PIC24F16KA102T-I/ML - 16-bit XLP MCU, 16KB Flash, 28-QFN | Microchip
N.º de pieza: PIC24F16KA102T-I/ML ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $3.42 | $3,42 |
| 10 | $3.08 | $30,80 |
| 100 | $2.74 | $274,00 |
| 500 | $2.39 | $1.195,00 |
| 1.000 | $2.05 | $2.050,00 |
| 3.300 | $1.71 | $5.643,00 |
PIC24F16KA102T-I/ML Descripción general
A PIC24F microcontroller is a 16-bit modified Harvard architecture MCU from Microchip's PIC family, optimized for ultra-low power and mixed-signal embedded applications. It sits in the broader taxonomy of microcontroller -> embedded processor -> semiconductor, offering higher performance and richer peripherals than 8-bit PIC MCUs while consuming less power than dsPIC and PIC32 devices, making it well-suited to battery-powered and energy-harvesting designs.
Key features include 16 MIPS throughput at 32 MHz, nanoWatt XLP technology with deep-sleep current below 1 µA, and rich peripherals such as a 10-bit ADC, multiple UART/SPI/I2C interfaces, comparators, RTCC with calendar mode, and configurable logic cells. The 28-QFN package exposes the die thermal pad for enhanced heat dissipation and offers 18 digital I/O pins.
Architecturally, the device uses a 16-bit modified Harvard core with separate program and data buses, hardware multiply/divide, and a configurable instruction set compatible with PIC24F assembly and MPLAB XC16 C code. The XLP power management block integrates DSBOR (deep-sleep brown-out reset), DSWDT (deep-sleep watchdog timer), and a real-time clock calendar, enabling sleep currents measured in nanoamps while keeping time and wake-up sources active.
Typical applications include battery-powered IoT sensor nodes, wearable health monitors, automotive body controllers, energy meters, RF4CE remote controls, and ultra-low-power wireless sensor platforms. The combination of nanoWatt XLP sleep modes, RTCC retention, and AEC-Q100 qualification makes it suitable for designs that must run for years on a coin cell or that must operate reliably under automotive temperature stress.
When designing with this device, pay attention to decoupling: place 100 nF + 1 µF ceramics close to VDD/AVDD pairs and use the exposed pad (EP) for low-impedance ground and thermal relief. Programming is supported by MPLAB X IDE with the XC16 compiler, and debug is handled via the ICSP/ICD interface using PGECx/PGEDx pins. This page consolidates distributor pricing, drop-in alternatives, and engineering guidance not collated in the manufacturer datasheet.
Alternativas directas para PIC24F16KA102T-I/ML — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC24F16KA102T-I/ML (mismo factor de forma y huella) — difiere en ADC, Package, Program Memory (Flash), Timers, Core Architecture.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC24F16KA102-I/ML
✅ Sustitución directa✓ En stock
$2.05 / unidad
Ver hoja de datos →PIC24F16KA102-E/ML
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC24F08KA102T-I/ML
✅ Sustitución directa✓ En stock
$2.05 / unidad
Ver hoja de datos →PIC24F08KA102-I/ML
✅ Sustitución directa✓ En stock
$1.78 / unidad
Ver hoja de datos →PIC24F08KM202T-I/ML
✅ Sustitución directa✓ En stock
$1.95 / unidad
Ver hoja de datos →PIC24F16KA102T-I/ML Valores máximos y características eléctricas
| Core | PIC24F 16-bit modified Harvard |
| Family | PIC24F XLP (eXtreme Low Power) |
| Program Memory (Flash) | 16 KB (5.5K x 24) |
| Data RAM | 2 KB |
| EEPROM | 512 B |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Operating Voltage | 1.8 V to 3.6 V |
| I/O Pins | 18 |
| Encapsulado | 28-QFN (6x6 mm) with exposed pad |
| Tipo de montaje | Surface Mount |
| Automotive Qualification | AEC-Q100 qualified (T suffix, I temperature) |
| Temperatura de funcionamiento | -40C to +85C (Industrial) |
| ADC | 10-bit, 9-channel |
| Communication Interfaces | 2x UART, 2x SPI, 2x I2C |
| Timers | 5x 16-bit, 1x 32-bit |
| Comparators | 3 |
| RTCC | Yes (with calendar mode) |
| Deep-Sleep Current | Approx. 20 nA typical (RTCC + DSBOR active) |
| CTMU | Yes |
| Estado RoHS | Compliant |
Configuración de pines de PIC24F16KA102T-I/ML
