SC667112CLC - 8-Bit S08 Core MCU, 20MHz, 16KB Flash | NXP
N.º de pieza: SC667112CLC ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4.5 | $4,50 |
| 10 | $4.05 | $40,50 |
| 100 | $3.6 | $360,00 |
| 500 | $3.24 | $1.620,00 |
| 1.000 | $2.92 | $2.920,00 |
SC667112CLC Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and a range of peripheral interfaces onto one semiconductor die. The 8-bit S08 core family sits within the broader hierarchy of microcontrollers -> embedded controllers -> microprocessors -> semiconductors, and is designed for ultra-low-power, deterministic real-time tasks such as sensor signal conditioning, motor control loops, human-machine interface (HMI) key-scan logic, and small protocol bridging. The S08 instruction set is upward compatible with the legacy HC08 architecture, simplifying code migration from earlier Freescale designs.
Key features of the SC667112CLC include a maximum CPU clock of 20 MHz providing up to 20 MIPS of instruction throughput, 16 KB of Flash for application code, on-chip RAM, multiple general-purpose timers, ADC, communication peripherals, and a wide operating voltage range suited to both battery-powered and industrial environments. The integrated peripherals typically include an asynchronous serial communications interface (SCI), a serial peripheral interface (SPI), an inter-integrated circuit (I2C) bus, general-purpose I/O (GPIO), and a multi-channel 10-bit analog-to-digital converter (ADC).
From an architectural perspective, the S08 core uses a von Neumann bus structure with a compact 16-bit instruction word, allowing dense code storage within the 16 KB Flash budget. Hardware multiply-and-accumulate support accelerates common DSP-style routines, while integrated clock options (internal reference and external crystal) simplify BOM by reducing external components. The on-chip debug interface supports in-system programming and boundary-scan-style test access.
Typical applications for the SC667112CLC include white-goods and small-appliance controllers, industrial sensor interfaces, automotive body electronics sub-modules (non-safety-critical), consumer remote controls, simple LCD/LED display drivers, and battery management front-ends for small portable devices. The part is also found in lighting controls, smart metering peripherals, and as a glue controller in larger system-on-chip designs.
When designing with the SC667112CLC, ensure that decoupling, ground-plane integrity, and an external oscillator (if used) follow standard NXP S08 reference-layout recommendations to maintain EMC margins, and verify firmware tooling (CodeWarrior or NXP S08 toolchains) compatibility before committing to the device for production.
This page synthesizes distributor stock, current pricing, drop-in alternative MPNs, and practical design notes for engineers evaluating the SC667112CLC alongside other 8-bit S08 family members and competitor equivalents.
Alternativas directas para SC667112CLC — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con SC667112CLC (mismo factor de forma y huella) — difiere en Core Processor, Flash Memory, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC9S08QG8CFFE
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
Consulte el precio
Ver hoja de datos →MC9S08QD4CSC
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
Consulte el precio
Ver hoja de datos →MC9S08SH4CTJR
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
SC667112CLC Valores máximos y características eléctricas
| Core Architecture | S08 (8-bit CISC) |
| Core Family | Freescale/NXP S08 family |
| Maximum CPU Frequency | 20 MHz |
| Program Memory (Flash) | 16 KB |
| Instruction Set Compatibility | Freescale HC08 (upward compatible) |
| Bus Architecture | Von Neumann |
| Maximum Operating Frequency | 20 MHz |
| Package Type | LQFP |
| Tipo de montaje | Surface Mount |
| On-chip Debug | Background Debug Mode (BDM) |
| Manufacturing Status | Rochester Electronics continues supply as authorized aftermarket source |
Guía de configuración de pines de SC667112CLC lqfp
Configuración de pines para SC667112CLC (encapsulado lqfp). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para SC667112CLC.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
SC667112CLC es adecuado para 6 aplicacións: White Goods Appliance Controller, Industrial Sensor Interface Module, Consumer Remote Control and HMI, Automotive Body Electronics Sub-module (Non-safety), LED Lighting and Display Driver, Battery Management Front-End for Small Portables.
White Goods Appliance Controller
Why SC667112CLC fits: The S08 core's deterministic interrupt response, 20 MHz throughput, and 16 KB Flash budget comfortably handle the state machines and timing logic used in washing machines, dishwashers, and microwave oven controllers. How it is used + performance: The MCU runs the main control loop, scans the user key matrix, drives the LED or simple LCD HMI, modulates the relay and triac outputs for motor/element control, and handles serial communication with the sensor board. With 16 KB Flash, firmware supports boot loader plus diagnostics; BDM enables in-system firmware updates during production.
Recomendado
Industrial Sensor Interface Module
Why SC667112CLC fits: 8-bit precision, 20 MHz clock, and 16 KB Flash are well-matched to 4-20 mA or 0-10 V sensor signal conditioning boards, where the MCU digitizes analog signals and bridges to a higher-level fieldbus master. How it is used + performance: The integrated ADC samples multiple analog channels at low rates (<=1 kHz), the MCU applies linearization, and the SCI/SPI peripherals forward the processed data to a main PLC. Determinism of the S08 core ensures low-latency response to over-range fault conditions.
