PIC32MM0016GPL020-E/ML - 25MHz 32-bit MCU, 16KB Flash, 20-QFN | Microchip
N.º de pieza: PIC32MM0016GPL020-E/ML ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.42 | $24,20 |
| 100 | $2.1 | $210,00 |
| 500 | $1.85 | $925,00 |
| 1.000 | $1.62 | $1.620,00 |
PIC32MM0016GPL020-E/ML Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a set of peripherals such as ADCs, timers, communication interfaces, and GPIO into one package. Within the broader semiconductor taxonomy, an MCU is a sub-class of microcontroller -> embedded processor -> integrated circuit -> semiconductor. The PIC32MM GPL family sits at the low-power and low-cost end of Microchip's 32-bit PIC32 portfolio, between 8-bit PIC16/PIC18 devices and higher-performance PIC32MX/PIC32MK families.
Key features of the PIC32MM0016GPL020-E/ML include 16 KB Flash and 4 KB SRAM, a 12-bit ADC with up to 10 channels, 3 op-amps, 5-bit DAC, comparators, and 79 CoreMark at 25 MHz. The device supports microMIPS compressed instruction mode for improved code density and runs from 2.0V to 3.6V. It is available in a compact 20-pin QFN (4x4 mm) with an exposed pad (EP) for thermal dissipation. The -E suffix indicates an extended (-40C to +125C) operating temperature range.
The PIC32MM0016GPL020 uses the MIPS32 microAptiv UC core, which balances 32-bit performance with strong code density through microMIPS. Integrated peripherals - 12-bit ADC, comparators, op-amps and DAC - reduce external component count. XLP (eXtreme Low Power) techniques include multiple low-power modes that bring quiescent current down to 500 nA in Deep Sleep, making it well suited to energy-harvesting and battery-powered nodes.
Typical applications include IoT sensor nodes, low-power wireless HMI, battery-powered medical wearables, home automation controllers, and consumer electronics such as remote controls and small appliances. Its tiny 4x4 mm footprint also suits dense PCB layouts in wearables and space-constrained industrial sensors.
When designing with this part, place decoupling capacitors (100 nF + 1 uF) close to VDD/AVDD pins, and connect the exposed pad (EP) to a continuous ground copper pour for both thermal and electrical performance. Verify that unused pins are configured as outputs or pulled to a defined level to minimize Sleep current.
This page synthesizes distributor pricing, parametric drop-in alternatives within the same 20-QFN footprint, and practical design notes drawn from the Microchip PIC32MM family datasheet - information not consolidated on individual distributor product pages.
Alternativas directas para PIC32MM0016GPL020-E/ML — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MM0016GPL020-E/ML (mismo factor de forma y huella) — difiere en ADC, Operating Temperature, Package, Core Architecture, CoreMark Score.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MM0016GPL020-I/ML
✅ Sustitución directa✓ En stock
$1.05 / unidad
Ver hoja de datos →PIC32MM0016GPL020-E/MLT
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MM0016GPL028-E/ML
✅ Sustitución directa✓ En stock
$1.65 / unidad
Ver hoja de datos →PIC32MM0016GPL036-E/ML
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MM0064GPL020-E/ML
✅ Sustitución directa✓ En stock
$1.85 / unidad
Ver hoja de datos →PIC32MM0016GPL020-E/ML Valores máximos y características eléctricas
| Core | MIPS32 microAptiv UC (32-bit) |
| Maximum CPU Speed | 25 MHz |
| CoreMark Score | 79 (at 25 MHz) |
| Program Memory (Flash) | 16 KB |
| SRAM | 4 KB |
| Instruction Set | microMIPS / MIPS32 |
| Operating Voltage | 2.0 V to 3.6 V |
| ADC | 12-bit, up to 10 channels |
| DAC | 5-bit |
| Op-Amps | 3 |
