MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP
MPN: MPC860PCZQ50D4 ✗ Cuối đờiMPC860PCZQ50D4 Tóm tắt
What is a PowerQUICC processor? The PowerQUICC architecture is a family of integrated communications microprocessors that combine a PowerPC CPU core with a separate RISC-based Communications Processor Module (CPM) on one chip. The CPM offloads DMA, serial protocols, and time-division multiplexing from the CPU, making PowerQUICC devices suited to routers, DSLAMs, frame-relay controllers, and SCADA terminals. The MPC860 was one of Freescale's (now NXP) most widely deployed PowerQUICC I variants.
Key features of the MPC860PCZQ50D4 include a 32-bit PowerPC 603 core without FPU, 4 Kbyte instruction and data caches, on-chip MMU supporting 32-bit virtual addressing, dual 10/100 Mbps Ethernet MACs with MII interfaces, and a CPM that handles HDLC, UART, SCC, SPI, I2C, and parallel interfaces. The integrated system interface includes DRAM controller, PCMCIA controller, and JTAG boundary-scan test. Operating power is 3.3 V for I/O and 1.8 V or 2.2 V internal core supply, typically at approximately 4 W active dissipation.
Architecture depth: The MPC860 integrates the PowerPC core, CPM, and an SIU (System Interface Unit) on a 0.32 micron CMOS process. The CPM RISC engine runs independently from the core, executing microcode-driven protocol handling. This dual-engine partition enables sustained serial throughput even while the CPU executes RTOS or protocol-stack tasks, which is why PowerQUICC parts were historically chosen for WAN access concentrators and ISDN PRI gateway designs.
Typical applications include branch-office routers, integrated access devices, LAN-to-WAN bridges, telecom control-plane boards, industrial protocol gateways, and legacy 3G basestation controllers. Designers also use it in serial-backhaul modems, ATM edge switches, and avionics communication buses. Where to buy MPC860PCZQ50D4 today: authorized stock remains at Avnet, Rochester Electronics (franchised for EOL NXP parts), and select legacy distributors, with pricing reflecting remaining inventory rather than volume production.
Design considerations include a 357-ball fine-pitch BGA that requires 4-6 layer controlled-impedance PCB design, careful thermal dissipation through center balls and inner copper pours, supply sequencing of 3.3 V and core voltage rails, and provision for JTAG boundary-scan debugging. Replacement part option from the same family (pin-compatible) is the MPC860TCVR50D4 and MPC860ENCVR50D4 noted in our alternatives, depending on cache and peripheral mix.
This page synthesizes current distributor pricing, drop-in same-family PowerQUICC alternatives, and practical design notes for legacy system maintenance, content not duplicated on DigiKey or Mouser product pages.
Bộ thay thế dễ dàng lắp đặt cho MPC860PCZQ50D4 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MPC860PCZQ50D4 (cùng hình factor và footprint) — khác nhau ở Process Technology, Core Architecture, Processor Type, Mounting Type, RoHS Status.
