S9S12B96F0CFUER - 16-bit 96MHz S12 MCU, 96KB, Automotive LQFP-80 | NXP
N.º de pieza: S9S12B96F0CFUER ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $16.6 | $16,60 |
| 10 | $15.5 | $155,00 |
| 100 | $14.2 | $1.420,00 |
| 500 | $12.8 | $6.400,00 |
| 1.000 | $11.5 | $11.500,00 |
S9S12B96F0CFUER Descripción general
A microcontroller (MCU) is a single-chip computer containing a processor, program and data memory, peripherals, and input/output interfaces on one integrated circuit. The 16-bit MCU category sits between 8-bit microcontrollers (typical of small appliances and simple logic) and 32-bit microcontrollers (typical of complex applications requiring RTOS, high-speed connectivity, or large memory footprints). Within NXP's portfolio, the S12/S12X family occupies the same mid-range 16-bit niche as dsPIC (DSPIC), MSP430, and Renesas RL78/RX, balancing deterministic interrupt latency with modest power consumption.
Key features of the S9S12B96F0CFUER include 96KB flash, automotive-grade qualification, the LQFP-80 surface-mount footprint, S12 core architecture, and 25MHz operation. The flash memory provides in-application reprogrammability via the standard NXP BDM interface, and the family architecture ensures software portability across memory-size variants in the B-series.
The S12 core is an enhanced 16-bit CISC architecture with a 20-bit ALU and 16-bit index registers, optimized for automotive body electronics. The peripheral set in the B family typically includes multiple CAN modules (msCAN), SCI/SPI, PWM channels, and timers suitable for body control modules.
Typical applications include automotive body control modules (BCM), instrument cluster controllers, HVAC actuators, lighting controllers, and industrial CAN nodes. The pin-compatible family structure also makes the part useful as a drop-in upgrade for B-family designs requiring different memory densities.
When designing with this device, ensure the BDM debug port is broken out to a header for firmware development, and follow NXP's AN for power-supply decoupling on VDDR/VSS pairs. Confirm reflow profile compliance with the MSL-3 floor-life spec.
This page synthesizes distributor pricing from FPGACenter (5.538 units in stock from $16.60 as of 2026-10-20), drop-in alternatives within the MC9S12B family, and practical design notes not found in the standalone datasheet.
Alternativas directas para S9S12B96F0CFUER — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con S9S12B96F0CFUER (mismo factor de forma y huella) — difiere en Package, Core, Program Memory Size, ADC, Operating Temperature Range.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC9S12B64CFUE
✅ Sustitución directa✓ En stock
$10.1 / unidad
Ver hoja de datos →MC9S12B128CFUE
✅ Sustitución directa✓ En stock
$14.85 / unidad
Ver hoja de datos →MC9S12C96CFAE557
✅ Sustitución directa✓ En stock
$4.95 / unidad
Ver hoja de datos →MC9S12C32VFAE16
✅ Sustitución directa✓ En stock
$6.42 / unidad
Ver hoja de datos →MC9S12H256VFVE
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$10.95 / unidad
Ver hoja de datos →MC9S12GC64CFAE
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4.41 / unidad
Ver hoja de datos →S9S12B96F0CFUER Valores máximos y características eléctricas
| Core | S12 (16-bit CISC) |
| CPU Maximum Frequency | 25 MHz |
| Encapsulado | LQFP-80 (FUE) |
| Recuento de pines | 80 |
| Rango de temperatura de funcionamiento | -40C to +85C |
| Automotive Qualified | Yes |
| Nivel MSL | 3 |
| Peak Reflow Temperature | 260 C |
| Maximum Time At Peak Reflow Temperature | 40 s |
| Terminal Finish | TIN |
| JESD-609 Code | e3 |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
Guía de configuración de pines de S9S12B96F0CFUER lqfp-80 (fue)
Configuración de pines para S9S12B96F0CFUER (encapsulado lqfp-80 (fue)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para S9S12B96F0CFUER.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
S9S12B96F0CFUER es adecuado para 7 aplicacións: Automotive Body Control Module (BCM), Automotive Instrument Cluster, HVAC Control Module, Automotive Lighting Controller, Industrial CAN Node, Automotive Door Module, Automotive Seat Control Module.
Automotive Body Control Module (BCM)
The S9S12B96F0CFUER fits BCM applications because the 25 MHz S12 core and 96 KB flash provide ample headroom for typical BCM firmware stacks including CAN diagnostics (UDS/KWP2000), central locking, lighting control, and LIN master/slave stacks. Its -40C to +85C automotive qualification and LQFP-80 footprint are matched to the harsh EMC and thermal conditions under the dash. The B-family pin compatibility allows memory-density scaling across vehicle platforms without PCB rework.
Recomendado
Automotive Instrument Cluster
The S9S12B96F0CFUER suits instrument cluster designs where driving speed (cluster), step (dimming), and stepper-motor gauge control benefit from the S12 core's deterministic interrupt latency and on-chip PWM. The 96 KB flash holds gauge graphics tables and CAN stacks; the LQFP-80 footprint provides enough I/O for backlight drivers and warning-lamp outputs. The pin-compatible B-family allows memory-size scaling across vehicle trim levels.
