MSC8144VT800B - Quad-Core SC3400 DSP, 800MHz | NXP | FCBGA-783
N.º de pieza: MSC8144VT800B ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $179.87 | $179,87 |
| 10 | $161.88 | $1.618,80 |
| 50 | $143.9 | $7.195,00 |
| 100 | $125.91 | $12.591,00 |
| 250 | $107.92 | $26.980,00 |
MSC8144VT800B Descripción general
A DSP (Digital Signal Processor) is a specialized microprocessor whose architecture (multiple MAC units, wide data paths, hardware loop buffers, zero-overhead looping) is optimized for numerically intensive real-time workloads such as baseband processing, voice codecs, video transcoding, and radar/sonar pipelines. Within a SoC hierarchy, the MSC8144VT800B is a compute tile typically paired with a host CPU; the L1/L2 memory hierarchy (L1 I-cache + D-cache per core, shared L2) and dual external memory controllers place it firmly in the high-performance DSP class.
Key features of the MSC8144VT800B include four SC3400 cores at 800 MHz (3200 MIPS aggregate), 10.5 MB unified on-chip RAM, dual DDR/DDR2 memory controllers with ECC, four SGMII Ethernet MACs (Gbps-class serial), a Serial RapidIO 1x/4x endpoint conforming to RapidIO 1.2, and integrated encryption accelerators (PACSUN R2.1). The 783-FCBGA package supports the multi-watt power envelope typical of quad-DSP compute.
Architecturally, the device uses a multi-issue SC3400 core with hardware support for 16/32-bit fixed-point and single-precision IEEE-754 floating-point operations; quad-core coherency is maintained through the shared M3 memory subsystem. The PACA/PACSUN crypto engines handle bulk encryption/decryption offload.
Typical applications include 3G/4G baseband processing, multi-channel voice gateways, defense and aerospace signal intelligence, medical imaging accelerators, and high-density media transcoding platforms. Serial RapidIO enables deployment in AdvancedTCA / MicroTCA chassis where multiple DSP blades interoperate.
When designing with this device, allocate a 6-layer (minimum) PCB stack-up for the FCBGA breakout, follow NXP's decoupling and via-in-pad guidelines, and budget thermal dissipation via forced airflow since the 783-FCBGA package concentrates multi-watt dissipation in a 29x29 mm body. Always reference the MSC8144 Reference Manual together with the data sheet.
This page synthesizes distributor pricing, drop-in same-family alternatives (MSC8144TVT800B, MSC8144SVT1000B), and practical layout guidance not found in a single distributor listing.
Alternativas directas para MSC8144VT800B — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MSC8144VT800B (mismo factor de forma y huella) — difiere en Core Count, Mounting Type, Non-Volatile Memory, On-Chip RAM.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MSC8144TVT800B
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MSC8144SVT1000B
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MSC8156SVT1000B
✅ Sustitución directa✓ En stock
$124.8 / unidad
Ver hoja de datos →MSC8144VT800B Especificaciones
| Core Architecture | SC3400 (StarCore) - Quad-Core |
| Core Count | 4 |
| Operating Frequency | 800 MHz |
| Aggregate Performance | 800 MIPS per core |
| On-Chip RAM | 10.5 MB |
| Non-Volatile Memory | External |
| External Memory Controller | Dual DDR/DDR2 with ECC |
| Ethernet MAC | 4x SGMII (Gbps) |
| Interconnect | Serial RapidIO 1x/4x endpoint (RapidIO 1.2) |
| Encryption Accelerator | PACSUN R2.1 |
| Encapsulado | 783-FCBGA (29x29 mm) |
| Tipo de montaje | Surface Mount (flip-chip BGA) |
| Estado RoHS | Compliant |
| Bit Width (Data) | 32-bit |
| Packaging | Tray |
Guía de configuración de pines de MSC8144VT800B 783-fcbga (29x29 mm)
Configuración de pines para MSC8144VT800B (encapsulado 783-fcbga (29x29 mm)). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.
