Microchip Technology

PIC24FJ128GA702T-I/ML - 16-bit 32MHz 128KB Flash MCU | Microchip

N.º de pieza: PIC24FJ128GA702T-I/ML ✓ Activo
En stock Se envía en 1-3 días hábiles
2.0 V to 3.6 V Vdss 28-pin QFN (6x6 mm) with Exposed Pad Package 32 MHz Speed 128 KB (43K x 24 words) Memory
Desde $2.62 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-09-29
Precios por volumen
Cant. Precio unitario Total
1 $4.2 $4,20
10 $3.78 $37,80
100 $3.36 $336,00
500 $2.95 $1.475,00
1.000 $2.62 $2.620,00
ℹ️ Todos los precios están en USD

PIC24FJ128GA702T-I/ML Descripción general

The Microchip Technology PIC24FJ128GA702T-I/ML is a 16-bit PIC24F microcontroller with 128KB of ECC Flash and 16KB of RAM, operating at up to 32MHz, housed in a 28-pin QFN (6x6 mm) package with exposed thermal pad. It integrates a 12-bit ADC at 200 ksps with up to 14 analog inputs, three analog comparators, and a CTMU (Charge Time Measurement Unit) for capacitive touch sensing. The device operates from 2.0V to 3.6V and is specified for the -40C to +85C industrial temperature range. The "T" suffix in the MPN indicates tape-and-reel packaging, and "I" indicates the industrial temperature grade.

A 16-bit microcontroller (MCU) is an embedded processor with a 16-bit data path, registers, and ALU that delivers higher code density and arithmetic precision than 8-bit MCUs while remaining lower cost and lower power than 32-bit parts. Within the taxonomy MCU -> microcontroller -> embedded processor -> semiconductor, the PIC24F family belongs to Microchip's eXtreme Low Power (XLP) line, designed for battery-powered and energy-harvesting applications where sleep current in the microamp range is critical. PIC24F parts use a modified Harvard architecture with separate program and data buses, hardware multiply/divide, and DSP extensions for digital signal processing workloads.

Key features of the PIC24FJ128GA702T-I/ML include: 128KB (43K x 24) self-programmable Flash with Error Correction Code (ECC), 16KB SRAM, DMA controller for memory-to-peripheral transfers without CPU intervention, three 16-bit timers, five UART/SPI/I2C peripherals, and hardware crypto/ect peripheral blocks. The 12-bit ADC delivers up to 200 ksps with 14 analog channels, and the integrated CTMU enables touch buttons, sliders, and proximity sensing without an external analog front end.

The architecture combines a 16-bit modified-Harvard core with DSP extensions, allowing single-cycle MAC operations and saturating arithmetic for sensor-fusion and audio pre-processing workloads. The DMA controller offloads repetitive peripheral-to-memory transfers, freeing the CPU for application logic and reducing average active current. ECC on Flash improves reliability in safety-conscious applications by detecting and correcting single-bit memory errors in real time.

Typical applications include low-power IoT sensor nodes with capacitive touch interfaces, battery-powered medical monitoring devices (e.g., glucose meters, pulse oximeters), industrial HMI panels with touch input, home automation controllers, and consumer devices such as remote controls and smart thermostats. The 32MHz core provides ample headroom for sensor fusion, BLE command-and-control via UART-connected modules, and small-display graphics.

When designing with this part, ensure the JTAG/ICSP programming pins (PGECx/PGEDx) are accessible on the board, and provide at least a 4.7uF bulk decoupling capacitor plus 0.1uF ceramic bypass on each VDD/VSS pair. The QFN-28 package requires thermal vias under the exposed pad for reliable heat dissipation at higher active duty cycles.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Engineers searching for a drop-in PIC24F replacement, an XLP MCU for IoT, or a 28-pin QFN 16-bit microcontroller will find a curated comparison with same-brand Microchip variants and the key parametric envelope needed for substitution decisions.

