MSC8156TVT1000B - Six-Core 1 GHz StarCore DSP, 783-FCBGA | NXP
N.º de pieza: MSC8156TVT1000B ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $241.6 | $241,60 |
| 10 | $230.15 | $2.301,50 |
| 100 | $215.4 | $21.540,00 |
| 500 | $198.75 | $99.375,00 |
| 1.000 | $182.3 | $182.300,00 |
MSC8156TVT1000B Descripción general
A digital signal processor (DSP) is a specialized microprocessor whose instruction set, register file, and memory hierarchy are optimized for the high-throughput arithmetic required by real-time signal processing workloads such as baseband, audio, video, radar, and control loops. Within the broader taxonomy, the MSC8156TVT1000B sits at: DSP -> media/communications processor -> multicore SoC -> semiconductor. It is distinct from general-purpose CPUs (latency-optimized control flow), GPUs (data-parallel throughput), and microcontrollers (low-cost deterministic I/O).
Key features include six SC3850 cores with SIMD extensions, an integrated MAPLE-B2 baseband accelerator, four SerDes lanes for Serial RapidIO and SGMII interconnect, dual RGMII Ethernet MACs, PCI Express, and a rich peripheral mix including I2C, SPI, UART, and GPIO. The device targets carrier-grade wireless base stations, 3G/4G channel cards, and other high-channel-count DSP farms.
The SC3850 core adds 16-bit fractional ALU extensions and a variable-width vector unit that lifts per-cycle MAC throughput far beyond legacy single-core DSPs. With six cores at 1 GHz, peak 16-bit MMAC/s reaches well into the tens of thousands, sufficient for multi-antenna 3GPP LTE physical-layer processing on a single device.
Typical applications include LTE/HSPA+ baseband processing, software-defined radio, channel aggregation in small cells, voice and audio transcoding engines, and high-density industrial control loops. The 783-FCBGA exposes the full SerDes and Ethernet bandwidth required for backhaul.
When laying out a board, dedicate continuous GND and PWR planes under the BGA, follow NXP's breakout-and-routing guidance for the SerDes lanes, and respect the 1.0 V core / 2.5 V I/O sequencing rules to avoid latch-up. A minimum 8-layer stack-up is recommended to route all 783 balls without via stubs on high-speed lanes.
This page combines distributor stock and pricing, drop-in and same-family alternatives, and design notes that go beyond the manufacturer datasheet so engineers can shorten selection and bring-up time.
Alternativas directas para MSC8156TVT1000B — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MSC8156TVT1000B (mismo factor de forma y huella) — difiere en Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
No hay alternativas directas disponibles para este producto.
Solicitar alternativasMSC8156TVT1000B Especificaciones
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Status | Obsolete |
| Type | SC3850 Six-Core Digital Signal Processor |
| Series | StarCore |
| Clock Rate | 1 GHz |
| Number of Cores | 6 x SC3850 DSP subsystems |
| L1 Instruction Cache (per core) | 32 KB |
| L1 Data Cache (per core) | 32 KB |
| Unified L2 Cache | 512 KB (configurable partition) |
| On-Chip RAM | 576 KB |
| Non-Volatile Memory (ROM) | 96 KB |
| Core Voltage | 1.00 V |
| I/O Voltage | 2.50 V |
| Interfaces | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART |
| Encapsulado / Carcasa | 783-BBGA, FCBGA (29x29 mm) |
| Packaging | Tray |
| Tipo de montaje | Surface Mount |
| Operating Temperature Grade | Industrial |
| SVHC | Exceeds threshold (per Freescale datasheet) |
| ECCN (US) | 3A991 |
| HTS Code | 8542.31.00.01 |
Guía de configuración de pines de MSC8156TVT1000B 783-bbga, fcbga (29x29 mm)
Configuración de pines para MSC8156TVT1000B (encapsulado 783-bbga, fcbga (29x29 mm)). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.
No hay datos detallados de patillaje disponibles para MSC8156TVT1000B.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MSC8156TVT1000B es adecuado para 7 aplicacións: LTE/4G Baseband Channel Card, Software-Defined Radio (SDR) Platform, Voice and Audio Transcoding Engine, Industrial Multi-Axis Motor Control, Medical Imaging Front-End Processor, Aerospace and Defense Signal Intelligence, Network Accelerator / Base Station Co-Processor.
LTE/4G Baseband Channel Card
The MSC8156TVT1000B's six SC3850 cores at 1 GHz and integrated MAPLE-B2 baseband accelerator make it a fit for 3GPP LTE physical-layer processing on a single device. Its Serial RapidIO and RGMII interfaces provide the backhaul bandwidth required for multi-antenna radio units. Each core has 32 KB L1 I-cache and 32 KB L1 D-cache with 512 KB unified L2, enabling real-time FFT, turbo decoding, and channel estimation without external memory bottlenecks. Compared with a single-core DSP farm, the six-core SoC reduces PCB area while sustaining the MAC throughput needed for 4x4 MIMO.
Recomendado
Software-Defined Radio (SDR) Platform
The MSC8156TVT1000B delivers six programmable SC3850 cores that can be partitioned across multiple SDR waveforms simultaneously. Its 576 KB on-chip RAM plus 96 KB ROM support resident waveform tables, while the SerDes lanes enable multi-gigabit I/Q streaming between RF front-ends and the DSP. Industrial temperature grading and surface-mount FCBGA packaging suit ruggedized SDR enclosures. With the SC3850 SIMD extensions, the device accelerates FFTs and FIR filters commonly used in cognitive-radio and spectrum-sensing tasks.
