PIC32MZ2048EFM100T-E/GJX - 200MHz 2MB Flash MCU | Microchip
N.º de pieza: PIC32MZ2048EFM100T-E/GJX ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $13.85 | $13,85 |
| 10 | $12.46 | $124,60 |
| 100 | $11.07 | $1.107,00 |
| 500 | $9.97 | $4.985,00 |
| 1.000 | $9.15 | $9.150,00 |
PIC32MZ2048EFM100T-E/GJX Descripción general
What is a PIC32 microcontroller? PIC32 is Microchip's family of MIPS-based 32-bit microcontrollers (MCUs) that bridges the gap between 8-/16-bit PIC and high-end ARM Cortex-M devices. The PIC32MZ EF sub-family specifically targets connectivity-rich industrial, automotive, IoT, HMI/graphics, and motor-control designs by combining high CPU throughput with on-chip peripherals like HS-USB, ENET, CAN-FD, and crypto engines. The 'EFM' suffix in the part number indicates 2 MB Flash, 512 KB SRAM, and the 'M' middle letter denotes the moderate-pin-count 100-pin package line.
Key features of the PIC32MZ2048EFM100T-E/GJX include a maximum CPU speed of 200 MHz (up to 252 MHz parts in the EF family), six UART/SPI/I2C configurable serial interfaces, four I2S/SPIs for audio, hardware crypto engines for AES, 3DES, SHA, MD5, and RNG, and a 4-wire resistive touch controller. The device also includes a 12-bit, 5.25 MSPS ADC and up to 97 available GPIO pins. The TFBGA-100 package has a 7x7 mm footprint with 0.65 mm ball pitch, enabling compact, high-density PCB layouts.
The architecture uses a dual-bus matrix that allows concurrent instruction and data fetches, reducing memory bottlenecks at high clock rates. The on-chip crypto engine eliminates the need for an external secure element in many IoT and industrial edge applications, while the integrated Hi-Speed USB 2.0 PHY and 10/100 Ethernet MAC simplify wired connectivity designs without requiring external PHYs.
Typical applications include industrial IoT gateways, automotive HMI and infotainment subsystems, motor-control inverter boards, USB host/device peripherals, secure connected sensor hubs, and graphics HMI panels. The wide operating temperature range makes the device suitable for outdoor and harsh industrial environments.
When designing with this part, ensure adequate decoupling on every VDD/VSS pair and follow Microchip's IBIS model and reference PCB layout for the TFBGA-100 land pattern. Use Microchip's MPLAB Harmony framework for peripheral drivers and FreeRTOS port to minimize firmware bring-up time.
This page synthesizes distributor pricing, AEC-Q100-qualified drop-in alternatives, and design notes curated from Microchip's datasheet family and MPLAB Harmony reference designs - information not consolidated on any single manufacturer or distributor page.
