PIC32MM0016GPL020-I/ML - 16KB Flash 32-bit MCU 20-QFN | Microchip
MPN: PIC32MM0016GPL020-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.18 | $2.18 |
| 10 | $1.95 | $19.50 |
| 100 | $1.62 | $162.00 |
| 500 | $1.28 | $640.00 |
| 1,000 | $1.05 | $1,050.00 |
PIC32MM0016GPL020-I/ML Overview
A 32-bit microcontroller (MCU) is an integrated system-on-chip that combines a high-performance processor core, Flash program memory, SRAM, and a rich set of analog and digital peripherals in a single package. The PIC32MM family extends Microchip's PIC architecture into 32-bit territory using the MIPS microAptiv core, while maintaining software compatibility with the company's MPLAB X IDE and Harmony ecosystem. 32-bit MCUs typically replace older 8/16-bit parts when designs need more computational headroom, larger address spaces, and richer peripherals for connected or signal-processing applications.
Key features of this PIC32MM0016GPL020-I/ML include 16KB (16K x 8) Flash program memory, 4KB SRAM, an integrated 12-bit ADC, multiple UART/SPI/I2C peripherals, and a wide operating voltage range suited for both battery-powered and industrial systems. The device also integrates Microchip's nanoWatt XLP technology for sub-microamp sleep currents, enabling multi-year coin-cell or lithium battery operation in always-on applications.
Technically, the part uses the MIPS32 microAptiv UC core with a 5-stage pipeline and supports a 25 MHz/25 MIPS core clock from an internal 8 MHz oscillator with PLL. The 20-QFN (4x4 mm) package provides 14 general-purpose I/O pins, 9 channels of 10-bit ADC, and 3 comparators, while keeping board area to roughly 16 mm squared.
Typical applications include low-power IoT sensor nodes, wearable fitness/health monitors, remote controls, battery-powered HVAC sensors, USB dongles, and space-constrained consumer devices such as toys and personal electronics where 8-bit performance would be limiting.
When designing with this device, allocate pin 1 (MCLR) for proper reset, ensure the VCAP pin has a 1uF decoupling capacitor, and follow Microchip's datasheet layout guidelines for the 4x4 mm QFN thermal pad to keep the die within safe junction temperatures.
This page synthesizes distributor pricing, drop-in PIC32MM family alternatives, application design notes, and a side-by-side parametric comparison - information not bundled together on the manufacturer datasheet.
Drop-in alternatives for PIC32MM0016GPL020-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MM0016GPL020-I/ML (same form factor and footprint) — differing in Package, ADC, Operating Temperature, Sleep Current (XLP), Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MM0032GPL020-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MM0064GPL020-I/ML
✅ Drop-In✓ In Stock
$1.28 / Unit
View Datasheet →PIC32MM0016GPL020-I/SS
✅ Drop-In✓ In Stock
$1.1 / Unit
View Datasheet →PIC32MM0016GPL020-E/SS
✅ Drop-In✓ In Stock
$1.18 / Unit
View Datasheet →PIC32MM0032GPL020-I/SS
✅ Drop-In✓ In Stock
$1.45 / Unit
View Datasheet →PIC32MM0016GPL020-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 microAptiv UC |
| Core Size | 32-bit |
| Maximum CPU Speed | 25 MHz / 25 MIPS |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data SRAM | 4 KB |
| Package | 20-pin QFN (4x4 mm) (ML) |
| I/O Pins | 14 |
| Supply Voltage | 2.0 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (Industrial) |
| ADC | 10-bit, 9 channels |
| Comparators | 3 |
| Communication Peripherals | UART, SPI, I2C |
| Sleep Current (XLP) | 500 nA (typical) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC32MM0016GPL020-I/ML Pin Configuration
| Pin 1 | MCLR — Master Clear (reset) input, drive low to reset |
| Pin 2 | RA0 — GPIO RA0 / analog input |
| Pin 3 | RA1 — GPIO RA1 / analog input |
| Pin 4 | RB0 — GPIO RB0 / programming pin |
| Pin 5 | RB1 — GPIO RB1 |
| Pin 6 | RB2 — GPIO RB2 |
| Pin 7 | — GPIO RB3 |
| Pin 8 | VSS — Ground |
| Pin 9 | VCAP — Voltage regulator bypass (1uF cap to VSS) |
| Pin 10 | RB4 — GPIO RB4 |
| Pin 11 | RB5 — GPIO RB5 |
| Pin 12 | RB6 — GPIO RB6 / ICS_PGD |
| Pin 13 | RB7 — GPIO RB7 / ICS_PGC |
| Pin 14 | RA2 — GPIO RA2 |
| Pin 15 | RA3 — GPIO RA3 |
| Pin 16 | RA4 — GPIO RA4 |
| Pin 17 | RA5 — GPIO RA5 |
| Pin 18 | VDD — Positive supply (2.0V to 3.6V) |
| Pin 19 | VSS — Ground (also exposed pad) |
| Pin 20 | RB8 — GPIO RB8 |
Typical Applications
PIC32MM0016GPL020-I/ML is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Wearable Fitness & Health Monitors, Remote Controls & Consumer Electronics, Industrial HVAC & Building Sensors, USB Dongles & HID Devices, Small Appliance Motor Control.
