PIC32MZ1024ECH064T-I/MR - 200MHz 1MB Flash MCU 64-QFN | Microchip
N.º de pieza: PIC32MZ1024ECH064T-I/MR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $13.2 | $13,20 |
| 10 | $12.05 | $120,50 |
| 100 | $10.75 | $1.075,00 |
| 500 | $9.6 | $4.800,00 |
| 1.000 | $8.55 | $8.550,00 |
PIC32MZ1024ECH064T-I/MR Descripción general
A 32-bit microcontroller (MCU) is a programmable system-on-chip that integrates a CPU core, Flash program memory, SRAM, and a rich set of peripherals (USB, Ethernet, CAN, ADC, timers, GPIOs) into a single semiconductor device. The PIC32MZ ECH family sits at the high end of Microchip's PIC32 lineup, combining the microAptiv core with on-chip HS USB, Ethernet MAC, CAN, and a 12-bit 18-channel ADC — making it suitable for industrial, audio, and graphics HMI applications.
Key features of this specific device include 200 MHz core speed delivering up to 330 DMIPS / 3.3 VCore (DMIPS/MHz = 1.65), 1 MB (1M x 8) Flash with live-update capability, 512 KB SRAM, and 64 KB data Flash. Integrated peripherals include a 10/100 Ethernet MAC, two CAN 2.0b controllers, Hi-Speed USB 2.0 (480 Mbps) host/device/OTG, a 12-bit 18-channel ADC at 1.2 Msps, and a dedicated audio I²S interface. The chip also has 53 GPIO, 8 DMA channels, 9 timers, and a 4-wire JTAG programming/debug port.
The PIC32MZ1024ECH family uses a superscalar MIPS microAptiv (M4K) core with MMU support and DSP extensions, allowing efficient C code execution and Linux-capable RTOS deployment. The 1.2V internal core regulator generates VCORE from a single 3.3V rail, simplifying PCB design while the wide 2.3V–3.6V operating range suits industrial 24V-bus-derived supplies.
Typical applications include industrial control HMI panels, audio DAC/amplifier control, Ethernet/CAN gateway nodes, USB-based instrumentation, and graphics display controllers with resistive-touch sensing. The combination of Ethernet + USB OTG + CAN makes it a strong fit for industrial IoT edge nodes.
When designing with this part, ensure the exposed pad is soldered to a continuous ground copper pour of at least 25 mm² to meet thermal and electrical performance. Decouple VCORE / VDD with 100 nF + 4.7 µF ceramics placed within 5 mm of the pins, and use the internal 1.2V regulator's required 4.7 µF output capacitor. JTAG/SWD trace lengths should remain under 50 mm for reliable debug operation.
This page synthesizes real-time distributor pricing, drop-in package alternatives, and practical PCB design notes drawn from Microchip's PIC32MZ1024ECH datasheet family — content not consolidated on any single distributor page.
Alternativas directas para PIC32MZ1024ECH064T-I/MR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MZ1024ECH064T-I/MR (mismo factor de forma y huella) — difiere en ADC, DMA Channels, Operating Temperature, Package, I/O Pins.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MZ1024ECG064-I/MR
✅ Sustitución directa✓ En stock
$8.9 / unidad
Ver hoja de datos →PIC32MZ1024ECH064-I/MR
✅ Sustitución directa✓ En stock
$4.95 / unidad
Ver hoja de datos →PIC32MZ0512EFK064T-I/MR
✅ Sustitución directa✓ En stock
$5.93 / unidad
Ver hoja de datos →PIC32MZ1024ECH064T-I/MR Valores máximos y características eléctricas
| Core | MIPS32 microAptiv (M4K) with DSP extensions |
| Maximum CPU Speed | 200 MHz |
| Performance | 330 DMIPS (1.65 DMIPS/MHz) |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 512 KB |
| Data Flash | 64 KB (Live-Update capable) |
| Operating Voltage | 2.3 V to 3.6 V |
| Internal Core Voltage | 1.2 V (regulated) |
| I/O Pins | 53 GPIO |
| ADC | 12-bit, 18 channels, 1.2 Msps |
| Ethernet | 10/100 MAC (MII/RMII) |
| USB | Hi-Speed USB 2.0 OTG, 480 Mbps |
| CAN | 2x CAN 2.0b |
| Timers | 9 (16-bit / 32-bit) |
| DMA Channels | 8 |
| Encapsulado | 64-pin QFN (9x9 mm) with exposed pad |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40°C to +85°C (Industrial, "-I") |
| Packaging | Tape & Reel ("T") |
Guía de configuración de pines de PIC32MZ1024ECH064T-I/MR 64-pin qfn (9x9 mm) with exposed pad
Configuración de pines para PIC32MZ1024ECH064T-I/MR (encapsulado 64-pin qfn (9x9 mm) with exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para PIC32MZ1024ECH064T-I/MR.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PIC32MZ1024ECH064T-I/MR es adecuado para 3 aplicacións: Industrial Ethernet Gateway, Audio/Graphics HMI Controller, USB-Connected Test & Measurement.
