PIC24HJ64GP502-H/MM - 16-bit 40MIPS MCU 64KB Flash | Microchip
N.º de pieza: PIC24HJ64GP502-H/MM ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.95 | $5,95 |
| 10 | $5.42 | $54,20 |
| 100 | $4.85 | $485,00 |
| 500 | $4.31 | $2.155,00 |
| 1.000 | $3.79 | $3.790,00 |
PIC24HJ64GP502-H/MM Descripción general
A microcontroller (MCU) is a single-chip computer containing a CPU core, non-volatile program memory (typically Flash), volatile working memory (SRAM), and a rich set of on-chip peripherals such as timers, ADC, communication controllers, and general-purpose I/O. The PIC24H sub-family occupies the middle tier of Microchip's 16-bit portfolio, sitting above the PIC24F and below the dsPIC33 in DSP capability. It is the standard choice when an application needs deterministic 40 MIPS throughput, deterministic interrupt latency, and ample analog peripherals, but does not require DSP extensions.
Key features include a 40 MIPS 16-bit CPU core with single-cycle 16x16 hardware multiply, 64 KB self-programmable Flash with table read/write in RAM, 8 KB SRAM, 16-channel 10-bit 500 ksps ADC, two UART, two SPI, one I2C, five 16-bit timers, an input capture, an output compare/PWM module, and a 21-channel peripheral pin-select (PPS) remap. The QFN-S (MM) package exposes 21 general-purpose I/O plus dedicated analog, oscillator, and programming/debug pins; it is qualified to the -40C to +150C (H = "High Temperature" automotive grade) operating range.
Typical applications include BLDC/PMSM motor control (sensored and sensorless FOC), industrial automation (PLCs, sensor nodes, HMI), automotive body and chassis ECUs running at high ambient temperature, digital-power conversion (SMPS, PFC, LLC), and consumer appliances requiring deterministic real-time control with USB or CAN connectivity via external transceivers.
When designing with this part, place 100 nF decoupling capacitors within 2 mm of every VDD/VSS pair, route the analog VDD/VSS separately from the digital supply, and keep the MCLR reset trace short with a 10 kΩ pull-up. The "-H" temperature grade targets automotive under-hood and industrial thermal-stress environments; choose the -I (industrial) or -E (extended) variant when the operating temperature will remain below +125C.
Alternativas directas para PIC24HJ64GP502-H/MM — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC24HJ64GP502-H/MM (mismo factor de forma y huella) — difiere en ADC, Core Architecture, Timers, Program Memory (Flash), RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC24HJ64GP502-I/MM
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC24HJ64GP502-E/MM
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC24HJ128GP502-H/MM
✅ Sustitución directa✓ En stock
$4.21 / unidad
Ver hoja de datos →PIC24HJ64GP502T-H/MM
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
dsPIC33FJ64MC502-H/MM
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC24HJ64GP502-H/MM Valores máximos y características eléctricas
| Core Architecture | 16-bit PIC24H (modified Harvard, hardware MAC) |
| CPU Performance | 40 MIPS at 3.0V to 3.6V |
| Program Memory (Flash) | 64 KB (22K x 24 instruction words) |
| Data Memory (SRAM) | 8 KB |
| Supply Voltage (VDD) | 3.0 V to 3.6 V |
| Operating Temperature Grade | -40C to +150C (H = automotive high-temp) |
| Encapsulado / Carcasa | 28-pin QFN-S EP, 6x6 mm (MM) |
| Number of I/O Pins | 21 |
| ADC | 10-bit, up to 16 channels, 500 ksps |
| Communication Interfaces | 2x UART, 2x SPI, 1x I2C |
| Timers | 5 x 16-bit |
| DMA Channels | 8 |
| Peripheral Pin Select (PPS) | Yes (remappable digital peripherals) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Configuración de pines de PIC24HJ64GP502-H/MM
| Pin 1 | MCLR — Master Clear (Reset) input, active low |