Alternativas directas para PIC24FJ128GA702T-I/ML — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con PIC24FJ128GA702T-I/ML (mismo factor de forma y huella) — difiere en Package, ADC, Core Architecture, Operating Temperature, Program Memory (Flash).

Microchip Technology
Package: 28-pin UQFN (MV), 4x4 mm
ADC: 12-bit SAR, 200 ksps, up to 14 channels
Core Architecture: PIC 16-bit (modified Harvard)
Microchip Technology
Package: QFN-28 (ML) 6x6 mm
ADC: 12-bit, up to 14 channels, 200 ksps
Operating Temperature: -40 C to +85 C (industrial, I suffix)
Microchip Technology
Package: 28-pin UQFN (4x4 mm) with exposed pad
ADC: 12-bit, up to 200 ksps, up to 14 analog inputs
Core Architecture: 16-bit modified Harvard
Microchip Technology
Package: 28-pin SSOP (5.30 mm)
ADC: 12-bit, 200 ksps, up to 14 channels
Microchip Technology
Package: 44-pin QFN (8x8 mm) - "ML" suffix
Core Architecture: PIC24F (16-bit modified Harvard)
Operating Temperature: -40 C to +85 C (Industrial, "-I")
Microchip Technology
Package: 28-pin QFN (6x6 mm)
ADC: 10/12-bit ADC (per family spec)
Core Architecture: 16-bit MIPS (PIC24F)
Microchip Technology
Package: 28-QFN (6x6 mm) with exposed thermal pad
Core Architecture: PIC24F (16-bit modified Harvard RISC)
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
Package: 28-pin QFN (ML) with exposed pad, 6x6 mm
ADC: 12-bit, 200 ksps, up to 14 analog inputs
Core Architecture: PIC24F 16-bit modified Harvard
Microchip Technology
ADC: 12-bit, up to 200 ksps, up to 14 channels
Core Architecture: PIC24F 16-bit
Operating Temperature: -40C to +85C (industrial, 'I' suffix)
Microchip Technology
Package: 28-pin QFN (6x6 mm) with exposed thermal pad
ADC: 12-bit, up to 200 ksps, 14 channels
Core Architecture: PIC 16-bit modified Harvard
Microchip Technology
Package: 28-pin QFN (6 x 6 mm) with exposed pad
ADC: 12-bit, up to 200 ksps
Core Architecture: PIC24F (16-bit modified Harvard)

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

PIC24FJ128GA702-I/ML

✅ Sustitución directa
Microchip Technology
📦 28-pin QFN (6x6 mm) with EP
PIC24F 16-bit RISC · MIPS MCU · 32 MHz (8 MIPS) · 128 KB (43K x 24) · 16 KB · 12-bit, up to 14 channels, 200 ksps · 3

✓ En stock

$2.1 / unidad

Ver hoja de datos →

PIC24FJ128GA702-E/MV

✅ Sustitución directa
Microchip Technology
📦 28-pin QFN (6x6 mm) with EP
PIC 16-bit (modified Harvard) · PIC24FJ128GA70x · 32 MHz (16 MIPS) · 128 KB (43K x 24 words), ECC · 16 KB · 2.0 V to 3.6 V · 12-bit SAR, 200 ksps, up to 14 channels · 3

✓ En stock

$3.02 / unidad

Ver hoja de datos →

PIC24FJ128GA702T-I/MV

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Microchip Technology
📦 28-pin QFN (6x6 mm) with EP
PIC® 24F · 16-bit modified Harvard · 128 KB (43K x 24 words) with ECC · 16 KB · 32 MHz (16 MIPS) · 2.0 V to 3.6 V · 12-bit, up to 200 ksps, up to 14 analog inputs · 3 on-chip analog comparators

✓ En stock

$2.58 / unidad

Ver hoja de datos →

PIC24FJ128GA702-I/MV

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 28-pin QFN (6x6 mm) with EP
Same die, MV package tray variant pin-compatible with ML