Battery-Powered IoT Sensor Nodes
The PIC32MM0016GPL020-I/ML suits IoT sensor nodes requiring low-power 32-bit performance in a compact footprint. The 500 nA XLP sleep current enables multi-year coin-cell operation, while the 25 MIPS core supports sensor fusion and protocol stacks like LoRaWAN or BLE beaconing. Place the MCU between a sensor (e.g., temperature/humidity) and a wireless radio, waking on RTC interrupt to read sensors and transmit data. The 4x4 mm QFN fits easily in wearable or environmental sensor form factors where every square millimeter matters. Designers can leverage MPLAB Harmony's wireless drivers to accelerate time-to-market.
Recommended
Wearable Fitness & Health Monitors
The PIC32MM0016GPL020-I/ML fits wearable health monitors where small size, low power, and 32-bit DSP capability are critical. Its 500 nA sleep mode preserves battery life between heart-rate or step-counting measurements, while the 25 MIPS core handles real-time signal processing for heart-rate variability (HRV) or accelerometer step detection. The 20-pin 4x4 mm QFN allows a complete fitness band PCB in under 10 mm squared. The 10-bit ADC with 9 channels easily accommodates multiple biometric sensors simultaneously. Use the MPLAB Harmony BLE profile stacks to add wireless connectivity to companion smartphones.
Recommended
Remote Controls & Consumer Electronics
The PIC32MM0016GPL020-I/ML is well suited for advanced remote controls, smart toys, and small consumer appliances requiring touch buttons, IR transmission, and battery operation. The 500 nA sleep current extends battery life to 2+ years on two AA cells, while the 32-bit core handles complex protocols like RC5/RC6 IR encoding or BLE pairing sequences. The 14 GPIO pins easily support a 4x4 keypad matrix, multiple LEDs, and an IR emitter. Designers can use Microchip's MCP1624 boost converter companion to drive the MCU from a single 1.5 V cell when needed.
Recommended
Industrial HVAC & Building Sensors
The PIC32MM0016GPL020-I/ML works well in industrial HVAC and building automation sensors monitoring temperature, humidity, air quality, or occupancy. The -40 C to +85 C industrial operating temperature range handles harsh HVAC environments, while the 25 MIPS core runs Modbus RTU or BACnet protocol stacks over UART/RS-485 transceivers. The 500 nA sleep current enables battery or energy-harvesting powered wireless sensor nodes. The 10-bit ADC is sufficient for most environmental sensor interfaces including thermistor, NDIR CO2, and VOC sensors.
Recommended
USB Dongles & HID Devices
The PIC32MM0016GPL020-I/ML can serve as the controller in low-cost USB dongles, HID devices, or simple CDC virtual COM ports when paired with an external USB transceiver. The 25 MIPS core processes USB 2.0 full-speed packets at 12 Mbps with sufficient headroom for HID report encoding, while the 16 KB Flash holds USB stack and application code. The 4x4 mm QFN keeps dongle PCB under 15 mm squared. Designers can use Microchip's USB stack within MPLAB Harmony to add HID, CDC, or vendor-class USB profiles without external licensing fees.