| Pin 2 | RP0/RB0 — Remappable I/O, port B bit 0 |
| Pin 3 | RP1/RB1 — Remappable I/O, port B bit 1 |
| Pin 4 | RP2/RB2 — Remappable I/O, port B bit 2 |
| Pin 5 | RP3/RB3 — Remappable I/O, port B bit 3 |
| Pin 6 | RP4/RB4 — Remappable I/O, port B bit 4 |
| Pin 7 | RP5/RB5 — Remappable I/O, port B bit 5 |
| Pin 8 | VSS — Ground |
| Pin 9 | OSC1/RC12 — Crystal/clock input or remappable I/O |
| Pin 10 | OSC2/RC13 — Crystal/clock output or remappable I/O |
| Pin 11 | RP6/RB6 — Remappable I/O, port B bit 6 |
| Pin 12 | RP7/RB7 — Remappable I/O, port B bit 7 |
| Pin 13 | RP8/RB8 — Remappable I/O, port B bit 8 |
| Pin 14 | VDD — Digital supply voltage (3.0V-3.6V) |
| Pin 15 | RP9/RB9 — Remappable I/O, port B bit 9 |
| Pin 16 | RP10/RB10 — Remappable I/O, port B bit 10 |
| Pin 17 | RP11/RB11 — Remappable I/O, port B bit 11 |
| Pin 18 | VSS — Ground |
| Pin 19 | RP12/RB12 — Remappable I/O, port B bit 12 |
| Pin 20 | RP13/RB13 — Remappable I/O, port B bit 13 |
| Pin 21 | RP14/RB14 — Remappable I/O, port B bit 14 |
| Pin 22 | RP15/RB15 — Remappable I/O, port B bit 15 |
| Pin 23 | AN0/RB0 — Analog input 0 / port B bit 0 (alt) |
| Pin 24 | AN1/RB1 — Analog input 1 / port B bit 1 (alt) |
| Pin 25 | AVSS — Analog ground |
| Pin 26 | AVDD — Analog supply voltage |
| Pin 27 | PGED1/RP7 — ICSP programming data / remappable I/O |
| Pin 28 | PGEC1/RP6 — ICSP programming clock / remappable I/O |
| Pin EP | EP — Exposed thermal pad - must be soldered to PCB ground pad for thermal dissipation |
Aplicaciones típicas
PIC24HJ64GP502-H/MM es adecuado para 6 aplicacións: BLDC / PMSM Motor Control, Digital Power Conversion (SMPS, PFC, LLC), Automotive Body and Chassis ECUs, Industrial Automation Controllers, Consumer Appliance Control Boards, Sensor-Conditioner and Data-Acquisition Front Ends.
BLDC / PMSM Motor Control
The PIC24HJ64GP502-H/MM is well-matched to sensored and sensorless Field-Oriented Control (FOC) of BLDC and PMSM motors in the low-to-mid kW range. Its 16-bit modified-Harvard core delivers 40 MIPS with a single-cycle 16x16 hardware MAC, providing the throughput needed to run an FOC loop (Clarke/Park transform, PI current controllers, SVPWM) at 10-20 kHz switching frequency. The output-compare/PWM module supplies complementary PWMs with programmable dead-band control, ideal for driving a 3-phase inverter bridge via gate drivers. The 10-bit 500 ksps SAR ADC samples phase currents via shunt resistors fast enough for sub-microsecond current control, and the 21 remappable I/Os (PPS) let the engineer re-assign PWM and QEI pins without PCB re-spin. The -H +150C grade ensures reliability in automotive under-hood and industrial inverter environments where ambient can exceed 100C.
Recomendado
Digital Power Conversion (SMPS, PFC, LLC)
For Switch-Mode Power Supplies (SMPS), Power Factor Correction (PFC), and LLC resonant converters, the PIC24HJ64GP502-H/MM provides 40 MIPS of deterministic compute with the peripherals to close digital control loops in firmware. The high-speed 10-bit 500 ksps ADC samples the output voltage, inductor current, and PFC multiplier input, while the output-compare/PWM module generates the control waveforms with hardware dead-band and fault shutdown. The DMA controller offloads ADC result transfer from the CPU, leaving MIPS headroom for the compensator algorithm, soft-start, and housekeeping. The 8 KB SRAM is sufficient for two-loop control state variables and a small look-up table for efficiency optimization, while 64 KB Flash holds the compensator code, the firmware-based PID loops, and a Modbus or PMBus interface for telemetry. The -H +150C grade supports high-density converters where the local ambient near the magnetics rises above 100C.