| Pin 1 | MCLR — Master Clear (reset) input, active-low |
| Pin 2 | RA0 — Port A bit 0 / analog AN0 |
| Pin 3 | RA1 — Port A bit 1 / analog AN1 |
| Pin 4 | RA2 — Port A bit 2 / analog AN2 / CVref+ |
| Pin 5 | RA3 — Port A bit 3 / analog AN3 / Vref+ |
| Pin 6 | RA4 — Port A bit 4 / analog AN4 |
| Pin 7 | AVDD — Analog supply voltage |
| Pin 8 | AVSS — Analog ground |
| Pin 9 | RB0 — Port B bit 0 / AN8 / PGED1 |
| Pin 10 | RB1 — Port B bit 1 / AN9 / PGEC1 |
| Pin 11 | RB2 — Port B bit 2 |
| Pin 12 | RB3 — Port B bit 3 |
| Pin 13 | RB4 — Port B bit 4 |
| Pin 14 | RB5 — Port B bit 5 |
| Pin 15 | RB6 — Port B bit 6 / ICSPCLK |
| Pin 16 | RB7 — Port B bit 7 / ICSPDAT |
| Pin 17 | RB8 — Port B bit 8 |
| Pin 18 | RB9 — Port B bit 9 |
| Pin 19 | VSS — Digital ground |
| Pin 20 | VCAP — Internal core regulator decoupling |
| Pin 21 | RC0 — Port C bit 0 |
| Pin 22 | RC1 — Port C bit 1 |
| Pin 23 | RC2 — Port C bit 2 |
| Pin 24 | RC3 — Port C bit 3 |
| Pin 25 | RC4 — Port C bit 4 |
| Pin 26 | RC5 — Port C bit 5 |
| Pin 27 | RC6 — Port C bit 6 / OSC2 |
| Pin 28 | RC7 — Port C bit 7 / OSC1 |
| Pin EP | EP — Exposed thermal pad, tie to VSS for thermal relief |
Aplicaciones típicas
PIC24F16KA102T-I/ML es adecuado para 6 aplicacións: Battery-Powered IoT Sensor Node, Wearable Health Monitor, Automotive Body Controller Module, Energy Harvesting Wireless Switch, Smart Home and Metering Robot, RF4CE Remote Control.
Battery-Powered IoT Sensor Node
The PIC24F16KA102T-I/ML is well-matched to wireless IoT sensor nodes because its nanoWatt XLP deep-sleep current of approximately 20 nA keeps average power consumption dominated only by wake-up duty cycle and radio TX time, while 16 KB program memory accommodates an RTOS-less application plus a lightweight wireless stack such as LoRaWAN or Zigbee MAC. At 1.8-3.6 V operation it can be powered directly from a single Li-ion, two alkaline AA cells, or a 3.3 V LDO downstream of a boost regulator. Compared with 8-bit PIC MCUs the 16 MIPS throughput reduces active-mode energy per measurement, and the 28-QFN 6x6 mm footprint is small enough for coin-cell form factors.
Recomendado
Wearable Health Monitor
The PIC24F16KA102T-I/ML suits wearable health monitors where PCB area is constrained and sleep current must be measured in nanoamps: the integrated 10-bit ADC with CTMU drives impedance-based heart-rate and galvanic-skin-response front-ends, while the RTCC with calendar mode maintains accurate timekeeping during deep sleep without an external RTC chip. Its 1.8-3.6 V supply range is compatible with Li-Po batteries, and the 28-QFN package exposes the thermal pad for skin-contact thermal relief. The XLP deep-sleep mode plus DSWDT allows the MCU to wake once per second, sample, transmit, and return to sleep, yielding average currents below 25 mA at duty cycle.
Recomendado
Automotive Body Controller Module
The PIC24F16KA102T-I/ML is AEC-Q100 qualified and operates across the automotive -40C to +85C industrial range, making it a strong fit for body controllers where small form factor and moderate processing are required. With 5 timers, 2 UART, 2 SPI, and 2 I2C peripherals it can drive LIN bus transceivers, switch-mode LED drivers, mirror/door-zone sensors, and PWM-controlled lighting while remaining responsive on the LIN bus. The 18 I/O pins map cleanly to the typical body module signal count, and the wide 1.8-3.6 V supply range tolerates 12 V automotive rail transients via a small LDO.
Recomendado
Energy Harvesting Wireless Switch
The PIC24F16KA102T-I/ML fits energy-harvesting wireless switches where the energy budget is set by a kinetic or RF tap of a few hundred microjoules per press: at approximately 20 nA in deep sleep with the RTCC running, the device draws less than 70 nW continuously, allowing a coin-cell or harvested-only supply to last the product lifetime. The 10-bit ADC with CTMU supports capacitive-touch sensing for the switch input, while a GPIO drives an SPI-attached sub-GHz or 2.4 GHz radio. The 28-QFN 6x6 mm package fits inside a wall-switch gang box with antenna trace routed around it.
