MSC8144VT800B - Quad-Core SC3400 DSP, 800MHz | NXP | FCBGA-783
Артикул: MSC8144VT800B ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $179.87 | $179,87 |
| 10 | $161.88 | $1.618,80 |
| 50 | $143.9 | $7.195,00 |
| 100 | $125.91 | $12.591,00 |
| 250 | $107.92 | $26.980,00 |
MSC8144VT800B Обзор
A DSP (Digital Signal Processor) is a specialized microprocessor whose architecture (multiple MAC units, wide data paths, hardware loop buffers, zero-overhead looping) is optimized for numerically intensive real-time workloads such as baseband processing, voice codecs, video transcoding, and radar/sonar pipelines. Within a SoC hierarchy, the MSC8144VT800B is a compute tile typically paired with a host CPU; the L1/L2 memory hierarchy (L1 I-cache + D-cache per core, shared L2) and dual external memory controllers place it firmly in the high-performance DSP class.
Key features of the MSC8144VT800B include four SC3400 cores at 800 MHz (3200 MIPS aggregate), 10.5 MB unified on-chip RAM, dual DDR/DDR2 memory controllers with ECC, four SGMII Ethernet MACs (Gbps-class serial), a Serial RapidIO 1x/4x endpoint conforming to RapidIO 1.2, and integrated encryption accelerators (PACSUN R2.1). The 783-FCBGA package supports the multi-watt power envelope typical of quad-DSP compute.
Architecturally, the device uses a multi-issue SC3400 core with hardware support for 16/32-bit fixed-point and single-precision IEEE-754 floating-point operations; quad-core coherency is maintained through the shared M3 memory subsystem. The PACA/PACSUN crypto engines handle bulk encryption/decryption offload.
Typical applications include 3G/4G baseband processing, multi-channel voice gateways, defense and aerospace signal intelligence, medical imaging accelerators, and high-density media transcoding platforms. Serial RapidIO enables deployment in AdvancedTCA / MicroTCA chassis where multiple DSP blades interoperate.
When designing with this device, allocate a 6-layer (minimum) PCB stack-up for the FCBGA breakout, follow NXP's decoupling and via-in-pad guidelines, and budget thermal dissipation via forced airflow since the 783-FCBGA package concentrates multi-watt dissipation in a 29x29 mm body. Always reference the MSC8144 Reference Manual together with the data sheet.
This page synthesizes distributor pricing, drop-in same-family alternatives (MSC8144TVT800B, MSC8144SVT1000B), and practical layout guidance not found in a single distributor listing.
Аналоги без доработки для MSC8144VT800B — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MSC8144VT800B (тот же форм-фактор и посадочное место) — отличается по Core Count, Mounting Type, Non-Volatile Memory, On-Chip RAM.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MSC8144TVT800B
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MSC8144SVT1000B
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MSC8156SVT1000B
✅ Прямая замена✓ В наличии
$124.8 / шт.
Открыть даташит →MSC8144VT800B Характеристики
| Core Architecture | SC3400 (StarCore) - Quad-Core |
| Core Count | 4 |
| Operating Frequency | 800 MHz |
| Aggregate Performance | 800 MIPS per core |
| On-Chip RAM | 10.5 MB |
| Non-Volatile Memory | External |
| External Memory Controller | Dual DDR/DDR2 with ECC |
| Ethernet MAC | 4x SGMII (Gbps) |
| Interconnect | Serial RapidIO 1x/4x endpoint (RapidIO 1.2) |
| Encryption Accelerator | PACSUN R2.1 |
| Корпус | 783-FCBGA (29x29 mm) |
| Тип монтажа | Surface Mount (flip-chip BGA) |
| Статус RoHS | Compliant |
| Bit Width (Data) | 32-bit |
| Packaging | Tray |
Руководство по цоколевке MSC8144VT800B в корпусе 783-fcbga (29x29 mm)
Цоколевка для MSC8144VT800B (корпус 783-fcbga (29x29 mm)). Нумерация выводов, функции и схемы подключения определены в техническом описании производителя. Обратитесь к нему для точного посадочного места и рекомендаций по пайке.
