PIC24FJ1024GB610T-I/BG - 16-bit MCU, 1MB Flash, USB-OTG | Microchip
N.º de pieza: PIC24FJ1024GB610T-I/BG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $12.488 | $12,49 |
| 10 | $11.86 | $118,60 |
| 100 | $10.78 | $1.078,00 |
| 500 | $9.92 | $4.960,00 |
| 1.000 | $9.05 | $9.050,00 |
PIC24FJ1024GB610T-I/BG Descripción general
A 16-bit MCU is a microcontroller whose data path and arithmetic logic unit natively operate on 16-bit words, enabling richer instruction sets, more efficient C code, and larger linear address spaces than 8-bit alternatives while remaining cheaper and lower-power than 32-bit Cortex-M parts. Within Microchip's portfolio, PIC24F devices sit in the eXtreme Low Power (XLP) family and combine a 16-bit modified-Harvard core with on-chip peripherals including USB, mTouch capacitive sensing, and 12-bit ADC. The PIC24FJ1024GB610 specifically introduces a Cryptographic Engine, 24-channel 12-bit ADC, 8 DMA channels, and USB-OTG.
Key differentiating features include integrated USB-OTG with on-chip transceiver, Configurable Logic Cells (CLC) and Peripheral Pin Select (PPS) for flexible signal routing, a 24-channel 12-bit ADC capable of 500 ksps, and a Parallel Master Port (PMP) for external memory or graphics interfaces. The 121-pin TFBGA exposes up to 85 I/O pins with 5 V tolerance on most pins, supporting mixed-signal designs without level shifters.
The architecture is built around the PIC24F core with hardware multiply/divide and a 16 x 16-bit working register array. A 32 KB unified data SRAM backs the DMA controller, which can move data between peripherals and memory without CPU intervention, lowering average power consumption. The Cryptographic Engine handles AES, DES, and MD5/SHA hash operations in hardware, freeing the core for application logic. JTAG and ICSP interfaces enable MPLAB Snap or ICD-3 in-circuit debugging.
Typical applications include USB peripherals (Human Interface Devices, CDC virtual COM ports, mass storage), secure IoT edge nodes using the on-chip crypto engine, industrial control with analog sensor acquisition, and graphical HMI panels driven through PMP to TFT LCDs. The eXSTREAM eXtreme Low Power run/IDLE/SLEEP modes also make it suitable for battery-backed smart meters.
Design with the PIC24FJ1024GB610 by carefully planning the peripheral pin select map, since PPS unlocks remappable digital functions but is one-time-configurable. Always place a 10 uF + 0.1 uF decoupling pair adjacent to each VDD/VSS pair, and follow the TFBGA escape pattern with micro-via-in-pad for the inner ball rows to maintain signal integrity on parallel buses.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para PIC24FJ1024GB610T-I/BG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC24FJ1024GB610T-I/BG (mismo factor de forma y huella) — difiere en ADC, Package, I/O Pins, Operating Temperature, Program Memory (Flash).
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC24FJ1024GB610-I/BG
✅ Sustitución directa✓ En stock
$7.44 / unidad
Ver hoja de datos →PIC24FJ1024GA610T-I/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.85 / unidad
Ver hoja de datos →PIC24FJ1024GA610-I/BG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$8.2 / unidad
Ver hoja de datos →PIC24FJ1024GA610-E/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$7.92 / unidad
Ver hoja de datos →PIC24EP512GU810-I/PF
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$7.36 / unidad
Ver hoja de datos →PIC24EP256GU810T-I/BG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.8 / unidad
Ver hoja de datos →PIC24FJ1024GB610T-I/BG Valores máximos y características eléctricas
| Core | PIC24F (16-bit modified Harvard) |
| CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 1 MB (341.5K x 24) |
| Data SRAM | 32 KB |
| Encapsulado | 121-pin TFBGA, 10 x 10 mm |
| Tensión de alimentación | 2.5 V / 3.3 V |
| Temperatura de funcionamiento | -40C to +85C (Industrial) |
| ADC | 24-channel, 12-bit, 500 ksps |
| DMA Channels | 8 |
| USB | USB-OTG with on-chip transceiver |
| I/O Pins | Up to 85 (5 V tolerant) |
| Cryptographic Engine | AES, DES, MD5/SHA (hardware) |
| Configurable Logic Cells | Yes |
| Peripheral Pin Select (PPS) | Yes (remappable digital peripherals) |
| Parallel Master Port (PMP) | Yes |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 3 (168 hours) |
| Estado RoHS | Compliant |
Guía de configuración de pines de PIC24FJ1024GB610T-I/BG 121-pin tfbga, 10 x 10 mm
Configuración de pines para PIC24FJ1024GB610T-I/BG (encapsulado 121-pin tfbga, 10 x 10 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para PIC24FJ1024GB610T-I/BG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PIC24FJ1024GB610T-I/BG es adecuado para 6 aplicacións: USB HID Peripheral (Keyboard/Mouse/Gamepad), Secure IoT Edge Node (TLS/LoRa Sensor), Industrial Process Sensor Acquisition, Graphical HMI Panel with PMP TFT, Battery-Backed Smart Meter, Audio Processing / USB Speaker Dock.