MPC860TVR50D4
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC860TCVR50D4
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC860ENCVR50D4
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC860SRVR50D4
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
XPC860CZP50C1
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC860DTZQ50D4
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC860PCZQ50D4 Tỷ lệ tối đa & tính chất điện
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU |
| Core Architecture | PowerPC 603 (32-bit, no FPU) |
| Core Frequency | 50 MHz |
| Number of Cores | 1 (CPU + CPM RISC engine) |
| Operating Voltage - I/O | 3.3 V |
| Internal Core Voltage | 2.2 V or 1.8 V (selection required) |
| Process Technology | 0.32 micron CMOS |
| Instruction Cache | 4 Kbyte |
| Data Cache | 4 Kbyte |
| MMU | Yes (32-bit virtual addressing) |
| On-chip Ethernet MAC | 2x 10/100 Mbps (MII interface) |
| Hộp | 357-PBGA (25x25 mm) |
| Khoảng nhiệt độ hoạt động | -40C to +85C (industrial, 'PC' suffix) |
| Lead Status | Contains Lead |
| Trạng thái RoHS | Non-Compliant (contains lead) |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Trạng thái vòng đời | End of Life |
Cấu hình chân MPC860PCZQ50D4
| Chân A1 | VCC — I/O supply 3.3 V (group varies; see datasheet) |
| Chân A2 | PA0 — Port A bit 0 / general purpose I/O or function |
| Chân B1 | VSS — Ground (group varies; see datasheet) |
| Chân B2 | PA1 — Port A bit 1 |
| Chân C1 | PA2 — Port A bit 2 |
| Chân C2 | PA3 — Port A bit 3 |
| Chân D1 | PA4 — Port A bit 4 |
| Chân D2 | PA5 — Port A bit 5 |
| Chân E1 | PA6 — Port A bit 6 |
| Chân E2 | PA7 — Port A bit 7 |
| Chân F1 | PA8 — Port A bit 8 |
| Chân F2 | PA9 — Port A bit 9 |
| Chân G1 | PA10 — Port A bit 10 |
| Chân G2 | PA11 — Port A bit 11 |
| Chân H1 | PA12 — Port A bit 12 |
| Chân H2 | PA13 — Port A bit 13 |
| Chân J1 | PA14 — Port A bit 14 |
| Chân J2 | PA15 — Port A bit 15 |
| Chân K1 | PB16 — Port B / address/data bus (line varies) |
| Chân K2 | PB17 — Port B / address/data bus |
Ứng dụng tiêu biểu
MPC860PCZQ50D4 phù hợp cho 7 Áp dụngs: Branch-Office Router and WAN Access Concentrator, ISDN PRI Gateway and PBX Control Board, Industrial SCADA and Protocol Gateway, ATM Edge Switch and Frame-Relay Controller, Avionics Communication Bus Controller, Point-of-Sale and Embedded Printer/Scanner Controller, Legacy 3G Basestation Controller and Baseband Processor.
Branch-Office Router and WAN Access Concentrator
The MPC860PCZQ50D4's integrated dual 10/100 Ethernet MACs and CPM-driven HDLC channels suit it directly for branch-office routers and DSLAM-style WAN access concentrators. The PowerPC core handles routing tables and firewalling tasks at 50 MHz while the off-load CPM executes HDLC framing, ATM AAL5 segmentation, or PPP multiplexing in parallel. In a typical 4-port WAN module the device runs Linux 2.6.x with NAPI polling on the MII interfaces, freeing the CPU for management-plane work. The 4 Kbyte instruction and data caches plus MMU support full TCP/IP stacks without external logic, and the 357-PBGA package fits the compact router mainboards used in CPE enclosures. Power dissipation around 4 W lets designers run the device at 100% duty in fanless metal chassis.
Được đề xuất
ISDN PRI Gateway and PBX Control Board
The MPC860PCZQ50D4's multi-channel SCC (Serial Communication Controller) bank drives up to four E1/T1 ISDN PRI spans without external glue logic, making it a classic fit for PBX control boards and PRI gateway appliances. The CPM microcoded HDLC and transparent bit protocols handle Q.921, Q.931, and channel-associated signalling directly, while the PowerPC core runs call-control stacks with Linux or VxWorks. The 357-PBGA (25x25 mm) footprint matches standard PBX base-boards from the late 1990s/early 2000s telecom equipment generation, simplifying legacy field replacements. Industrial -40C to +85C operation lets installers deploy the gateway in uncontrolled telecom closets. PC suffix variant matches the industrial temperature requirement that most carrier-grade deployments mandate.
