PIC32MZ1025DAS176T-V/2J - 200MHz MCU, 1MB Flash, Graphics+32MB DDR2 | Microchip
N.º de pieza: PIC32MZ1025DAS176T-V/2J ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8.62 | $8,62 |
| 10 | $8.21 | $82,10 |
| 100 | $7.55 | $755,00 |
| 500 | $6.88 | $3.440,00 |
| 1.000 | $6.1 | $6.100,00 |
PIC32MZ1025DAS176T-V/2J Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and programmable peripherals. The PIC32MZ DAS family sits in the high-performance tier of 32-bit MCUs, combining an MPU-class MIPS core with an integrated 2D graphics controller and DDR2 memory interface. This architecture targets graphical user interface (GUI) applications where discrete MPU + external memory + external LCD controller designs would otherwise inflate BOM cost and PCB area. Hypernyms: MCU -> 32-bit microcontroller -> embedded processor -> semiconductor IC.
Key differentiating features include the integrated DDR2 memory controller (eliminating external SDRAM glue logic), hardware 2D graphics accelerator (reducing CPU overhead for rendering), HS USB 2.0 with integrated PHY, and a 200 MHz/330 DMIPS core. Compared with bare-metal PIC32MX parts, the DAS variant reduces system cost for HMI designs by absorbing graphics, DRAM, and high-speed connectivity into one package. The 45-channel 12-bit 18 MSPS ADC is the fastest in the PIC32 family, enabling high-speed sensor acquisition without an external ADC.
Typical applications include industrial HMI panels with TFT LCDs, automotive instrument clusters, medical patient monitors with GUI, point-of-sale terminals, and home automation touch-screen controllers. Designers choose this part when the design needs a smooth GUI rendering on 4-7 inch displays, an external frame buffer in DDR2, and CAN/USB connectivity for industrial networking.
When designing with the PIC32MZ1025DAS176T-V/2J, ensure the DDR2 trace lengths are length-matched per JEDEC DDR2 specifications and that the LQFP-176 thermal pad (if any) is soldered for proper heat dissipation. Programming is supported via MPLAB X IDE with MPLAB Harmony framework; third-party display drivers and graphics middleware from Microchip accelerate GUI development.
Alternativas directas para PIC32MZ1025DAS176T-V/2J — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MZ1025DAS176T-V/2J (mismo factor de forma y huella) — difiere en USB, Graphics Controller, External Memory Interface, Core Architecture, Package.
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PIC32MZ1025DAS176-V/2J
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PIC32MZ1025DAK176-V/2J
✅ Sustitución directa✓ En stock
$5.72 / unidad
Ver hoja de datos →PIC32MZ1025DAR176-V/2J
✅ Sustitución directa✓ En stock
$15.92 / unidad
Ver hoja de datos →PIC32MZ1025DAL176-I/2J
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$5.5 / unidad
Ver hoja de datos →PIC32MZ1025DAB176T-I/2J
✅ Sustitución directa✓ En stock
$21.75 / unidad
Ver hoja de datos →PIC32MZ1025DAS176T-V/2J Valores máximos y características eléctricas
| Core Architecture | MIPS32 microAptiv |
| Core Width | 32-bit Single-Core |
| Maximum Clock Speed | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| RAM Size | 256K x 8 + 32MB stacked DDR2 SDRAM |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated 2D Graphics Controller + GPU |
| External Memory Interface | DDR2 SDRAM controller (32MB on-chip stacked) |
| USB | Hi-Speed USB 2.0 with on-chip transceiver |
| CAN | Yes (CAN 2.0B) |
| I/O Count | 120 I/O pins |
| Encapsulado | 176-LQFP (20x20 mm) |
| Tipo de montaje | Surface Mount |
| Rango de temperatura de funcionamiento | -40C to +105C (V-temp) |
| Packaging | Tape & Reel |
| Nivel MSL | 3 (168 hours) |
| Estado RoHS | Compliant |
Guía de configuración de pines de PIC32MZ1025DAS176T-V/2J 176-lqfp (20x20 mm)
Configuración de pines para PIC32MZ1025DAS176T-V/2J (encapsulado 176-lqfp (20x20 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para PIC32MZ1025DAS176T-V/2J.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PIC32MZ1025DAS176T-V/2J es adecuado para 6 aplicacións: Industrial HMI with TFT LCD, Automotive Instrument Cluster, Medical Patient Monitor GUI, Point-of-Sale (POS) Terminal, Smart Home Touchscreen Controller, Building Automation Touch Panel.
