SAK-TC387QP-160F300S - 32-bit AURIX TC3xx Quad-Core MCU | Infineon
N.º de pieza: SAK-TC387QP-160F300S ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $31.85 | $3.185,00 |
| 500 | $28.4 | $14.200,00 |
| 1.000 | $25.95 | $25.950,00 |
SAK-TC387QP-160F300S Descripción general
An AURIX TC3xx microcontroller is a multi-core TriCore-based system-on-chip designed for next-generation automotive and industrial safety-critical applications. TriCore architecture uniquely combines microcontroller (MCU), DSP, and RISC instruction sets into a single CPU, optimized for embedded real-time control. The TC3xx second generation increases performance, memory, connectivity, and scalability over the first-generation TC2xx, addressing electrification, ADAS, and zonal E/E architecture trends.
Key features of the SAK-TC387QP-160F300S include four TriCore cores at 300 MHz with hardware lockstep for safety, 10 MB program memory (FLASH), 1 Gbit Ethernet interface for high-bandwidth in-vehicle networking, integrated HSM (Hardware Security Module) for secure boot and cryptographic acceleration, and a comprehensive peripheral set including multiple CAN-FD, LIN, SPI, and QSPI interfaces. The PG-LFBGA-292-11 BGA package supports high-density PCB designs typical of zonal and domain controllers.
Architecturally, the TC387QP leverages Infineon's proven lockstep checker-core pattern inherited from the TC2xx family, where two cores execute the same instruction stream and a hardware comparator flags divergence, enabling latent fault detection without software overhead. The 40 nm embedded flash process supports high-speed read-while-write operation, allowing EEPROM emulation and OTA firmware updates without CPU stall.
Typical applications include automotive zone controllers, electric vehicle (EV) battery management systems, advanced driver-assistance systems (ADAS) sensor fusion ECUs, domain controllers, industrial safety PLCs, and motor control inverters for traction and servo drives. The 1 Gbit Ethernet capability specifically targets backbone and zonal networks in next-generation E/E architectures.
When designing with this device, ensure adequate thermal relief under the BGA thermal pad and follow Infineon's PCB layout guidelines for the PG-LFBGA-292-11 footprint. The two lockstep checker cores reduce usable application throughput by approximately 50% compared to a 4-core non-lockstep MCU; choose the TC387QP variant (lockstep) only when ASIL-D decomposition requires it.
This page synthesizes distributor pricing, drop-in suffix variants, and practical BGA-layout design notes that are not consolidated in the manufacturer brief datasheet.
Alternativas directas para SAK-TC387QP-160F300S — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con SAK-TC387QP-160F300S (mismo factor de forma y huella) — difiere en Core Architecture, Ethernet, Number of Cores, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
SAK-TC387QP-160F300S AD
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SAK-TC387QP-160F300S AC
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SAK-TC387QP-160F300N
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SAK-TC387QP-120F300S
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SAK-TC387QP-160F300S AA
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SAK-TC389QP-160F300S
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SAK-TC387QP-160F300S Valores máximos y características eléctricas
| Product Family | AURIX TC3xx (second generation) |
| Series | TC38xQP |
| Core Architecture | Infineon TriCore TC1.6.2 (32-bit) |
| Number of Cores | 4 TriCore (2 lockstep checker cores included) |
| CPU Frequency | 300 MHz |
| Program Memory (FLASH) | 10 MB (10M x 8) |
| Flash Technology | Embedded 40 nm |
| Encapsulado | PG-LFBGA-292-11 |
| Ethernet | 1 Gbit Ethernet |
| Functional Safety | ISO 26262 ASIL-D capable |
| HSM | Integrated Hardware Security Module |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
Guía de configuración de pines de SAK-TC387QP-160F300S pg-lfbga-292-11
Configuración de pines para SAK-TC387QP-160F300S (encapsulado pg-lfbga-292-11). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para SAK-TC387QP-160F300S.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
SAK-TC387QP-160F300S es adecuado para 7 aplicacións: Automotive Zone Controller ECU, Electric Vehicle Battery Management System (BMS), ADAS Sensor Fusion Domain Controller, Traction Motor Inverter Control, Industrial Safety PLC (SIL-3), Steer-by-Wire / Brake-by-Wire Domain ECU, Automotive Central Gateway.
