PIC24FJ128GA702T-I/ML - 16-bit 32MHz 128KB Flash MCU | Microchip
MPN: PIC24FJ128GA702T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.36 | $336.00 |
| 500 | $2.95 | $1,475.00 |
| 1,000 | $2.62 | $2,620.00 |
PIC24FJ128GA702T-I/ML Overview
A 16-bit microcontroller (MCU) is an embedded processor with a 16-bit data path, registers, and ALU that delivers higher code density and arithmetic precision than 8-bit MCUs while remaining lower cost and lower power than 32-bit parts. Within the taxonomy MCU -> microcontroller -> embedded processor -> semiconductor, the PIC24F family belongs to Microchip's eXtreme Low Power (XLP) line, designed for battery-powered and energy-harvesting applications where sleep current in the microamp range is critical. PIC24F parts use a modified Harvard architecture with separate program and data buses, hardware multiply/divide, and DSP extensions for digital signal processing workloads.
Key features of the PIC24FJ128GA702T-I/ML include: 128KB (43K x 24) self-programmable Flash with Error Correction Code (ECC), 16KB SRAM, DMA controller for memory-to-peripheral transfers without CPU intervention, three 16-bit timers, five UART/SPI/I2C peripherals, and hardware crypto/ect peripheral blocks. The 12-bit ADC delivers up to 200 ksps with 14 analog channels, and the integrated CTMU enables touch buttons, sliders, and proximity sensing without an external analog front end.
The architecture combines a 16-bit modified-Harvard core with DSP extensions, allowing single-cycle MAC operations and saturating arithmetic for sensor-fusion and audio pre-processing workloads. The DMA controller offloads repetitive peripheral-to-memory transfers, freeing the CPU for application logic and reducing average active current. ECC on Flash improves reliability in safety-conscious applications by detecting and correcting single-bit memory errors in real time.
Typical applications include low-power IoT sensor nodes with capacitive touch interfaces, battery-powered medical monitoring devices (e.g., glucose meters, pulse oximeters), industrial HMI panels with touch input, home automation controllers, and consumer devices such as remote controls and smart thermostats. The 32MHz core provides ample headroom for sensor fusion, BLE command-and-control via UART-connected modules, and small-display graphics.
When designing with this part, ensure the JTAG/ICSP programming pins (PGECx/PGEDx) are accessible on the board, and provide at least a 4.7uF bulk decoupling capacitor plus 0.1uF ceramic bypass on each VDD/VSS pair. The QFN-28 package requires thermal vias under the exposed pad for reliable heat dissipation at higher active duty cycles.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Engineers searching for a drop-in PIC24F replacement, an XLP MCU for IoT, or a 28-pin QFN 16-bit microcontroller will find a curated comparison with same-brand Microchip variants and the key parametric envelope needed for substitution decisions.
Drop-in alternatives for PIC24FJ128GA702T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FJ128GA702T-I/ML (same form factor and footprint) — differing in Package, ADC, Core Architecture, Operating Temperature, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FJ128GA702-I/ML
✅ Drop-In✓ In Stock
$2.1 / Unit
View Datasheet →PIC24FJ128GA702-E/MV
✅ Drop-In✓ In Stock
$3.02 / Unit
View Datasheet →PIC24FJ128GA702T-I/MV
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.58 / Unit
View Datasheet →PIC24FJ128GA702-I/MV
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24FJ128GA310T-I/BF
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24FJ128GA702T-I/ML Maximum Ratings & Electrical Characteristics
| Product Family | PIC24F 16-bit Microcontroller |
| Core Architecture | 16-bit modified Harvard with DSP extensions |
| Program Memory (Flash) | 128 KB (43K x 24 words) |
| Flash ECC | Yes (Error Correction Code) |
| SRAM | 16 KB |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage (VDD) | 2.0 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (Industrial, "I" grade) |
| ADC | 12-bit, up to 200 ksps, up to 14 analog channels |
| Analog Comparators | 3 |
| CTMU (Touch) | Yes (Charge Time Measurement Unit) |
| DMA | Yes |
| Timers | 3 x 16-bit |
| Communication Peripherals | UART, SPI, I2C |
| Package | 28-pin QFN (6x6 mm) with Exposed Pad |
| Mounting Type | Surface Mount |
| Packaging Type | Tape & Reel ("T" suffix) |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
PIC24FJ128GA702T-I/ML Pin Configuration