Industrial HMI with TFT LCD
The PIC32MZ1025DAS176T-V/2J targets industrial human-machine interface panels with 4-7 inch WVGA TFT LCDs. Its integrated 2D graphics controller plus hardware GPU render icons, fonts, and animations at 60 fps without burdening the 200 MHz MIPS core. The 32MB stacked DDR2 serves as the frame buffer, eliminating external SDRAM and reducing PCB area. The 120 GPIO, 45-channel 12-bit 18 MSPS ADC, CAN, and HS USB cover typical industrial panel needs. Designers save approximately $1.50-2.00 in BOM by removing external memory chips.
Recomendado
Automotive Instrument Cluster
The PIC32MZ1025DAS176T-V/2J with V-temp grade (-40C to +105C) suits automotive instrument cluster displays. The 2D graphics controller renders speedometer, tachometer, and warning icons on TFT LCDs, while the 200 MHz MIPS core handles real-time CAN bus message processing. The integrated 32MB DDR2 frame buffer keeps the BOM small, critical for cost-sensitive automotive designs. The 12-bit 18 MSPS ADC reads fuel-level, temperature, and battery-voltage sensors directly, eliminating an external ADC. AEC-Q100 qualification is not present on this grade; automotive Tier-1 OEMs typically require Q100-compliant variants.
Recomendado
Medical Patient Monitor GUI
Medical patient monitors with color touchscreen GUI benefit from the PIC32MZ1025DAS176T-V/2J's graphics integration and 12-bit 18 MSPS ADC. The ADC samples multi-lead ECG, SpO2, and temperature signals with 45 channels, replacing external ADC ICs. The 32MB stacked DDR2 stores waveform history buffers and graphical assets without external memory. The 200 MHz core runs real-time signal processing while the GPU handles display updates. Designers must validate IEC 60601-1 compliance separately; the MCU itself is not a finished medical device. For battery-powered portable monitors, evaluate low-power PIC32MX variants.
Recomendado
Point-of-Sale (POS) Terminal
Point-of-sale terminals with touchscreen interface use the PIC32MZ1025DAS176T-V/2J as the main processor, leveraging its 2D graphics controller for product catalogs, payment screens, and receipt printing. The HS USB 2.0 supports barcode scanners, receipt printers, and customer displays. The integrated DDR2 frame buffer enables smooth GUI animation for product images and QR codes. CAN is rarely used in POS; the peripheral is available for legacy retail fixtures. V-temp range supports kitchen or warehouse environments where ambient temperature may exceed 70C. The 120 GPIO can drive multiple keypads, LEDs, and auxiliary peripherals simultaneously.
Recomendado
Smart Home Touchscreen Controller
Premium smart-home touchscreen controllers use the PIC32MZ1025DAS176T-V/2J to drive 4-7 inch capacitive-touch displays showing HVAC, lighting, security, and media controls. The 2D graphics controller animates smooth UI transitions, while the 32MB stacked DDR2 holds icons, fonts, and screen layouts. The HS USB connects to external cameras and storage, while CAN interfaces with high-end HVAC and security systems. WiFi/Bluetooth connectivity is provided by companion modules such as the Microchip ATWINC3400 over SPI/UART. The 200 MHz MIPS core runs MQTT or Matter protocol stacks comfortably.
