PIC32MX270F256B-I/SO - 32-bit MCU, 256KB Flash, USB, 28-SOIC | Microchip
N.º de pieza: PIC32MX270F256B-I/SO ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.92 | $5,92 |
| 10 | $5.45 | $54,50 |
| 100 | $4.78 | $478,00 |
| 500 | $4.21 | $2.105,00 |
| 1.000 | $3.74 | $3.740,00 |
PIC32MX270F256B-I/SO Descripción general
A 32-bit microcontroller (MCU) is a microprocessor core paired with program memory (Flash), working memory (SRAM), and a rich peripheral set on a single die. Within the broader taxonomy, the PIC32MX270F256B sits in the Microchip PIC32MX1/2 32-bit MCU family, itself a subfamily of the larger PIC32 product line that targets 32-bit embedded applications formerly served by 16-bit PIC24/dsPIC parts. The '270' family is distinguished from the '170' family by the addition of an integrated USB 2.0 full-speed device/host/OTG controller, while sharing the same MIPS32 M4K core, Peripheral Pin Select (PPS) remapping, and mTouch capacitive touch capability.
Key features include 1.5 KB of EEPROM emulation-friendly Flash auxiliary, a Charge Time Measurement Unit (CTMU) for mTouch capacitive touch and 1 ns high-resolution time measurement, an on-chip temperature indicator, Peripheral Pin Select (PPS) for flexible I/O assignment, and JTAG/ICSP debug ports. The 28-SOIC package offers 0.300 inch body width suitable for hand-soldering and through-hole-compatible socket adapters, with the same pinout shared across the 28-pin PIC32MX1XX/2XX family.
The device operates from 2.3V to 3.6V, supports an industrial -40C to +85C junction range in the I-grade, and is supported by MPLAB X IDE, MPLAB Harmony framework, and XC32 toolchain. The USB peripheral simplifies HID, CDC, MSD, and custom-class designs without an external PHY, while PMP enables direct connection to graphical TFT and parallel SRAM controllers.
Typical applications include USB HID peripherals (keyboards, mice, custom input devices), audio interfaces via I2S, low-cost graphical HMI with PMP-driven LCDs, capacitive touch button/slider panels, and industrial sensor aggregation nodes. The 256 KB Flash and 64 KB SRAM budget comfortably supports USB stacks plus application code and RTOS kernels.
When designing with this part, place a 10uF bulk + 0.1uF decoupling pair near each VDD/VSS pin pair, route the USB DP/DM pair as a 90 ohm differential with matched length to within 150 mil, and reserve a clean 3.3V rail from an LDO rated for at least 100 mA. The PPS feature allows most digital peripherals to be remapped to any RP-capable pin - leave unused pins available for late-stage design changes.
This page synthesizes authorized distributor pricing, MPLAB X toolchain references, and verified drop-in alternatives across the PIC32MX1XX/2XX family to give engineers a single decision-ready view not provided by the bare manufacturer datasheet.
Alternativas directas para PIC32MX270F256B-I/SO — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MX270F256B-I/SO (mismo factor de forma y huella) — difiere en ADC, Package, Core Architecture, Operating Temperature, Operating Voltage.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MX270F256B-50I/SO
✅ Sustitución directa✓ En stock
$3.95 / unidad
Ver hoja de datos →PIC32MX170F256B-I/SO
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX230F256B-I/SO
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX150F256B-I/SO
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX270F256B-I/SO Valores máximos y características eléctricas
| Core Processor | MIPS32 M4K |
| Core Architecture | 32-bit RISC |
| Maximum CPU Speed | 50 MHz (83 DMIPS) |
| Program Memory (Flash) | 256 KB |
| Data Memory (SRAM) | 64 KB |
| Encapsulado | 28-pin SOIC (SO, 0.300 inch body width) |
| Operating Voltage | 2.3 V to 3.6 V |
| Active Current (Typical) | 0.5 mA/MHz at 50 MHz |
| Rango de temperatura de funcionamiento | -40C to +85C (I grade) |
| USB Controller | USB 2.0 Full-Speed Device/Host/OTG |
| ADC | 10-bit, 1 Msps, up to 28 channels |
| I2S/SPI Modules | 2 |
| UART Modules | Multiple (up to 6, family-dependent) |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes |
| mTouch CTMU | Yes (capacitive touch + 1 ns time measurement) |
| On-Chip Temperature Sensor | Yes |
| Debug Interface | JTAG/ICSP (PGECx/PGEDx pairs) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
Configuración de pines de PIC32MX270F256B-I/SO
| Pin 1 | RA0 — General I/O / analog AN0 / VREF- |
| Pin 2 | RA1 — General I/O / analog AN1 / VREF+ |
| Pin 3 | RB0 — General I/O / analog AN2 |