No hay datos detallados de patillaje disponibles para MSC8144VT800B.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MSC8144VT800B es adecuado para 6 aplicacións: 3G/4G LTE Baseband Processing, Multi-Channel Voice / Media Gateways, Defense Signal Intelligence / SDR, Medical Imaging Accelerators, Video Transcoding / Broadcast Encoding, Aerospace Radar Pre-Processing.
3G/4G LTE Baseband Processing
The MSC8144VT800B is purpose-built for multi-channel baseband processing in 3G/4G LTE base stations. Its four SC3400 cores at 800 MHz deliver 3200 MIPS aggregate, with each core combining 16-bit and 32-bit MAC units ideal for turbo decoder, Viterbi, and FFT accelerators. The dual DDR2 memory controller with ECC sustains the high-throughput working set of LTE PHY layers, while Serial RapidIO 1x/4x endpoint streams baseband samples between radio cards and the baseband blade. Compared with general-purpose processors, the SC3400 architecture's zero-overhead looping and hardware loop buffer dramatically reduce per-instruction overhead in the tight inner kernels of channel estimation.
Recomendado
Multi-Channel Voice / Media Gateways
VoIP and media gateway designs benefit from the MSC8144VT800B's combination of DSP compute density and integrated encryption. Each SC3400 core handles tens of G.711/G.729/AMR-WB voice channels in parallel while the PACSUN R2.1 engine accelerates SRTP/AES bulk encryption without taxing the DSPs. The four SGMII Ethernet MACs support four GbE network interfaces for direct trunking into packet backplanes, and 10.5 MB on-chip RAM lets large codec working sets stay resident. This removes cache thrashing in deep transcoding pipelines typical of carrier-class media gateways.
Recomendado
Defense Signal Intelligence / SDR
Software-defined radio platforms benefit from the MSC8144VT800B's 4-core compute density and Serial RapidIO's deterministic, low-latency fabric. Each SC3400 core can independently run a different waveform (wideband receivers, COMINT/SIGINT pipelines) and ship results back via SRIO to a system controller. The PACSUN R2.1 engine handles encrypted data flows and the dual DDR2 controller with ECC ensures signal-processing integrity under harsh environmental stress. The flip-chip 783-FCBGA also provides superior thermal resilience in conduction-cooled ATR chassis commonly used in defense platforms.
Recomendado
Medical Imaging Accelerators
Ultrasound beamforming and CT reconstruction workloads map cleanly to the MSC8144VT800B. Each SC3400 core runs beamformed I/Q paths or back-projection kernels with IEEE-754 single-precision float support, while the 10.5 MB on-chip RAM keeps entire image slices resident between firings. SGMII carries digitized RF to the compute blade and Serial RapidIO aggregates results back to the host. The quad-core architecture lets a single device replace multiple older single-core DSPs, reducing board area and BOM in cart-based and portable ultrasound systems.
Recomendado
Video Transcoding / Broadcast Encoding
Live broadcast encoders and IPTV headends can run multi-format video transcoding (H.264/AVC, MPEG-2) using the MSC8144VT800B's quad-core SC3400 array. Each core independently encodes one channel, with the dual DDR2 controller feeding reference frames at high bandwidth and the PACSUN engine securing CAS-protected streams. The 783-FCBGA package concentrates encoding compute in a compact footprint suitable for blade-density headend racks, while Serial RapidIO links to system controllers in chassis-based deployments.