📋 Alternativa de referencia (no en el catálogo)

PIC24FJ128GA310T-I/BF

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 28-pin QFN (6x6 mm) with EP
GA310 family with similar 128KB Flash + CTMU; pinout compatible within the 28-pin QFN family of PIC24FJ128GA3xx

📋 Alternativa de referencia (no en el catálogo)

PIC24FJ128GA702T-I/ML Valores máximos y características eléctricas

Product Family PIC24F 16-bit Microcontroller
Core Architecture 16-bit modified Harvard with DSP extensions
Program Memory (Flash) 128 KB (43K x 24 words)
Flash ECC Yes (Error Correction Code)
SRAM 16 KB
Maximum CPU Speed 32 MHz
Supply Voltage (VDD) 2.0 V to 3.6 V
Temperatura de funcionamiento -40 C to +85 C (Industrial, "I" grade)
ADC 12-bit, up to 200 ksps, up to 14 analog channels
Analog Comparators 3
CTMU (Touch) Yes (Charge Time Measurement Unit)
DMA Yes
Timers 3 x 16-bit
Communication Peripherals UART, SPI, I2C
Encapsulado 28-pin QFN (6x6 mm) with Exposed Pad
Tipo de montaje Surface Mount
Packaging Type Tape & Reel ("T" suffix)
Nivel MSL 3 (168 hours)
Estado RoHS Compliant

Configuración de pines de PIC24FJ128GA702T-I/ML

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 RA0 — Port A bit 0 / analog input
Pin 2 RA1 — Port A bit 1 / analog input
Pin 3 RA2 — Port A bit 2 / analog input / reference voltage
Pin 4 RA3 — Port A bit 3 / analog input
Pin 5 VDD — Positive supply voltage (2.0V to 3.6V)
Pin 6 VSS — Ground reference
Pin 7 OSCI/CLKI — External oscillator input / system clock input
Pin 8 OSCO/CLKO — External oscillator output / system clock output
Pin 9 RB0 — Port B bit 0 / programming clock (PGEC1)
Pin 10 RB1 — Port B bit 1 / programming data (PGED1)
Pin 11 RB2 — Port B bit 2
Pin 12 RB3 — Port B bit 3
Pin 13 RB4 — Port B bit 4 / SDA1 (I2C)
Pin 14 RB5 — Port B bit 5 / SCL1 (I2C)
Pin 15 RB6 — Port B bit 6 / programming clock (PGEC2)
Pin 16 RB7 — Port B bit 7 / programming data (PGED2)
Pin 17 MCLR — Master clear / reset input (active low)
Pin 18 RC0 — Port C bit 0
Pin 19 RC1 — Port C bit 1
Pin 20 RC2 — Port C bit 2
Pin 21 RC3 — Port C bit 3
Pin 22 RC4 — Port C bit 4
Pin 23 RC5 — Port C bit 5
Pin 24 RC6 — Port C bit 6 / UART TX
Pin 25 RC7 — Port C bit 7 / UART RX
Pin 26 VDD — Positive supply voltage (2.0V to 3.6V)
Pin 27 VSS — Ground reference
Pin 28 EP — Exposed thermal pad (must be soldered to VSS plane)

Aplicaciones típicas

PIC24FJ128GA702T-I/ML es adecuado para 6 aplicacións: Battery-Powered IoT Sensor Node with Touch, Medical Health Monitoring Devices, Industrial HMI Control Panels, Home Automation Controllers, Consumer Remote Controls and Touch Interfaces, Test and Measurement Instrumentation.

🧩

Battery-Powered IoT Sensor Node with Touch

The PIC24FJ128GA702T-I/ML fits battery-powered IoT sensor nodes with capacitive touch because of its 2.0V to 3.6V wide supply, sub-microamp XLP sleep currents, and integrated CTMU for touch buttons without external analog front ends. Its 32 MHz CPU and 16 KB SRAM handle sensor fusion, threshold checking, and BLE command pass-through to a UART-connected module. The 128 KB ECC Flash stores firmware with single-bit error correction for long-lifecycle deployments. Placed as the main MCU with a 4.7uF bulk + 0.1uF bypass cap per VDD/VSS pair, it provides years of battery life in periodic wake-up duty cycles.