Recomendado
Automotive Body and Chassis ECUs
The PIC24HJ64GP502-H/MM is a strong fit for automotive body-electronics and chassis-control ECUs that must operate reliably across under-hood thermal stress. The -H grade is qualified to -40C to +150C and supports automotive PPAP/AEC-Q100 flows, while the deterministic 40 MIPS throughput, hardware MAC, and CAN/LIN readiness (via external transceiver + UART/SPI) cover body modules such as HVAC blowers, seat controllers, mirror modules, and chassis sensors. The 21 PPS-remappable I/Os allow flexible pinout to fit compact body-controller PCBs that route to multiple actuators, and the 8 KB SRAM accommodates a small RTOS or scheduler plus diagnostic buffers. Its small 28-QFN-S MM 6x6 mm footprint helps meet the tight board-area budgets of seat and door modules without sacrificing thermal dissipation via the exposed pad.
Recomendado
Industrial Automation Controllers
For PLCs, sensor-conditioning nodes, and small HMIs in industrial automation, the PIC24HJ64GP502-H/MM offers the deterministic interrupt latency and 40 MIPS throughput required for closed-loop control loops. The 10-bit SAR ADC reads multiple analog sensors (temperature, pressure, flow), the input-capture module decodes quadrature encoder feedback from stepper or BLDC servo motors, and the dual UART/SPI ports support RS-485 (via transceiver) for Modbus RTU or SPI for local displays. Peripheral Pin Select lets the engineer route the UART to whichever I/O pads the PCB layout requires, simplifying board routing. The 64 KB Flash accommodates the IEC 61131-3 logic interpreter or a small ladder-logic run-time, while 8 KB SRAM holds process variables and stack frames. The H grade is overkill for cabinet-mounted equipment but ideal for sensors mounted directly on machinery with elevated ambient.
Recomendado
Consumer Appliance Control Boards
The PIC24HJ64GP502-H/MM is a strong fit for white-goods and consumer-electronics control boards that need deterministic real-time control with USB or Bluetooth connectivity. Its 40 MIPS throughput runs user-interface state machines, sensor fusion for temperature/humidity probes, and PID loops for compressors or heater elements. The 64 KB Flash holds a small RTOS, communication class, and the user-interface graphics driver, while 8 KB SRAM is sufficient for stack and frame buffers for a low-resolution LCD or seven-segment display. The 21 I/Os with PPS remap allow direct connection to capacitive-touch keys, LED drivers, and buzzer PWM without external glue logic. Microchip's free MPLAB X IDE, MPLAB Code Configurator (MCC), and Harmony framework lower the firmware development cost for typical appliance designs.
