P1010NXE5KHA557 - QorIQ P1010 1.0GHz e500v2 MPU 425-TEPBGA | NXP
N.º de pieza: P1010NXE5KHA557 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2.61 | $2,61 |
| 10 | $2.48 | $24,80 |
| 100 | $2.3 | $230,00 |
| 500 | $2.15 | $1.075,00 |
| 1.000 | $2 | $2.000,00 |
P1010NXE5KHA557 Descripción general
A microprocessor (MPU) is a single-chip CPU that integrates a processor core, cache, memory controller, and peripheral interfaces into one package. Microprocessor hierarchy: MPU > microprocessor IC > processor > integrated circuit > semiconductor. QorIQ P-series MPUs specifically target embedded communications and control planes where deterministic performance, hardware-offloaded security, and rich I/O are critical - they differ from microcontrollers (MCUs) by relying on external DRAM and running an operating system such as Linux, rather than executing bare-metal firmware from flash.
Key features of the P1010NXE5KHA include hardware-accelerated SEC (Security Engine) for IPSec, SSL/TLS and 3DES/AES, a DDR3/3L memory controller with ECC, four DMA channels, a 32-bit external data bus, a 16-bit address bus, and industrial-grade temperature endurance. The integrated peripherals reduce BOM and PCB area in cost-sensitive designs by eliminating the need for separate GbE PHYs, SATA controllers, or external crypto accelerators.
The P1010 SoC integrates the e500v2 core with on-chip L1 cache, a system interconnect fabric, and the peripherals above; it is widely used in secure industrial gateways, fanless factory controllers, and ruggedized networking appliances where the e500v2 power/performance balance is a deliberate choice versus ARM Cortex-A9 alternatives. The Trusted Boot block supports secure firmware verification at reset.
Typical applications include industrial Ethernet gateways, secure serial-to-Ethernet device servers, programmable logic controllers (PLCs), substation automation equipment, industrial IoT edge nodes, and small-form-factor networked storage. The GbE, USB, and PCIe integration makes the P1010 well-suited as a headless communications controller attached to a host processor.
When designing with this device, ensure the 425-ball TE-PBGA is placed on a 19x19 mm land pattern with matched-length DDR3 traces for signal integrity; the industrial-grade thermal envelope lets it operate fanlessly in sealed enclosures.
This page synthesizes distributor pricing from LCSC, JLCPCB, DigiKey and Mouser, drop-in alternatives within the QorIQ P1 family, and practical design notes not found in the summary datasheet entries.
Alternativas directas para P1010NXE5KHA557 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con P1010NXE5KHA557 (mismo factor de forma y huella) — difiere en Core Architecture, Memory Controller, Mounting Type, Operating Temperature, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
P1010NSE5KHA
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$54.25 / unidad
Ver hoja de datos →P1014NXE5KHA
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
P1013NXE5KHA
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
P1012NXE5KHA
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P1010NXE5KHA557 Valores máximos y características eléctricas
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-bit |
| Address Bus Width | 16-bit |
| Frecuencia de reloj máxima | 1.0 GHz |
| Process Technology | 45 nm |
| Instruction Set | 32-bit Power Architecture |
| DMA Channels | 4 |
| Memory Controller | DDR3 / DDR3L with ECC |
| Integrated Peripherals | USB, SATA, GbE, PCIe, SEC, Trusted Boot |
| Encapsulado | 425-TEPBGA (19x19 mm) |
| Temperatura de funcionamiento | -40C to +105C (Industrial) |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Family Series | QorIQ P1 (P1010/P1014/P1013/P1012 family) |
Guía de configuración de pines de P1010NXE5KHA557 425-tepbga (19x19 mm)
Configuración de pines para P1010NXE5KHA557 (encapsulado 425-tepbga (19x19 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para P1010NXE5KHA557.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
P1010NXE5KHA557 es adecuado para 6 aplicacións: Industrial Ethernet Gateway, Secure IoT Edge Router, Substation Automation Controller, Industrial Printer / Imaging Controller, Network-Attached Storage (NAS) Controller, Building Automation Controller (BACnet/Modbus).
Industrial Ethernet Gateway
The P1010NXE5KHA557 fits industrial Ethernet gateway designs because its single 1.0 GHz e500v2 core runs deterministic protocol-conversion firmware (Modbus TCP, EtherNet/IP, PROFINET) with headroom for edge analytics. The integrated GbE MAC, USB 2.0, and PCIe controller remove the need for external NIC chips, cutting PCB area and BOM. The on-chip SEC engine accelerates IPSec and SSL/TLS for VPN-tunneled field sites, while Trusted Boot verifies gateway firmware at power-up. The -40C to +105C thermal envelope lets the gateway operate fanlessly in sealed DIN-rail cabinets on the factory floor, and DDR3 with ECC corrects single-bit memory errors common in industrial EMI environments.
Recomendado
Secure IoT Edge Router
The P1010NXE5KHA557 targets secure IoT edge routers because its hardware SEC engine accelerates AES-256 and SHA-2 with wire-rate throughput, offloading crypto from the e500v2 core and freeing CPU cycles for MQTT routing, data normalization, and TLS termination. The GbE plus PCIe interface allows WAN and Wi-Fi 6 module attachment for last-mile connectivity to sensors. Trusted Boot anchors the root of trust, validating signed firmware before any network port is enabled, which matters for unattended edge deployments where physical tamper resistance is required. The 45 nm process keeps typical power consumption below 5 W, allowing PoE-powered operation.