Được đề xuất
Industrial SCADA and Protocol Gateway
The MPC860PCZQ50D4's robust -40C to +85C industrial temperature range and rich mix of serial protocols make it well suited for SCADA remote terminal units and serial-Ethernet protocol gateways used in substations, oil-and-gas skids, and water/wastewater plants. The CPM handles Modbus RTU, DNP3, and IEC 60870-5-101 master/slave framing autonomously, while the PowerPC core executes the SCADA host stack. Two Ethernet MII interfaces support redundant ring or bridged uplink topologies with sub-millisecond failover controlled by the PC860's PCMCIA-ready memory bus. The 357-BGA package is proven for vibration-sensitive industrial enclosures when populated with underfill or ruggedized socket variants. With thousands of protocol gateways still in field service, this part is a classic example of NXP industrial longevity.
Được đề xuất
ATM Edge Switch and Frame-Relay Controller
The MPC860PCZQ50D4's communications processor module natively segments and reassembles ATM AAL1/AAL5 cells, while supporting frame-relay LMI and PVC switching, which made it the historical controller of choice for ATM edge switches and frame-relay access devices. The CPM's microcoded SAR (Segmentation and Reassembly) engine handles per-cell overhead and OAM flows without CPU intervention, and the PowerPC core manages signalling and connection-admission-control. The 3.3 V I/O supply aligns with late-1990s carrier switch ASIC interfaces, and the 32-bit PowerPC bus connects directly to UTOPIA-II framers or to discrete Utopia PHY devices. Where ATM is still deployed in legacy carrier networks for cellular backhaul, the part remains a cost-effective controller when paired with supported framer ASICs.
Được đề xuất
Avionics Communication Bus Controller
The MPC860PCZQ50D4 has a long heritage in avionics communications bus controllers, where its industrial-grade temperature range and deterministic CPM timing suit ARINC 429, MIL-STD-1553, and custom serial bus implementations. With external transceivers, multiple SCC channels drive 16 channels of ARINC 429 receivers plus transmit channels, while the core executes DO-178C certifiable real-time code on VxWorks or Integrity. The 357-PBGA package is acceptable for vibration-prone avionics enclosures when assembled with underfill or ruggedized sockets. Military temperature (MR suffix) variants extend coverage to -55C to +125C for high-altitude platforms. Legacy avionics programs still deploy this MPU for satellite-communication bus management, in-flight entertainment backhaul, and flight-data recorder interfaces.
Được đề xuất
Point-of-Sale and Embedded Printer/Scanner Controller
The MPC860PCZQ50D4 is a proven controller in point-of-sale terminals and embedded industrial printer/scanner heads, where its two Ethernet MACs drive the LAN link and a parallel port drives the print engine or scanner CCD read-out. The CPM off-loads serial protocols (RS-232/485 cash drawer, MagTek card reader, USB through external ULPI) while the PowerPC core runs the application and encryption libraries. The 357-PBGA package is appropriate for the compact motherboards inside kiosk enclosures, and the -40C to +85C industrial grade supports both refrigerated warehouse and outdoor ticketing-machine deployments. Legacy POS programs with 10-15 year support windows still stock this part for in-warranty repairs and field retrofits.
