SN65DSI86IPAPRQ1 - MIPI DSI to eDP Bridge, 12Gbps | TI
N.º de pieza: SN65DSI86IPAPRQ1 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $22.77 | $22,77 |
| 10 | $20.49 | $204,90 |
| 100 | $18.22 | $1.822,00 |
| 500 | $16.4 | $8.200,00 |
| 1.000 | $14.76 | $14.760,00 |
SN65DSI86IPAPRQ1 Descripción general
A bridge IC of this type is a video interface converter in the display-signal-chain hierarchy: panel interface -> bridge/serializer -> display timing controller. The MIPI DSI (Display Serial Interface) protocol is a low-power differential standard common on mobile SoCs, while eDP (embedded DisplayPort) is the panel interface standard used in laptop, tablet, and automotive display panels. Bridges like the SN65DSI86-Q1 let a DSI-only processor drive an eDP panel without changing either device.
Key features include decoding of MIPI DSI 18-bpp RGB666 and 24-bpp RGB888 video packets, conversion to DisplayPort with up to four lanes, and resolution support suited to WQXGA (2560x1600) at 60 fps as well as full-HD 1920x1080 at an equivalent 120 fps with up to 24 bpp. The bridge is controlled via an I2C interface, and the core supply operates over a 1.14 V to 1.26 V range.
Architecturally, the device integrates a dual-channel MIPI D-PHY receiver front-end, a DSI packet decoder, and a DisplayPort 1.2-compatible transmitter. The dual-channel input configuration doubles aggregate input bandwidth so high-resolution panel content can be transported without compression artifacts or dropped frames.
Typical applications include netbooks and notebook PC display panels, tablet displays, and automotive cluster and infotainment screens where the -Q1 qualification and wide temperature operation are required. Designers should verify I2C address configuration and lane assignment early in bring-up, since incorrect DSI lane mapping is the most common integration issue. An external 1.8 V or similar auxiliary rail is typically needed for the D-PHY (see the TI datasheet for exact rail requirements).
This page adds value beyond the manufacturer datasheet by consolidating distributor pricing, drop-in same-family alternatives, comparison tables, and practical integration notes in one place.
Alternativas directas para SN65DSI86IPAPRQ1 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con SN65DSI86IPAPRQ1 (mismo factor de forma y huella) — difiere en Automotive Qualification, Max Resolution Support, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
SN65DSI84TPAPRQ1
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SN65DSI86IPAPQ1
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$12.53 / unidad
Ver hoja de datos →SN65DSI85Q1
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
SN65DSI86IPAP
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
SN65DSI86IPAPRQ1 Especificaciones
| Función | MIPI DSI to embedded DisplayPort (eDP) bridge |
| Input Interface | Dual-channel MIPI DSI, 4 lanes per channel (D-PHY) |
| Input Data Rate | 1.5 Gbps per lane |
| Maximum Input Bandwidth | 12 Gbps |
| Output Interface | DisplayPort, up to 4 lanes |
| Output Data Rate | 1.62 Gbps or 2.7 Gbps per lane |
| Supported Pixel Formats | 18-bpp RGB666, 24-bpp RGB888 |
| Max Resolution Support | WQXGA (2560x1600) at 60 fps; 1920x1080 at equivalent 120 fps |
| Control Interface | I2C |
| Supply Voltage (Core) | 1.14 V to 1.26 V |
| Automotive Qualification | AEC-Q100 qualified (-Q1) |
| Encapsulado | 64-HTQFP (PAP, 10x10 mm) with exposed pad |
| Tipo de montaje | Surface Mount |
| Typical Applications | Netbooks, notebook PC, tablet, automotive displays |
| Estado RoHS | Compliant |
Guía de configuración de pines de SN65DSI86IPAPRQ1 64-htqfp (pap, 10x10 mm) with exposed pad
Configuración de pines para SN65DSI86IPAPRQ1 (encapsulado 64-htqfp (pap, 10x10 mm) with exposed pad). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.
No hay datos detallados de patillaje disponibles para SN65DSI86IPAPRQ1.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
SN65DSI86IPAPRQ1 es adecuado para 6 aplicacións: Notebook PC Display Panel, Automotive Instrument Cluster, Tablet Display Interface, Automotive Center-Stack Infotainment, Industrial HMI and Medical Displays, Netbook and Low-Cost PC Platforms.
Notebook PC Display Panel
The SN65DSI86IPAPRQ1 fits notebook PC architectures where the application processor or discrete GPU outputs MIPI DSI but the panel assembly uses an embedded DisplayPort (eDP) input. Its dual-channel four-lane DSI front end at 1.5 Gbps per lane supplies up to 12 Gbps of input bandwidth, sufficient to drive WQXGA 2560x1600 panels at 60 fps with 24-bpp RGB888 color depth without compression. Placed between the SoC D-PHY port and the panel-side DP receiver, the bridge is configured over I2C for lane count, timing, and lane mapping. Because it converts rather than regenerates pixel data, added system latency is minimal, and the exposed-pad HTQFP dissipates heat through the PCB ground pour rather than a heatsink, keeping the thin display assembly compact.
Recomendado
Automotive Instrument Cluster
As an AEC-Q100 qualified -Q1 device, the SN65DSI86IPAPRQ1 is designed for automotive instrument cluster displays driven by automotive SoCs that expose MIPI DSI outputs. Clusters typically use high-resolution eDP panels; the bridge's 12 Gbps input budget supports 1920x720 class wide cluster panels at high refresh, and up to WQXGA at 60 fps. The I2C control interface lets the cluster MCU program lane mapping and timing during startup, supporting display bring-up diagnostics required by automotive functional-safety workflows. Designers should follow TI's automotive reference-design layout guidance for the D-PHY routing impedance and place the 1.14 V to 1.26 V core regulator close to the exposed pad to meet EMI and voltage-drop requirements on the 12 V vehicle supply chain.
