MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP
N.º de pieza: MPC860PCZQ50D4 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $73.2 | $732,00 |
| 50 | $68.4 | $3.420,00 |
| 100 | $62.9 | $6.290,00 |
| 250 | $58.1 | $14.525,00 |
MPC860PCZQ50D4 Descripción general
What is a PowerQUICC processor? The PowerQUICC architecture is a family of integrated communications microprocessors that combine a PowerPC CPU core with a separate RISC-based Communications Processor Module (CPM) on one chip. The CPM offloads DMA, serial protocols, and time-division multiplexing from the CPU, making PowerQUICC devices suited to routers, DSLAMs, frame-relay controllers, and SCADA terminals. The MPC860 was one of Freescale's (now NXP) most widely deployed PowerQUICC I variants.
Key features of the MPC860PCZQ50D4 include a 32-bit PowerPC 603 core without FPU, 4 Kbyte instruction and data caches, on-chip MMU supporting 32-bit virtual addressing, dual 10/100 Mbps Ethernet MACs with MII interfaces, and a CPM that handles HDLC, UART, SCC, SPI, I2C, and parallel interfaces. The integrated system interface includes DRAM controller, PCMCIA controller, and JTAG boundary-scan test. Operating power is 3.3 V for I/O and 1.8 V or 2.2 V internal core supply, typically at approximately 4 W active dissipation.
Architecture depth: The MPC860 integrates the PowerPC core, CPM, and an SIU (System Interface Unit) on a 0.32 micron CMOS process. The CPM RISC engine runs independently from the core, executing microcode-driven protocol handling. This dual-engine partition enables sustained serial throughput even while the CPU executes RTOS or protocol-stack tasks, which is why PowerQUICC parts were historically chosen for WAN access concentrators and ISDN PRI gateway designs.
Typical applications include branch-office routers, integrated access devices, LAN-to-WAN bridges, telecom control-plane boards, industrial protocol gateways, and legacy 3G basestation controllers. Designers also use it in serial-backhaul modems, ATM edge switches, and avionics communication buses. Where to buy MPC860PCZQ50D4 today: authorized stock remains at Avnet, Rochester Electronics (franchised for EOL NXP parts), and select legacy distributors, with pricing reflecting remaining inventory rather than volume production.
Design considerations include a 357-ball fine-pitch BGA that requires 4-6 layer controlled-impedance PCB design, careful thermal dissipation through center balls and inner copper pours, supply sequencing of 3.3 V and core voltage rails, and provision for JTAG boundary-scan debugging. Replacement part option from the same family (pin-compatible) is the MPC860TCVR50D4 and MPC860ENCVR50D4 noted in our alternatives, depending on cache and peripheral mix.
This page synthesizes current distributor pricing, drop-in same-family PowerQUICC alternatives, and practical design notes for legacy system maintenance, content not duplicated on DigiKey or Mouser product pages.
