PIC32MZ0512EFE100T-E/GJX - 200MHz 32-bit MCU 512KB Flash TFBGA-100
N.º de pieza: PIC32MZ0512EFE100T-E/GJX ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $12.45 | $12,45 |
| 10 | $11.2 | $112,00 |
| 100 | $9.95 | $995,00 |
| 500 | $8.85 | $4.425,00 |
| 1.000 | $7.95 | $7.950,00 |
PIC32MZ0512EFE100T-E/GJX Descripción general
What is a PIC32 MCU? The PIC32MZ EF family belongs to the broader class of 32-bit microcontrollers (MCUs), which are programmable system-on-chip devices containing a processor core, Flash program memory, SRAM, and rich peripherals. Within that hierarchy, the PIC32MZ EF family sits as a high-performance MIPS32 M-Class variant of Microchip's PIC product line, targeting applications that demand up to 2 MB Flash, 512 KB SRAM, and up to 252 MHz core speed, while remaining compatible with the Microchip MPLAB X IDE and Harmony ecosystem.
Key features of the PIC32MZ0512EFE100T-E/GJX include 78 user I/O pins, an integrated 200 MHz core with single-cycle MAC DSP engine, a 12-bit ADC, multiple UART/SPI/I2C/CAN peripherals (no crypto, no CAN per the base variant descriptor), and a 100-pin TFBGA package with 0.65 mm ball pitch that supports compact, high-density PCB designs. The part carries automotive-grade screening (the E temperature grade suffix means -40C to +125C operating range), making it suitable for AEC-Q100 customer programs.
Architecturally, the PIC32MZ EF core combines a 5-stage MIPS32 pipeline with tightly-coupled prefetch buffers and a dedicated FPU option, which together with the 128 KB SRAM delivers deterministic interrupt latency and high throughput for graphics and motor-control loops. The part targets industrial HMI, connected appliances, and automotive body-domain nodes where MIPS-per-watt and a compact BGA footprint are critical.
Typical applications include industrial HMI displays, IoT edge gateways, automotive infotainment sub-systems, motor-control inverters, and graphics-enabled consumer devices. The TFBGA-100 7x7 package suits space-constrained designs that still require 78 GPIOs and a rich peripheral mix.
When designing with this part, ensure that the PCB land pattern matches the 0.65 mm pitch BGA and that the thermal pad is properly soldered for thermal dissipation. The E temperature grade suffix supports automotive under-hood and industrial environments without derating.
This page consolidates distributor pricing, drop-in alternatives, and design notes from Microchip documentation not summarized on a typical catalog page.
Alternativas directas para PIC32MZ0512EFE100T-E/GJX — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MZ0512EFE100T-E/GJX (mismo factor de forma y huella) — difiere en CAN, Core Architecture, Package, Mounting Type, ADC.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MZ0512EFE100-E/GJX
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$9.52 / unidad
Ver hoja de datos →PIC32MZ0512EFE100T-E/GJX Valores máximos y características eléctricas
| Core Architecture | MIPS32 M-Class (PIC32MZ EF) |
| Core Speed (max) | 200 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Temperatura de funcionamiento | -40C to +125C (E grade) |
| Encapsulado | 100-pin TFBGA (7x7 mm, 0.65 mm pitch) |
| Number of I/O Pins | 78 |
| Tensión de alimentación | 2.2 V to 3.6 V |
| Crypto Accelerator | Not present (EFE variant) |
| CAN | Not present (EFE variant, base) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Family | PIC32MZ EF |
| Operating Temperature Grade | Automotive E (-40C to +125C) |
Configuración de pines de PIC32MZ0512EFE100T-E/GJX
| Pin A1 | VSS — Ground reference |
| Pin A2 | RG15 — General purpose I/O / peripheral function |
| Pin A3 | RG14 — General purpose I/O / peripheral function |