| Pin 1 | RA0 — Port A bit 0 / analog input |
| Pin 2 | RA1 — Port A bit 1 / analog input |
| Pin 3 | RA2 — Port A bit 2 / analog input / reference voltage |
| Pin 4 | RA3 — Port A bit 3 / analog input |
| Pin 5 | VDD — Positive supply voltage (2.0V to 3.6V) |
| Pin 6 | VSS — Ground reference |
| Pin 7 | OSCI/CLKI — External oscillator input / system clock input |
| Pin 8 | OSCO/CLKO — External oscillator output / system clock output |
| Pin 9 | RB0 — Port B bit 0 / programming clock (PGEC1) |
| Pin 10 | RB1 — Port B bit 1 / programming data (PGED1) |
| Pin 11 | RB2 — Port B bit 2 |
| Pin 12 | RB3 — Port B bit 3 |
| Pin 13 | RB4 — Port B bit 4 / SDA1 (I2C) |
| Pin 14 | RB5 — Port B bit 5 / SCL1 (I2C) |
| Pin 15 | RB6 — Port B bit 6 / programming clock (PGEC2) |
| Pin 16 | RB7 — Port B bit 7 / programming data (PGED2) |
| Pin 17 | MCLR — Master clear / reset input (active low) |
| Pin 18 | RC0 — Port C bit 0 |
| Pin 19 | RC1 — Port C bit 1 |
| Pin 20 | RC2 — Port C bit 2 |
| Pin 21 | RC3 — Port C bit 3 |
| Pin 22 | RC4 — Port C bit 4 |
| Pin 23 | RC5 — Port C bit 5 |
| Pin 24 | RC6 — Port C bit 6 / UART TX |
| Pin 25 | RC7 — Port C bit 7 / UART RX |
| Pin 26 | VDD — Positive supply voltage (2.0V to 3.6V) |
| Pin 27 | VSS — Ground reference |
| Pin 28 | EP — Exposed thermal pad (must be soldered to VSS plane) |
Typical Applications
PIC24FJ128GA702T-I/ML is suitable for 6 applications: Battery-Powered IoT Sensor Node with Touch, Medical Health Monitoring Devices, Industrial HMI Control Panels, Home Automation Controllers, Consumer Remote Controls and Touch Interfaces, Test and Measurement Instrumentation.
Battery-Powered IoT Sensor Node with Touch
The PIC24FJ128GA702T-I/ML fits battery-powered IoT sensor nodes with capacitive touch because of its 2.0V to 3.6V wide supply, sub-microamp XLP sleep currents, and integrated CTMU for touch buttons without external analog front ends. Its 32 MHz CPU and 16 KB SRAM handle sensor fusion, threshold checking, and BLE command pass-through to a UART-connected module. The 128 KB ECC Flash stores firmware with single-bit error correction for long-lifecycle deployments. Placed as the main MCU with a 4.7uF bulk + 0.1uF bypass cap per VDD/VSS pair, it provides years of battery life in periodic wake-up duty cycles.
Recommended
Medical Health Monitoring Devices
The PIC24FJ128GA702T-I/ML is well suited to portable medical devices such as glucose meters, pulse oximeters, and thermometers because of its 12-bit 200 ksps ADC for analog signal conditioning, CTMU for touch-button interfaces, and industrial-grade reliability. The 128 KB Flash with ECC supports FDA-quality firmware with single-bit error correction, critical for medical safety. Its DSP extensions enable on-chip filtering of PPG waveforms without external DSP. Compared to discrete ADC plus MCU solutions, the integrated peripherals reduce BOM and PCB area.
Recommended
Industrial HMI Control Panels
The PIC24FJ128GA702T-I/ML drives industrial HMI panels with capacitive touch sliders and buttons thanks to its CTMU, 14 ADC channels, and 128 KB Flash for storing graphics assets. The 12-bit ADC reads analog inputs from potentiometers and sensors, while UART/SPI/I2C connect to graphic displays and motor controllers. The -40C to +85C industrial temperature range supports factory-floor environments. Its DMA offloads repetitive peripheral transfers, leaving the CPU free for HMI logic.
Recommended
Home Automation Controllers
The PIC24FJ128GA702T-I/ML is a strong fit for home automation hubs, smart thermostats, and appliance control boards because of its low-power XLP modes, touch input via CTMU, and flexible peripherals. The 32 MHz CPU runs protocol stacks for Zigbee or sub-GHz command pass-through, while the 128 KB Flash stores application firmware and OTA update staging. The 12-bit ADC reads temperature, humidity, and light sensors. Compared to larger Cortex-M0+ designs, the PIC24F offers lower sleep current and lower BOM cost.
Recommended
Consumer Remote Controls and Touch Interfaces
The PIC24FJ128GA702T-I/ML excels in consumer remote controls, audio interfaces, and small appliances with touch buttons because of its CTMU, low power consumption, and small 28-pin QFN footprint. The integrated DMA keeps touch-scan and IR transmit operations off the CPU, preserving battery life. Its 128 KB Flash supports rich user interfaces and protocol stacks. Compared to 8-bit MCUs typically used in remotes, the PIC24FJ128GA702T-I/ML delivers 16-bit DSP performance at lower active current.