Recomendado
Aerospace Radar Pre-Processing
Radar and sonar pre-processing pipelines (pulse compression, CFAR detection, beamforming) map efficiently to the MSC8144VT800B's SC3400 cores. Each core handles one DSP pipeline in real time while 10.5 MB on-chip RAM maintains the working data set. Serial RapidIO is the deterministic fabric of choice in radar arrays, and SGMII links back to system controllers for higher-level processing. The 783-FCBGA flip-chip package provides thermal pathways optimized for conduction-cooled Avionics/LRU enclosures used in aerospace platforms.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MSC8144VT800B — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MSC8144TVT800B | MSC8144SVT1000B | MSC8156SVT1000B |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Core Architecture | SC3400 Quad-Core | SC3400 Quad-Core - same | SC3400 Quad-Core - same | SC3400 Hex-Core - more cores |
| Core Frequency | 800 MHz | 800 MHz - same | 1000 MHz (+25%) | 1000 MHz (+25%) |
| Aggregate MIPS | 3200 MIPS | 3200 MIPS - same | 4000 MIPS (+25%) | 6000 MIPS (+87%) |
| Serial RapidIO | 1x/4x endpoint (RapidIO 1.2) | 1x/4x endpoint - same | 1x/4x endpoint - same | 1x/4x endpoint - same |
| Encryption Accelerator | PACSUN R2.1 | PACSUN R2.1 - same | PACSUN R2.1 - same | PACSUN R2.1 - same |
| External Memory Controller | Dual DDR/DDR2 with ECC | Dual DDR/DDR2 with ECC - same | Dual DDR/DDR2 with ECC - same | Dual DDR/DDR2/DDR3 with ECC |
| Lifecycle (NXP) | NRND | NRND | Active (per NXP MSC8144 family) | Active (per NXP MSC8156 family) |
Diferenciadores clave
- Quad-core SC3400 compute density in 783-FCBGA (frente a Single-core legacy Freescale DSPs)
- Multi-gigabit fabric integration (SGMII + Serial RapidIO) (frente a DSPs requiring external PHY/MAC chips)
- Hardware encryption offload (PACSUN R2.1) (frente a DSP competitors without crypto engines)
Notas de diseño
The 783-FCBGA flip-chip package demands a high-density PCB stack-up. Use at least a 6-layer board with microvia technology (via-in-pad recommended for the BGA break-out region). Follow NXP's reference design stack-up exactly to maintain 50-ohm impedance on DDR2 address/control traces and matched-length routing (within +/-25 ps skew). Use of low-loss PCB material (FR4-180 or equivalent) is required for SGMII and Serial RapidIO serializer interfaces to preserve eye margin at 1.25-3.125 Gbps.
At 800 MHz quad-core operation, the MSC8144VT800B dissipates multi-watt power in a 29x29 mm package. Estimated: power dissipation of 6-9W typical under full load translates to junction temperatures that must be verified by NXP's published thermal models. Use 1-oz copper pours on all inner PCB layers stitching into the BGA's thermal balls, with a top-side copper spreader if natural convection is insufficient. For conduction-cooled enclosures, thermal interface material (TIM) plus a baseplate should be planned into the chassis mechanical design.
Sequence the MSC8144VT800B supply rails per NXP's power-up sequence: core voltage first, then I/O, then SerDes supplies (RapidIO/SGMII). In-rush current during DDR bulk charge can exceed the regulator's soft-start envelope unless sequenced correctly. Use NXP-recommended PMIC or sequencing controller. Decouple each core-supply pin with 0.1 uF + 1 uF + 10 uF ceramic on the BGA side, and bulk capacitance per Reference Manual Section 'Power Distribution'.
SGMII and Serial RapidIO serializer outputs need AC-coupling caps (typically 0.1 uF) and Tx pre-emphasis / Rx equalization must be configured via the MSC8144 Reference Manual. Reference clock jitter must be below 1 ps RMS for Serial RapidIO 1x/4x compliance; use a high-quality crystal or jitter-attenuating clock generator. DDR2 address/command traces require 50-ohm +/- 10% controlled impedance and Vtt termination at the far end.
Do not assume a generic BGA footprint works - the 783-FCBGA pad pattern is NXP-specific. Do not share power planes between DDR2 VDDQ and SerDes PLL supplies; isolate them with ferrite beads per Reference Manual. Do not enable the Serial RapidIO port before its reference clock is stable and the PLL is locked, or the link-training handshake will fail.
Información de cumplimiento
RoHS compliant per Lisleapex distributor listing. Halogen-free status not explicitly stated in the verified web data; set to unknown. AEC-Q100 qualification does not apply to industrial/commercial grade DSPs.