Alternativas directas para MPC860PCZQ50D4 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC860PCZQ50D4 (mismo factor de forma y huella) — difiere en Process Technology, Core Architecture, Processor Type, Mounting Type, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC860TVR50D4
✅ Sustitución directa✓ En stock
$58 / unidad
Ver hoja de datos →MPC860TCVR50D4
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →MPC860ENCVR50D4
✅ Sustitución directa✓ En stock
$52.4 / unidad
Ver hoja de datos →MPC860SRVR50D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XPC860CZP50C1
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860DTZQ50D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860PCZQ50D4 Valores máximos y características eléctricas
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU |
| Core Architecture | PowerPC 603 (32-bit, no FPU) |
| Core Frequency | 50 MHz |
| Number of Cores | 1 (CPU + CPM RISC engine) |
| Operating Voltage - I/O | 3.3 V |
| Internal Core Voltage | 2.2 V or 1.8 V (selection required) |
| Process Technology | 0.32 micron CMOS |
| Instruction Cache | 4 Kbyte |
| Data Cache | 4 Kbyte |
| MMU | Yes (32-bit virtual addressing) |
| On-chip Ethernet MAC | 2x 10/100 Mbps (MII interface) |
| Encapsulado | 357-PBGA (25x25 mm) |
| Rango de temperatura de funcionamiento | -40C to +85C (industrial, 'PC' suffix) |
| Lead Status | Contains Lead |
| Estado RoHS | Non-Compliant (contains lead) |
| Tipo de montaje | Surface Mount (BGA) |
| Estado del ciclo de vida | End of Life |
Configuración de pines de MPC860PCZQ50D4
| Pin A1 | VCC — I/O supply 3.3 V (group varies; see datasheet) |
| Pin A2 | PA0 — Port A bit 0 / general purpose I/O or function |
| Pin B1 | VSS — Ground (group varies; see datasheet) |
| Pin B2 | PA1 — Port A bit 1 |
| Pin C1 | PA2 — Port A bit 2 |
| Pin C2 | PA3 — Port A bit 3 |
| Pin D1 | PA4 — Port A bit 4 |
| Pin D2 | PA5 — Port A bit 5 |
| Pin E1 | PA6 — Port A bit 6 |
| Pin E2 | PA7 — Port A bit 7 |
| Pin F1 | PA8 — Port A bit 8 |
| Pin F2 | PA9 — Port A bit 9 |
| Pin G1 | PA10 — Port A bit 10 |
| Pin G2 | PA11 — Port A bit 11 |
| Pin H1 | PA12 — Port A bit 12 |
| Pin H2 | PA13 — Port A bit 13 |
| Pin J1 | PA14 — Port A bit 14 |
| Pin J2 | PA15 — Port A bit 15 |
| Pin K1 | PB16 — Port B / address/data bus (line varies) |
| Pin K2 | PB17 — Port B / address/data bus |
Aplicaciones típicas
MPC860PCZQ50D4 es adecuado para 7 aplicacións: Branch-Office Router and WAN Access Concentrator, ISDN PRI Gateway and PBX Control Board, Industrial SCADA and Protocol Gateway, ATM Edge Switch and Frame-Relay Controller, Avionics Communication Bus Controller, Point-of-Sale and Embedded Printer/Scanner Controller, Legacy 3G Basestation Controller and Baseband Processor.
Branch-Office Router and WAN Access Concentrator
The MPC860PCZQ50D4's integrated dual 10/100 Ethernet MACs and CPM-driven HDLC channels suit it directly for branch-office routers and DSLAM-style WAN access concentrators. The PowerPC core handles routing tables and firewalling tasks at 50 MHz while the off-load CPM executes HDLC framing, ATM AAL5 segmentation, or PPP multiplexing in parallel. In a typical 4-port WAN module the device runs Linux 2.6.x with NAPI polling on the MII interfaces, freeing the CPU for management-plane work. The 4 Kbyte instruction and data caches plus MMU support full TCP/IP stacks without external logic, and the 357-PBGA package fits the compact router mainboards used in CPE enclosures. Power dissipation around 4 W lets designers run the device at 100% duty in fanless metal chassis.
Recomendado
ISDN PRI Gateway and PBX Control Board
The MPC860PCZQ50D4's multi-channel SCC (Serial Communication Controller) bank drives up to four E1/T1 ISDN PRI spans without external glue logic, making it a classic fit for PBX control boards and PRI gateway appliances. The CPM microcoded HDLC and transparent bit protocols handle Q.921, Q.931, and channel-associated signalling directly, while the PowerPC core runs call-control stacks with Linux or VxWorks. The 357-PBGA (25x25 mm) footprint matches standard PBX base-boards from the late 1990s/early 2000s telecom equipment generation, simplifying legacy field replacements. Industrial -40C to +85C operation lets installers deploy the gateway in uncontrolled telecom closets. PC suffix variant matches the industrial temperature requirement that most carrier-grade deployments mandate.