Recomendado
Voice and Audio Transcoding Engine
For carrier media gateways and high-density transcoding blades, the MSC8156TVT1000B's six cores provide enough headroom to run multiple narrowband and wideband codecs (AMR-WB, EVS, Opus) in parallel. The 1 GHz clock and SC3850 SIMD unit accelerate voice-processing DSP kernels with deterministic latency, and the I2C/SPI/UART peripherals simplify control-plane glue to host CPUs. On-chip 576 KB SRAM keeps active frames on-die, which is critical for low-latency transcoding pipelines.
Recomendado
Industrial Multi-Axis Motor Control
Multi-axis servo drives benefit from the deterministic, low-latency control loops that the MSC8156TVT1000B's six SC3850 cores can service in parallel. Each core can manage an independent current/torque loop, with the integrated Ethernet (RGMII) and UART peripherals streaming telemetry to a central controller. The 1.0 V core / 2.5 V I/O supply split simplifies integration with industrial 24 V-bus-derived power trees. Industrial temperature grading suits factory-floor deployments.
Recomendado
Medical Imaging Front-End Processor
Ultrasound and other medical-imaging front-ends use the MSC8156TVT1000B's six SC3850 cores to parallelize beamforming, FFT, and envelope-detection pipelines. The 512 KB unified L2 cache supports high-throughput data movement between cores and the on-chip 576 KB SRAM, and the SPI/UART peripherals connect to ADCs and operator interfaces. Compared with a discrete DSP cluster, the integrated SoC reduces board area - useful for cart-based ultrasound systems.
Recomendado
Aerospace and Defense Signal Intelligence
The MSC3850 SC3850 core's SIMD throughput and the MSC8156TVT1000B's SerDes lanes make it suitable for SIGINT and ELINT workloads where multiple channels must be processed simultaneously. Six independent cores allow partitioning of wideband capture, demodulation, and decoding tasks, while the FCBGA package and industrial temperature grade support ruggedized enclosures. Engineers should verify lot screening and supplier provenance for any aerospace/defense deployment.
Recomendado
Network Accelerator / Base Station Co-Processor
In small-cell and macro-cell base stations the MSC8156TVT1000B offloads layer-1 baseband processing from the host CPU. Its Serial RapidIO and SGMII lanes connect cleanly to network processors, while the six cores accelerate turbo/LTE channel decoding, CRC, and HARQ combiners. Compared with fixed-function ASICs, the programmable StarCore SoC supports multi-standard operation through firmware updates.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MSC8156TVT1000B — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MSC8156HVT1000B | MSC8156MAG100B | MSC8157ESVT1000A |
|---|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-BBGA, FCBGA (29x29 mm) | 783-BBGA, FCBGA - same | 783-BBGA, FCBGA - same | 783-BBGA, FCBGA - same |
| Clock Rate | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| Core Architecture | 6 x SC3850 (StarCore) | 6 x SC3850 (StarCore) | 6 x SC3850 (StarCore) | Updated StarCore (8157 family) |
| Core Voltage | 1.00 V | 1.00 V | 1.00 V | 1.00 V |
| I/O Voltage | 2.50 V | 2.50 V | 2.50 V | 2.50 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Six SC3850 cores at 1 GHz with on-chip MAPLE-B2 baseband accelerator (frente a MSC8156MAG100B)
- Successor-grade compatibility within the 783-FCBGA footprint (frente a MSC8157ESVT1000A)
- Higher screening grade available in same family (frente a MSC8156HVT1000B)
Notas de diseño
Use a minimum 8-layer stack-up for the 783-ball FCBGA; route all signals on inner layers with microvias to escape the dense BGA field. Maintain continuous reference planes beneath the package and keep SerDes lanes on a single layer with no more than two vias to preserve signal integrity. Per NXP/Freescale guidance, follow the published escape pattern before splitting SerDes across multiple layers.
Sequence the 1.0 V core rail before the 2.5 V I/O rail on power-up; reverse order on power-down. Use a power-management IC with monotonic output and per-rail enable control tied to the MSC8156TVT1000B's sequencing requirements. Decouple each supply pin with 0.1 uF X7R and 10 uF bulk ceramic placed as close to the BGA as the breakout allows.
Do not rely on third-party pinout images for production layout; the 783-FCBGA ball map is dense and a single mismatched ball will cause non-functional silicon. Confirm ball-A1 orientation against the manufacturer's mechanical drawing before Gerber release. Also verify supplier lot integrity given the obsolete status - independent-distributor parts may not have full NXP traceability.
Estimated: with a typical 1.0 V core current in the multi-amp range and 2.5 V I/O, the FCBGA package dissipates several watts. Provide a thermal pad or copper flood directly under the BGA and connect it through thermal vias to inner planes. For enclosed base-station environments, consider forced-air cooling or a heatsink attached via thermal interface material to keep junction temperature within industrial limits.
Información de cumplimiento
Per Freescale-era documentation referenced on Xecor, the MSC8156TVT1000B contains SVHC content exceeding the REACH threshold. RoHS, lead-free, and halogen-free status are not explicitly stated in the verified web data and should be confirmed with the supplier; AEC-Q100 is not applicable to this DSP family.
