buy | Last time buy | Last time buy | Last time buy | Last time buy | Last time buy |
| Architecture | PowerPC + CPM | PowerPC + CPM | PowerPC + CPM | PowerPC + CPM | PowerPC + CPM | PowerPC + CPM |
Diferenciadores clave
- Customer-specific R2518 marking available on an otherwise standard EN 50 MHz die (frente a MPC860ENZQ50D4)
- 32% higher core and CPM clock available in the same 357-PBGA footprint (frente a MPC860ENZQ66D4)
- Industrial temperature grade (-40C to +85C) and Ethernet MAC together in a single BGA (frente a MPC860SRCZQ50D4)
Notas de diseño
The 357-PBGA at 1.27 mm pitch requires a 4-layer PCB minimum with matched-impedance routing on the external memory bus. Route address and data lines as length-matched groups within +/- 2 mm to satisfy the MPC860 set-up and hold budgets; use a continuous ground pour under the BGA for thermal spreading. Place 100 nF decoupling capacitors within 3 mm of every power pin and add bulk 10 uF tantalum capacitors at each power plane entry.
Estimated: at 3.3 V core supply and full peripheral utilization the MPC860 can dissipate 1.5 to 2 W. The PBGA-357 (25x25 mm) has a theta_JA of roughly 15 to 20 C/W with a 4-layer PCB and adequate ground pour, giving a junction rise of 30 to 40 C above ambient at 2 W. The industrial -40C to +85C ambient range leaves a safe junction margin; however, sealed enclosures should be derated to 70 C ambient to keep Tj below 100 C.
Series-terminate the external memory bus with 33 ohm resistors placed near the MPC860 output balls. For high-speed SCC clock lines, keep traces short and use a ground-reference strip on the adjacent layer. The CPM-driven serial clocks can produce EMI above 50 MHz; route them away from analog sections and use a guard ring around Ethernet PHY magnetics. Avoid routing memory bus signals across the BGA's inner-ball region to keep reference planes continuous.
Do not assume all MPC860 variants share firmware compatibility: the EN, DT, and SRC suffixes denote different CPM feature sets, and a binary built for the EN Ethernet MAC will not run on the DT or SRC variants without recompiling the CPM microcode. Also, do not omit the external bus pull-up resistors on the BCTL/IRQ pins or the part may fail to come out of reset reliably. Finally, verify the supply-voltage sequencing: the MPC860 requires 3.3 V I/O to ramp before or simultaneously with the 2.5 V (or 1.8 V on some speed grades) core supply.
Información de cumplimiento
Compliance status not present in the verified web data for this specific customer-code variant R2518. The MPC860 family was originally Motorola / Freescale and predates many modern compliance certifications; check the lot-specific documentation from your distributor (Rochester Electronics or LCSC) for the exact RoHS and lead-free status.