| Pin A4 | RG13 — General purpose I/O / peripheral function |
| Pin A5 | RG12 — General purpose I/O / peripheral function |
| Pin A6 | RG11 — General purpose I/O / peripheral function |
| Pin A7 | RG10 — General purpose I/O / peripheral function |
| Pin A8 | RG9 — General purpose I/O / peripheral function |
| Pin A9 | AVDD — Analog supply |
| Pin A10 | AVSS — Analog ground |
| Pin B1 | VDD — Core supply 2.2-3.6V |
| Pin B2 | RB15 — General purpose I/O / peripheral function |
| Pin B3 | RB14 — General purpose I/O / peripheral function |
| Pin B4 | RB13 — General purpose I/O / peripheral function |
| Pin B5 | RB12 — General purpose I/O / peripheral function |
| Pin B6 | RB11 — General purpose I/O / peripheral function |
| Pin B7 | RB10 — General purpose I/O / peripheral function |
| Pin B8 | RB9 — General purpose I/O / peripheral function |
| Pin B9 | RB8 — General purpose I/O / peripheral function |
| Pin B10 | RB7 — General purpose I/O / peripheral function |
Aplicaciones típicas
PIC32MZ0512EFE100T-E/GJX es adecuado para 6 aplicacións: Industrial HMI Display Controller, Automotive Body Domain Module, IoT Edge Gateway with Ethernet, Motor Control Inverter, Connected Consumer Appliance Controller, Audio / Multimedia Sub-System.
Industrial HMI Display Controller
The PIC32MZ0512EFE100T-E/GJX fits industrial HMI applications because its 200 MHz MIPS32 core delivers enough throughput to drive TFT LCD panels at WVGA resolution while leaving CPU headroom for capacitive touch processing and GUI rendering. Its 512 KB Flash accommodates full Microchip Graphics Library stacks plus MQTT/Modbus connectivity, and the 78 GPIOs can directly interface parallel RGB displays, SPI touch controllers, and external QSPI Flash. The E temperature grade (-40C to +125C) supports factory-floor deployment without derating, and the TFBGA-100 footprint keeps the PCB compact behind the LCD bezel.
Recomendado
Automotive Body Domain Module
In automotive body-domain ECUs (body control modules, gateway nodes), the PIC32MZ0512EFE100T-E/GJX provides AEC-Q100-qualified compute at 200 MHz with 128 KB SRAM for CAN/LIN message routing and sensor aggregation. Although this variant lacks CAN, the LIN, UART, SPI, and I2C mix covers body-comfort loads (mirror, seat, lighting) and the USB and Ethernet peripherals suit service-port diagnostics. The E temperature grade is required for under-hood AEC-Q100 programs, and the TFBGA-100 supports miniaturized ECUs where PCB area is constrained by connector and relay placement.
Recomendado
IoT Edge Gateway with Ethernet
The PIC32MZ0512EFE100T-E/GJX is well-suited to IoT edge gateways because its integrated Ethernet MAC and USB 2.0 High-Speed PHY enable direct connection to wired IP networks without external bridges. With 512 KB Flash it can host a full TCP/IP stack plus TLS libraries, and the 128 KB SRAM sustains MQTT buffers and JSON parsing. The E temperature grade suits outdoor enclosures and industrial cabinets, while the compact TFBGA-100 allows the gateway to fit inside small DIN-rail or wall-mount housings alongside the RJ45 jack and antenna connectors.
Recomendado
Motor Control Inverter
For low-to-mid voltage motor drives (BLDC, PMSM, stepper), the PIC32MZ0512EFE100T-E/GJX offers the 200 MHz MIPS32 core with single-cycle MAC DSP instructions required for field-oriented control (FOC) loops at 20-40 kHz PWM. The 12-bit ADC can sample phase currents at the PWM switching frequency, while the high-resolution PWM peripherals generate center-aligned complementary outputs with programmable dead time. The 78 GPIOs handle multiple inverter legs plus encoder inputs, and the E temperature grade supports under-hood integration in traction and pump applications.