Recomendado
HVAC Control Module
The S9S12B96F0CFUER fits HVAC control modules because the S12 core, 25 MHz CPU, and on-chip ADC channels easily handle thermistor reading, blower-motor PWM, and mode-door stepper control. The 96 KB flash holds calibration tables for climate profiles, and the LQFP-80 footprint exposes enough GPIO for HVAC switch scanning. Automotive qualification and the B-family pin compatibility enable rapid cross-platform development.
Recomendado
Automotive Lighting Controller
The S9S12B96F0CFUER serves lighting controller nodes because the B-family PWM channels and CAN peripherals support adaptive headlamp, DRL, and turn-indicator functions. The 96 KB flash accommodates lighting-state machine firmware and CAN diagnostic stacks. Pin-compatible B-family variants let designers tune memory to specific lighting subsystems without PCB rework, optimizing BOM cost across vehicle trim lines.
Recomendado
Industrial CAN Node
The S9S12B96F0CFUER fits industrial CAN node applications because the msCAN module supports CAN 2.0B at 1 Mbit/s, the 25 MHz S12 core handles industrial protocol stacks, and 96 KB flash is generous for CANopen or DeviceNet dictionaries. The -40C to +85C operating range matches industrial enclosure thermal requirements, and the LQFP-80 footprint simplifies hand-rework for low-volume industrial nodes.
Recomendado
Automotive Door Module
The S9S12B96F0CFUER is well suited to door module designs because the S12 core and B-family peripherals cover window lift, mirror adjust, and central locking control, with 96 KB flash holding CAN/LIN stacks and motor-control state machines. The LQFP-80 footprint exposes enough I/O for H-bridge enable signals and current-sense ADC channels. The B-family pin compatibility allows memory scaling for feature-rich vs base door trims.
Recomendado
Automotive Seat Control Module
The S9S12B96F0CFUER fits seat control module applications where 96 KB flash and B-family peripherals support memory-position storage, multi-axis motor control via PWM, and CAN/LIN body-network integration. The 25 MHz S12 core handles real-time motor PID loops, and the LQFP-80 footprint provides enough I/O for seat-position switches and motor enable signals. Pin-compatible B-family variants allow scaling from base to premium seat modules.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para S9S12B96F0CFUER — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC9S12B64CFUE | MC9S12B128CFUE | MC9S12C96CFAE557 | MC9S12C32VFAE16 | MC9S12H256VFVE | MC9S12GC64CFAE |
|---|---|---|---|---|---|---|---|
| Package | LQFP-80 (FUE) | LQFP-80 - same | LQFP-80 - same | LQFP-80 - same | LQFP-80 - same | LQFP-80 - same | LQFP-80 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | S12 (16-bit) | S12 (16-bit) | S12 (16-bit) | S12 (16-bit) | S12 (16-bit) | S12 (16-bit) | S12 (16-bit) |
| CPU Max Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 96 KB | 64 KB (-33%) | 128 KB (+33%) | 96 KB (same) | 32 KB (-67%) | 256 KB (+167%) | 64 KB (-33%) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Automotive Qualified | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Family | MC9S12B | MC9S12B | MC9S12B | MC9S12C | MC9S12C | MC9S12H | MC9SGC |
| MSL Level | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Diferenciadores clave
- Mid-range 96 KB flash with B-family pin compatibility (frente a MC9S12B64CFUE)
- Lower memory cost than B128 with same footprint (frente a MC9S12B128CFUE)
- Production NXP mask-set identifier (frente a MC9S12B96)
Notas de diseño
Place a 100 nF decoupling cap on each VDD/VSS pair as close to the LQFP-80 pins as practical, plus a 10 uF bulk cap on the regulator output. The B-family reference manual recommends VDDR/VSS pairs isolated from VDDX (I/O supply) with separate ferrite beads for noise-sensitive ADC channels. Keep the BKGD and RESET traces short and away from switching signals.
Estimated: At 25 MHz CPU and typical automotive BCM duty cycle (50% CPU load), core power dissipation is roughly 0.4-0.6 W. The LQFP-80 has a theta_JA of approximately 50 C/W on a 4-layer JEDEC test board, yielding a junction rise of 20-30 C above ambient. At +85C ambient, junction stays under 115C, well inside the 150C automotive max. No heatsink required.
Do not exceed the MSL-3 floor life of 168 hours once the dry-pack is opened. Bake at 125C for 24 hours if exceeded. The BDM pin (BKGD) must be pulled up with a 10 kohm resistor to VDDX; floating BDM will cause spurious debug mode entries on power-up. Avoid routing the ECLK output near ADC input traces to prevent digital switching noise coupling.
Información de cumplimiento
RoHS compliant (JESD-609 e3, TIN terminal finish), automotive qualified per MC9S12B-family product page, AEC-Q100 implied by automotive qualification. Reach and conflict-minerals status per NXP product environmental disclosures.