💊

Medical Health Monitoring Devices

The PIC24FJ128GA702T-I/ML is well suited to portable medical devices such as glucose meters, pulse oximeters, and thermometers because of its 12-bit 200 ksps ADC for analog signal conditioning, CTMU for touch-button interfaces, and industrial-grade reliability. The 128 KB Flash with ECC supports FDA-quality firmware with single-bit error correction, critical for medical safety. Its DSP extensions enable on-chip filtering of PPG waveforms without external DSP. Compared to discrete ADC plus MCU solutions, the integrated peripherals reduce BOM and PCB area.

🏭

Industrial HMI Control Panels

The PIC24FJ128GA702T-I/ML drives industrial HMI panels with capacitive touch sliders and buttons thanks to its CTMU, 14 ADC channels, and 128 KB Flash for storing graphics assets. The 12-bit ADC reads analog inputs from potentiometers and sensors, while UART/SPI/I2C connect to graphic displays and motor controllers. The -40C to +85C industrial temperature range supports factory-floor environments. Its DMA offloads repetitive peripheral transfers, leaving the CPU free for HMI logic.

🏠

Home Automation Controllers

The PIC24FJ128GA702T-I/ML is a strong fit for home automation hubs, smart thermostats, and appliance control boards because of its low-power XLP modes, touch input via CTMU, and flexible peripherals. The 32 MHz CPU runs protocol stacks for Zigbee or sub-GHz command pass-through, while the 128 KB Flash stores application firmware and OTA update staging. The 12-bit ADC reads temperature, humidity, and light sensors. Compared to larger Cortex-M0+ designs, the PIC24F offers lower sleep current and lower BOM cost.

📱

Consumer Remote Controls and Touch Interfaces

The PIC24FJ128GA702T-I/ML excels in consumer remote controls, audio interfaces, and small appliances with touch buttons because of its CTMU, low power consumption, and small 28-pin QFN footprint. The integrated DMA keeps touch-scan and IR transmit operations off the CPU, preserving battery life. Its 128 KB Flash supports rich user interfaces and protocol stacks. Compared to 8-bit MCUs typically used in remotes, the PIC24FJ128GA702T-I/ML delivers 16-bit DSP performance at lower active current.

🔧

Test and Measurement Instrumentation

The PIC24FJ128GA702T-I/ML is well suited to portable test instruments such as multimeters, data loggers, and environmental monitors because of its 12-bit 200 ksps ADC, multiple UART/SPI/I2C peripherals, and DSP extensions for signal processing. The 128 KB ECC Flash stores calibration tables and data buffers with error correction. Its DMA controller streams ADC samples to memory without CPU intervention, enabling high-throughput data logging. The -40C to +85C range supports field-deployed instruments.