Нет подробных данных о распиновке для MSC8144VT800B.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
MSC8144VT800B подходит для 6 применениеs: 3G/4G LTE Baseband Processing, Multi-Channel Voice / Media Gateways, Defense Signal Intelligence / SDR, Medical Imaging Accelerators, Video Transcoding / Broadcast Encoding, Aerospace Radar Pre-Processing.
3G/4G LTE Baseband Processing
The MSC8144VT800B is purpose-built for multi-channel baseband processing in 3G/4G LTE base stations. Its four SC3400 cores at 800 MHz deliver 3200 MIPS aggregate, with each core combining 16-bit and 32-bit MAC units ideal for turbo decoder, Viterbi, and FFT accelerators. The dual DDR2 memory controller with ECC sustains the high-throughput working set of LTE PHY layers, while Serial RapidIO 1x/4x endpoint streams baseband samples between radio cards and the baseband blade. Compared with general-purpose processors, the SC3400 architecture's zero-overhead looping and hardware loop buffer dramatically reduce per-instruction overhead in the tight inner kernels of channel estimation.
Рекомендуется
Multi-Channel Voice / Media Gateways
VoIP and media gateway designs benefit from the MSC8144VT800B's combination of DSP compute density and integrated encryption. Each SC3400 core handles tens of G.711/G.729/AMR-WB voice channels in parallel while the PACSUN R2.1 engine accelerates SRTP/AES bulk encryption without taxing the DSPs. The four SGMII Ethernet MACs support four GbE network interfaces for direct trunking into packet backplanes, and 10.5 MB on-chip RAM lets large codec working sets stay resident. This removes cache thrashing in deep transcoding pipelines typical of carrier-class media gateways.
Рекомендуется
Defense Signal Intelligence / SDR
Software-defined radio platforms benefit from the MSC8144VT800B's 4-core compute density and Serial RapidIO's deterministic, low-latency fabric. Each SC3400 core can independently run a different waveform (wideband receivers, COMINT/SIGINT pipelines) and ship results back via SRIO to a system controller. The PACSUN R2.1 engine handles encrypted data flows and the dual DDR2 controller with ECC ensures signal-processing integrity under harsh environmental stress. The flip-chip 783-FCBGA also provides superior thermal resilience in conduction-cooled ATR chassis commonly used in defense platforms.
Рекомендуется
Medical Imaging Accelerators
Ultrasound beamforming and CT reconstruction workloads map cleanly to the MSC8144VT800B. Each SC3400 core runs beamformed I/Q paths or back-projection kernels with IEEE-754 single-precision float support, while the 10.5 MB on-chip RAM keeps entire image slices resident between firings. SGMII carries digitized RF to the compute blade and Serial RapidIO aggregates results back to the host. The quad-core architecture lets a single device replace multiple older single-core DSPs, reducing board area and BOM in cart-based and portable ultrasound systems.
Рекомендуется
Video Transcoding / Broadcast Encoding
Live broadcast encoders and IPTV headends can run multi-format video transcoding (H.264/AVC, MPEG-2) using the MSC8144VT800B's quad-core SC3400 array. Each core independently encodes one channel, with the dual DDR2 controller feeding reference frames at high bandwidth and the PACSUN engine securing CAS-protected streams. The 783-FCBGA package concentrates encoding compute in a compact footprint suitable for blade-density headend racks, while Serial RapidIO links to system controllers in chassis-based deployments.