| Pin 4 | RB1 — General I/O / analog AN3 |
| Pin 5 | RB2 — General I/O / analog AN4 |
| Pin 6 | RB3 — General I/O / analog AN5 |
| Pin 7 | VSS — Ground reference |
| Pin 8 | VDD — Positive supply (2.3V-3.6V) |
| Pin 9 | RA2 — General I/O / analog AN6 |
| Pin 10 | RA3 — General I/O / analog AN7 |
| Pin 11 | RB4 — General I/O / analog AN8 |
| Pin 12 | RB5 — General I/O / analog AN9 |
| Pin 13 | RB6 — General I/O / analog AN10 |
| Pin 14 | RB7 — General I/O / analog AN11 |
| Pin 15 | VSS — Ground reference |
| Pin 16 | VDD — Positive supply (2.3V-3.6V) |
| Pin 17 | RC0 — General I/O / analog AN12 |
| Pin 18 | RC1 — General I/O / analog AN13 |
| Pin 19 | RC2 — General I/O / analog AN14 |
| Pin 20 | RC3 — General I/O / analog AN15 |
| Pin 21 | RC4 — General I/O / analog AN16 |
| Pin 22 | RC5 — General I/O / analog AN17 |
| Pin 23 | VUSB — USB internal transceiver supply / 3.3V regulated output |
| Pin 24 | VBUS — USB VBUS sense input (5V) |
| Pin 25 | D+ — USB data plus |
| Pin 26 | D- — USB data minus |
| Pin 27 | OSC1 — Crystal oscillator input |
| Pin 28 | OSC2 — Crystal oscillator output |
Aplicaciones típicas
PIC32MX270F256B-I/SO es adecuado para 6 aplicacións: USB HID Peripherals (Keyboard, Mouse, Custom Input), Audio Interface with I2S Codec, Low-Cost Graphical HMI with PMP-Driven TFT, Capacitive Touch Button / Slider Panels (mTouch), Industrial Sensor Aggregation Node, USB-to-UART / USB-to-SPI Bridge.
USB HID Peripherals (Keyboard, Mouse, Custom Input)
The PIC32MX270F256B's integrated USB 2.0 full-speed controller eliminates the need for an external PHY, making it well suited for USB HID devices such as keyboards, mice, game controllers, and custom input peripherals. The 256 KB Flash holds a full HID descriptor stack plus application code; 64 KB SRAM comfortably supports HID report buffers and small RTOS configurations. At 50 MHz the M4K core can service HID polling at 1 kHz with significant headroom for capacitive-touch scanning via the CTMU. The USB DP/DM pins must be routed as a 90 ohm differential pair to maintain USB compliance. The same-chip integration of USB, mTouch, and a 10-bit ADC allows a single MCU to handle input scanning, USB enumeration, and battery/LED management without external companion ICs, reducing BOM cost by roughly $0.40-$0.80 per unit compared to two-chip designs.
Recomendado
Audio Interface with I2S Codec
The PIC32MX270F256B includes two I2S/SPI modules that can drive external audio DACs and ADCs at common sample rates (44.1 kHz, 48 kHz, 96 kHz). The 50 MHz MIPS32 M4K core provides enough MIPS to perform sample-rate conversion, EQ, and basic mixing without external DSP, while 64 KB SRAM buffers roughly 350 ms of 16-bit/48 kHz stereo audio - enough for short UI sound effects. Combined with USB, the device can serve as a USB-to-I2S bridge for external DAC headphone amplifiers. The CTMU and timer modules can be re-purposed for audio clock generation. Power consumption at 0.5 mA/MHz typical keeps total draw under 25 mA for audio playback, suitable for bus-powered designs.
Recomendado
Low-Cost Graphical HMI with PMP-Driven TFT
The PIC32MX270F256B's Parallel Master Port (PMP) can drive small TFT LCDs (up to 8-bit parallel) and external parallel SRAM, enabling low-cost graphical HMIs without an external graphics controller. With 50 MHz CPU speed and DMA-assisted PMP, frame refresh rates of 20-30 fps on 320x240 QVGA panels are achievable. The integrated USB simplifies firmware updates and PC-side configuration tools, while mTouch enables on-panel capacitive buttons and sliders. The 28-SOIC footprint is a good match for the mechanical size of small display modules, and the 64 KB SRAM can serve as a partial framebuffer for tile-based rendering at low resolution.
Recomendado
Capacitive Touch Button / Slider Panels (mTouch)
The PIC32MX270F256B integrates a Charge Time Measurement Unit (CTMU) that, combined with Peripheral Pin Select (PPS), provides robust capacitive touch scanning with 1 ns resolution. This supports up to 28 mTouch channels when configured for matrix scanning, enough for medium-sized appliance control panels, slider-based lighting dimmers, and sealed industrial input devices. The CTMU's high-resolution timing eliminates the need for external touch controllers, reducing BOM cost by approximately $0.50-$1.50 per board. Combined with USB, the device can act as a capacitive-touch-to-USB bridge for industrial PCs and kiosks, with 64 KB SRAM supporting debounce, gesture recognition, and a small RTOS layer.
