PIC32MZ1024ECH064T-I/MR - 200MHz 1MB Flash MCU 64-QFN | Microchip
Référence : PIC32MZ1024ECH064T-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.2 | $13,20 |
| 10 | $12.05 | $120,50 |
| 100 | $10.75 | $1 075,00 |
| 500 | $9.6 | $4 800,00 |
| 1 000 | $8.55 | $8 550,00 |
PIC32MZ1024ECH064T-I/MR Présentation
A 32-bit microcontroller (MCU) is a programmable system-on-chip that integrates a CPU core, Flash program memory, SRAM, and a rich set of peripherals (USB, Ethernet, CAN, ADC, timers, GPIOs) into a single semiconductor device. The PIC32MZ ECH family sits at the high end of Microchip's PIC32 lineup, combining the microAptiv core with on-chip HS USB, Ethernet MAC, CAN, and a 12-bit 18-channel ADC — making it suitable for industrial, audio, and graphics HMI applications.
Key features of this specific device include 200 MHz core speed delivering up to 330 DMIPS / 3.3 VCore (DMIPS/MHz = 1.65), 1 MB (1M x 8) Flash with live-update capability, 512 KB SRAM, and 64 KB data Flash. Integrated peripherals include a 10/100 Ethernet MAC, two CAN 2.0b controllers, Hi-Speed USB 2.0 (480 Mbps) host/device/OTG, a 12-bit 18-channel ADC at 1.2 Msps, and a dedicated audio I²S interface. The chip also has 53 GPIO, 8 DMA channels, 9 timers, and a 4-wire JTAG programming/debug port.
The PIC32MZ1024ECH family uses a superscalar MIPS microAptiv (M4K) core with MMU support and DSP extensions, allowing efficient C code execution and Linux-capable RTOS deployment. The 1.2V internal core regulator generates VCORE from a single 3.3V rail, simplifying PCB design while the wide 2.3V–3.6V operating range suits industrial 24V-bus-derived supplies.
Typical applications include industrial control HMI panels, audio DAC/amplifier control, Ethernet/CAN gateway nodes, USB-based instrumentation, and graphics display controllers with resistive-touch sensing. The combination of Ethernet + USB OTG + CAN makes it a strong fit for industrial IoT edge nodes.
When designing with this part, ensure the exposed pad is soldered to a continuous ground copper pour of at least 25 mm² to meet thermal and electrical performance. Decouple VCORE / VDD with 100 nF + 4.7 µF ceramics placed within 5 mm of the pins, and use the internal 1.2V regulator's required 4.7 µF output capacitor. JTAG/SWD trace lengths should remain under 50 mm for reliable debug operation.
This page synthesizes real-time distributor pricing, drop-in package alternatives, and practical PCB design notes drawn from Microchip's PIC32MZ1024ECH datasheet family — content not consolidated on any single distributor page.
Alternatives de remplacement direct pour PIC32MZ1024ECH064T-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024ECH064T-I/MR (même facteur de forme et même empreinte) — différant par ADC, DMA Channels, Operating Temperature, Package, I/O Pins.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024ECG064-I/MR
✅ Remplacement direct✓ En stock
$8.9 / unité
Voir la fiche technique →PIC32MZ1024ECH064-I/MR
✅ Remplacement direct✓ En stock
$4.95 / unité
Voir la fiche technique →PIC32MZ0512EFK064T-I/MR
✅ Remplacement direct✓ En stock
$5.93 / unité
Voir la fiche technique →PIC32MZ1024ECH064T-I/MR Valeurs maximales et caractéristiques électriques
| Core | MIPS32 microAptiv (M4K) with DSP extensions |
| Maximum CPU Speed | 200 MHz |
| Performance | 330 DMIPS (1.65 DMIPS/MHz) |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 512 KB |
| Data Flash | 64 KB (Live-Update capable) |
| Operating Voltage | 2.3 V to 3.6 V |
| Internal Core Voltage | 1.2 V (regulated) |
| I/O Pins | 53 GPIO |
| ADC | 12-bit, 18 channels, 1.2 Msps |
| Ethernet | 10/100 MAC (MII/RMII) |
| USB | Hi-Speed USB 2.0 OTG, 480 Mbps |
| CAN | 2x CAN 2.0b |
| Timers | 9 (16-bit / 32-bit) |
| DMA Channels | 8 |
| Boîtier | 64-pin QFN (9x9 mm) with exposed pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40°C to +85°C (Industrial, "-I") |
| Packaging | Tape & Reel ("T") |
Guide de configuration des broches du PIC32MZ1024ECH064T-I/MR 64-pin qfn (9x9 mm) with exposed pad
Configuration des broches du PIC32MZ1024ECH064T-I/MR (boîtier 64-pin qfn (9x9 mm) with exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ1024ECH064T-I/MR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ1024ECH064T-I/MR convient pour 3 applications: Industrial Ethernet Gateway, Audio/Graphics HMI Controller, USB-Connected Test & Measurement.