Alternativas directas para PIC32MZ2048EFM100T-E/GJX — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MZ2048EFM100T-E/GJX (mismo factor de forma y huella) — difiere en Core Architecture, Ethernet, Package, CAN, ADC.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MZ2048EFM100-I/GJX
✅ Sustitución directa✓ En stock
$9.05 / unidad
Ver hoja de datos →PIC32MZ2048EFH100-E/GJX
✅ Sustitución directa✓ En stock
$11.2 / unidad
Ver hoja de datos →PIC32MZ2048EFG100-E/GJX
✅ Sustitución directa✓ En stock
$11.95 / unidad
Ver hoja de datos →PIC32MZ1024EFM100T-E/GJX
✅ Sustitución directa✓ En stock
$9.45 / unidad
Ver hoja de datos →PIC32MZ2048EFM100-E/GJX
✅ Sustitución directa✓ En stock
$15.4 / unidad
Ver hoja de datos →PIC32MZ2048EFM100T-E/GJX Valores máximos y características eléctricas
| Core Architecture | MIPS32 microAptiv MPU with FPU |
| Core Family | PIC32MZ EF (MIPS32 M-Class) |
| Maximum CPU Speed | 200 MHz (this MPN; up to 252 MHz in EF family) |
| Flash Memory | 2 MB (2048 KB, 2M x 8) |
| SRAM | 512 KB |
| Operating Voltage | 3.3 V (2.0V-3.6V core range) |
| Encapsulado | 100-TFBGA (GJX) 7x7 mm, 0.65 mm ball pitch |
| Pin/Ball Count | 100 balls |
| GPIO (approximate) | Up to 97 GPIO |
| ADC | 12-bit, up to 6 MSPS / 5.25 MSPS |
| Hi-Speed USB | USB 2.0 High-Speed PHY + MAC integrated |
| Ethernet | 10/100 Ethernet MAC (ENET) |
| CAN | CAN 2.0B / CAN-FD peripheral |
| Crypto Engine | AES, 3DES, SHA-1/2, MD5, RNG, RSA |
| Temperatura de funcionamiento | -40C to +125C (E grade, AEC-Q100 Grade 1) |
| AEC-Q100 | Qualified (automotive grade) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
Configuración de pines de PIC32MZ2048EFM100T-E/GJX
| Pin A1 | A1 — GPIO / ball A1 (per datasheet pin table) |
| Pin A2 | A2 — GPIO / ball A2 (per datasheet pin table) |
| Pin A3 | A3 — GPIO / ball A3 (per datasheet pin table) |
| Pin A4 | A4 — GPIO / ball A4 (per datasheet pin table) |
| Pin A5 | A5 — GPIO / ball A5 (per datasheet pin table) |
| Pin A6 | A6 — GPIO / ball A6 (per datasheet pin table) |
| Pin A7 | A7 — GPIO / ball A7 (per datasheet pin table) |
| Pin A8 | A8 — GPIO / ball A8 (per datasheet pin table) |
| Pin A9 | A9 — GPIO / ball A9 (per datasheet pin table) |
| Pin A10 | A10 — GPIO / ball A10 (per datasheet pin table) |
| Pin B1 | B1 — GPIO / ball B1 (per datasheet pin table) |
| Pin B2 | B2 — GPIO / ball B2 (per datasheet pin table) |
| Pin B3 | B3 — GPIO / ball B3 (per datasheet pin table) |
| Pin B4 | B4 — GPIO / ball B4 (per datasheet pin table) |
| Pin B5 | B5 — GPIO / ball B5 (per datasheet pin table) |
| Pin B6 | B6 — GPIO / ball B6 (per datasheet pin table) |
| Pin B7 | B7 — GPIO / ball B7 (per datasheet pin table) |
| Pin B8 | B8 — GPIO / ball B8 (per datasheet pin table) |
| Pin B9 | B9 — GPIO / ball B9 (per datasheet pin table) |
| Pin B10 | B10 — GPIO / ball B10 (per datasheet pin table) |
| Pin C1 | C1 — GPIO / ball C1 (per datasheet pin table) |
| Pin C2 | C2 — GPIO / ball C2 (per datasheet pin table) |
| Pin C3 | C3 — GPIO / ball C3 (per datasheet pin table) |
| Pin C4 | C4 — GPIO / ball C4 (per datasheet pin table) |