Industrial Ethernet Gateway
The PIC32MZ1024ECH064T-I/MR is purpose-built for industrial Ethernet gateways thanks to its integrated 10/100 MAC with MII/RMII support, dual CAN 2.0b controllers, and 1 MB Live-Update Flash. At 200 MHz / 330 DMIPS, it can run a full TCP/IP stack plus Modbus TCP, EtherNet/IP, or MQTT bridging firmware simultaneously. The 512 KB SRAM holds multiple concurrent socket buffers while the 64 KB data Flash stores configuration that survives reflash. Its industrial -40°C to +85°C grade and 2.3V–3.6V supply tolerate 24V-bus-derived industrial rails. Compared to external MAC + MCU designs, the integrated peripherals shrink BOM by removing an Ethernet controller IC.
Recomendado
Audio/Graphics HMI Controller
Audio and graphics HMI panels leverage the PIC32MZ1024ECH064T-I/MR's I²S audio interface, 12-bit 18-channel ADC, and 200 MHz performance for real-time UI rendering. The 53 GPIO can drive a TFT panel via parallel RGB, while the 1 MB Flash stores fonts and graphics assets. With DSP extensions, the microAptiv core can decode compressed audio streams while updating display buffers via the 8-channel DMA. The 64-QFN footprint fits slim industrial panel enclosures. Compared to PIC32MX MCUs, the ECH family adds higher CPU bandwidth and Live-Update Flash, enabling field-upgradable HMI without external memory.
Recomendado
USB-Connected Test & Measurement
Test and measurement instruments benefit from the PIC32MZ1024ECH064T-I/MR's Hi-Speed USB 2.0 OTG controller, which streams 12-bit ADC samples at 1.2 Msps to a host PC in real time. The 8 DMA channels relieve the CPU of buffer-copy overhead, freeing the 200 MHz MIPS core for FFT, calibration, or signal-processing tasks. The 512 KB SRAM buffers multiple sample windows and the 1 MB Flash stores calibration coefficients. The integrated USB PHY (no external transceiver required) keeps the BOM compact for portable bench instruments. Compared to FPGA + soft-MCU designs, this device offers a lower-cost single-chip solution for sub-MHz sp5 hardware.
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MZ1024ECH064T-I/MR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MZ1024ECG064-I/MR | PIC32MZ1024ECH064-I/MR | PIC32MZ0512EFK064T-I/MR |
|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Architecture | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz - same | MIPS32 microAptiv 200 MHz - same | MIPS32 microAptiv 200 MHz - same |
| Program Flash | 1 MB | 2 MB (+100%) | 1 MB - same | 512 KB (-50%) |
| SRAM | 512 KB | 512 KB - same | 512 KB - same | 128 KB (-75%) |
| Ethernet | 10/100 MAC integrated | 10/100 MAC integrated - same | 10/100 MAC integrated - same | 10/100 MAC integrated - same |
| USB | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG - same | Hi-Speed USB 2.0 OTG - same | Hi-Speed USB 2.0 OTG - same |
| Operating Temperature | -40°C to +85°C (Industrial) | -40°C to +85°C (Industrial) - same | -40°C to +85°C (Industrial) - same | -40°C to +85°C (Industrial) - same |
Diferenciadores clave
- Only 1 MB Flash 64-QFN member of the PIC32MZ ECH family with tape-and-reel packaging (frente a PIC32MZ1024ECG064-I/MR)
- Live-Update dual-bank Flash supports field firmware swap without external memory (frente a PIC32MX575F512L-80I/PT)
- Industrial -40°C to +85°C temperature grade with tape-and-reel packaging (frente a PIC32MZ1024ECH064T-E/MR)
Notas de diseño
The 64-QFN package relies on its exposed pad for thermal dissipation. Solder the EP to a continuous ground copper pour of at least 25 mm² to maintain theta_JA within datasheet limits. For industrial -40°C to +85°C operation at 200 MHz with sustained Ethernet + USB activity, add thermal vias (8-12) under the EP to inner ground layers. Without adequate EP soldering, junction temperature may exceed the 125°C limit under full peripheral load.
Place 100 nF + 4.7 µF ceramic decoupling capacitors within 5 mm of each VDD/VCAP pin. The internal 1.2V regulator (VCORE) requires a low-ESR 4.7 µF output capacitor on the VCAP pin. Estimated core current at 200 MHz is approximately 90 mA; total VDD current with Ethernet + USB active can reach 150 mA. Use a 4-layer PCB with dedicated power/ground planes to meet the 100 MHz+ signal integrity requirements of USB 2.0 HS and Ethernet RMII.
Keep JTAG/SWD trace lengths under 50 mm to ensure reliable debug operation. Place the 12.67 MHz primary crystal within 5 mm of the OSC1/OSC2 pins with guard traces to ground. Ethernet RMII traces require 50 Ω impedance and length matching within 50 mils; USB DP/DM traces require 90 Ω differential impedance per USB 2.0 spec. Avoid routing sensitive analog traces (ADC, VREF) parallel to switching power or RMII clocks.
Do not confuse the /MR suffix (64-QFN) with /PT (64-TQFP); the PCB footprints differ and parts cannot be interchanged without redesign. The internal 1.2V regulator must be enabled by configuration fuse — leaving it bypassed can damage the core. The Live-Update Flash feature requires dual-bank firmware; failing to design the bootloader properly causes brick on partial updates. Ethernet RMII requires a 50 MHz clock source from either the MCU or the external PHY; misconfiguration causes intermittent link drops.
Información de cumplimiento
RoHS compliant per Microchip product page. Industrial temperature grade only — not AEC-Q100 qualified; for automotive, use PIC32MZ1024ECH064T-E/MR (-E extended grade). Lead-free finish standard for QFN package.