Recomendado
Industrial SCADA and Protocol Gateway
The MPC860PCZQ50D4's robust -40C to +85C industrial temperature range and rich mix of serial protocols make it well suited for SCADA remote terminal units and serial-Ethernet protocol gateways used in substations, oil-and-gas skids, and water/wastewater plants. The CPM handles Modbus RTU, DNP3, and IEC 60870-5-101 master/slave framing autonomously, while the PowerPC core executes the SCADA host stack. Two Ethernet MII interfaces support redundant ring or bridged uplink topologies with sub-millisecond failover controlled by the PC860's PCMCIA-ready memory bus. The 357-BGA package is proven for vibration-sensitive industrial enclosures when populated with underfill or ruggedized socket variants. With thousands of protocol gateways still in field service, this part is a classic example of NXP industrial longevity.
Recomendado
ATM Edge Switch and Frame-Relay Controller
The MPC860PCZQ50D4's communications processor module natively segments and reassembles ATM AAL1/AAL5 cells, while supporting frame-relay LMI and PVC switching, which made it the historical controller of choice for ATM edge switches and frame-relay access devices. The CPM's microcoded SAR (Segmentation and Reassembly) engine handles per-cell overhead and OAM flows without CPU intervention, and the PowerPC core manages signalling and connection-admission-control. The 3.3 V I/O supply aligns with late-1990s carrier switch ASIC interfaces, and the 32-bit PowerPC bus connects directly to UTOPIA-II framers or to discrete Utopia PHY devices. Where ATM is still deployed in legacy carrier networks for cellular backhaul, the part remains a cost-effective controller when paired with supported framer ASICs.
Recomendado
Avionics Communication Bus Controller
The MPC860PCZQ50D4 has a long heritage in avionics communications bus controllers, where its industrial-grade temperature range and deterministic CPM timing suit ARINC 429, MIL-STD-1553, and custom serial bus implementations. With external transceivers, multiple SCC channels drive 16 channels of ARINC 429 receivers plus transmit channels, while the core executes DO-178C certifiable real-time code on VxWorks or Integrity. The 357-PBGA package is acceptable for vibration-prone avionics enclosures when assembled with underfill or ruggedized sockets. Military temperature (MR suffix) variants extend coverage to -55C to +125C for high-altitude platforms. Legacy avionics programs still deploy this MPU for satellite-communication bus management, in-flight entertainment backhaul, and flight-data recorder interfaces.
Recomendado
Point-of-Sale and Embedded Printer/Scanner Controller
The MPC860PCZQ50D4 is a proven controller in point-of-sale terminals and embedded industrial printer/scanner heads, where its two Ethernet MACs drive the LAN link and a parallel port drives the print engine or scanner CCD read-out. The CPM off-loads serial protocols (RS-232/485 cash drawer, MagTek card reader, USB through external ULPI) while the PowerPC core runs the application and encryption libraries. The 357-PBGA package is appropriate for the compact motherboards inside kiosk enclosures, and the -40C to +85C industrial grade supports both refrigerated warehouse and outdoor ticketing-machine deployments. Legacy POS programs with 10-15 year support windows still stock this part for in-warranty repairs and field retrofits.