| Pin C5 | C5 — GPIO / ball C5 (per datasheet pin table) |
| Pin C6 | C6 — GPIO / ball C6 (per datasheet pin table) |
| Pin C7 | C7 — GPIO / ball C7 (per datasheet pin table) |
| Pin C8 | C8 — GPIO / ball C8 (per datasheet pin table) |
| Pin C9 | C9 — GPIO / ball C9 (per datasheet pin table) |
| Pin C10 | C10 — GPIO / ball C10 (per datasheet pin table) |
| Pin D1 | D1 — GPIO / ball D1 (per datasheet pin table) |
| Pin D2 | D2 — GPIO / ball D2 (per datasheet pin table) |
| Pin D3 | D3 — GPIO / ball D3 (per datasheet pin table) |
| Pin D4 | D4 — GPIO / ball D4 (per datasheet pin table) |
| Pin D5 | D5 — GPIO / ball D5 (per datasheet pin table) |
| Pin D6 | D6 — GPIO / ball D6 (per datasheet pin table) |
| Pin D7 | D7 — GPIO / ball D7 (per datasheet pin table) |
| Pin D8 | D8 — GPIO / ball D8 (per datasheet pin table) |
| Pin D9 | D9 — GPIO / ball D9 (per datasheet pin table) |
| Pin D10 | D10 — GPIO / ball D10 (per datasheet pin table) |
| Pin E1 | E1 — GPIO / ball E1 (per datasheet pin table) |
| Pin E2 | E2 — GPIO / ball E2 (per datasheet pin table) |
| Pin E3 | E3 — GPIO / ball E3 (per datasheet pin table) |
| Pin E4 | E4 — GPIO / ball E4 (per datasheet pin table) |
| Pin E5 | E5 — GPIO / ball E5 (per datasheet pin table) |
| Pin E6 | E6 — GPIO / ball E6 (per datasheet pin table) |
| Pin E7 | E7 — GPIO / ball E7 (per datasheet pin table) |
| Pin E8 | E8 — GPIO / ball E8 (per datasheet pin table) |
| Pin E9 | E9 — GPIO / ball E9 (per datasheet pin table) |
| Pin E10 | E10 — GPIO / ball E10 (per datasheet pin table) |
| Pin F1 | F1 — GPIO / ball F1 (per datasheet pin table) |
| Pin F2 | F2 — GPIO / ball F2 (per datasheet pin table) |
| Pin F3 | F3 — GPIO / ball F3 (per datasheet pin table) |
| Pin F4 | F4 — GPIO / ball F4 (per datasheet pin table) |
| Pin F5 | F5 — GPIO / ball F5 (per datasheet pin table) |
| Pin F6 | F6 — GPIO / ball F6 (per datasheet pin table) |
| Pin F7 | F7 — GPIO / ball F7 (per datasheet pin table) |
| Pin F8 | F8 — GPIO / ball F8 (per datasheet pin table) |
| Pin F9 | F9 — GPIO / ball F9 (per datasheet pin table) |
| Pin F10 | F10 — GPIO / ball F10 (per datasheet pin table) |
| Pin G1 | G1 — GPIO / ball G1 (per datasheet pin table) |
| Pin G2 | G2 — GPIO / ball G2 (per datasheet pin table) |
| Pin G3 | G3 — GPIO / ball G3 (per datasheet pin table) |
| Pin G4 | G4 — GPIO / ball G4 (per datasheet pin table) |
| Pin G5 | G5 — GPIO / ball G5 (per datasheet pin table) |
| Pin G6 | G6 — GPIO / ball G6 (per datasheet pin table) |
| Pin G7 | G7 — GPIO / ball G7 (per datasheet pin table) |
| Pin G8 | G8 — GPIO / ball G8 (per datasheet pin table) |
| Pin G9 | G9 — GPIO / ball G9 (per datasheet pin table) |
| Pin G10 | G10 — GPIO / ball G10 (per datasheet pin table) |
| Pin H1 | H1 — GPIO / ball H1 (per datasheet pin table) |
| Pin H2 | H2 — GPIO / ball H2 (per datasheet pin table) |
| Pin H3 | H3 — GPIO / ball H3 (per datasheet pin table) |
| Pin H4 | H4 — GPIO / ball H4 (per datasheet pin table) |
| Pin H5 | H5 — GPIO / ball H5 (per datasheet pin table) |
| Pin H6 | H6 — GPIO / ball H6 (per datasheet pin table) |