Được đề xuất
Legacy 3G Basestation Controller and Baseband Processor
Earlier 3G Node B base-station designs used the MPC860PCZQ50D4 as the cell-site controller providing timing, ATM backhaul, and E1/T1 Abis interfaces, while an external DSP handled baseband processing. The CPM's HDLC channels and Time-Division-Multiplexer carry Abis signalling and voice traffic between the base-station and BSC, and the 32-bit PowerPC runs the Layer-2/Layer-3 radio resource management stack. While macro basestations have migrated to newer multicore SoCs, tens of thousands of pico-cells, femto-cells, and in-building repeaters still employ this MPU for control-plane tasks, which is why franchised distributors keep this part in stock for legacy network operators.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho MPC860PCZQ50D4 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MPC860TVR50D4 | MPC860TCVR50D4 | MPC860ENCVR50D4 | MPC860SRVR50D4 | MPC860DTZQ50D4 | XPC860CZP50C1 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Motorola Mobility LLC |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Core Architecture | PowerPC 603 (32-bit, no FPU) | PowerPC 603 (no FPU) | PowerPC 603 (no FPU) | PowerPC 603 (no FPU) | PowerPC 603 (no FPU) | PowerPC 603 (no FPU) | PowerPC 603 (no FPU) |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| On-chip Ethernet MAC | 2x 10/100 Mbps (MII) | 2x 10/100 Mbps (MII) | 2x 10/100 Mbps (MII) | 2x 10/100 (enhanced) | 2x 10/100 Mbps (MII) | 2x 10/100 (dual-fast) | 2x 10/100 Mbps (MII) |
| Instruction/Data Cache | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte |
| MMU | Yes (32-bit VA) | Yes (32-bit VA) | Yes (32-bit VA) | Yes (32-bit VA) | Yes (32-bit VA) | Yes (32-bit VA) | Yes (32-bit VA) |
| Lifecycle Status | End of Life | End of Life | End of Life | End of Life | End of Life | End of Life | End of Life (discontinued by Motorola) |
Bảo phân biệt quan trọng
- Industrial -40C to +85C temperature grade in standard PBGA-357 package (vsMPC860ECZQ50D4 (extended commercial 0C to +70C))
- PowerQUICC integrated CPM off-loads HDLC, ATM, and serial protocols from the CPU (vsMPC860TCVR50D4 (variant with refined CPM))
- Cross-brand Motorola-original equivalent simplifies legacy avionics designs (vsXPC860CZP50C1)
Ghi chú thiết kế
The 357-ball PBGA at 1.27 mm pitch requires a 4-6 layer PCB with symmetrical stack-up, 50 ohm controlled-impedance traces for the Ethernet MII pairs, and matched-length delay tuning on the 32-bit external data bus. Place all decoupling capacitors within 100 mil of their respective supply balls, and stitch the inner ground plane directly under the BGA thermal field for low-impedance return paths. Avoid routed signal layers under the BGA footprint to prevent via stubs.
Estimated: At typical 50 MHz activity, the MPC860PCZQ50D4 dissipates approximately 4 W worst-case. With the 357-PBGA at theta_JA around 18 C/W (still-air JEDEC test board), the junction-to-ambient rise is roughly 72 C. Provide at least 800 sqmm of inner copper connected to the BGA thermal balls on the top and inner layers, and recommend a 200-300 LFM airflow for sealed enclosures. For fanless designs, derate the 50 MHz activity by 20 percent or position the device near a chassis heat-spreader.
The MPC860PCZQ50D4 requires separate 3.3 V I/O and 1.8 V or 2.2 V core supplies with strict sequencing: the 3.3 V rail must ramp within 100 ms before the core rail, or both rails must come up together. Use a low-dropout regulator with Power-Good monitoring, then enable the core supply only when 3.3 V PGOOD asserts. Add bulk tantalum plus ceramic bypass at each supply island, and avoid hot-plug of the part because BGA balls will cold-joint without proper preheat.
Match the MII transmit and receive clocks to within 50 ps to keep the Ethernet PHY in spec, and isolate the MII traces on a dedicated layer with continuous ground beneath. The 32-bit external memory bus should be length-matched within 250 mil (6.35 mm) across the byte lanes to prevent bus-strobe skew, and route all source-synchronous strobes (DQS equivalent on PowerPC) with reference to ground, not power, to avoid SSN jitter on read accesses.
Do not mix this 357-PBGA package with the 357-BGA footprint on newer PowerQUICC II devices - the MPNs differ in lead-free vs lead-bearing reflow profiles and JTAG TAP IDs. Avoid pulling the JTAG TRST pin high during reset - the BDM debugger needs proper reset configuration before scans. Use Rochester Electronics bonded-stock if your program exceeds 24 months of forecasted demand, since open-market supply for EOL PowerQUICC can be counterfeit-prone.
Thông tin tuân thủ
Contains lead (ZQ suffix indicates lead-bearing PBGA). RoHS non-compliant per DigiKey listing. NXP End-of-Life notification is in effect; long-term procurement requires Rochester Electronics or legacy distributor agreements.