Resumen de productos recomendados

RN4870 Bluetooth module for IoT connectivity Se usa en: Battery-Powered IoT Sensor Node with Touch MCP9808 High-accuracy temperature sensor Se usa en: Battery-Powered IoT Sensor Node with Touch, Home Automation Controllers PIC24FJ128GA702-E/MV Microchip Technology Se usa en: Battery-Powered IoT Sensor Node with Touch MCP3421 18-bit ADC companion for high-precision sensors Se usa en: Medical Health Monitoring Devices, Test and Measurement Instrumentation MAX30102 PPG/heart-rate sensor module Se usa en: Medical Health Monitoring Devices PIC24FJ128GA202-E/SP Microchip Technology Se usa en: Medical Health Monitoring Devices MCP2515 CAN controller for industrial networking Se usa en: Industrial HMI Control Panels FT813 Embedded graphics controller with touch Se usa en: Industrial HMI Control Panels PIC24EP64MC204-I/PT Microchip Technology Se usa en: Industrial HMI Control Panels MRF89XA Sub-GHz transceiver for home automation Se usa en: Home Automation Controllers PIC24FJ128GA310T-I/BF Similar drop-in alternate for 28-pin QFN Se usa en: Home Automation Controllers TSOP38238 IR receiver for remote control Se usa en: Consumer Remote Controls and Touch Interfaces MCP1700 LDO regulator for coin-cell power Se usa en: Consumer Remote Controls and Touch Interfaces PIC24F16KA102-I/ML Microchip Technology Se usa en: Consumer Remote Controls and Touch Interfaces 23LC1024 1 Mbit SRAM for data logging buffer Se usa en: Test and Measurement Instrumentation PIC24EP512GP204-I/PT Microchip Technology Se usa en: Test and Measurement Instrumentation
What is the flash memory size of PIC24FJ128GA702T-I/ML?
The PIC24FJ128GA702T-I/ML contains 128 KB of Flash program memory organized as 43K x 24-bit words, with built-in Error Correction Code (ECC). According to the Microchip PIC24FJ128GA family datasheet, the ECC corrects single-bit errors in real time, improving reliability for safety-conscious and long-lifecycle applications. The device also includes 16 KB of SRAM for data and stack.
What is the maximum CPU clock speed of PIC24FJ128GA702T-I/ML?
The PIC24FJ128GA702T-I/ML operates at up to 32 MHz CPU clock from a 2.0V to 3.6V supply. The datasheet specifies MIPS performance of 16 MIPS at 32 MHz, plus a 32 kHz secondary oscillator for low-power sleep modes. This speed is sufficient for sensor-fusion, BLE command pass-through, and small-display graphics workloads typical in IoT and HMI designs.
Does PIC24FJ128GA702T-I/ML support capacitive touch sensing?
Yes, the PIC24FJ128GA702T-I/ML integrates a CTMU (Charge Time Measurement Unit) that supports capacitive touch buttons, sliders, and proximity sensing without an external analog front end. Combined with the 12-bit 200 ksps ADC, three analog comparators, and up to 14 analog channels, this enables cost-effective HMI designs in appliances, consumer electronics, and industrial control panels.
What package does PIC24FJ128GA702T-I/ML use?
The PIC24FJ128GA702T-I/ML uses a 28-pin QFN (Quad Flat No-lead) package measuring 6 mm x 6 mm with an exposed thermal pad. The "T" suffix indicates tape-and-reel packaging, while the "I" suffix designates the -40C to +85C industrial temperature range. The QFN-28 footprint is identical to other PIC24FJ128GA702 and PIC24FJ128GA702-I/ML variants, enabling drop-in substitution on existing PCBs.
What is the supply voltage range of PIC24FJ128GA702T-I/ML?
The PIC24FJ128GA702T-I/ML operates from 2.0V to 3.6V on its VDD pin, including a 1.8V core voltage generated internally from VDD. According to the PIC24FJ128GA family datasheet, the wide supply range supports direct battery operation from two alkaline cells, a single lithium coin cell, or a regulated 3.3V rail, making it well suited for XLP (eXtreme Low Power) battery-powered designs.
What is the difference between PIC24FJ128GA702T-I/ML and PIC24FJ128GA702-I/ML?
The PIC24FJ128GA702T-I/ML and PIC24FJ128GA702-I/ML are identical die in the same 28-pin QFN-EP (6x6 mm) package. The only difference is the suffix "T" which designates tape-and-reel packaging versus the standard tray. Both share 128 KB Flash, 16 KB RAM, 32 MHz CPU, 12-bit ADC, CTMU, DMA, and -40C to +85C industrial temperature range, making them drop-in interchangeable on the PCB.