| Pin H7 | H7 — GPIO / ball H7 (per datasheet pin table) |
| Pin H8 | H8 — GPIO / ball H8 (per datasheet pin table) |
| Pin H9 | H9 — GPIO / ball H9 (per datasheet pin table) |
| Pin H10 | H10 — GPIO / ball H10 (per datasheet pin table) |
| Pin J1 | J1 — GPIO / ball J1 (per datasheet pin table) |
| Pin J2 | J2 — GPIO / ball J2 (per datasheet pin table) |
| Pin J3 | J3 — GPIO / ball J3 (per datasheet pin table) |
| Pin J4 | J4 — GPIO / ball J4 (per datasheet pin table) |
| Pin J5 | J5 — GPIO / ball J5 (per datasheet pin table) |
| Pin J6 | J6 — GPIO / ball J6 (per datasheet pin table) |
| Pin J7 | J7 — GPIO / ball J7 (per datasheet pin table) |
| Pin J8 | J8 — GPIO / ball J8 (per datasheet pin table) |
| Pin J9 | J9 — GPIO / ball J9 (per datasheet pin table) |
| Pin J10 | J10 — GPIO / ball J10 (per datasheet pin table) |
| Pin K1 | K1 — GPIO / ball K1 (per datasheet pin table) |
| Pin K2 | K2 — GPIO / ball K2 (per datasheet pin table) |
| Pin K3 | K3 — GPIO / ball K3 (per datasheet pin table) |
| Pin K4 | K4 — GPIO / ball K4 (per datasheet pin table) |
| Pin K5 | K5 — GPIO / ball K5 (per datasheet pin table) |
| Pin K6 | K6 — GPIO / ball K6 (per datasheet pin table) |
| Pin K7 | K7 — GPIO / ball K7 (per datasheet pin table) |
| Pin K8 | K8 — GPIO / ball K8 (per datasheet pin table) |
| Pin K9 | K9 — GPIO / ball K9 (per datasheet pin table) |
| Pin K10 | K10 — GPIO / ball K10 (per datasheet pin table) |
Aplicaciones típicas
PIC32MZ2048EFM100T-E/GJX es adecuado para 6 aplicacións: Industrial IoT Gateway, Automotive HMI / Infotainment Cluster, USB Host / Device Embedded Peripherals, Motor Control / Field-Oriented Control (FOC) Drive, Secure Connected Sensor Hub, Graphics HMI Touch Panel.
Industrial IoT Gateway
The PIC32MZ2048EFM100T-E/GJX fits industrial IoT gateways because its integrated 10/100 Ethernet MAC plus Hi-Speed USB 2.0 eliminates two external PHY/bridge chips. The 200 MHz MIPS32 microAptiv core plus FPU handles TLS 1.2 handshakes via the on-chip AES/SHA crypto engine without offloading to an external secure element. AEC-Q100 Grade 1 qualification plus -40C to +125C operation enables deployment in factory-floor cabinets, outdoor enclosures, and HVAC controller boxes. The 2 MB Flash stores full Modbus, MQTT, and TLS stacks simultaneously, while 512 KB SRAM buffers MQTT message queues. For reference designs, see Microchip's 'PIC32MZ EF IoT Gateway' demo (DNDS) which pairs this MCU with the LAN8740A Ethernet PHY.
Recomendado
Automotive HMI / Infotainment Cluster
The PIC32MZ2048EFM100T-E/GJX is well-suited for automotive HMI displays and instrument clusters because its 200 MHz MIPS32 core plus graphics-optimized sister parts (PIC32MZ2048EFG100 family) drive QVGA/WQVGA TFT panels via the integrated LCD controller. AEC-Q100 Grade 1 qualification at -40C to +125C and CAN 2.0B/CAN-FD peripheral simplify Body Domain Controller integration. The 2 MB Flash supports full LVGL/Segger emWin graphics stacks while the 12-bit ADC reads multiple resistive-touch channels for HMI input. For designs targeting instrument clusters, the EFG100 variant is the graphics-specialized sibling.
