PIC32MZ2048EFG100-E/GJX - 200MHz 2MB Flash MCU | Microchip
N.º de pieza: PIC32MZ2048EFG100-E/GJX ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.75 | $167,50 |
| 100 | $15.1 | $1.510,00 |
| 500 | $13.4 | $6.700,00 |
| 1.000 | $11.95 | $11.950,00 |
PIC32MZ2048EFG100-E/GJX Descripción general
A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, program memory, data memory, and peripheral interfaces into one package. The PIC32MZ EF family belongs to the broader taxonomy: microcontroller -> embedded MCU -> 32-bit MCU -> MIPS-based MCU -> Microchip PIC32 family. These devices combine high computational throughput with deterministic interrupt response, making them foundational building blocks for connected, real-time, and graphics-oriented embedded systems.
Key features include a hardware IEEE 754-compliant Floating Point Unit (FPU), four 64-bit accumulators with single-cycle MAC, saturating and fractional math support for DSP workloads, dual-panel Flash for live firmware updates, and a 200 MHz / 330 DMIPS MIPS Warrior M-class core. The part integrates High-Speed USB, Ethernet, multiple SPI/I2C/UART interfaces, 12-bit ADC modules, and graphics/audio peripherals for HMI applications. The "G" silicon designation indicates the standard feature set without cryptographic acceleration or CAN-FD.
Typical applications include industrial connectivity gateways, IoT edge nodes, automotive HMI clusters, graphics-driven HMI terminals, and motor-control subsystems. The dual-panel Flash architecture enables fail-safe over-the-air (OTA) firmware upgrades - critical for connected products that must remain updatable in the field without bricking the device. The 100-pin TFBGA package minimises PCB footprint while exposing the full peripheral set.
When designing with this device, plan the dual-panel Flash layout so the bootloader (Panel 1) is write-protected and the application image (Panel 2) is upgradeable. Decouple VDD/VUSB with low-ESR ceramic capacitors placed within 3 mm of each supply pin, and follow Microchip's IBIS models for SDRAM interface timing closure.
This page synthesises distributor pricing, drop-in alternatives, and practical design notes not found on a single distributor product page, accelerating sourcing and design-in for engineers targeting PIC32MZ EF family designs.
Alternativas directas para PIC32MZ2048EFG100-E/GJX — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MZ2048EFG100-E/GJX (mismo factor de forma y huella) — difiere en Ethernet, Core Architecture, Package, ADC, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MZ2048EFH100-E/GJX
✅ Sustitución directa✓ En stock
$11.2 / unidad
Ver hoja de datos →PIC32MZ2048EFM100-E/GJX
✅ Sustitución directa✓ En stock
$15.4 / unidad
Ver hoja de datos →PIC32MZ2048EFF100-E/GJX
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MZ2048EFK100-E/GJX
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MZ1024EFG100T-I/GJX
✅ Sustitución directa✓ En stock
$8.45 / unidad
Ver hoja de datos →PIC32MZ1024EFH100-E/GJX
✅ Sustitución directa✓ En stock
$7.65 / unidad
Ver hoja de datos →PIC32MZ2048EFG100-E/GJX Valores máximos y características eléctricas
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| Core Frequency | 200 MHz |
| DMIPS | 330 DMIPS |
| FPU | IEEE 754-compliant hardware Floating Point Unit |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating & fractional math |
| Program Flash | 2 MB (2M x 8), dual-panel for live update |
| SRAM | 512 KB |
| Tensión de alimentación | 3.3 V (typical) |
| Temperatura de funcionamiento | -40C to +125C (Extended -E grade) |
| Encapsulado | 100-TFBGA (7x7 mm) |
| AEC-Q100 | Qualified (automotive grade) |
| Cryptographic Accelerator | No (G silicon) |
| CAN | No (G silicon - no CAN) |
| High-Speed USB | Yes |
| Ethernet | Yes (10/100 Mbps MAC) |
| Estado RoHS | Compliant |
Guía de configuración de pines de PIC32MZ2048EFG100-E/GJX 100-tfbga (7x7 mm)
Configuración de pines para PIC32MZ2048EFG100-E/GJX (encapsulado 100-tfbga (7x7 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para PIC32MZ2048EFG100-E/GJX.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PIC32MZ2048EFG100-E/GJX es adecuado para 7 aplicacións: Automotive HMI Cluster, Industrial IoT Gateway, Graphics HMI Terminal, Connected Motor Control, Smart Home Hub, Portable Medical Device Controller, Audio Processing Module.
