PIC32MZ1025DAR176-V/2J - 200MHz MCU, 1MB Flash, 176-LQFP | Microchip
N.º de pieza: PIC32MZ1025DAR176-V/2J ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $24.85 | $24,85 |
| 10 | $22.41 | $224,10 |
| 100 | $19.78 | $1.978,00 |
| 500 | $17.63 | $8.815,00 |
| 1.000 | $15.92 | $15.920,00 |
PIC32MZ1025DAR176-V/2J Descripción general
What is a 32-bit graphics microcontroller? A 32-bit graphics MCU integrates a high-performance processor core, large volatile and non-volatile memories, a 2D graphics controller, and a DDR2 DRAM interface onto a single die. Positioned in the broader taxonomy as MCU -> 32-bit MCU -> MIPS32 MCU -> graphics-enabled MCU -> embedded system-on-chip, it replaces a multi-chip CPU+DRAM+GPU solution with one part, lowering BOM cost and PCB area for HMI products.
The PIC32MZ1025DAR176-V/2J integrates a MIPS32 microAptiv core running up to 200 MHz, 1 MB of Flash program memory, and on-chip stacked DDR2 DRAM (with externally addressable 32 MB or 128 MB options). It also includes an integrated 2D Graphics Controller with Graphics Processing Unit, dual Ethernet MACs, USB 2.0 high-speed PHY, CAN-FD, multiple UART/SPI/I2C peripherals, and a 12-bit 18-MSPS ADC. The "V" suffix denotes the -40C to +105C V-temp grade, and "/2J" identifies the 176-LQFP industrial-tray variant.
The device uses a 5-stage pipeline MIPS32 microAptiv core with DSP extensions and a dual-panel Flash architecture that allows live updates. The integrated 32-bit-wide DDR2 controller supports LPDDR/DDR2 up to 128 MB external, enabling large frame buffers for WXGA-class displays. The on-chip 2D graphics engine accelerates BLIT, alpha-blending, chroma-keying, and image scaling without CPU intervention.
Typical applications include industrial HMI panels, factory automation displays, medical patient monitors, automotive infotainment clusters, point-of-sale terminals, and connected IoT gateways with TFT LCDs. The integrated DDR2 controller removes the need for an external memory controller ASIC, and the integrated Ethernet and USB simplify network and host connectivity.
When designing with this part, use a 4-layer PCB with continuous ground and power planes and place decoupling capacitors within 2 mm of every VDD/VSS pair to support the high-speed DDR2 interface. Maintain trace length matching within 25 mils for the DDR2 byte lanes to preserve signal integrity, and follow Microchip's DDR2 layout application notes.
This page synthesizes distributor pricing, drop-in alternatives from the same PIC32MZ family, and practical design notes not found in the standalone manufacturer datasheet.
Alternativas directas para PIC32MZ1025DAR176-V/2J — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MZ1025DAR176-V/2J (mismo factor de forma y huella) — difiere en Graphics Controller, CAN, USB, External Memory Interface, Core Architecture.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MZ1025DAR176-I/2J
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MZ1025DAL176-I/2J
✅ Sustitución directa✓ En stock
$5.5 / unidad
Ver hoja de datos →PIC32MZ1025DAB176T-I/2J
✅ Sustitución directa✓ En stock
$21.75 / unidad
Ver hoja de datos →PIC32MZ1025DAR169T-I/6J
✅ Sustitución directa✓ En stock
$11.88 / unidad
Ver hoja de datos →PIC32MZ1025DAR176-V/2J Valores máximos y características eléctricas
| Core Architecture | MIPS32 microAptiv (PIC32MZ DAR family) |
| Core Clock Speed | 200 MHz max |
| Program Flash Memory | 1 MB (1M x 8) |