Recommended
Test and Measurement Instrumentation
The PIC24FJ128GA702T-I/ML is well suited to portable test instruments such as multimeters, data loggers, and environmental monitors because of its 12-bit 200 ksps ADC, multiple UART/SPI/I2C peripherals, and DSP extensions for signal processing. The 128 KB ECC Flash stores calibration tables and data buffers with error correction. Its DMA controller streams ADC samples to memory without CPU intervention, enabling high-throughput data logging. The -40C to +85C range supports field-deployed instruments.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FJ128GA702T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FJ128GA702-I/ML | PIC24FJ128GA702-E/MV | PIC24FJ128GA702T-I/MV | PIC24FJ128GA702-I/MV | PIC24FJ128GA310T-I/BF |
|---|---|---|---|---|---|---|
| Package | 28-pin QFN (6x6 mm) with EP | 28-pin QFN (6x6 mm) with EP - same | 28-pin QFN (6x6 mm) with EP - same | 28-pin QFN (6x6 mm) with EP - same | 28-pin QFN (6x6 mm) with EP - same | 28-pin QFN (6x6 mm) with EP - same family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB ECC | 128 KB ECC - same | 128 KB ECC - same | 128 KB ECC - same | 128 KB ECC - same | 128 KB ECC - same |
| RAM | 16 KB | 16 KB - same | 16 KB - same | 16 KB - same | 16 KB - same | 16 KB - same |
| CPU Speed | 32 MHz (16 MIPS) | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C - same | -40C to +125C (Extended) | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same |
| ADC | 12-bit, 200 ksps | 12-bit, 200 ksps - same | 12-bit, 200 ksps - same | 12-bit, 200 ksps - same | 12-bit, 200 ksps - same | 12-bit, 200 ksps - same |
| CTMU Touch Sensing | Yes | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same family |
| Packaging Type | Tape & Reel | Tray | Tube | Tape & Reel | Tray | Tape & Reel |
Key Differentiators
- Integrated CTMU eliminates external analog front end for capacitive touch (vs PIC24FJ128GA202-I/SS (PIC24F GA202 family))
- 128 KB Flash with hardware ECC for long-lifecycle reliability (vs PIC24FJ64GA family with 64 KB Flash)
- DMA controller offloads repetitive peripheral-to-memory transfers (vs PIC24FJ16KA family without DMA)
Design Notes
Estimated: at 32 MHz active CPU, 3.3V VDD, all peripherals enabled, active current is approximately 6 mA. Place a 4.7uF bulk capacitor plus 0.1uF ceramic bypass on each VDD/VSS pair as close to the IC pins as possible. For battery-powered designs using XLP sleep modes, the device can drop below 1uA in deep sleep with RTCC enabled, making it suitable for years-long coin-cell operation. Decoupling must be designed to handle the inrush current when waking from sleep.
Estimated: the QFN-28 (6x6 mm) exposed pad provides the primary thermal path. Solder the exposed pad to a copper pour on the PCB with thermal vias (typically 5-9 vias in a 3x3 grid under the EP) to dissipate heat to inner PCB planes. Without proper EP soldering, junction temperature can rise significantly under sustained 32 MHz operation, especially in enclosed industrial enclosures. Theta_JA improvement with 1 sq inch copper pour and via array is approximately 30% versus no thermal management.
The QFN-28 (6x6 mm) package has a 0.65 mm pitch which requires fine-pitch PCB manufacturing capability (typically 4/4 mil trace/space). Place programming pins PGEC1/PGED1 (RB0/RB1) and PGEC2/PGED2 (RB6/RB7) on accessible test points or a programming header to enable in-circuit serial programming (ICSP). Ensure the MCLR pin has a 10 kohm pull-up to VDD and a 100 nF capacitor to ground for proper reset behavior during power-up.
Do not exceed 3.6V on VDD - the PIC24FJ128GA702T-I/ML is a 3.3V part, not 5V tolerant. Failure to configure the JTAG/ICSP pins correctly can lock out the device, requiring a high-voltage programmer to recover. The CTMU requires calibration routine execution at startup for accurate touch measurements - do not skip the CTMU calibration step in firmware. Finally, ensure the watchdog timer is enabled in safety-critical applications to recover from firmware lock-ups.
Keep analog signals (ADC inputs, CTMU touch channels) physically separated from digital switching traces on the PCB. Use a ground plane and route analog signals over the ground plane for best ADC noise performance. For I2C buses, place 4.7 kohm pull-ups close to the PIC24FJ128GA702T-I/ML side and keep trace lengths under 100 mm to minimize ringing. SPI traces to displays or memories should be length-matched within 5 mm for reliable high-speed operation at 10 MHz+.
Compliance Information
RoHS compliant per Microchip product page. Industrial temperature grade -40C to +85C; choose PIC24FJ128GA702-E/MV (extended -40C to +125C) for higher temperature applications. Not AEC-Q100 qualified; choose automotive-grade PIC24F parts for AEC-Q100 requirements.