Recomendado
Building Automation Touch Panel
Commercial building automation panels with 7-inch TFT LCDs deploy the PIC32MZ1025DAS176T-V/2J for centralized control of HVAC, lighting, blinds, and access control. The 45-channel 12-bit 18 MSPS ADC reads analog sensors (temperature, humidity, CO2) directly, while CAN interfaces with BACnet or proprietary building-automation networks. The 32MB stacked DDR2 frame buffer stores floor plans and zone-control graphics. The 200 MHz MIPS core handles BACnet/IP and Modbus TCP protocol stacks. The V-temp -40C to +105C range supports unheated mechanical rooms where temperatures can drop below freezing or exceed 85C during summer peaks.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MZ1025DAS176T-V/2J — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MZ1025DAS176-V/2J | PIC32MZ1025DAK176-V/2J | PIC32MZ1025DAR176-V/2J | PIC32MZ1025DAL176-I/2J | PIC32MZ1025DAB176T-I/2J |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20) | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same |
| Core Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Size | 1 MB | 1 MB | 1 MB | 4 MB | 2 MB | 1 MB |
| Integrated DDR2 | 32 MB stacked | 32 MB stacked | 128 MB stacked | External memory interface | 32 MB stacked | External memory interface |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +105C (V-temp) | -40C to +105C (V-temp) | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| Packaging | Tape & Reel | Tray | Tray | Tray | Tray | Tape & Reel |
| Use Case Tier | Mid-range GUI (32MB DDR2) | Mid-range GUI (32MB DDR2) | High-end GUI (128MB DDR2) | Max Flash + external memory | Cost-optimized (2MB Flash) | External memory design |
Diferenciadores clave
- Integrated 32MB stacked DDR2 eliminates external memory (frente a PIC32MZ1025DAB176T-I/2J)
- Higher memory capacity option available in same footprint (frente a PIC32MZ1025DAK176-V/2J)
- V-temp range for harsh environments (frente a PIC32MZ1025DAL176-I/2J)
Notas de diseño
The 176-LQFP at 0.4 mm pitch requires careful PCB design. Use 4-layer stack-up with continuous ground plane beneath the IC. DDR2 signal traces must be length-matched within +/-25 mils and routed on a single internal layer with reference ground plane. Keep DDR2 traces short (<50 mm) to avoid signal integrity issues. Place decoupling capacitors (100 nF + 10 uF bulk) within 2 mm of each power pin.
Estimated: at full 200 MHz operation with all peripherals active, the PIC32MZ1025DAS176T-V/2J draws approximately 150-200 mA from the 3.3V rail, dissipating 0.5-0.66W. The 176-LQFP thermal resistance theta_JA is approximately 35-40 C/W (per Microchip package thermal data), so junction temperature rise above ambient is 18-26C - no heatsink needed. However, the stacked DDR2 die inside the package adds thermal load; in sealed enclosures at 70C ambient, monitor junction temperature via the internal die temp sensor.
Do not confuse the DAS (32MB stacked DDR2) with DAB (external memory only) or DAK (128MB stacked DDR2) variants - the PCB is identical but firmware initialization differs. The "T" suffix means Tape & Reel; omit it for Tray packaging. The "V" suffix indicates V-temp grade; "I" is I-temp. V-temp parts command a small premium. Ensure MPLAB Harmony v3 is used; legacy MPLAB Harmony v2 does not support the DAS family DDR2 initialization.
The DDR2 interface runs at up to 200 MHz with 1.8V signaling. Source-impedance-matched routing (50 ohm +/-10%) with proper termination is essential. Use fly-by topology for multi-DDR2 loads (not applicable here, but plan for future DAK upgrade). Place reference voltage (VREF) bypass capacitor (0.1 uF + 10 uF) within 5 mm of the VREF pin. The DDR2 DLL requires stable PLL lock before training - allow 100 us after clock stable before initiating DDR2 init sequence.
Keep the 32 kHz low-power crystal traces within 5 mm of the SOSC pins with grounded guard ring. The HS USB DP/DM traces require 90 ohm differential impedance; route over continuous ground plane and avoid stubs. The ADC analog supply (AVDD) should be filtered with ferrite bead + 10 uF + 100 nF star topology; do not share digital return path with analog return to avoid digital noise coupling into ADC readings.
Información de cumplimiento
RoHS and REACH compliant per Microchip product page. AEC-Q100 not qualified - automotive Tier-1 OEMs should evaluate Microchip's Q100-graded parts separately. Halogen-free per JEDEC JS709A.