Recomendado
Smart Home and Metering Robot
The PIC24F16KA102T-I/ML is ideal for battery-powered smart-home and metering peripherals where the MCU must wake on a timer or external interrupt, perform a measurement, transmit over a low-power radio, and return to deep sleep. Its 16 KB flash accommodates a small wireless MAC plus metering application, while the 2 KB RAM is sufficient for packet buffers and a tiny RTOS or state-machine scheduler. The integrated RTCC eliminates external RTC chips in utility-meter form factors, and the exposed pad QFN package handles short bursts of 20-40 mA active current during radio transmission without thermal throttling.
Recomendado
RF4CE Remote Control
The PIC24F16KA102T-I/ML is suited for RF4CE remote controls where the device sits in deep sleep for months at a time and wakes on a capacitive-touch or keypad interrupt to transmit a short command packet: nanoWatt XLP sleep keeps standby current in the nanoamp range, while the 16 MIPS core reduces the active-time power cost of transmitting. The CTMU and comparators support capacitive-touch keypads without an external touch controller, and the 16 KB flash holds a small RF4CE protocol stack plus the application code. The 28-QFN package plus small RF section fits inside a slim remote enclosure.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC24F16KA102T-I/ML — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC24F16KA102-I/ML | PIC24F16KA102-E/ML | PIC24F08KA102T-I/ML | PIC24F08KA102-I/ML | PIC24F08KM202T-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) with EP | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same |
| Flash Memory | 16 KB | 16 KB | 16 KB | 8 KB | 8 KB | 8 KB |
| RAM | 2 KB | 2 KB | 2 KB | 1.5 KB | 1.5 KB | 1 KB |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Extended -40C to +125C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C |
| I/O Pins | 18 | 18 | 18 | 18 | 18 | 21 |
| Packaging | Tape & Reel | Tube | Tube | Tape & Reel | Tube | Tape & Reel |
Diferenciadores clave
- Tape-and-reel packing for high-volume SMD assembly (frente a PIC24F16KA102-I/ML (tube variant))
- AEC-Q100 automotive qualification with industrial temp grade (frente a PIC24F16KA102T-I/SO (SOIC variant))
- Same-family 16 KB flash options with full pinout compatibility (frente a PIC24F08KA102T-I/ML (8 KB flash))
Notas de diseño
Place a 100 nF decoupling capacitor close to each VDD/AVDD pin pair, and a bulk 1-10 uF ceramic on the supply rail. The PIC24F16KA102T-I/ML has a separate VCAP pin for the internal 1.8V core regulator - it must have a 2.2 uF-4.7 uF ceramic (X7R) tied from VCAP to VSS to ensure regulator stability and to keep Vcore ripple below 30 mV during sleep-to-wake transitions.
Estimated: at typical 32 MHz / 3.3 V active current near 8 mA, the device dissipates about 26 mW; the 28-QFN with EP tied to a 1 square-inch copper pour yields theta_JA in the 30-40 C/W range, well below thermal concerns for any normal firmware workload. Sleep-mode currents in the nanoamp range make the thermal envelope trivially small, but ensure the EP pad is soldered (not floating) for thermal and electrical ground integrity.
Route the ICSP/ICD lines (PGECx/PGEDx, RB6/RB7) away from switching traces and high-current digital lines; they are high-impedance during debug and sensitive to crosstalk. Place the 32.768 kHz crystal or external clock source as close to OSC1/OSC2 as possible with ground guards, and keep it away from any RF section or fast digital edges to avoid RTCC timing drift.
Do not leave the MCLR pin floating; tie it to VDD through a 10 kohm pull-up for normal operation or to the ICD header for in-circuit debug. Configure all unused I/O as outputs (or inputs with internal pulls) to minimize sleep current and to prevent ESD paths into unpowered domains. For RTCC operation ensure a 32.768 kHz crystal or external reference is configured before relying on calendar mode for timekeeping during deep sleep.
When using SPI at higher speeds (above 8 MHz), add 33 ohm source-termination on SCK/MOSI to dampen ringing on long traces, and ensure the SPI slave device has adequate ground stitching on the periphery. For ADC accuracy, bypass AVSS/AVDD with a separate 100 nF + 1 uF pair, and avoid routing switching signals under the analog pins to preserve 10-bit ENOB at full conversion rate.
Información de cumplimiento
AEC-Q100 qualified per Microchip product page for automotive applications. RoHS compliant, halogen-free, lead-free packaging. CML (Conflict Minerals) compliant per Microchip CML statement.
