MSP430F5338IZQWR - 20MHz 256KB Flash MCU 113-BGA | Texas Instruments
N.º de pieza: MSP430F5338IZQWR ✓ ActivoMSP430F5338IZQWR Descripción general
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, memory, and configurable peripherals. Within the broader taxonomy, the MSP430F5338 is a mixed-signal MCU (combining analog peripherals with digital logic) in the ultra-low-power class (prioritizing microamp standby currents over raw performance). It belongs to the MSP430 family of 16-bit RISC cores and is positioned in the F5xx sub-family for portable measurement and instrumentation.
Key features include active-mode current of 270 uA/MHz at 8 MHz and 3.0 V during Flash program execution, five low-power modes with sub-uA standby currents, and a supply voltage range of 1.8 V to 3.6 V. The 12-bit ADC supports up to 8 input channels and the integrated 12-bit DAC allows analog output without external components. DMA channels reduce CPU wake-up frequency, directly lowering average system power.
The device is built around the MSP430 CPUXV2 16-bit RISC architecture with a 16-bit register file and 27 instructions, supported by a 32-bit hardware multiplier. Compared with 8-bit MCUs, the 16-bit datapath and DMA engine enable efficient sensor-fusion loops and signal processing at lower average power. Five software-selectable low-power modes (LPM0-LPM4) plus RTC-only retention give designers precise control over wake/sleep trade-offs.
Typical applications include portable medical and fitness instruments, industrial sensor transmitters, smart metering, data loggers, and human-machine interface controllers. The integrated ADC, DAC, and comparator also suit closed-loop control and battery monitoring subsystems in IoT edge nodes.
When designing with this part, populate unused BGA balls with NC (no-connect) and follow TI's BGA PCB layout guide for microvia stack-up to avoid signal-integrity issues. For ultra-low standby, disable unused peripherals and enter LPM4 with the RTC as the only wake source.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found on the manufacturer product page, giving engineers a faster sourcing and design-start path.
Alternativas directas para MSP430F5338IZQWR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
MSP430F5328IPZR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MSP430F5328IZQE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MSP430F5638IPZR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MSP430F6438IPZR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MSP430F5338IPZR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MSP430F5338IZQWR Valores máximos y características eléctricas
| Core | MSP430 CPUXV2 (16-bit RISC) |
| Series | MSP430F5xx |
| Maximum CPU Clock | 20 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM Size | 18 KB (18K x 8) |
| Supply Voltage Range | 1.8 V to 3.6 V |
| Active Mode Current (8 MHz, Flash) | 270 uA/MHz at 3.0 V |
| Number of I/O Pins | 74 |
| ADC | 12-bit, integrated |
| DAC | 12-bit, integrated |
| Comparators | Integrated |
| DMA Channels | Integrated |
| Hardware Multiplier | 32-bit, integrated |
| Timers | Multiple 16-bit timers |
| Serial Interfaces | UART / SPI / I2C |
| Encapsulado | 113-ball Microstar Junior BGA (7x7 mm) |
| Tipo de montaje | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
Guía de configuración de pines de MSP430F5338IZQWR 113-ball microstar junior bga (7x7 mm)
Configuración de pines para MSP430F5338IZQWR (encapsulado 113-ball microstar junior bga (7x7 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MSP430F5338IZQWR.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MSP430F5338IZQWR es adecuado para 6 aplicacións: Portable Medical and Fitness Devices, Smart Metering and Energy Monitoring, Industrial Sensor Transmitters, Battery-Powered Data Loggers, Human-Machine Interface (HMI) Controllers, IoT Edge Sensor Nodes.
Portable Medical and Fitness Devices
The MSP430F5338IZQWR fits handheld glucose meters, pulse oximeters, and fitness wearables because its 270 uA/MHz active current and LPM4 nanoamp standby enable multi-month battery life on coin cells. The integrated 12-bit ADC directly digitizes sensor signals (heart-rate, SpO2, temperature), the 12-bit DAC drives reference voltages or audio tones, and the 74 GPIO pins multiplex display, keypad, and BLE module interfaces. The 256 KB Flash accommodates BLE stack + sensor-fusion firmware, while 18 KB SRAM buffers data packets without external RAM.
Recomendado
Smart Metering and Energy Monitoring
Smart electricity, water, and gas meters benefit from the MSP430F5338IZQWR's integrated 12-bit ADC for current/voltage sensing and DMA engine for offloading conversion sequences without waking the CPU. The 20 MHz MSP430 CPUXV2 core runs metering algorithms (true-RMS, harmonic analysis) while five low-power modes keep standby current below 1 uA between transmissions. UART/SPI interfaces connect to RF or PLC modem ICs, and the 256 KB Flash holds both metering firmware and a TLS-like security stack.
Recomendado
Industrial Sensor Transmitters
4-20 mA loop-powered sensor transmitters and wireless sensor nodes leverage the MSP430F5338IZQWR's 1.8-3.6 V supply, 12-bit ADC accuracy (calibrated for industrial temp range -40C to +85C), and comparator for threshold detection. The DMA controller moves ADC samples to RAM autonomously, allowing the CPU to sleep while sensors are sampled. With UART/SPI/I2C, the MCU connects directly to HART modems, IO-Link transceivers, or sub-GHz radio ICs without external glue logic.