Recomendado
Legacy 3G Basestation Controller and Baseband Processor
Earlier 3G Node B base-station designs used the MPC860PCZQ50D4 as the cell-site controller providing timing, ATM backhaul, and E1/T1 Abis interfaces, while an external DSP handled baseband processing. The CPM's HDLC channels and Time-Division-Multiplexer carry Abis signalling and voice traffic between the base-station and BSC, and the 32-bit PowerPC runs the Layer-2/Layer-3 radio resource management stack. While macro basestations have migrated to newer multicore SoCs, tens of thousands of pico-cells, femto-cells, and in-building repeaters still employ this MPU for control-plane tasks, which is why franchised distributors keep this part in stock for legacy network operators.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC860PCZQ50D4 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC860TVR50D4 | MPC860TCVR50D4 | MPC860ENCVR50D4 | MPC860SRVR50D4 | MPC860DTZQ50D4 | XPC860CZP50C1 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Motorola Mobility LLC |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Core Architecture | PowerPC 603 (32-bit, no FPU) | PowerPC 603 (no FPU) | PowerPC 603 (no FPU) | PowerPC 603 (no FPU) | PowerPC 603 (no FPU) | PowerPC 603 (no FPU) | PowerPC 603 (no FPU) |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| On-chip Ethernet MAC | 2x 10/100 Mbps (MII) | 2x 10/100 Mbps (MII) | 2x 10/100 Mbps (MII) | 2x 10/100 (enhanced) | 2x 10/100 Mbps (MII) | 2x 10/100 (dual-fast) | 2x 10/100 Mbps (MII) |
| Instruction/Data Cache | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte |
| MMU | Yes (32-bit VA) | Yes (32-bit VA) | Yes (32-bit VA) | Yes (32-bit VA) | Yes (32-bit VA) | Yes (32-bit VA) | Yes (32-bit VA) |
| Lifecycle Status | End of Life | End of Life | End of Life | End of Life | End of Life | End of Life | End of Life (discontinued by Motorola) |
Diferenciadores clave
- Industrial -40C to +85C temperature grade in standard PBGA-357 package (frente a MPC860ECZQ50D4 (extended commercial 0C to +70C))
- PowerQUICC integrated CPM off-loads HDLC, ATM, and serial protocols from the CPU (frente a MPC860TCVR50D4 (variant with refined CPM))
- Cross-brand Motorola-original equivalent simplifies legacy avionics designs (frente a XPC860CZP50C1)
Notas de diseño
The 357-ball PBGA at 1.27 mm pitch requires a 4-6 layer PCB with symmetrical stack-up, 50 ohm controlled-impedance traces for the Ethernet MII pairs, and matched-length delay tuning on the 32-bit external data bus. Place all decoupling capacitors within 100 mil of their respective supply balls, and stitch the inner ground plane directly under the BGA thermal field for low-impedance return paths. Avoid routed signal layers under the BGA footprint to prevent via stubs.
Estimated: At typical 50 MHz activity, the MPC860PCZQ50D4 dissipates approximately 4 W worst-case. With the 357-PBGA at theta_JA around 18 C/W (still-air JEDEC test board), the junction-to-ambient rise is roughly 72 C. Provide at least 800 sqmm of inner copper connected to the BGA thermal balls on the top and inner layers, and recommend a 200-300 LFM airflow for sealed enclosures. For fanless designs, derate the 50 MHz activity by 20 percent or position the device near a chassis heat-spreader.
The MPC860PCZQ50D4 requires separate 3.3 V I/O and 1.8 V or 2.2 V core supplies with strict sequencing: the 3.3 V rail must ramp within 100 ms before the core rail, or both rails must come up together. Use a low-dropout regulator with Power-Good monitoring, then enable the core supply only when 3.3 V PGOOD asserts. Add bulk tantalum plus ceramic bypass at each supply island, and avoid hot-plug of the part because BGA balls will cold-joint without proper preheat.
Match the MII transmit and receive clocks to within 50 ps to keep the Ethernet PHY in spec, and isolate the MII traces on a dedicated layer with continuous ground beneath. The 32-bit external memory bus should be length-matched within 250 mil (6.35 mm) across the byte lanes to prevent bus-strobe skew, and route all source-synchronous strobes (DQS equivalent on PowerPC) with reference to ground, not power, to avoid SSN jitter on read accesses.
Do not mix this 357-PBGA package with the 357-BGA footprint on newer PowerQUICC II devices - the MPNs differ in lead-free vs lead-bearing reflow profiles and JTAG TAP IDs. Avoid pulling the JTAG TRST pin high during reset - the BDM debugger needs proper reset configuration before scans. Use Rochester Electronics bonded-stock if your program exceeds 24 months of forecasted demand, since open-market supply for EOL PowerQUICC can be counterfeit-prone.
Información de cumplimiento
Contains lead (ZQ suffix indicates lead-bearing PBGA). RoHS non-compliant per DigiKey listing. NXP End-of-Life notification is in effect; long-term procurement requires Rochester Electronics or legacy distributor agreements.