Industrial Ethernet Gateway
The PIC32MZ1024ECH064T-I/MR is purpose-built for industrial Ethernet gateways thanks to its integrated 10/100 MAC with MII/RMII support, dual CAN 2.0b controllers, and 1 MB Live-Update Flash. At 200 MHz / 330 DMIPS, it can run a full TCP/IP stack plus Modbus TCP, EtherNet/IP, or MQTT bridging firmware simultaneously. The 512 KB SRAM holds multiple concurrent socket buffers while the 64 KB data Flash stores configuration that survives reflash. Its industrial -40°C to +85°C grade and 2.3V–3.6V supply tolerate 24V-bus-derived industrial rails. Compared to external MAC + MCU designs, the integrated peripherals shrink BOM by removing an Ethernet controller IC.
Recommandé
Audio/Graphics HMI Controller
Audio and graphics HMI panels leverage the PIC32MZ1024ECH064T-I/MR's I²S audio interface, 12-bit 18-channel ADC, and 200 MHz performance for real-time UI rendering. The 53 GPIO can drive a TFT panel via parallel RGB, while the 1 MB Flash stores fonts and graphics assets. With DSP extensions, the microAptiv core can decode compressed audio streams while updating display buffers via the 8-channel DMA. The 64-QFN footprint fits slim industrial panel enclosures. Compared to PIC32MX MCUs, the ECH family adds higher CPU bandwidth and Live-Update Flash, enabling field-upgradable HMI without external memory.
Recommandé
USB-Connected Test & Measurement
Test and measurement instruments benefit from the PIC32MZ1024ECH064T-I/MR's Hi-Speed USB 2.0 OTG controller, which streams 12-bit ADC samples at 1.2 Msps to a host PC in real time. The 8 DMA channels relieve the CPU of buffer-copy overhead, freeing the 200 MHz MIPS core for FFT, calibration, or signal-processing tasks. The 512 KB SRAM buffers multiple sample windows and the 1 MB Flash stores calibration coefficients. The integrated USB PHY (no external transceiver required) keeps the BOM compact for portable bench instruments. Compared to FPGA + soft-MCU designs, this device offers a lower-cost single-chip solution for sub-MHz sp5 hardware.
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024ECH064T-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024ECG064-I/MR | PIC32MZ1024ECH064-I/MR | PIC32MZ0512EFK064T-I/MR |
|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Architecture | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz - same | MIPS32 microAptiv 200 MHz - same | MIPS32 microAptiv 200 MHz - same |
| Program Flash | 1 MB | 2 MB (+100%) | 1 MB - same | 512 KB (-50%) |
| SRAM | 512 KB | 512 KB - same | 512 KB - same | 128 KB (-75%) |
| Ethernet | 10/100 MAC integrated | 10/100 MAC integrated - same | 10/100 MAC integrated - same | 10/100 MAC integrated - same |
| USB | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG - same | Hi-Speed USB 2.0 OTG - same | Hi-Speed USB 2.0 OTG - same |
| Operating Temperature | -40°C to +85°C (Industrial) | -40°C to +85°C (Industrial) - same | -40°C to +85°C (Industrial) - same | -40°C to +85°C (Industrial) - same |
Principaux différenciateurs
- Only 1 MB Flash 64-QFN member of the PIC32MZ ECH family with tape-and-reel packaging (vs PIC32MZ1024ECG064-I/MR)
- Live-Update dual-bank Flash supports field firmware swap without external memory (vs PIC32MX575F512L-80I/PT)
- Industrial -40°C to +85°C temperature grade with tape-and-reel packaging (vs PIC32MZ1024ECH064T-E/MR)
Notes de conception
The 64-QFN package relies on its exposed pad for thermal dissipation. Solder the EP to a continuous ground copper pour of at least 25 mm² to maintain theta_JA within datasheet limits. For industrial -40°C to +85°C operation at 200 MHz with sustained Ethernet + USB activity, add thermal vias (8-12) under the EP to inner ground layers. Without adequate EP soldering, junction temperature may exceed the 125°C limit under full peripheral load.
Place 100 nF + 4.7 µF ceramic decoupling capacitors within 5 mm of each VDD/VCAP pin. The internal 1.2V regulator (VCORE) requires a low-ESR 4.7 µF output capacitor on the VCAP pin. Estimated core current at 200 MHz is approximately 90 mA; total VDD current with Ethernet + USB active can reach 150 mA. Use a 4-layer PCB with dedicated power/ground planes to meet the 100 MHz+ signal integrity requirements of USB 2.0 HS and Ethernet RMII.
Keep JTAG/SWD trace lengths under 50 mm to ensure reliable debug operation. Place the 12.67 MHz primary crystal within 5 mm of the OSC1/OSC2 pins with guard traces to ground. Ethernet RMII traces require 50 Ω impedance and length matching within 50 mils; USB DP/DM traces require 90 Ω differential impedance per USB 2.0 spec. Avoid routing sensitive analog traces (ADC, VREF) parallel to switching power or RMII clocks.
Do not confuse the /MR suffix (64-QFN) with /PT (64-TQFP); the PCB footprints differ and parts cannot be interchanged without redesign. The internal 1.2V regulator must be enabled by configuration fuse — leaving it bypassed can damage the core. The Live-Update Flash feature requires dual-bank firmware; failing to design the bootloader properly causes brick on partial updates. Ethernet RMII requires a 50 MHz clock source from either the MCU or the external PHY; misconfiguration causes intermittent link drops.
Informations de conformité
RoHS compliant per Microchip product page. Industrial temperature grade only — not AEC-Q100 qualified; for automotive, use PIC32MZ1024ECH064T-E/MR (-E extended grade). Lead-free finish standard for QFN package.