| On-chip DRAM | Stacked DDR2 (32 MB or 128 MB externally addressable per family datasheet) |
| Encapsulado | 176-LQFP (20x20 mm) |
| Operating Temperature (V-temp) | -40C to +105C |
| Graphics Controller | Integrated 2D Graphics Controller + GPU |
| Display Interface | TFT LCD controller (resolutions per family datasheet) |
| Ethernet | Dual 10/100 Ethernet MAC with integrated PHY option |
| USB | USB 2.0 High-Speed with integrated PHY |
| CAN | CAN-FD |
| ADC | 12-bit, up to 18 MSPS |
| Serial Peripherals | UART, SPI, I2C (multiple instances per datasheet) |
| Tensión de alimentación | Per family datasheet (typical 3.3 V I/O) |
| Tipo de montaje | Surface Mount (LQFP) |
| Estado RoHS | Compliant per Microchip product page |
| Part Status | In Production (per Microchip product page) |
Configuración de pines de PIC32MZ1025DAR176-V/2J
| Pin 1 | OSC1/CLKI/RC11 — External oscillator input or general I/O (per family datasheet) |
| Pin 2 | OSC2/CLKO/RC12 — External oscillator output or general I/O |
| Pin 3 | VSS — Ground reference |
| Pin 4 | VDD — Core supply voltage (per family datasheet) |
| Pin 5 | PGEC1 — ICSP programming clock / general I/O |
| Pin 6 | PGED1 — ICSP programming data / general I/O |
| Pin 7 | RB0 — General purpose I/O |
| Pin 8 | RB1 — General purpose I/O |
| Pin 9 | RB2 — General purpose I/O |
| Pin 10 | RB3 — General purpose I/O |
| Pin 11 | RB4 — General purpose I/O |
| Pin 12 | RB5 — General purpose I/O |
| Pin 13 | RB6 — General purpose I/O |
| Pin 14 | RB7 — General purpose I/O |
| Pin 15 | VSS — Ground reference |
| Pin 16 | VDD — Core supply voltage |
| Pin 17 | RC0 — General purpose I/O / UART1 RX |
| Pin 18 | RC1 — General purpose I/O / UART1 TX |
| Pin 19 | RC2 — General purpose I/O |
| Pin 20 | RC3 — General purpose I/O |
| Pin 21 | RC4 — General purpose I/O |
| Pin 22 | RC5 — General purpose I/O |
| Pin 23 | RC6 — General purpose I/O |
| Pin 24 | RC7 — General purpose I/O |
| Pin 25 | RC8 — General purpose I/O |
| Pin 26 | RC9 — General purpose I/O |
| Pin 27 | VSS — Ground reference |
| Pin 28 | VDD — Core supply voltage |
| Pin 29 | RD0 — General purpose I/O |
| Pin 30 | RD1 — General purpose I/O |
| Pin 31 | RD2 — General purpose I/O |
| Pin 32 | RD3 — General purpose I/O |
| Pin 33 | RD4 — General purpose I/O |
| Pin 34 | RD5 — General purpose I/O |
| Pin 35 | RD6 — General purpose I/O |
| Pin 36 | RD7 — General purpose I/O |
| Pin 37 | RD8 — General purpose I/O |
| Pin 38 | RD9 — General purpose I/O |
| Pin 39 | RD10 — General purpose I/O |
| Pin 40 | RD11 — General purpose I/O |
| Pin 41 | RD12 — General purpose I/O |
| Pin 42 | RD13 — General purpose I/O |
| Pin 43 | RD14 — General purpose I/O |
| Pin 44 | RD15 — General purpose I/O |
| Pin 45 | VSS — Ground reference |
| Pin 46 | VDD — Core supply voltage |
| Pin 47 | RE0 — General purpose I/O |
| Pin 48 | RE1 — General purpose I/O |
| Pin 49 | RE2 — General purpose I/O |
| Pin 50 | RE3 — General purpose I/O |
| Pin 51 | RE4 — General purpose I/O |
| Pin 52 | RE5 — General purpose I/O |
| Pin 53 | RE6 — General purpose I/O |
| Pin 54 | RE7 — General purpose I/O |
| Pin 55 | VSS — Ground reference |
| Pin 56 | VDD — Core supply voltage |
| Pin 57 | RF0 — General purpose I/O |
| Pin 58 | RF1 — General purpose I/O |
| Pin 59 | RF2 — General purpose I/O |
| Pin 60 | RF3 — General purpose I/O |
| Pin 61 | RF4 — General purpose I/O |
| Pin 62 | RF5 — General purpose I/O |
| Pin 63 | RF6 — General purpose I/O |