Recomendado
Sensor-Conditioner and Data-Acquisition Front Ends
For sensor-conditioning modules and low-channel-count data-acquisition (DAQ) front ends, the PIC24HJ64GP502-H/MM combines a 10-bit 500 ksps SAR ADC, dual UART/SPI, and 64 KB Flash into a compact 28-QFN-S footprint. The ADC's 16 input channels scan multiple analog sensors (thermocouples via op-amp front-ends, RTDs, 4-20 mA loops) with hardware conversion trigger from timer 1, while the DMA controller moves results into SRAM without CPU intervention. The 8 KB SRAM buffers scan histories for averaging and digital smoothing, and the 21 I/Os drive status LEDs and relay outputs. A UART-to-RS-485 link (via external transceiver) sends the processed data to a central controller. The H grade supports deployment near machinery with elevated ambient temperature, and PPS remap keeps the PCB layout compact.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC24HJ64GP502-H/MM — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC24HJ64GP502-I/MM | PIC24HJ64GP502-E/MM | PIC24HJ128GP502-H/MM | PIC24HJ64GP502T-H/MM | dsPIC33FJ64MC502-H/MM |
|---|---|---|---|---|---|---|
| Package | 28-QFN-S EP (MM) 6x6 mm | 28-QFN-S EP (MM) 6x6 mm | 28-QFN-S EP (MM) 6x6 mm | 28-QFN-S EP (MM) 6x6 mm | 28-QFN-S EP (MM) 6x6 mm | 28-QFN-S EP (MM) 6x6 mm |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Throughput | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | dsPIC33F 16-bit + DSP, 40 MIPS |
| Flash Program Memory | 64 KB | 64 KB | 64 KB | 128 KB | 64 KB | 64 KB |
| SRAM Data Memory | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Supply Voltage Range | 3.0V to 3.6V | 3.0V to 3.6V | 3.0V to 3.6V | 3.0V to 3.6V | 3.0V to 3.6V | 3.0V to 3.6V |
| Operating Temperature Grade | -40C to +150C (H automotive) | -40C to +85C (I industrial) | -40C to +125C (E extended) | -40C to +150C (H automotive) | -40C to +150C (H automotive) | -40C to +150C (H automotive) |
| ADC / PWM / DMA | 10-bit 500 ksps / OC+PWM / 8-ch DMA | Identical | Identical | Identical | Identical | Identical + motor-control PWMs |
| Approx. Unit Price (qty 1, USD) | 5.95 | 4.95 | 5.45 | 6.95 | 5.95 | 7.45 |
Diferenciadores clave
- Pin-compatible upgrade path to dsPIC33F DSP engine (frente a dsPIC33FJ64MC502-H/MM)
- Wide -40C to +150C automotive thermal envelope in 28-QFN-S MM (frente a PIC24HJ64GP502-I/MM)
- 40 MIPS deterministic throughput with Peripheral Pin Select (frente a PIC24HJ128GP502-H/MM)
Notas de diseño
Solder the exposed thermal pad (EP) of the 28-QFN-S MM package to a copper pad on the PCB - this is the primary heat-dissipation path. Without a properly soldered EP, junction temperature rises sharply under sustained 40 MIPS load. For H-grade automotive designs running near +125C ambient, add 4 thermal vias (0.3 mm drill) under the EP to the inner ground plane. Estimated: at 3.3V VDD, 40 MIPS active CPU draws ~30 mA; ground plates hold junction rise well within the +150C limit for the H grade.
Place 100 nF X7R decoupling capacitors within 2 mm of every VDD/VSS pin pair, plus a bulk 10 uF tantalum or ceramic on the main VDD rail. Route analog VDD/AVSS as a separate island away from digital switching traces - the 10-bit ADC accuracy depends on a quiet analog supply. If the application uses high-current motor drive, use a star-ground topology with the MCU ground tied to the EP pad first, then to the high-current return. Per Microchip's PIC24H family design checklist, the ICSP pins (PGEC1/PGED1) should be routed to a 2x5 0.1" header for in-circuit debugging without disturbing firmware operation.
Do not confuse the PIC24HJ64GP502 (PIC24H core, no DSP) with the dsPIC33FJ64MC502 (DSP engine). Pinout and peripherals are similar, but firmware is NOT binary-compatible - the dsPIC33F uses different SFR mapping. Also avoid confusing the GP502 (28-pin) with the GP504 (44-pin) and GP506 (64-pin) variants in the same family; they have different pin counts and different pin maps even within the same datasheet. Finally, ensure the "H" temperature grade is required: H-grade parts cost more due to additional factory thermal screening, and selecting H when I or E suffices inflates BOM cost unnecessarily.
Información de cumplimiento
RoHS and lead-free per Microchip product page. AEC-Q100 qualified via the H temperature grade per Microchip automotive-grade qualification flow. Reach and conflict-minerals declarations available on Microchip's environmental compliance portal.