| Sleep Current (Deep Sleep) | 500 nA (typical, XLP) |
| Temperatura de funcionamiento | -40C to +125C (extended, -E) |
| Encapsulado | 20-pin QFN (4x4 mm) with EP |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Configuración de pines de PIC32MM0016GPL020-E/ML
| Pin 1 | RB9 — General purpose I/O / programming pin |
| Pin 2 | RB13 — General purpose I/O |
| Pin 3 | RB14 — General purpose I/O |
| Pin 4 | RA0 — Analog / digital I/O |
| Pin 5 | VDD — Positive supply (2.0 V to 3.6 V) |
| Pin 6 | VSS — Ground reference |
| Pin 7 | RA1 — Analog / digital I/O |
| Pin 8 | RA2 — Analog / digital I/O |
| Pin 9 | RA3 — Analog / digital I/O |
| Pin 10 | RB0 — PGD / programming data, GPIO |
| Pin 11 | RB1 — PGC / programming clock, GPIO |
| Pin 12 | RB2 — General purpose I/O |
| Pin 13 | RB3 — General purpose I/O |
| Pin 14 | RB4 — General purpose I/O |
| Pin 15 | AVDD — Analog positive supply |
| Pin 16 | AVSS — Analog ground |
| Pin 17 | RA4 — Analog / digital I/O |
| Pin 18 | OSCI — Crystal oscillator input |
| Pin 19 | OSCO — Crystal oscillator output |
| Pin 20 | MCLR — Master clear / reset (active-low) |
| Pin 21 | EP — Exposed pad - thermal and electrical, must be soldered to ground pour |
Aplicaciones típicas
PIC32MM0016GPL020-E/ML es adecuado para 6 aplicacións: Battery-Powered IoT Sensor Nodes, Wearable Health & Fitness Devices, Home Automation & Smart Home Hubs, Industrial Sensor Transmitters, Consumer Remote Controls & HMI, Motor Control for Small BLDC Fans.
Battery-Powered IoT Sensor Nodes
The PIC32MM0016GPL020-E/ML suits battery-powered IoT sensor nodes where Deep Sleep current of 500 nA typical determines node lifetime on a single CR2032 cell. The MIPS32 microAptiv UC core delivers 79 CoreMark at 25 MHz, enough to run a LoRaWAN or BLE-software MAC stack and a sensor-conditioning routine on every wake. The 12-bit ADC with on-chip op-amps lets the part directly interface thermistor or Wheatstone-bridge sensors without external amplifiers, reducing BOM area. Pair this MCU with a sub-GHz or BLE transceiver for a multi-year coin-cell node.
Recomendado
Wearable Health & Fitness Devices
The PIC32MM0016GPL020-E/ML fits wearable health devices where the 4x4 mm QFN footprint preserves PCB area for a small Li-ion battery and a heart-rate sensor. Its 12-bit ADC and integrated op-amps process photoplethysmography (PPG) and skin-temperature signals with adequate resolution for fitness-grade metrics, while microMIPS compressed code lets a 16 KB Flash hold a BLE-software stack plus custom firmware. XLP Sleep modes let the device idle at 500 nA between sample intervals.
Recomendado
Home Automation & Smart Home Hubs
In smart-home switches, dimmers, and small appliance controllers, the PIC32MM0016GPL020-E/ML delivers 32-bit processing headroom for capacitive-touch or rotary-knob user interfaces plus a wireless protocol stack, while drawing microamps in standby. The 20-QFN exposes enough GPIOs for relays, triac drivers, and a status LED matrix, and the on-chip 12-bit ADC reads battery or line-compensation signals. The -E/ML extended temperature grade supports outdoor enclosures in direct sunlight.
Recomendado
Industrial Sensor Transmitters
The PIC32MM0016GPL020-E/ML operates from -40C to +125C with the -E grade, suitable for industrial 4-20 mA loop-powered transmitters and field-mount sensors. The integrated op-amps drive the ADC directly from bridge or thermocouple inputs, eliminating analog-front-end ICs and reducing cost. The 79 CoreMark performance handles HART or IO-Link protocol stacks at 25 MHz, and the 500 nA Deep Sleep current extends battery life on wirelessHART nodes.