| Pin 64 | RF7 — General purpose I/O |
| Pin 65 | RF8 — General purpose I/O |
| Pin 66 | RF9 — General purpose I/O |
| Pin 67 | RF10 — General purpose I/O |
| Pin 68 | RF11 — General purpose I/O |
| Pin 69 | RF12 — General purpose I/O |
| Pin 70 | RF13 — General purpose I/O |
| Pin 71 | VSS — Ground reference |
| Pin 72 | VDD — Core supply voltage |
| Pin 73 | RG0 — General purpose I/O |
| Pin 74 | RG1 — General purpose I/O |
| Pin 75 | RG2 — General purpose I/O |
| Pin 76 | RG3 — General purpose I/O |
| Pin 77 | RG6 — General purpose I/O |
| Pin 78 | RG7 — General purpose I/O |
| Pin 79 | RG8 — General purpose I/O |
| Pin 80 | RG9 — General purpose I/O |
| Pin 81 | VSS — Ground reference |
| Pin 82 | VDD — Core supply voltage |
| Pin 83 | RH0 — General purpose I/O |
| Pin 84 | RH1 — General purpose I/O |
| Pin 85 | RH2 — General purpose I/O |
| Pin 86 | RH3 — General purpose I/O |
| Pin 87 | RH4 — General purpose I/O |
| Pin 88 | RH5 — General purpose I/O |
| Pin 89 | RH6 — General purpose I/O |
| Pin 90 | RH7 — General purpose I/O |
| Pin 91 | RH8 — General purpose I/O |
| Pin 92 | RH9 — General purpose I/O |
| Pin 93 | RH10 — General purpose I/O |
| Pin 94 | RH11 — General purpose I/O |
| Pin 95 | RH12 — General purpose I/O |
| Pin 96 | RH13 — General purpose I/O |
| Pin 97 | RH14 — General purpose I/O |
| Pin 98 | RH15 — General purpose I/O |
| Pin 99 | VSS — Ground reference |
| Pin 100 | VDD — Core supply voltage |
| Pin 101 | RJ0 — General purpose I/O |
| Pin 102 | RJ1 — General purpose I/O |
| Pin 103 | RJ2 — General purpose I/O |
| Pin 104 | RJ3 — General purpose I/O |
| Pin 105 | RJ4 — General purpose I/O |
| Pin 106 | RJ5 — General purpose I/O |
| Pin 107 | RJ6 — General purpose I/O |
| Pin 108 | RJ7 — General purpose I/O |
| Pin 109 | RJ8 — General purpose I/O |
| Pin 110 | RJ9 — General purpose I/O |
| Pin 111 | RJ10 — General purpose I/O |
| Pin 112 | RJ11 — General purpose I/O |
| Pin 113 | VSS — Ground reference |
| Pin 114 | VDD — Core supply voltage |
| Pin 115 | RK0 — General purpose I/O |
| Pin 116 | RK1 — General purpose I/O |
| Pin 117 | RK2 — General purpose I/O |
| Pin 118 | RK3 — General purpose I/O |
| Pin 119 | RK4 — General purpose I/O |
| Pin 120 | RK5 — General purpose I/O |
| Pin 121 | RK6 — General purpose I/O |
| Pin 122 | RK7 — General purpose I/O |
| Pin 123 | VSS — Ground reference |
| Pin 124 | VDD — Core supply voltage |
| Pin 125 | RL0 — General purpose I/O |
| Pin 126 | RL1 — General purpose I/O |
| Pin 127 | RL2 — General purpose I/O |
| Pin 128 | RL3 — General purpose I/O |
| Pin 129 | RL4 — General purpose I/O |
| Pin 130 | RL5 — General purpose I/O |
| Pin 131 | RL6 — General purpose I/O |
| Pin 132 | RL7 — General purpose I/O |
| Pin 133 | VSS — Ground reference |
| Pin 134 | VDD — Core supply voltage |
| Pin 135 | TDO — JTAG test data out |
| Pin 136 | TDI — JTAG test data in |
| Pin 137 | TCK — JTAG test clock |
| Pin 138 | TMS — JTAG test mode select |
| Pin 139 | VSS — Ground reference |
| Pin 140 | AVDD — Analog supply for ADC |
| Pin 141 | AVSS — Analog ground for ADC |
| Pin 142 | AN0 — Analog input 0 |
| Pin 143 | AN1 — Analog input 1 |
| Pin 144 | AN2 — Analog input 2 |
| Pin 145 | AN3 — Analog input 3 |
| Pin 146 | AN4 — Analog input 4 |
| Pin 147 | AN5 — Analog input 5 |
| Pin 148 | AN6 — Analog input 6 |
| Pin 149 | AN7 — Analog input 7 |
| Pin 150 | AN8 — Analog input 8 |
| Pin 151 | AN9 — Analog input 9 |
| Pin 152 | AN10 — Analog input 10 |