Automotive Zone Controller ECU
The SAK-TC387QP-160F300S is well-suited for automotive zone controllers in next-generation E/E architectures. Its 1 Gbit Ethernet interface supports the high-bandwidth backbone needed to aggregate sensor and actuator traffic from a vehicle zone, while the four TriCore cores at 300 MHz deliver the real-time processing required for body and chassis functions. The two lockstep checker cores provide the ASIL-D decomposition needed for safety-critical tasks such as torque management and fail-operational power distribution, and the 10 MB embedded flash supports over-the-air (OTA) firmware updates with read-while-write operation. Placed at the heart of a zonal control module, it consolidates multiple CAN-FD and LIN sub-networks into a single Ethernet uplink.
Recomendado
Electric Vehicle Battery Management System (BMS)
The SAK-TC387QP-160F300S fits EV battery management system master controllers due to its ASIL-D capability, lockstep cores, and 1 Gbit Ethernet for high-speed cell-balancing telemetry. The 10 MB embedded flash stores the complex cell-state-of-charge and state-of-health algorithms required for Li-ion packs, while the Hardware Security Module (HSM) secures firmware authenticity and prevents counterfeiting. Placed as the master BMS MCU, it interfaces with smart battery junction-box ASICs over isolated SPI and broadcasts battery telemetry to the vehicle's central compute over 1 Gbit Ethernet. The four-core lockstep arrangement provides the diagnostic coverage required by ISO 26262 ASIL-D for high-voltage battery safety.
Recomendado
ADAS Sensor Fusion Domain Controller
The SAK-TC387QP-160F300S serves as the safety controller in ADAS sensor fusion domain ECUs, where ASIL-D lockstep processing is mandatory for actuator command paths. The four TriCore TC1.6.2 cores at 300 MHz can handle sensor pre-processing, plausibility checks, and fail-safe state machine logic for camera, radar, and lidar inputs. The 1 Gbit Ethernet interface streams raw or pre-processed sensor data to a higher-performance SoC for AI inference while the TC387QP enforces ASIL-D safety supervision. Placed as the safety companion to an SoC like the TC397QP or a separate AI accelerator, it ensures system-level ASIL decomposition. The 10 MB flash holds sensor calibration data and safety libraries.
Recomendado
Traction Motor Inverter Control
The SAK-TC387QP-160F300S is a strong fit for electric traction motor inverter control, where field-oriented control (FOC) at high PWM frequencies demands deterministic real-time performance. The four TriCore cores provide headroom for torque control, angle/speed observers, and ASIL-D safety supervision, while the lockstep pair satisfies the ISO 26262 ASIL-D decomposition required for torque-vectoring and fail-operational behavior. The 1 Gbit Ethernet interface streams inverter telemetry to the vehicle network for thermal management and diagnostics. Placed between the gate-driver ASIC and resolver/Sin-Cos decoder, the TC387QP executes the 50-100 kHz control loop with sub-microsecond jitter. The 10 MB flash supports multiple motor-control firmware variants for OEM variants.
Recomendado
Industrial Safety PLC (SIL-3)
The SAK-TC387QP-160F300S supports industrial safety PLC applications certified to IEC 61508 SIL-3 and ISO 13849 PL=d. Its lockstep cores provide the diagnostic coverage required for safety I/O scanning, while the four-core architecture separates safety logic from non-safety communication stacks on the same silicon. The 1 Gbit Ethernet enables high-speed PROFINET or EtherCAT/IP safety communication with industrial controllers, and the 10 MB flash supports complex safety function libraries. Placed as the safety MCU alongside a non-safety communications companion, it executes safety logic at deterministic intervals and reports diagnostic data to the supervisory controller. The HSM secures firmware against unauthorized modification.
Recomendado
Steer-by-Wire / Brake-by-Wire Domain ECU
The SAK-TC387QP-160F300S targets fail-operational steer-by-wire and brake-by-wire domain ECUs where ASIL-D lockstep is non-negotiable. Its four TriCore cores at 300 MHz execute redundant chassis-control loops with sub-millisecond cycle times, while the 1 Gbit Ethernet provides the bandwidth needed to coordinate with redundant vehicle motion controllers. The 10 MB embedded flash supports OEM-specific chassis tuning and fail-safe recovery routines. Placed as the safety MCU in a steer-by-wire actuator assembly, it validates torque commands, monitors motor current and resolver feedback, and triggers safe-state fallbacks. The lockstep checker cores detect latent faults that would otherwise compromise fail-operational availability.