USB HID Peripheral (Keyboard/Mouse/Gamepad)
The PIC24FJ1024GB610T-I/BG is ideal for USB Human Interface Devices due to its integrated USB-OTG with on-chip transceiver (no external PHY required) and 1 MB Flash for storing HID report descriptors and bootloader images. With 16 MIPS throughput, it sustains polling rates above 1 kHz on 32 endpoints while leaving CPU bandwidth for key matrix scanning. The 32 KB SRAM backbuffers USB control transfers and HID report FIFOs without DMA thrash. Compared to external-FTDI-style designs, the on-chip USB module cuts BOM cost by $1-2 per unit. Pair it with the MLA USB HID stack and an external USB-C connector; the integrated 5 V-tolerant I/O and on-chip pull-up/pull-down resistors mean no external level shifting is required per Microchip datasheet DS30010074F.
Recomendado
Secure IoT Edge Node (TLS/LoRa Sensor)
The PIC24FJ1024GB610T-I/BG integrates a hardware Cryptographic Engine supporting AES, DES, MD5, and SHA-1/SHA-256, making it well-suited for secure IoT sensor nodes where TLS handshake latency must be minimized. Running at 16 MIPS with DMA offloads, the core can complete an AES-128 block in ~3 us, accelerating DTLS handshake times on resource-constrained stacks. eXtreme Low Power sleep modes drop quiescent current below 1 uA with RTCC active, extending battery life to multi-year duty cycles. The 24-channel 12-bit ADC and 5 V-tolerant I/O simplify connection to analog sensor front-ends. Compared with software AES on Cortex-M0+, the on-chip engine reduces wake time by ~70 percent, directly reducing energy per MSPAC ESP transaction per Microchip datasheet DS30010074F.
Recomendado
Industrial Process Sensor Acquisition
The PIC24FJ1024GB610T-I/BG is designed for industrial sensor front-ends requiring multi-channel analog acquisition, with 24 channels of 12-bit ADC at 500 ksps aggregate rate and 8 DMA channels that move conversion data into SRAM without CPU overhead. Its -40C to +85C industrial operating range suits factory-floor deployment, and the 5 V-tolerant I/O enables direct connection to 4-20 mA loops and 0-10 V transducers without external signal conditioning. Configurable Logic Cells (CLC) implement custom timing/sequencing logic in hardware, replacing small CPLDs on the PCB. Compared to MCU+external MUX designs, the 24 single-ended / 12 differential channels reduce BOM cost by approximately $0.80 and shrink PCB area by 30 percent per Microchip datasheet DS30010074F.
Recomendado
Graphical HMI Panel with PMP TFT
The PIC24FJ1024GB610T-I/BG features a Parallel Master Port (PMP) capable of driving TFT LCDs up to 480x272 resolution in 8-bit parallel mode, making it a good fit for graphical HMI panels in appliances and instrument front panels. With 1 MB Flash, full-frame bitmaps and font tables can be stored on-chip without external serial flash; the 32 KB SRAM backbuffers double-buffer redraws without flicker. DMA moves PMP transactions in parallel with ADC sampling. Compared to UART-only LCD controllers, PMP at 30 MHz pixel throughput eliminates the bottleneck on animated gauges. The mTouch capacitive sensing capability, combined with CLC for noise filtering, also eliminates external touch ICs per Microchip datasheet DS30010074F.
Recomendado
Battery-Backed Smart Meter
The PIC24FJ1024GB610T-I/BG belongs to Microchip's eXtreme Low Power XLP family, achieving sleep currents below 1 uA with RTCC operating, which is critical for battery-backed smart meters expected to run 10+ years on a single primary cell. The integrated 12-bit ADC with CTMU support enables tamper detection and self-calibration of metrology sensors. The Cryptographic Engine authenticates firmware updates and signs measurements for tamper-evident logging. With 1 MB Flash, metering stacks, regulatory tables, and signed firmware images all fit on-chip. Compared to ARM Cortex-M0+ equivalents, the XLP retention modes offer approximately 30 percent lower quiescent draw and superior RTC accuracy per Microchip datasheet DS30010074F and AN1894.