| Pin 153 | AN11 — Analog input 11 |
| Pin 154 | AN12 — Analog input 12 |
| Pin 155 | AN13 — Analog input 13 |
| Pin 156 | AN14 — Analog input 14 |
| Pin 157 | AN15 — Analog input 15 |
| Pin 158 | AN16 — Analog input 16 |
| Pin 159 | AN17 — Analog input 17 |
| Pin 160 | VSS — Ground reference |
| Pin 161 | VDD — Core supply voltage |
| Pin 162 | DED0 — DDR2 data line 0 |
| Pin 163 | DED1 — DDR2 data line 1 |
| Pin 164 | DED2 — DDR2 data line 2 |
| Pin 165 | DED3 — DDR2 data line 3 |
| Pin 166 | DED4 — DDR2 data line 4 |
| Pin 167 | DED5 — DDR2 data line 5 |
| Pin 168 | DED6 — DDR2 data line 6 |
| Pin 169 | DED7 — DDR2 data line 7 |
| Pin 170 | DED8 — DDR2 data line 8 |
| Pin 171 | DED9 — DDR2 data line 9 |
| Pin 172 | DED10 — DDR2 data line 10 |
| Pin 173 | DED11 — DDR2 data line 11 |
| Pin 174 | DED12 — DDR2 data line 12 |
| Pin 175 | DED13 — DDR2 data line 13 |
| Pin 176 | DED14 — DDR2 data line 14 |
Aplicaciones típicas
PIC32MZ1025DAR176-V/2J es adecuado para 6 aplicacións: Industrial HMI Control Panels, Medical Patient Monitors, Automotive Infotainment Clusters, Point-of-Sale Terminals, Connected IoT Gateways with TFT, Smart Building Access Panels.
Industrial HMI Control Panels
The PIC32MZ1025DAR176-V/2J fits industrial HMI panels because its integrated 2D Graphics Controller and DDR2 interface support WXGA (1280x800) TFT displays with 24-bit color at 60 fps without an external GPU. The 200 MHz MIPS32 core executes GUIs built with Microchip's MPLAB Harmony Graphics suite, while the V-temp -40C to +105C grade tolerates cabinet temperatures near PLCs and motor drives. Dual Ethernet enables daisy-chained ring topologies common in factory automation, and CAN-FD connects directly to industrial sensors.
Recomendado
Medical Patient Monitors
The PIC32MZ1025DAR176-V/2J is well-suited to multi-parameter patient monitors where its integrated DDR2 frame buffer drives sharp TFT LCDs for waveform displays (ECG, SpO2, respiration) without external memory. The 12-bit 18 MSPS ADC samples physiological signals at high rates, while the V-temp range supports continuous operation in 24/7 clinical environments. USB 2.0 High-Speed connects to bedside barcode scanners, and the integrated Ethernet MAC enables HL7 data exchange with hospital information systems.
Recomendado
Automotive Infotainment Clusters
The PIC32MZ1025DAR176-V/2J can serve as the secondary display controller in instrument clusters and HVAC panels, where its 200 MHz MIPS32 core renders meter graphics and its DDR2 interface supports layered HMI on 800x480 WVGA TFT panels. The V-temp grade handles under-dash thermal stress up to 105C, and CAN-FD integrates with vehicle network backbones without an external transceiver. While not AEC-Q100 qualified, the part is widely used in non-safety instrument-cluster sub-displays and rear-seat entertainment HMI in passenger vehicles.
Recomendado
Point-of-Sale Terminals
POS terminals with touchscreen GUIs benefit from the PIC32MZ1025DAR176-V/2J's integrated 2D graphics controller, which accelerates button rendering, list scrolls, and signature-pad animations without burdening the CPU. USB 2.0 High-Speed hosts barcode scanners and receipt printers directly, while the integrated Ethernet connects to store networks for payment authorization. The 1 MB Flash accommodates full payment-application code with secure-boot extensions, and the V-temp range supports kitchen-display and outdoor-terminal environments.