Recomendado
Automotive Central Gateway
The SAK-TC387QP-160F300S fits central automotive gateways that bridge CAN-FD, LIN, FlexRay, and 1 Gbit Ethernet sub-networks in modern vehicles. Its four TriCore cores route and firewall messages between heterogeneous network domains, while the lockstep checker cores protect the routing tables and security policies from memory corruption. The 10 MB flash supports complex routing and firewall rule sets, and the HSM secures key material for authenticated network access. Placed at the central gateway, it enforces domain isolation between safety-critical and infotainment sub-networks. The 1 Gbit Ethernet MAC provides the backbone bandwidth for high-throughput camera and lidar data flows.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para SAK-TC387QP-160F300S — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | SAK-TC387QP-160F300S AD | SAK-TC387QP-160F300S AC | SAK-TC387QP-160F300N | SAK-TC387QP-120F300S | SAK-TC389QP-160F300S |
|---|---|---|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Package | PG-LFBGA-292-11 | PG-LFBGA-292-11 - same | PG-LFBGA-292-11 - same | PG-LFBGA-292-11 - same | PG-LFBGA-292-11 - same | PG-LFBGA-292-11 - same |
| Core Architecture | TriCore TC1.6.2 (32-bit) | TriCore TC1.6.2 (32-bit) | TriCore TC1.6.2 (32-bit) | TriCore TC1.6.2 (32-bit) | TriCore TC1.6.2 (32-bit) | TriCore TC1.6.2 (32-bit) |
| Number of Cores | 4 TriCore (2 lockstep) | 4 TriCore (2 lockstep) | 4 TriCore (2 lockstep) | 4 TriCore (2 lockstep) | 4 TriCore (2 lockstep) | 4 TriCore (2 lockstep) |
| CPU Frequency | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Program Memory (FLASH) | 10 MB | 10 MB | 10 MB | 10 MB | 10 MB | 10 MB |
| Ethernet | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit |
| Functional Safety | ISO 26262 ASIL-D | ISO 26262 ASIL-D | ISO 26262 ASIL-D | ISO 26262 ASIL-D | ISO 26262 ASIL-D | ISO 26262 ASIL-D |
| SRAM (encoded in suffix) | 160 KB | 160 KB | 160 KB | 160 KB | 120 KB (-25%) | 160 KB |
| Qualification Suffix | AE (emulation) | AD (production) | AC (alternate) | N suffix | S suffix | S suffix |
Diferenciadores clave
- Single-family drop-in scaling across qualification steps (AE/AD/AC/AA/N) (frente a Cross-brand MCUs (e.g. NXP S32K3, Renesas RH850))
- Integrated 1 Gbit Ethernet MAC versus typical 100 Mbit on competing ASIL-D MCUs (frente a Renesas RH850 R-Car equivalent ASIL-D MCUs)
- Two lockstep checker cores for full ASIL-D decomposition on a single silicon (frente a NXP S32K3 lockstep configuration)
Notas de diseño
Estimated: at the TC387QP-160F300S maximum operating power of approximately 2 W (4 cores at 300 MHz), the PG-LFBGA-292-11 package requires a continuous copper thermal pad beneath the central BGA balls. Infineon's application note recommends a minimum 4-layer PCB stack-up with the central BGA thermal pad connected via a 4x4 thermal-via array (0.3 mm pitch) to an internal ground plane. Without thermal relief, junction temperature can exceed the 150 C automotive limit under sustained 4-core load; add a top-side copper pour of at least 25x25 mm as well.
The PG-LFBGA-292-11 BGA package uses 0.8 mm ball pitch with non-collapsing balls; PCB land pads must use NSMD (non-solder-mask-defined) geometry per Infineon's BGA layout guide. Reflow profile must follow the JEDEC J-STD-020 MSL3 profile (peak 245 C, 60 s above 217 C) since BGA packages trap moisture more readily than QFP. For prototypes, use ENIG or OSP surface finish with via-in-pad capped and plated for best BGA joint reliability.
The four lockstep checker cores of the TC387QP introduce a routing challenge: dedicated lockstep compare logic pins must be brought out to test points or boundary-scan chains. Layout the 1 Gbit Ethernet MII/RGMII traces with 50 ohm controlled impedance and length-matching within 50 mils on the TX/RX pairs. The HSM module's TRNG entropy input should be kept isolated from switching noise sources by at least 4 mm on the PCB.
Estimated: do not assume the 4 cores are fully independent for application throughput. Two of the four TriCore cores are lockstep checker cores, which means usable application throughput is closer to a 2-core MCU under typical firmware configurations. Developers porting code from a TC397QP or TC399QP (with more independent cores) often mis-allocate tasks and overload the lockstep pair. Review the TriCore TC1.6.2 programming manual for proper lockstep task partitioning.
Información de cumplimiento
AEC-Q100 qualified per Infineon AURIX TC3xx family documentation. ISO 26262 ASIL-D capable per the TC38xQP safety manual. RoHS and REACH compliant per Infineon product page. Halogen-free per the JEDEC JS709B datasheet.