Automotive HMI Cluster
The PIC32MZ2048EFG100-E/GJX is well-suited to automotive instrument clusters and HMI controllers because it combines 330 DMIPS throughput with a hardware FPU, 2 MB dual-panel Flash for fail-safe OTA updates, and AEC-Q100 qualification for -40C to +125C operation. The integrated graphics peripherals and SRAM support layered display rendering at typical cluster refresh rates of 30-60 Hz. Designers place the MCU between the CAN/LIN transceivers and the TFT display, with the G silicon mapping suited to HMI-only clusters that do not need cryptographic acceleration. The 100-TFBGA package minimises PCB footprint behind the cluster bezel. Compared with general-purpose Cortex-M4 alternatives, the dual-panel Flash is the decisive advantage for safety-critical OTA workflows.
Recomendado
Industrial IoT Gateway
In industrial IoT edge gateways, the PIC32MZ2048EFG100-E/GJX delivers the processing headroom to run TLS, MQTT, and Modbus stacks simultaneously while driving the High-Speed USB and 10/100 Ethernet peripherals. The 2 MB Flash accommodates full TCP/IP stacks and application logic without external memory, and 512 KB SRAM buffers network packets during peak load. The dual-panel Flash enables fail-safe OTA updates - a critical feature for unattended gateways mounted in factories. The -E temperature grade supports outdoor enclosures and industrial cabinets. Engineers typically pair this MCU with a PHY like the LAN8742A and route Ethernet traffic through lwIP + FreeRTOS ports available in MPLAB Harmony.
Recomendado
Graphics HMI Terminal
The PIC32MZ2048EFG100-E/GJX is an effective host for medium-resolution graphics terminals (up to WVGA) where its FPU and 512 KB SRAM accelerate image compositing, anti-aliased text rendering, and widget animations. The integrated LCD controller and graphics peripherals eliminate the need for an external GPU, reducing BOM cost. The 200 MHz core sustains typical 2D UI frame rates at 24 bpp, while 2 MB Flash holds full UI assets and multilingual resources. Industrial HMI panels in factory automation leverage the AEC-Q100 grade for reliable operation in harsh environments, and dual-panel Flash allows field UI updates without service interruption.
Recomendado
Connected Motor Control
The PIC32MZ2048EFG100-E/GJX serves as the supervisory controller in connected motor drives, where its DSP extensions (four 64-bit accumulators, single-cycle MAC) handle field-oriented control (FOC) math while Ethernet and USB manage connectivity. The 200 MHz core sustains 20 kHz PWM update rates with margin for parameter monitoring and adaptive tuning loops. The dual-panel Flash architecture permits firmware A/B updates on rotating machinery where downtime is expensive. The G silicon suits cost-optimised drives that delegate CAN-FD communication to a companion MCU; for drives requiring integrated CAN, the H/M silicon variants are recommended as drop-in upgrades.
Recomendado
Smart Home Hub
Smart home hubs benefit from the PIC32MZ2048EFG100-E/GJX's combination of High-Speed USB (for Wi-Fi/BLE dongles), Ethernet (for wired backhaul), and 2 MB Flash (for Matter/Thread/Zigbee stack coexistence). The 200 MHz core runs multi-protocol translation while keeping latency low for voice assistant integrations. The AEC-Q100 grade and -E temperature range support hub installations in unconditioned spaces (garages, attics). Dual-panel Flash allows seamless OTA updates as protocol stacks evolve - a major advantage over single-panel Cortex-M competitors that risk bricking during firmware updates.
Recomendado
Portable Medical Device Controller
Portable medical devices such as patient monitors and infusion pump controllers leverage the PIC32MZ2048EFG100-E/GJX's deterministic interrupt response, hardware FPU for DSP filter chains (ECG/EEG), and 2 MB Flash for full IEC 62304-compliant firmware with logging. The 200 MHz MIPS core sustains 500 Hz waveform sampling while running HMI and communication tasks. The -E temperature grade supports clinical environments and emergency-response transport. Designers benefit from dual-panel Flash for safe firmware updates on deployed units. The 100-TFBGA package suits compact handheld form factors where PCB area is constrained.