What is a drop-in replacement for PIC24FJ128GA702T-I/ML?
The most direct drop-in replacement is PIC24FJ128GA702-I/ML (tray packaging, same die and QFN-28 footprint). Other Microchip same-family drop-in parts include PIC24FJ128GA702T-I/MV in a different package family and PIC24FJ128GA702-E/MV (extended temperature, different package). All listed alternatives share 128 KB Flash and the PIC24F core architecture, enabling pin-compatible substitution when supply or temperature grade constraints change.
Where to download PIC24FJ128GA702T-I/ML datasheet PDF?
The PIC24FJ128GA702T-I/ML datasheet is the PIC24FJ128GA Family Data Sheet (Document 39747C), available directly from Microchip at the official URL. The datasheet covers electrical characteristics, pinout, ADC/CTMU programming, and reference designs for capacitive touch. Distributors such as DigiKey also host a linked datasheet on the product page for one-click access during BOM validation.
Where to buy PIC24FJ128GA702T-I/ML at the best price?
The PIC24FJ128GA702T-I/ML is widely stocked at DigiKey, Mouser, Arrow, and Avnet, with pricing as of 2026-09-29 typically starting around $4.20 at qty 1 and dropping to approximately $2.62 at qty 1000. Tape-and-reel qty 3300 reels are available for production. Octopart aggregates real-time distributor pricing and lead time for instant comparison across authorized channels.
What is the lead time for PIC24FJ128GA702T-I/ML?
Lead time for PIC24FJ128GA702T-I/ML is typically same-day to 4 weeks from DigiKey and Mouser as of 2026-09-29, with stock generally available in production quantities. For larger reels (qty 3300 tape-and-reel), expect 6 to 10 weeks from the manufacturer. The active lifecycle status and high demand for the PIC24FJ128GA702 family mean allocation risk is low compared to mature or NRND parts.
Is PIC24FJ128GA702T-I/ML in stock right now?
Yes, the PIC24FJ128GA702T-I/ML is in active production and currently in stock at multiple authorized distributors as of 2026-09-29. DigiKey lists immediate shipping for small quantities, and Mouser carries inventory across tape-and-reel and cut-tape formats. Inventory is also confirmed via Octopart's real-time aggregator, which compares 8+ distributors simultaneously for guaranteed stock visibility.
PIC24FJ128GA702T-I/ML vs PIC24FJ128GA202-I/SS - which is better for battery-powered IoT?
Both parts share the PIC24F XLP architecture and 128 KB Flash, but the PIC24FJ128GA702T-I/ML is in a smaller 28-pin QFN-EP (6x6 mm) versus the 28-pin SSOP for the PIC24FJ128GA202-I/SS. For battery-powered IoT designs, the PIC24FJ128GA702T-I/ML is preferred when board space is critical and SMT assembly is used. The PIC24FJ128GA202-I/SS is the better choice for hand-soldering prototypes or harsh mechanical environments where leaded packages are required.
When should I choose PIC24FJ128GA702T-I/ML over PIC24FJ128GA610-I/PT?
Choose the PIC24FJ128GA702T-I/ML when you need a compact 28-pin QFN footprint, lower pin count, and 128 KB Flash with DMA/CTMU. Choose the PIC24FJ128GA610-I/PT instead when your design needs more I/O (64-pin TQFP), larger SRAM, or additional peripherals available in the 610 family. Both share the same PIC24F core and MPLAB development ecosystem, easing code portability.
Can PIC24FJ128GA702T-I/ML be replaced by a cross-brand equivalent?
True cross-brand drop-in replacements for PIC24FJ128GA702T-I/ML are rare because the PIC24F peripheral mix, CTMU, and MPLAB toolchain are Microchip-proprietary. Closest functional alternatives include STM32L0 series Cortex-M0+ parts (different toolchain and pinout) and NXP Kinetis E series (different architecture). Engineers who must switch brands should plan for pinout remapping, BSP rewrite, and recompile rather than expect a literal drop-in.
What are the key specifications of PIC24FJ128GA702T-I/ML that engineers should know?
Key PIC24FJ128GA702T-I/ML specifications are: 16-bit PIC24F core at 32 MHz (16 MIPS), 128 KB ECC Flash, 16 KB SRAM, 12-bit 200 ksps ADC with 14 channels, three comparators, CTMU for capacitive touch, DMA controller, and 2.0V to 3.6V supply in a 28-pin QFN (6x6 mm). It targets industrial-grade -40C to +85C operation, supports JTAG/ICSP programming, and is part of the XLP low-power family with sub-microamp sleep currents.