Recommended
Small Appliance Motor Control
The PIC32MM0016GPL020-I/ML handles low-cost BLDC or stepper motor control in small appliances like fans, pumps, or toys. The 25 MIPS core runs Microchip's MCC-generated motor control libraries including sensorless BEMF zero-cross detection or simple 6-step commutation. The 3 on-chip comparators provide hardware overcurrent and BEMF sensing without external op-amps. The 4x4 mm QFN fits in tight motor housings where space is at a premium. Use PWM outputs to drive external H-bridge MOSFET drivers like the MCP8024.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MM0016GPL020-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MM0032GPL020-I/ML | PIC32MM0064GPL020-I/ML | PIC32MM0016GPL020-I/SS | PIC32MM0016GPL020-E/SS | PIC32MM0032GPL020-I/SS |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-pin QFN (4x4 mm) | 20-pin QFN (4x4 mm) - same | 20-pin QFN (4x4 mm) - same | 20-pin SSOP - different | 20-pin SSOP - different | 20-pin SSOP - different |
| Flash Program Memory | 16 KB | 32 KB (+100%) | 64 KB (+300%) | 16 KB (same) | 16 KB (same) | 32 KB (+100%) |
| SRAM | 4 KB | 4 KB (same) | 8 KB (+100%) | 4 KB (same) | 4 KB (same) | 4 KB (same) |
| Maximum CPU Speed | 25 MHz / 25 MIPS | 25 MHz (same) | 25 MHz (same) | 25 MHz (same) | 25 MHz (same) | 25 MHz (same) |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C (Extended) | -40 C to +85 C |
| Supply Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| XLP Sleep Current | 500 nA | 500 nA (same) | 500 nA (same) | 500 nA (same) | 500 nA (same) | 500 nA (same) |
| Unit Price (qty 1000) | $1.05 (as of 2026-10-01) | $1.20 (est.) | $1.40 (est.) | $1.10 (est.) | $1.45 (est.) | $1.25 (est.) |
Key Differentiators
- Lowest-cost 32-bit MCU in 4x4 mm QFN with XLP 500 nA sleep (vs PIC32MM0032GPL020-I/ML)
- Compact 4x4 mm QFN saves 60% board area vs SSOP (vs PIC32MM0016GPL020-I/SS)
- Industrial -40 C to +85 C temperature range (vs PIC32MM0016GPL020-E/SS)
- MIPS32 microAptiv core with 5-stage pipeline (vs Cross-brand ARM Cortex-M0+)
Design Notes
Decouple VDD (pin 18) with a 100 nF ceramic capacitor placed within 3 mm of the pin, plus a 10 uF bulk capacitor on the supply rail. The VCAP pin (pin 9) requires a 1 uF low-ESR ceramic to ground - never leave this pin floating as it stabilizes the internal 1.8V core voltage regulator. For battery-powered designs, add a 100 kohm pull-up on MCLR (pin 1) and tie through a Schottky diode to VDD for brown-out protection.
The 20-pin QFN (4x4 mm) has an exposed thermal pad on the underside that must be soldered to a copper pad on the PCB for mechanical reliability and thermal dissipation. Use an array of 9 thermal vias (0.3 mm drill, 0.5 mm pitch) connecting the thermal pad to an internal ground plane. Per IPC-7351 land pattern guidelines, the QFN pad should be 0.4 mm larger than the package on each side to ensure a reliable solder fillet.
Route the ICS_PGD (RB6, pin 12) and ICS_PGC (RB7, pin 13) signals as short traces, ideally under 50 mm, and avoid running them parallel to noisy switching power traces. Place a 4.7 kohm pull-up on MCLR even in production to ensure clean reset behavior during power-up. Keep analog signals (RA0-RA5) away from digital switching traces and surround analog pins with a ground pour to minimize coupling noise into the 10-bit ADC readings.
Do not skip the VCAP capacitor - the PIC32MM internal LDO will oscillate and cause erratic behavior without it. Avoid using the internal 8 MHz oscillator for UART communication at high baud rates without PLL calibration, as the internal oscillator has a +/- 2% tolerance over temperature. For designs that require accurate timing or USB, switch to an external crystal oscillator. Also, beware of accidentally enabling the JTAG/ICD pins on RB6/RB7 without realizing they share ICS_PGD/ICS_PGC function.
Estimated: at 25 MHz active core speed and 3.3V supply, the PIC32MM0016GPL020 consumes approximately 8 mA (26 mW). At maximum ambient 85 C and natural convection, junction temperature rise is only ~5 C above ambient due to the small die. The QFN exposed pad thermal resistance theta_JA is around 40 C/W, so thermal shutdown is unlikely in typical embedded applications. However, do not operate above 3.6V as internal LDO dissipation could increase junction temperature beyond safe limits.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - this is a commercial/industrial MCU; choose AEC-Q100 qualified PIC32 parts for automotive applications. MSL rating not specified in retrieved data.