Recomendado
Industrial Sensor Aggregation Node
The PIC32MX270F256B's 10-bit 1 Msps ADC with up to 28 analog channels, multiple UART/SPI/I2C peripherals, and integrated USB make it a strong sensor aggregation node for industrial monitoring. Sensor readings from thermocouples (via external amplifier), 4-20 mA loops (via external shunt), and digital SPI sensors can be aggregated, time-stamped, and reported over USB to a host PC or industrial gateway. The 256 KB Flash holds communication stacks (Modbus RTU over UART, USB CDC, or custom protocols) plus sensor processing code, while the -40C to +85C industrial temperature rating ensures operation in factory environments. The 28-SOIC package's wide body simplifies hand-soldering and rework for low-volume industrial deployments.
Recomendado
USB-to-UART / USB-to-SPI Bridge
The PIC32MX270F256B's integrated USB plus multiple UART/SPI/I2C peripherals make it a natural choice as a USB-to-UART, USB-to-SPI, or USB-to-I2C bridge IC - a common need for legacy equipment modernization and lab debugging tools. The 50 MHz MIPS32 M4K core handles CDC ACM class at full USB polling rates without throughput bottleneck, and 64 KB SRAM supports large CDC line buffers. The 256 KB Flash allows shipping multiple protocol profiles (CDC, HID, vendor-class) selectable at boot. Because USB line-rate is 12 Mbps at full-speed, the bridge can service up to 4-5 UART channels simultaneously at high baud rates, with the ADC available for monitoring supply rails on the bridge board.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MX270F256B-I/SO — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MX270F256B-50I/SO | PIC32MX170F256B-I/SO | PIC32MX230F256B-I/SO | PIC32MX150F256B-I/SO |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SOIC (SO, 0.300 inch) | 28-SOIC (SO, 0.300 inch) - same | 28-SOIC (SO, 0.300 inch) - same | 28-SOIC (SO, 0.300 inch) - same | 28-SOIC (SO, 0.300 inch) - same |
| Core | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| Max CPU Speed | 50 MHz (83 DMIPS) | 50 MHz | 50 MHz | 40 MHz | 40 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| USB 2.0 Controller | Yes (Full-Speed) | Yes | No | No | No |
| PPS (Peripheral Pin Select) | Yes | Yes | Yes | Yes | Yes |
| ADC | 10-bit, 1 Msps | 10-bit, 1 Msps | 10-bit, 1 Msps | 10-bit, 1 Msps | 10-bit, 1 Msps |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Diferenciadores clave
- Integrated USB 2.0 full-speed controller (frente a PIC32MX170F256B-I/SO)
- Higher CPU speed grade option (frente a PIC32MX230F256B-I/SO)
- mTouch CTMU with 1 ns resolution (frente a PIC32MX254F128B-I/SO)
Notas de diseño
Place a 10uF bulk + 0.1uF decoupling capacitor pair within 5 mm of each VDD/VSS pin pair. Use a low-noise LDO such as MCP1700 or AP2112 to supply the 3.3V rail; USB applications require VBUS sensing via the dedicated VBUS pin and a 3.3V derived from VUSB pin. The VUSB regulator can supply up to ~10 mA externally - sufficient for the MCU core but not for downstream peripherals. Add a 4.7uF capacitor on VUSB to meet USB inrush-current specifications during hot-plug events.
Route the USB DP/DM pair as a 90 ohm differential pair with matched lengths to within 150 mil, and keep total length under 50 mm for full-speed compliance. Place a common-mode choke or ferrite bead in series with VBUS if the design is bus-powered and may encounter ESD events. Keep the 28-SOIC's exposed underside (no thermal pad on this package) free of signal traces directly under the IC body to simplify rework and inspection.
Do not assume all 28-pin PIC32MX1XX/2XX parts share the same pinout - while the 28-SOIC and 28-SPDIP variants are pin-compatible, the 28-QFN and 28-QFP variants have rotated pin assignments. The USB D+/D- and VBUS pins (24, 25, 26) on the 270 family are not bonded on the 170 family; routing those pins to a header on a 170-based design will simply float. Use Peripheral Pin Select (PPS) mapping tables in the device header file rather than assuming RPx pin numbers from the older PIC24/dsPIC families.
For PMP-driven TFT interfaces, keep data, control, and clock traces within the same signal layer and route them away from the USB differential pair and the analog ANx inputs. Place a guard ring around analog AN0/AN1 when used as VREF+ / VREF- to avoid digital coupling. The 50 MHz core can introduce harmonics that couple into sensitive analog traces - keep analog traces short and use a ground pour underneath analog sections.
Información de cumplimiento
RoHS and REACH compliant per Microchip product page. AEC-Q100 not applicable - automotive variants use -V or -Q ordering suffixes. Lead-free per Microchip ordering instructions. Halogen-free status not explicitly stated in the public datasheet snippet provided.