Рекомендуется
Aerospace Radar Pre-Processing
Radar and sonar pre-processing pipelines (pulse compression, CFAR detection, beamforming) map efficiently to the MSC8144VT800B's SC3400 cores. Each core handles one DSP pipeline in real time while 10.5 MB on-chip RAM maintains the working data set. Serial RapidIO is the deterministic fabric of choice in radar arrays, and SGMII links back to system controllers for higher-level processing. The 783-FCBGA flip-chip package provides thermal pathways optimized for conduction-cooled Avionics/LRU enclosures used in aerospace platforms.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MSC8144VT800B — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MSC8144TVT800B | MSC8144SVT1000B | MSC8156SVT1000B |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Core Architecture | SC3400 Quad-Core | SC3400 Quad-Core - same | SC3400 Quad-Core - same | SC3400 Hex-Core - more cores |
| Core Frequency | 800 MHz | 800 MHz - same | 1000 MHz (+25%) | 1000 MHz (+25%) |
| Aggregate MIPS | 3200 MIPS | 3200 MIPS - same | 4000 MIPS (+25%) | 6000 MIPS (+87%) |
| Serial RapidIO | 1x/4x endpoint (RapidIO 1.2) | 1x/4x endpoint - same | 1x/4x endpoint - same | 1x/4x endpoint - same |
| Encryption Accelerator | PACSUN R2.1 | PACSUN R2.1 - same | PACSUN R2.1 - same | PACSUN R2.1 - same |
| External Memory Controller | Dual DDR/DDR2 with ECC | Dual DDR/DDR2 with ECC - same | Dual DDR/DDR2 with ECC - same | Dual DDR/DDR2/DDR3 with ECC |
| Lifecycle (NXP) | NRND | NRND | Active (per NXP MSC8144 family) | Active (per NXP MSC8156 family) |
Ключевые отличия
- Quad-core SC3400 compute density in 783-FCBGA (против Single-core legacy Freescale DSPs)
- Multi-gigabit fabric integration (SGMII + Serial RapidIO) (против DSPs requiring external PHY/MAC chips)
- Hardware encryption offload (PACSUN R2.1) (против DSP competitors without crypto engines)
Заметки по проектированию
The 783-FCBGA flip-chip package demands a high-density PCB stack-up. Use at least a 6-layer board with microvia technology (via-in-pad recommended for the BGA break-out region). Follow NXP's reference design stack-up exactly to maintain 50-ohm impedance on DDR2 address/control traces and matched-length routing (within +/-25 ps skew). Use of low-loss PCB material (FR4-180 or equivalent) is required for SGMII and Serial RapidIO serializer interfaces to preserve eye margin at 1.25-3.125 Gbps.
At 800 MHz quad-core operation, the MSC8144VT800B dissipates multi-watt power in a 29x29 mm package. Estimated: power dissipation of 6-9W typical under full load translates to junction temperatures that must be verified by NXP's published thermal models. Use 1-oz copper pours on all inner PCB layers stitching into the BGA's thermal balls, with a top-side copper spreader if natural convection is insufficient. For conduction-cooled enclosures, thermal interface material (TIM) plus a baseplate should be planned into the chassis mechanical design.
Sequence the MSC8144VT800B supply rails per NXP's power-up sequence: core voltage first, then I/O, then SerDes supplies (RapidIO/SGMII). In-rush current during DDR bulk charge can exceed the regulator's soft-start envelope unless sequenced correctly. Use NXP-recommended PMIC or sequencing controller. Decouple each core-supply pin with 0.1 uF + 1 uF + 10 uF ceramic on the BGA side, and bulk capacitance per Reference Manual Section 'Power Distribution'.
SGMII and Serial RapidIO serializer outputs need AC-coupling caps (typically 0.1 uF) and Tx pre-emphasis / Rx equalization must be configured via the MSC8144 Reference Manual. Reference clock jitter must be below 1 ps RMS for Serial RapidIO 1x/4x compliance; use a high-quality crystal or jitter-attenuating clock generator. DDR2 address/command traces require 50-ohm +/- 10% controlled impedance and Vtt termination at the far end.
Do not assume a generic BGA footprint works - the 783-FCBGA pad pattern is NXP-specific. Do not share power planes between DDR2 VDDQ and SerDes PLL supplies; isolate them with ferrite beads per Reference Manual. Do not enable the Serial RapidIO port before its reference clock is stable and the PLL is locked, or the link-training handshake will fail.
Информация о соответствии
RoHS compliant per Lisleapex distributor listing. Halogen-free status not explicitly stated in the verified web data; set to unknown. AEC-Q100 qualification does not apply to industrial/commercial grade DSPs.