Recomendado
Audio Processing Module
Audio applications like professional mixers, multi-channel DSP effects units, and networked PA amplifiers leverage the PIC32MZ2048EFG100-E/GJX's DSP extensions and FPU to implement real-time audio processing chains (EQ, dynamics, FFT). The 200 MHz core sustains multi-channel 48 kHz audio processing with low algorithmic latency. The 2 MB Flash holds full audio effect libraries, while the 512 KB SRAM acts as an audio buffer pool. USB Audio Class support and Ethernet enable networked audio (Dante/AES67) endpoints. The -E grade supports installation in amplifier racks with elevated ambient temperature.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MZ2048EFG100-E/GJX — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MZ2048EFH100-E/GJX | PIC32MZ2048EFM100-E/GJX | PIC32MZ2048EFF100-E/GJX | PIC32MZ1024EFG100T-I/GJX |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7) | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 2 MB dual-panel | 2 MB dual-panel | 2 MB dual-panel | 2 MB dual-panel | 1 MB dual-panel (-50%) |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB (-50%) |
| Silicon Feature Set | G (no crypto, no CAN) | H (crypto + CAN-FD) | M (crypto + CAN-FD) | F (reduced peripherals) | G (no crypto, no CAN) |
| Temperature Grade | -40C to +125C (E grade, AEC-Q100) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C (I grade) |
Diferenciadores clave
- Dual-panel Flash architecture for fail-safe OTA updates (frente a PIC32MX795F512L-80I/PT)
- Integrated FPU and DSP extensions on a 200 MHz MIPS core (frente a PIC32MZ2048ECM100T-I/PT)
- AEC-Q100 qualification with -E temperature grade (frente a PIC32MZ2048EFG100-I/GJX)
Notas de diseño
Decouple each VDD/AVDD pair with a 100 nF X7R ceramic capacitor placed within 3 mm of the supply pin. Add a bulk 10 uF tantalum or polymer capacitor near the MCU for transient load response. The High-Speed USB VBUS rail requires a separate 4.7 uF capacitor per the USB 2.0 specification. Power-rail sequencing is not required by the PIC32MZ EF family, but keep the 3.3 V rail monotonic during startup to avoid brown-out reset loops. Estimated: total decoupling capacitance for the 100-TFBGA package is approximately 1.5-2 uF distributed across VDD pins.
The 100-TFBGA package has a theta_JA of approximately 28 C/W on a JEDEC 4-layer test board with thermal vias. Under maximum CPU load (Dhrystone at 200 MHz, all peripherals active), core dissipation reaches ~0.5 W - within the package's thermal envelope. For industrial cabinet designs, ensure the PCB thermal via array under the exposed die-attach pad is filled and capped per Microchip's thermal management application note. The -E temperature grade guarantees operation up to +125C junction temperature, but derate by 10-15 C for long-term reliability.
Route SDRAM traces (if used) with 50 ohm controlled impedance and length-matching within 50 mils across byte lanes. The 100-TFBGA escape requires HDI microvia construction; use a 4-layer stack-up with 1-2-1 routing and 0.8 mm pitch BGA fanout. The High-Speed USB D+/D- pair must be routed with 90 ohm differential impedance and length-matched within 150 mils. The Ethernet MII/RMII traces to the external PHY must be length-matched within 500 mils and isolated from noisy digital signals. Follow Microchip's PCB layout checklist for PIC32MZ EF family designs.
The G silicon designation means NO cryptographic accelerator and NO CAN-FD peripheral - designs expecting these features will fail silently if populated with the EFG100 variant. Verify the silicon revision letter (G/H/M/F/K) in the device marking before firmware bring-up. The dual-panel Flash requires explicit bootloader configuration to enable live update; without this, the second panel remains inaccessible and OTA updates will fail. The FPU is enabled by default in Harmony 3 but may require explicit compiler flags in bare-metal projects - floating-point exceptions are unmasked by default and must be trapped in safety-critical code.
The High-Speed USB interface requires a 90 ohm differential pair with reference plane continuity; any split in the ground plane beneath the D+/D- traces will cause signal integrity failures and USB compliance test failures. The Ethernet RMII traces (50 MHz) must be length-matched within 50 mils and isolated from the 25 MHz oscillator traces. The 12-bit ADC inputs are sensitive to digital switching noise - separate analog and digital ground planes if any analog precision is required, and add a ferrite bead between AVDD and DVDD.
Información de cumplimiento
AEC-Q100 qualified per Microchip product page. RoHS and REACH compliant per Microchip environmental certification. Lead-free (Pb-free) and halogen-free per Microchip material declaration.