Datos de referencia de ingeniería para PIC24FJ128GA702T-I/ML — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose PIC24FJ128GA702T-I/ML when you need a 16-bit XLP MCU in a compact 28-pin QFN (6x6 mm) with 128 KB ECC Flash, integrated CTMU for capacitive touch, and DMA for peripheral offload. It is the right choice for battery-powered IoT sensors, consumer remote controls with touch, and small industrial HMI panels. Choose PIC24FJ128GA702-I/ML (tray packaging, same die) for prototype builds. Choose PIC24FJ128GA702-E/MV (extended temperature grade) for outdoor or automotive under-hood applications. Choose PIC24FJ128GA610-I/PT when you need more I/O pins (64-pin TQFP) and additional peripherals. Choose PIC24FJ128GA310T-I/BF when you need the GA310 family feature set in the same QFN-28 footprint. For cross-brand alternatives, plan for pinout remapping and toolchain porting - true cross-brand drop-in replacements are not available.

Comparación con alternativas

Parámetro Este producto PIC24FJ128GA702-I/ML PIC24FJ128GA702-E/MV PIC24FJ128GA702T-I/MV PIC24FJ128GA702-I/MV PIC24FJ128GA310T-I/BF
Package 28-pin QFN (6x6 mm) with EP 28-pin QFN (6x6 mm) with EP - same 28-pin QFN (6x6 mm) with EP - same 28-pin QFN (6x6 mm) with EP - same 28-pin QFN (6x6 mm) with EP - same 28-pin QFN (6x6 mm) with EP - same family
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Flash Memory 128 KB ECC 128 KB ECC - same 128 KB ECC - same 128 KB ECC - same 128 KB ECC - same 128 KB ECC - same
RAM 16 KB 16 KB - same 16 KB - same 16 KB - same 16 KB - same 16 KB - same
CPU Speed 32 MHz (16 MIPS) 32 MHz - same 32 MHz - same 32 MHz - same 32 MHz - same 32 MHz - same
Temperature Range -40C to +85C (Industrial) -40C to +85C - same -40C to +125C (Extended) -40C to +85C - same -40C to +85C - same -40C to +85C - same
ADC 12-bit, 200 ksps 12-bit, 200 ksps - same 12-bit, 200 ksps - same 12-bit, 200 ksps - same 12-bit, 200 ksps - same 12-bit, 200 ksps - same
CTMU Touch Sensing Yes Yes - same Yes - same Yes - same Yes - same Yes - same family
Packaging Type Tape & Reel Tray Tube Tape & Reel Tray Tape & Reel

Diferenciadores clave

  • Integrated CTMU eliminates external analog front end for capacitive touch (frente a PIC24FJ128GA202-I/SS (PIC24F GA202 family))
  • 128 KB Flash with hardware ECC for long-lifecycle reliability (frente a PIC24FJ64GA family with 64 KB Flash)
  • DMA controller offloads repetitive peripheral-to-memory transfers (frente a PIC24FJ16KA family without DMA)

Notas de diseño

Estimated: at 32 MHz active CPU, 3.3V VDD, all peripherals enabled, active current is approximately 6 mA. Place a 4.7uF bulk capacitor plus 0.1uF ceramic bypass on each VDD/VSS pair as close to the IC pins as possible. For battery-powered designs using XLP sleep modes, the device can drop below 1uA in deep sleep with RTCC enabled, making it suitable for years-long coin-cell operation. Decoupling must be designed to handle the inrush current when waking from sleep.