Recomendado
Consumer Remote Control and HMI
Why SC667112CLC fits: 16 KB Flash is more than adequate for IR or RF remote control protocol stacks (RC5, NEC, BLE-passthrough glue), and the S08 core's low-power sleep modes extend battery life on remotes that sit idle for months. How it is used + performance: The MCU decodes button matrix inputs via GPIO interrupts, generates the carrier-modulated IR or RF output, and runs the power-management state machine. Hibernation currents on S08 keep standby drain in the microamp range, ideal for coin-cell-powered designs.
Recomendado
Automotive Body Electronics Sub-module (Non-safety)
Why SC667112CLC fits: The S08 family has a long automotive heritage, and the 20 MHz clock is well-suited to non-safety body functions such as interior lighting controllers, seat-position memory, and accessory modules. How it is used + performance: The MCU talks LIN (via SCI) to the body control module, drives LED strings with PWM, and handles input debounce for switches. For safety-critical body functions, choose an AEC-Q100 qualified part instead; this reference is for non-safety body sub-modules only.
Recomendado
LED Lighting and Display Driver
Why SC667112CLC fits: PWM timers plus 16 KB Flash suit decorative LED controllers, RGB strips, and small alphanumeric or dot-matrix displays that need deterministic refresh without jitter. How it is used + performance: The MCU generates PWM channels for color mixing, scans push-button inputs, and runs a small protocol stack (DMX-512, SPI-to-LED driver ICs). 20 MHz clock and S08 interrupts enable flicker-free refresh rates above 200 Hz even with 32+ PWM channels.
Recomendado
Battery Management Front-End for Small Portables
Why SC667112CLC fits: The integrated ADC and S08 low-power modes make this MCU a strong choice as a fuel-gauge and protection front-end for small Li-ion or Li-Po packs in wearables, Bluetooth trackers, and portable medical devices. How it is used + performance: The MCU periodically samples cell voltage and current via the ADC, integrates coulomb count, communicates state-of-charge over I2C to a host SoC, and enforces protection thresholds. S08's low quiescent current in wait mode helps the front-end itself stay below 50 uA idle drain.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para SC667112CLC — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC9S08QG8CFFE | MC9S08QD4CSC | MC9S08SH4CTJR |
|---|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP (SMD) | LQFP-32 - same family | LQFP-32 - same family | LQFP-32 - same family |
| Core Architecture | S08 8-bit | S08 8-bit | S08 8-bit | S08 8-bit |
| Maximum CPU Frequency | 20 MHz | 20 MHz | 10 MHz | 20 MHz |
| Flash Memory | 16 KB | 8 KB | 4 KB | 4 KB |
| Lifecycle Status | NRND | Active | Active | Active |
| Indicative Unit Price (qty 1) | ~$4.50 | ~$2.10 | ~$1.85 | ~$2.40 |
Diferenciadores clave
- Best-in-class 8-bit price-to-performance within NXP NRND portfolio (frente a MC9S08QG8CFFE)
- Heritage Freescale/NXP toolchain support and reference materials (frente a MC9S08QD4CSC)
- Larger Flash budget than SH family members (frente a MC9S08SH4CTJR)
Notas de diseño
S08 cores draw modest supply current (single-digit mA active, microamp-range sleep), but design adequate bulk + bypass capacitance on Vdd/Vddad. Place one 10 uF bulk, one 0.1 uF, and one 1 nF ceramic cap within 5 mm of the Vdd pin pair. For battery-powered designs, route MCU wake-up pins to edge-triggered interrupts instead of polling to maximize standby time.
LQFP packages have theta_JA around 60-80 C/W depending on PCB copper area. At 20 MHz with all peripherals active, the MCU stays well below 50 mW, so no heatsink is needed. Ensure at least 1 sq. inch of continuous ground copper beneath the LQFP exposed pad region to stay within the recommended thermal envelope.
Follow standard NXP S08 reference-layout practices: a solid ground plane on layer 2, short traces from crystal to EXTAL/XTAL pins (<= 5 mm), and a guard ring around the crystal traces to keep switching noise out. Keep the RESET pin trace short and decouple with a 0.1 uF cap close to the pin; ESD protection on the HMI connectors should sit near the connector, not the MCU.
Do not rely solely on the internal clock for designs that need precise UART baud rates or ADC timing - use an external crystal. Verify that the chosen toolchain (CodeWarrior for S08, S08-aware GCC, or newer NXP S08 plug-ins) supports the specific Flash size and BDM signature of the SC667112CLC before starting firmware development. Always check the latest PCN list because this part is in NRND status.
Información de cumplimiento
RoHS, REACH, and lead-free status were not stated in the verified distributor data; verified against the NXP/Freescale legacy product page only. AEC-Q100 is not applicable to this part number (non-automotive qualification); consult automotive-grade S08 variants for body electronics AEC-Q100 requirements.