Recomendado
Substation Automation Controller
The P1010NXE5KHA557 fits substation automation controllers (IEC 61850) because its industrial -40C to +105C temperature range meets IEC 61850-3 environmental requirements for outdoor cabinets and high-voltage switchyards. Its single-core e500v2 architecture delivers deterministic real-time response for GOOSE message processing within 4 ms latency budgets. Hardware SEC acceleration handles MACsec and role-based authentication required by IEC 62351, while Trusted Boot secures firmware against physical-tamper attack vectors. The DDR3 with ECC prevents bit flips in high-EMI switchyard environments, and the 1.0 GHz clock speed supports IEC 61850-9-2 sampled-value streams in parallel with supervisory traffic.
Recomendado
Industrial Printer / Imaging Controller
The P1010NXE5KHA557 fits industrial printer and imaging controllers thanks to its PCIe interface for attaching high-speed scanner ASICs and its SATA host for local storage of print job buffers. The e500v2 core runs embedded Linux distributions such as Yocto or Wind River Linux with printer firmware stacks, while the DDR3 controller handles large image rasterization buffers. The GbE MAC supports 1 Gbps network connectivity for shared office/industrial printer fleets. Industrial temperature grade ensures continuous operation in non-climate-controlled production environments.
Recomendado
Network-Attached Storage (NAS) Controller
The P1010NXE5KHA557 fits small-form-factor NAS controllers because its integrated SATA host and GbE MAC deliver file-server throughput in a single chip. The e500v2 core runs ZFS or ext4 file systems with hardware-XOR acceleration for RAID5/6 parity computation, offloaded by the SEC engine from the host CPU. DDR3 with ECC protects data integrity against bit errors during long RAID rebuilds, while Trusted Boot validates NAS firmware at boot to defeat rootkit attacks. The 1.0 GHz core supports simultaneous SMB/NFS/iSCSI protocol stacks for multi-protocol access.
Recomendado
Building Automation Controller (BACnet/Modbus)
The P1010NXE5KHA557 suits building automation controllers that aggregate BACnet/IP, Modbus TCP, and KNX traffic in commercial HVAC and lighting systems. Its GbE MAC and USB 2.0 host provide physical connectivity to field buses, while the e500v2 core runs a real-time OS such as VxWorks or INTEGRITY for deterministic I/O scheduling. The industrial -40C to +105C thermal envelope handles unconditioned mechanical rooms, and the hardware SEC engine secures remote-management TLS sessions against credential theft. DDR3 with ECC ensures reliable long-term operation in 24/7 building control loops.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para P1010NXE5KHA557 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | P1010NSE5KHA | P1014NXE5KHA | P1013NXE5KHA | P1012NXE5KHA |
|---|---|---|---|---|---|
| Package | 425-TEPBGA (19x19 mm) | 425-TEPBGA (19x19 mm) - same | 425-TEPBGA (19x19 mm) - same | 425-TEPBGA (19x19 mm) - same | 425-TEPBGA (19x19 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
| Maximum Clock Frequency | 1.0 GHz | 800 MHz | 1.0 GHz | 800 MHz | 600 MHz |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Memory Controller | DDR3 / DDR3L with ECC | DDR3 / DDR3L with ECC | DDR3 / DDR3L with ECC | DDR3 / DDR3L | DDR3 / DDR3L |
| Security Engine | Yes (SEC + Trusted Boot) | Yes | Yes | Yes | Limited/optional |
| Process Technology | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm |
Diferenciadores clave
- Industrial temperature grade -40C to +105C with Trusted Boot and hardware SEC (frente a P1010NSE5KHA)
- Caches aligned with e500v2 architecture for deterministic latency (frente a P1014NXE5KHA)
- 10+ years NXP long-term silicon availability for industrial lifecycles (frente a Generic ARM Cortex-A9 MPU)
Notas de diseño
The 425-TEPBGA package at 19x19 mm has a published theta-JA in the high single-digit C/W range for a 4-layer JEDEC test board. Estimated: at 1.0 GHz and a typical application power of 3-5 W, junction-to-ambient temperature rise is roughly 30-50 C above ambient. Designers targeting sealed enclosures with 70C internal air should validate with the manufacturer thermal model, keeping the junction under 105C for industrial-grade reliability. Use thermal vias under the center balls and a copper spreader on the top side for improved dissipation.
Route DDR3 traces as matched-length pairs to the 425-TEPBGA balls, ideally within 25 mil length tolerance per byte lane, with reference-ground vias stitched every 200 mil. Series-stubs must be removed by terminating at the via. Keep GbE traces away from PCIe and SATA switching nodes; use guard ground between analog and digital sections. The exposed balls under the package require a land pattern with 0.8 mm pitch micro-via fan-out to inner signal layers.
Do not assume the P1010NXE5KHA557 is pin-compatible with QorIQ P2 (P2020) parts even though both use TE-PBGA packages - the P2020 uses a different 25x25 mm ball map and would short-circuit the PCB. Always re-spin the PCB land pattern when migrating between QorIQ families. Also, the 557 customer-specific suffix means firmware configuration differs from stock P1010NXE5KHA parts; confirm your BSP supports the 557 device tree before field deployment.
Use a multi-rail power solution: 1.0 V for the e500v2 core, 1.5 V for DDR3, 1.8 V or 3.3 V for I/O. Estimated: at 1.0 GHz core, dynamic power is on the order of 2-3 W; static/leakage adds ~0.5 W. Use NXP VR500 or compatible PMIC with sequencing that respects core-before-I/O power-up. Decoupling: 0.1 uF X7R near each supply ball and 10 uF bulk per power domain.
Información de cumplimiento
RoHS compliant per LCSC distributor listing (C7018230). Industrial-grade temperature rating is -40C to +105C (extended); not AEC-Q100 automotive qualified. Refer to NXP product page for up-to-date REACH and conflict-mineral compliance statements.