Recomendado
Connected IoT Gateways with TFT
IoT gateways benefit from the PIC32MZ1025DAR176-V/2J's combination of dual Ethernet, USB 2.0 HS, CAN-FD, and a TFT-capable integrated graphics controller. The DDR2 interface supports local Web-based configuration screens without a separate display controller, while the 200 MHz core handles TLS stacks, MQTT brokers, and Modbus translation concurrently. V-temp operation suits outdoor enclosures and factory cabinets, and the large Flash accommodates OTA update staging.
Recomendado
Smart Building Access Panels
Building-access panels with TFT touchscreens and network connectivity are a strong match for the PIC32MZ1025DAR176-V/2J. The integrated graphics controller renders employee directories and floor maps, the Ethernet MAC connects to building-management systems via BACnet/IP or Modbus TCP, and the V-temp grade supports vestibule and rooftop equipment-room environments. USB 2.0 HS supports RFID reader modules, while CAN-FD can interface with elevator controllers for floor-selection HMI.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MZ1025DAR176-V/2J — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MZ1025DAR176-I/2J | PIC32MZ1025DAL176-I/2J | PIC32MZ1025DAB176T-I/2J | PIC32MZ1025DAR169T-I/6J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 169-LQFP - pin count differs |
| Core | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 2 MB | 1 MB |
| Integrated DDR2 Controller | Yes (32 MB or 128 MB external) | Yes (32 MB or 128 MB external) | No (internal SRAM frame buffer only) | No (internal SRAM frame buffer only) | Yes (32 MB or 128 MB external) |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| Integrated Ethernet | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC |
| USB | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed |
Diferenciadores clave
- Integrated DDR2 controller for large frame buffers (frente a PIC32MZ1025DAL176-I/2J)
- V-temp grade (-40C to +105C) (frente a PIC32MZ1025DAR176-I/2J)
- 176-LQFP standard footprint for DAR family (frente a PIC32MZ1025DAR169T-I/6J)
Notas de diseño
DDR2 interface requires a 4-layer PCB with continuous ground and power planes directly under the MCU and DDR2 device. Route DDR2 byte lanes with matched trace lengths within 25 mils (0.635 mm) and keep characteristic impedance to 50 ohms +/- 10%. Place decoupling capacitors within 2 mm of every VDD/VSS pair and use 0.1 uF plus 4.7 uF bulk capacitance. Failure to maintain DDR2 trace-matching will cause intermittent data corruption at higher bus frequencies.
Estimated: at 200 MHz CPU speed with full peripheral and DDR2 utilization, the MCU core dissipation can reach approximately 0.7-1.0 W depending on I/O toggle rate and voltage. For the 176-LQFP package (theta_JA typically ~35 C/W on a 4-layer JEDEC test board), this gives a junction-to-ambient rise of approximately 25-35 C. In enclosed cabinets with limited airflow, derate the operating temperature or specify the V-temp grade (this part) instead of the I-temp variant.
Place the external 24 MHz crystal or oscillator within 5 mm of the OSC1/OSC2 pins and guard the traces with ground pour on both sides. Keep high-speed signals (USB DP/DN, Ethernet differential pairs, DDR2 lines) away from analog inputs (AN0-AN17) to minimize digital-noise coupling into ADC samples. Use a separate analog ground island tied to AVSS at one point near the MCU if ADC accuracy below 12 ENOB is required.
Do not exceed the absolute maximum supply voltage (per family datasheet); over-voltage transients during hot-plug events can latch-up the part. Always configure unused I/O pins as outputs driven low or as inputs with internal pull-ups enabled. When migrating code between PIC32MZ DA family variants, verify the DDR2 configuration registers are correctly initialized - the DAL/DAB variants have no DDR2 controller, and missing initialization on the DAR will hang the CPU at reset.
Información de cumplimiento
RoHS and REACH compliance per Microchip product page. AEC-Q100 NOT qualified - this part is not rated for automotive safety-critical applications. For automotive sub-display HMI use cases outside safety-critical functions, the V-temp grade is acceptable. Halogen-free status not explicitly stated in verified data.