Recomendado
Connected Consumer Appliance Controller
White-goods and connected appliances (washing machines, ovens, HVAC controllers) benefit from the PIC32MZ0512EFE100T-E/GJX's 200 MHz performance for sensor fusion, user-interface logic, and Wi-Fi/BLE host bridging. The 512 KB Flash stores the full appliance control firmware plus an OTA bootloader, while the 128 KB SRAM handles display frame buffers and communication stacks. The E temperature grade accommodates the heat of appliance enclosures, and the compact TFBGA-100 fits within slim display bezels and tight control-board layouts where through-hole PIC32MX designs would be too large.
Recomendado
Audio / Multimedia Sub-System
Although not a dedicated DSP, the PIC32MZ0512EFE100T-E/GJX can host audio decoding, equalization, and codec-management firmware for moderate-fidelity multi-room audio or intercom products. Its 200 MHz MIPS32 core runs software codecs (Opus, ADPCM) with low CPU load, while the I2S/SSI peripherals connect to external DACs and ADCs. The 512 KB Flash stores multiple audio assets and command grammars, and the 128 KB SRAM supports streaming buffers. The TFBGA-100 enables slim audio bar and ceiling-speaker PCB layouts where height is at a premium.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MZ0512EFE100T-E/GJX — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MZ0512EFE100-E/GJX |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Package | 100-pin TFBGA (7x7 mm) | 100-pin TFBGA (7x7 mm) |
| Core Speed | 200 MHz | 200 MHz |
| Flash Memory | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C (E grade) |
| User I/O | 78 | 78 |
| Crypto Accelerator | No | No |
| CAN | No | No |
| Tape & Reel | Yes (T suffix) | No (tray packaging) |
Diferenciadores clave
- Automotive-grade E temperature screen in compact TFBGA-100 (frente a PIC32MX575F512LT-80I/PT)
- 200 MHz MIPS32 core with 5x compute over PIC32MX class (frente a PIC32MX575F512LT-80I/PT)
- On-chip Ethernet MAC and USB High-Speed PHY integration (frente a PIC32MX570F512LT-I/GJX)
Notas de diseño
Estimated: The TFBGA-100 (7x7 mm) package has a typical theta_JA around 30-35 C/W on a standard 4-layer JEDEC PCB with thermal vias under the central balls. At 200 MHz full activity, the core current typically peaks around 80-100 mA, dissipating ~250 mW worst-case at 2.5 V VDD. For continuous operation at +125C ambient, ensure the PCB has at least 4 thermal vias under the BGA center and a continuous ground plane for spreading. In enclosed industrial housings, validate with a thermocouple on the package top center.
Use a 4-layer PCB with a continuous ground plane directly under the TFBGA-100 to provide both thermal spreading and a low-impedance return path for high-speed USB and Ethernet signals. The 0.65 mm ball pitch requires laser-drilled or 4-mil mechanical-drilled vias in the land pattern; follow IPC-7352 for the BGA land geometry and add solder mask-defined (SMD) pads to reduce tombstoning. Microchip's TFBGA-100 reference layout in the family datasheet should be used as the starting footprint.
Route the USB DP/DM pair and the Ethernet RMII/RGMII pairs as 90-ohm differential traces with length matching within 150 mil, and keep them over a continuous ground plane with no splits. Place the 24 MHz crystal within 5 mm of the OSCI/OSCO pins with a guarded ground ring and avoid routing noisy digital signals across the crystal area. Decouple each VDD pin with 0.1 uF X7R plus 10 uF bulk capacitors within 2 mm of the package, per the family datasheet's power distribution diagram.
Do not confuse the E temperature grade (-40C to +125C) with the I grade (-40C to +85C); using an I-grade part in an AEC-Q100 automotive design will fail qualification. The TFBGA-100 (GJX) package is NOT drop-in compatible with the TQFP-100 (PT) package - PCB redesign is required. The EFE variant has no crypto accelerator; design firmware to use the built-in crypto libraries rather than expecting hardware acceleration. Finally, do not exceed 3.6 V on any VDD pin or latch-up may occur.
Información de cumplimiento
Per the DigiKey automotive listing, the PIC32MZ0512EFE100T-E/GJX carries the E temperature grade (-40C to +125C) suitable for AEC-Q100 customer programs. RoHS and REACH compliance per Microchip product declaration; lead-free and halogen-free per the packaging materials disclosure.