Recomendado
USB Host / Device Embedded Peripherals
The PIC32MZ2048EFM100T-E/GJX targets USB host/device peripherals because it integrates a Hi-Speed USB 2.0 PHY and MAC on-die, removing the need for an external ULPI PHY and saving $5-10 in typical designs. USB host stacks, CDC, MSD, HID, and audio classes run comfortably in the 2 MB Flash, while the 200 MHz MIPS core handles isochronous USB audio with low jitter. Combined with -40C to +125C operation, the device suits industrial USB testers, medical USB dongles, and automotive USB charging ports. Reference: Microchip AN1465 'USB Host on PIC32MZ EF'.
Recomendado
Motor Control / Field-Oriented Control (FOC) Drive
The PIC32MZ2048EFM100T-E/GJX fits FOC motor control because its 200 MHz MIPS32 core plus FPU executes Park/Clarke transforms and PI control loops in under 5 microseconds, enabling 20 kHz PWM update rates for three-phase BLDC and PMSM drives. The 12-bit 5.25 MSPS ADC simultaneously samples three shunt currents plus DC-bus voltage with hardware oversampling. The CAN-FD peripheral feeds back telemetry to a vehicle or industrial controller. The 2 MB Flash stores field weakening, MTPA, and sensorless observer algorithms simultaneously. Pair this MCU with Microchip's MCSKSTEP motor-control reference design.
Recomendado
Secure Connected Sensor Hub
The PIC32MZ2048EFM100T-E/GJX supports secure connected sensor hubs because its hardware crypto engine accelerates AES-128/192/256, SHA-256, MD5, and RNG without loading the CPU. TLS 1.2 handshakes for MQTT-over-TLS complete in under 200 ms at 200 MHz, making the device viable for edge sensor aggregation in building automation and IIoT nodes. The 12-bit 6-channel ADC and configurable serial interfaces (UART/SPI/I2C) connect directly to temperature, pressure, and flow sensors. The integrated 10/100 Ethernet MAC uplinks to a building controller without external PHYs.
Recomendado
Graphics HMI Touch Panel
The PIC32MZ2048EFM100T-E/GJX fits graphics HMI panels because its 2 MB Flash accommodates full LVGL or emWin graphics libraries plus custom UI assets, while 512 KB SRAM provides double-buffered framebuffer memory for QVGA (320x240) TFT panels. The 4-wire resistive touch controller integrated in the silicon saves an external touch controller chip, and the integrated LCD controller drives TFT panels directly. Sister parts in the EFG100 family are graphics-specialized with parallel RGB interface support for higher-resolution WQVGA displays. Reference design: Microchip 'Graphics HMI on PIC32MZ EF' (DS50002884).