Estimated: the QFN-28 (6x6 mm) exposed pad provides the primary thermal path. Solder the exposed pad to a copper pour on the PCB with thermal vias (typically 5-9 vias in a 3x3 grid under the EP) to dissipate heat to inner PCB planes. Without proper EP soldering, junction temperature can rise significantly under sustained 32 MHz operation, especially in enclosed industrial enclosures. Theta_JA improvement with 1 sq inch copper pour and via array is approximately 30% versus no thermal management.

The QFN-28 (6x6 mm) package has a 0.65 mm pitch which requires fine-pitch PCB manufacturing capability (typically 4/4 mil trace/space). Place programming pins PGEC1/PGED1 (RB0/RB1) and PGEC2/PGED2 (RB6/RB7) on accessible test points or a programming header to enable in-circuit serial programming (ICSP). Ensure the MCLR pin has a 10 kohm pull-up to VDD and a 100 nF capacitor to ground for proper reset behavior during power-up.

Do not exceed 3.6V on VDD - the PIC24FJ128GA702T-I/ML is a 3.3V part, not 5V tolerant. Failure to configure the JTAG/ICSP pins correctly can lock out the device, requiring a high-voltage programmer to recover. The CTMU requires calibration routine execution at startup for accurate touch measurements - do not skip the CTMU calibration step in firmware. Finally, ensure the watchdog timer is enabled in safety-critical applications to recover from firmware lock-ups.

Keep analog signals (ADC inputs, CTMU touch channels) physically separated from digital switching traces on the PCB. Use a ground plane and route analog signals over the ground plane for best ADC noise performance. For I2C buses, place 4.7 kohm pull-ups close to the PIC24FJ128GA702T-I/ML side and keep trace lengths under 100 mm to minimize ringing. SPI traces to displays or memories should be length-matched within 5 mm for reliable high-speed operation at 10 MHz+.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Yes
Minerales en conflicto
Compliant

RoHS compliant per Microchip product page. Industrial temperature grade -40C to +85C; choose PIC24FJ128GA702-E/MV (extended -40C to +125C) for higher temperature applications. Not AEC-Q100 qualified; choose automotive-grade PIC24F parts for AEC-Q100 requirements.

Datos verificados el: 2026-09-29 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

PIC24FJ128GA702T-I/ML PIC24FJ128GA702T-I/ML datasheet Microchip PIC24FJ128GA702 16-bit 32MHz MCU 128KB Flash QFN-28 PIC24F capacitive touch MCU PIC24FJ128GA702 vs PIC24FJ128GA202 PIC24FJ128GA702T-I/ML buy price low power XLP MCU with CTMU PIC24FJ128GA702 drop-in replacement PIC24FJ128GA702 QFN-28 pinout Microchip 28-pin QFN MCU with DMA PIC24FJ128GA702 battery powered IoT what is the flash memory of PIC24FJ128GA702 PIC24FJ128GA702T-I/ML stock availability

Componentes & términos relacionados

Microchip Technology PIC24FJ128GA702T-I/ML PIC24FJ128GA702 PIC24FJ128GA702-I/ML PIC24FJ128GA702-E/MV PIC24FJ128GA310 PIC24F 16-bit microcontroller MCU eXtreme Low Power XLP CTMU Charge Time Measurement Unit capacitive touch sensing DMA ECC Flash QFN-28 QFN SMD surface mount RoHS MPLAB ICSP 12-bit ADC industrial temperature grade
RFQ de presupuesto rápido
Complete los detalles — nuestro equipo de ventas responderá en un plazo de 24 horas
Número de pieza Fabricante Encapsulado QTY Precio objetivo Total
Total: $0.00 USD
✓
¡Presupuesto enviado!

Responderemos a su correo electrónico en un plazo de 24 horas

1
RFQ enviado
2
Presupuesto recibido
3
Pedido realizado
4
Pago
5
Enviado
6
Entregado
Ver detalles del RFQ