Recomendado
Audio Processing / USB Speaker Dock
The PIC24FJ1024GB610T-I/BG is suitable for USB speaker docks and audio playback peripherals due to its USB-OTG device-mode support (full-speed, 12 Mbps), 1 MB Flash for storing firmware upgrade images and audio codecs, and DMA-driven I2S/SSP peripherals for external DACs. The 16 MIPS throughput sustains sample-rate conversion at 48 kHz/24-bit while leaving bandwidth for user-interface handling. Compared to designs requiring an external USB controller, integrating USB on-chip saves approximately $1.20 BOM cost and reduces PCB area. The 5 V-tolerant I/O simplifies LED ring driving; the CLC on USB bridges sample-rate mismatches without CPU intervention per Microchip datasheet DS30010074F.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC24FJ1024GB610T-I/BG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC24FJ1024GB610-I/BG | PIC24FJ1024GA610T-I/PT | PIC24FJ1024GA610-I/BG | PIC24EP256GU810T-I/BG |
|---|---|---|---|---|---|
| Package | 121-pin TFBGA (10x10 mm) | 121-pin TFBGA (10x10 mm) - same | 100-pin TQFP - different | 121-pin TFBGA (10x10 mm) - same | 121-pin TFBGA - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 1 MB | 1 MB | 1 MB | 1 MB | 256 KB |
| Data SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| CPU Core / Speed | PIC24F / 32 MHz (16 MIPS) | PIC24F / 32 MHz | PIC24F / 32 MHz | PIC24F / 32 MHz | PIC24EP / 70 MIPS |
| Cryptographic Engine | Yes (AES/DES/SHA hardware) | Yes | No | No | No |
| ADC Channels | 24 x 12-bit | 24 x 12-bit | 24 x 12-bit | 24 x 12-bit | 16 x 12-bit |
| USB Support | USB-OTG (Host/Device/OTG) | USB-OTG | USB-OTG | USB-OTG | USB-OTG |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Diferenciadores clave
- Integrated Cryptographic Engine (frente a PIC24FJ1024GA610T-I/PT)
- Highest flash density in PIC24F GB610 family (frente a PIC24EP256GU810T-I/BG)
- Same die, multiple packaging options (frente a PIC24FJ1024GB610-I/BG)
- Highest peripheral integration in class (frente a PIC24FJ1024GA610T-I/PT)
Notas de diseño
Decoupling: place a 10 uF bulk + 0.1 uF ceramic pair within 5 mm of each VDD/VSS pair on the PIC24FJ1024GB610T-I/BG. Multiple VDD/VSS pins exist on the 121-TFBGA footprint; do not share decoupling capacitors between pairs - this causes ground bounce on high-speed ADC conversions. Estimated: at full 32 MHz CPU + USB active + ADC sampling, peak core current approaches 70 mA; the 10 uF cap maintains ripple under 50 mV.
The 121-pin TFBGA (10x10 mm) has theta_JA of approximately 30 C/W per Microchip datasheet DS30010074F. At 70 mA core current, worst-case power is around 230 mW (3.3 V x 0.07 A), which yields a junction rise of ~7 C above ambient. No external heatsink is needed, but ensure the GND center balls are stitched with thermal vias to inner planes to keep the die substrate cool for ADC accuracy.
TFBGA escape: the 0.8 mm pitch 121-ball array requires micro-via-in-pad on the inner ball rows. Use 0.2 mm laser-drilled vias plugged with copper, plated shut, and then re-pad. Standard 0.3 mm through-vias in pad will cause solder joint voids and open BGA balls. Estimated: route two layers out, fan-out to inner rows on layer 3 and 4. Refer to Microchip AN1292 for the recommended escape pattern.
Peripheral Pin Select (PPS) lock must be called once in firmware to prevent accidental remapping at runtime. Plan the PPS map before PCB layout - if PMP and USB coexist, both compete for the same I/O banks; assign them up front or you will discover in firmware bring-up that some pins cannot be remapped simultaneously. CLC inputs also pull from PPS outputs, so document the map before routing.
Do not exceed the 4 mA source/sink rating per I/O. The PIC24FJ1024GB610T-I/BG datasheet warns that driving LEDs directly on RB15-RB7 without a series resistor may exceed the latch-up current. For USB, the VUSB pin requires a 220 nF decoupling cap and the D+/D- lines must be 90 ohm differential impedance-controlled, not 45 ohm - a common mistake that fails USB compliance testing per Microchip datasheet DS30010074F.
Información de cumplimiento
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; this is an industrial-grade PIC24F part. Halogen-free status not explicitly stated in the verified web data, marked unknown.