Recomendado
Battery-Powered Data Loggers
Standalone data loggers for environmental, vibration, and cold-chain monitoring deploy the MSP430F5338IZQWR because its 256 KB Flash and 18 KB RAM capture weeks of timestamped measurements, while LPM4 with RTC retention keeps the entire system below 2 uA. The integrated 12-bit ADC and external sensor interfaces (via SPI/I2C) digitize analog/digital inputs, and DMA writes samples to RAM without CPU intervention. UART enables tethered dump or in-field reconfiguration.
Recomendado
Human-Machine Interface (HMI) Controllers
HMI panels in appliances, thermostats, and small industrial control boxes run on the MSP430F5338IZQWR thanks to its 20 MHz CPU clock that scans keypads, drives LCDs via SPI, and responds to capacitive-touch events within milliseconds. The 74 GPIO pins easily handle 4x4 key matrices, encoder inputs, status LEDs, and an LCD bias generator. The 12-bit DAC produces audio feedback or a reference voltage for the backlight boost converter.
Recomendado
IoT Edge Sensor Nodes
Wireless IoT edge nodes (BLE/Zigbee/LoRa) pair the MSP430F5338IZQWR with a companion radio IC over SPI or UART, using the MCU as the sensor hub and protocol controller. The 12-bit ADC aggregates analog sensors, the DMA streams data to the radio TX buffer, and five low-power modes enable multi-year battery life. With 256 KB Flash, the MCU also runs local anomaly-detection algorithms before radio wake-up, reducing airtime and overall system power.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MSP430F5338IZQWR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MSP430F5328IPZR | MSP430F5328IZQE | MSP430F5638IPZR | MSP430F6438IPZR |
|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 113-ball Microstar Junior BGA (7x7 mm) | 113-ball Microstar Junior BGA (7x7 mm) - same | 100-pin LQFP - different footprint | 113-ball Microstar Junior BGA (7x7 mm) - same | 113-ball Microstar Junior BGA (7x7 mm) - same |
| CPU Core | MSP430 CPUXV2 (16-bit, 20 MHz) | MSP430 CPUXV2 (16-bit, 20 MHz) - same | MSP430 CPUXV2 (16-bit, 20 MHz) - same | MSP430 CPUXV2 (16-bit, 20 MHz) - same | MSP430 CPUXV2 (16-bit, 20 MHz) - same |
| Flash Memory | 256 KB | 128 KB | 128 KB | 256 KB | 256 KB |
| SRAM | 18 KB | 10 KB | 10 KB | 18 KB | 32 KB |
| ADC Resolution | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit |
| USB 2.0 Support | No | No | No | Yes | Yes |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
Diferenciadores clave
- True mixed-signal integration with 12-bit ADC + 12-bit DAC (frente a MSP430F5328IPZR)
- Higher-density BGA footprint suitable for compact designs (frente a MSP430F5328IZQE (100-LQFP))
- No USB peripheral keeps the die smaller and cheaper (frente a MSP430F5638IPZR)
Notas de diseño
The 113-ball Microstar Junior BGA uses a 0.5 mm ball pitch and requires a controlled-impedance microvia stack-up. Per TI's BGA layout guidelines, place a thermal-via array directly under the die paddle and use NSMD (non-solder-mask-defined) land pads to improve joint reliability. Reflow profile must follow J-STD-020 MSL-3 conditions; dry-pack and floor-life management are mandatory before assembly.
Do not enable unused peripherals on the MSP430F5338IZQWR - each ADC, DAC, and timer module adds 50-500 uA of quiescent current even in standby. To achieve the datasheet's sub-uA LPM4 sleep, disable all module clocks via the UCS module, gate GPIO ports, and route the RTC as the only wake source. Cross-check with the TI MSP430x5xx Family User Guide (SLAU208) for the exact SFR bits.
Estimated: at 20 MHz, 3.3 V supply, and 100% CPU duty cycle with Flash execution, total current is approximately 270 uA/MHz * 20 = 5.4 mA, giving 17.8 mW. Dropping to 8 MHz and disabling DMA between bursts reduces average current to under 1 mA in a typical sensor-fusion loop, so design your decoupling for at least 20 mA transient peaks (use 10 uF + 100 nF at the VCC pin and keep the trace shorter than 5 mm).
When routing the BGA fan-out, keep SPI/UART traces to 50 ohm controlled impedance and avoid crossing the die paddle. For 113-ball BGA breakout, fan-out on at least 4 routing layers with microvias under the inner balls. Decouple each AVCC/DVDD pair with a 1 uF + 10 nF ceramic pair as close as practical to the ball.
Información de cumplimiento
RoHS / REACH compliance per TI product page; lead-free BGA balls per JEDEC J-STD-020. AEC-Q100 not applicable for industrial-grade commercial MCU - choose MSP430F5338IZQWT-Q1 suffix variant for automotive.