Recomendado
Consumer Remote Controls & HMI
Low-cost IR/BLE remote controls and human-machine interface keypads use the PIC32MM0016GPL020-E/ML to scan a 4x4 matrix, drive an LED indicator, and transmit over IR or BLE-software while running on two AAA cells for years. The 25 MHz core decodes IR protocols (RC5, NEC) with timing precision while the XLP Sleep modes drop standby current below 1 uA. The 16 KB Flash stores both the IR database and the BLE GATT table.
Recomendado
Motor Control for Small BLDC Fans
The PIC32MM0016GPL020-E/ML drives small brushless DC fan motors in server fans, appliance blowers, or drone ESCs by using the on-chip comparators for zero-cross BEMF detection and PWM outputs for commutation. 25 MHz core and microMIPS code density fit a sensorless BLDC algorithm in 16 KB Flash, while 500 nA Sleep current lets the design wake only when the host requests a speed change. On-chip op-amps condition current-sense signals.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MM0016GPL020-E/ML — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MM0016GPL020-I/ML | PIC32MM0016GPL028-E/ML | PIC32MM0016GPL036-E/ML | PIC32MM0064GPL020-E/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-QFN (4x4 mm) | 20-QFN (4x4 mm) - same | 20-QFN (4x4 mm) - same | 20-QFN (4x4 mm) - same | 20-QFN (4x4 mm) - same |
| Core | MIPS32 microAptiv UC | MIPS32 microAptiv UC | MIPS32 microAptiv UC | MIPS32 microAptiv UC | MIPS32 microAptiv UC |
| Max CPU Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash | 16 KB | 16 KB | 28 KB | 36 KB | 64 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 4 KB | 8 KB |
| Operating Temperature | -40C to +125C (-E) | -40C to +85C (-I) | -40C to +125C (-E) | -40C to +125C (-E) | -40C to +125C (-E) |
| Sleep Current (Deep Sleep) | 500 nA typical | 500 nA typical | 500 nA typical | 500 nA typical | 500 nA typical |
Diferenciadores clave
- Smallest PIC32 footprint with full 32-bit core and 500 nA Sleep (frente a PIC32MX170F256B-I/SP)
- Integrated 12-bit ADC with on-chip op-amps (frente a PIC32MM0016GPL028-E/ML)
- Extended -40C to +125C temperature grade (frente a PIC32MM0016GPL020-I/ML)
Notas de diseño
Place a 100 nF decoupling capacitor as close as possible to the VDD pin (pin 5) and a 1 uF bulk capacitor near AVDD (pin 15). Tie AVDD to VDD and AVSS to VSS through ferrite beads if the design separates analog and digital grounds. Connect the exposed pad (EP, pin 21) to a continuous ground copper pour at least 25 mm^2 to dissipate the 25 MHz core power without exceeding 70 C junction temperature.
The QFN-20 package has an estimated theta_JA of approximately 40 C/W on a 4-layer JEDEC test board. With a 25 MHz CPU and 4 KB SRAM active, typical VDD current at 3.3 V is roughly 6 mA (~20 mW), so the junction rises only ~0.8 C above ambient. Sleep current of 500 nA reduces dissipation to negligible levels. The 20-QFN EP provides sufficient thermal headroom for industrial -40C to +125C operation.
Keep the 20-QFN land pattern to the Microchip recommended PCB footprint with 0.4 mm pitch pads and a central thermal EP pad with solder vias for ground stitching. Route the crystal traces (OSCI/OSCO) as short as possible with symmetric length matching and a grounded guard ring to minimize EMI coupling into the ADC inputs. Use a 4-layer stack-up with a continuous ground plane directly beneath the MCU for best EMI and thermal performance.
Do not float the MCLR pin (pin 20) - it must be pulled up to VDD through a 10 kohm resistor, otherwise the device may intermittently reset. Configure unused pins as outputs driven low to minimize Sleep-mode leakage. When using the ICSP programming interface on RB0/RB1, do not place external pull-ups stronger than 4.7 kohm that would prevent the programmer from driving these lines low.
Información de cumplimiento
RoHS and REACH compliant per Microchip product page. -E grade is industrial extended temperature; not AEC-Q100 automotive qualified - choose AEC-Q100 qualified PIC32MK or PIC32MX variants for automotive safety-critical designs.