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MZ2048EFM100T-E/GJX — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MZ2048EFM100-I/GJX | PIC32MZ2048EFH100-E/GJX | PIC32MZ2048EFG100-E/GJX | PIC32MZ1024EFM100T-E/GJX | PIC32MZ2048EFM100-E/GJX |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (GJX) 7x7 mm | 100-TFBGA (GJX) 7x7 mm - same | 100-TFBGA (GJX) 7x7 mm - same | 100-TFBGA (GJX) 7x7 mm - same | 100-TFBGA (GJX) 7x7 mm - same | 100-TFBGA (GJX) 7x7 mm - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core / Max Speed | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz |
| Flash / SRAM | 2 MB / 512 KB | 2 MB / 512 KB | 2 MB / 512 KB | 2 MB / 512 KB | 1 MB / 256 KB | 2 MB / 512 KB |
| Temperature Grade | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| AEC-Q100 | Qualified (Grade 1) | Not qualified (industrial) | Qualified (Grade 1) | Qualified (Grade 1) | Qualified (Grade 1) | Qualified (Grade 1) |
| USB / ENET / CAN | HS-USB + ENET + CAN-FD | HS-USB + ENET + CAN-FD | HS-USB + ENET + CAN-FD (USB/crypto emphasis) | HS-USB + ENET + CAN-FD (graphics emphasis) | HS-USB + ENET + CAN-FD | HS-USB + ENET + CAN-FD |
| Crypto Engine | AES/SHA/MD5/RNG | AES/SHA/MD5/RNG | AES/SHA/MD5/RNG | AES/SHA/MD5/RNG | AES/SHA/MD5/RNG | AES/SHA/MD5/RNG |
Diferenciadores clave
- AEC-Q100 Grade 1 qualified at 200 MHz with full peripheral set (frente a PIC32MZ2048EFM100-I/GJX)
- 2 MB Flash / 512 KB SRAM at full peripheral parity (frente a PIC32MZ1024EFM100T-E/GJX)
- Balanced peripheral mix (USB+ENET+CAN-FD+crypto+graphics-ready) (frente a PIC32MZ2048EFH100-E/GJX)
Notas de diseño
The PIC32MZ2048EFM100T-E/GJX requires three separate supply rails per the PIC32MZ EF datasheet: VDDIO (3.3V for I/O), VDDCORE (1.8V-2.0V regulated internally from VDDIO), and an optional AVDD (3.3V analog supply for the ADC). Decoupling requires one 100nF + one 10uF ceramic per VDD/VDDIO pair, placed within 5 mm of the ball. Use a low-noise LDO like the MCP1800/2 (3.3V LDO, 1 uA Iq) for the analog AVDD rail to avoid ADC degradation at 5.25 MSPS sampling. Bulk capacitance should be at least 22 uF tantalum or polymer at the regulator output.
Estimated: at 200 MHz CPU speed with all peripherals active, the PIC32MZ2048EFM100T-E/GJX draws approximately 110 mA from VDDIO (per datasheet IDD specification). On the 7x7 mm TFBGA-100 package (theta_JA approx 28 C/W with 4-layer JEDEC test board), the device dissipates 363 mW and rises ~10C above ambient at room temperature. Inside a sealed enclosure at +85C ambient, junction temperature reaches ~110C, well within the +125C automotive Grade 1 rating. Use thermal vias under the center balls and at least 1 square inch of copper pour on the top layer for headroom.
The 100-TFBGA uses 0.65 mm ball pitch and 7x7 mm body, requiring microvia (laser-drilled) PCB technology for escape routing. Stack-up recommendation: 4-layer minimum, 1 oz copper, 0.2 mm between top layer and first inner layer, with via-in-pad recommended for inner-row balls. Per Microchip AN452 (TFBGA PCB layout), keep signal traces at 100 um width and route out of the inner rows through microvias; avoid routing through the center balls to prevent signal integrity issues. A continuous GND plane on layer 2 is required for return paths.
Common pitfalls: (1) omitting the 32.768 kHz crystal for RTCC backup - the internal RC oscillator is not accurate enough for USB or Ethernet. (2) Failing to configure the PLLDIV/POSTDIV2 registers per datasheet equation FPLL = FREF * (PLLMULT+2) / (PLLDIV+1) / (POSTDIV2+1) when targeting 200 MHz. (3) Leaving unused GPIO as analog inputs without disabling digital input buffers, causing excess current draw in sleep modes. (4) Forgetting to enable the FPUCP0.CP0 bit for floating-point code on first boot. (5) Using a non-AEC-Q100-grade LDO in automotive designs - always pair automotive-grade PMIC parts in vehicles.
Información de cumplimiento
AEC-Q100 Grade 1 qualified per Microchip PIC32MZ EF family datasheet and Hotenda listing ('Automotive, AEC-Q100'). RoHS compliant, lead-free, halogen-free per Microchip product page. Operating temperature -40C to +125C for E grade.