Recomendado
Tablet Display Interface
Tablets combine mobile SoCs with native MIPI DSI output and slim eDP panel assemblies; the SN65DSI86IPAPRQ1 bridges the two protocols with 18-bpp RGB666 and 24-bpp RGB888 packet decoding. The dual-channel DSI configuration is essential in this space because large tablet panels exceed the bandwidth of a single four-lane DSI port; splitting the stream across two channels preserves the 12 Gbps aggregate input needed for 2560x1600-class displays at 60 fps. Low idle power and I2C-configurable operation help meet tablet battery-life targets, while the 10x10 mm HTQFP fits the z-height- and area-constrained mainboard. Layout should keep the D-PHY differential pairs length-matched and reference a continuous ground plane to maintain signal integrity at 1.5 Gbps.
Recomendado
Automotive Center-Stack Infotainment
Center-stack and passenger infotainment screens increasingly use eDP panels with resolutions above what LVDS links carry. The SN65DSI86IPAPRQ1 accepts the DSI output typical of infotainment SoCs and converts it to a four-lane eDP stream at 1.62 or 2.7 Gbps per lane, supporting true-HD 1080p content at high frame rates (equivalent 120 fps) with 24 bpp. AEC-Q100 qualification addresses the extended ambient temperatures inside a vehicle cabin, and the I2C register interface allows runtime reconfiguration for different panel options on the same head-unit PCB. Because infotainment systems co-locate RF tuners and wireless modules, board designers should follow TI datasheet layout guidance: keep DSI/eDP differential pairs away from antenna feed lines and use solid reference planes to limit radiated emissions from the 2.7 Gbps links.
Recomendado
Industrial HMI and Medical Displays
Industrial human-machine interfaces and medical monitoring panels commonly pair x86 or ARM compute modules that output MIPI DSI with high-brightness eDP panels. The SN65DSI86IPAPRQ1's 12 Gbps input bandwidth covers the 1920x1080 and 2560x1600 resolutions typical of these displays at 60 fps with full RGB888 color. I2C-based configuration simplifies firmware-driven panel calibration, and the deterministic packet-to-pixel conversion avoids frame buffering artifacts important in medical imaging review. Although the device is automotive qualified, its specifications make it equally usable in industrial builds that value the same screening level. Designers should derate the core supply tolerance (1.14 V to 1.26 V) margin against regulator accuracy and add bulk plus 0.1 uF decoupling at each supply pin per the TI datasheet power-supply recommendations.
Recomendado
Netbook and Low-Cost PC Platforms
Netbooks and cost-optimized notebook platforms use SoCs with dual-channel DSI output to avoid the cost of native DisplayPort transmitters; the SN65DSI86IPAPRQ1 performs the protocol conversion to the eDP panel at minimal BOM cost. Its single-bridge approach replaces discrete DP transmitter solutions, and support for both 18-bpp RGB666 and 24-bpp RGB888 allows reuse across panel cost tiers within one platform design. DigiKey lists the device in its netbook/notebook/tablet interface category, reflecting this original design intent. For these platforms, the key design consideration is power sequencing: the core 1.14 V to 1.26 V rail must be stable before DSI video transmission begins, so use a sequenced PMIC or a load switch with power-good output to gate the D-PHY supply, per the TI datasheet startup recommendations.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para SN65DSI86IPAPRQ1 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | SN65DSI84TPAPRQ1 | SN65DSI86IPAPQ1 | SN65DSI85Q1 | SN65DSI86IPAP |
|---|---|---|---|---|---|
| Package | 64-HTQFP (PAP, 10x10 mm) exposed pad | 64-HTQFP (PAP family) | 64-HTQFP (PAP, 10x10 mm) - same | 64-HTQFP (PAP family) | 64-HTQFP (PAP, 10x10 mm) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Output Protocol | eDP (DisplayPort), up to 4 lanes | LVDS (dual-link) | eDP (DisplayPort), up to 4 lanes | LVDS | eDP (DisplayPort), up to 4 lanes |
| Automotive Qualification | AEC-Q100 (-Q1) | AEC-Q100 (-Q1) | AEC-Q100 (-Q1) | AEC-Q100 (-Q1) | Commercial (not -Q1) |
| Control Interface | I2C | I2C | I2C | I2C | I2C |
Diferenciadores clave
- eDP output with 4 lanes at 2.7 Gbps (frente a SN65DSI84TPAPRQ1)
- Dual-channel 12 Gbps DSI input (frente a SN65DSI85Q1)
- AEC-Q100 automotive qualification (frente a SN65DSI86IPAP)
Notas de diseño
Route the MIPI DSI input and eDP output differential pairs as 100-ohm controlled-impedance pairs over a continuous ground reference plane. Keep intra-pair skew matched (per TI datasheet layout guidance) and avoid splitting pairs across plane gaps. At 1.5 Gbps DSI and 2.7 Gbps eDP, stubs from test points or vias cause reflections; place AC coupling capacitors where the datasheet specifies and avoid mid-pair vias. Length-match pairs within the tolerances given in the SN65DSI86-Q1 datasheet layout section before committing the PCB stack-up.
The core supply must remain within the 1.14 V to 1.26 V window; select a buck converter with +/-2% or better output accuracy so load transients and DC drop cannot exit the range. TI datasheet power-supply recommendations call for local decoupling at each supply pin - place 0.1 uF ceramics within 2 mm of the pins plus bulk capacitance per rail. Verify power-up sequencing between the core rail and the D-PHY/analog rails before enabling DSI video; an unsequenced rail can leave the D-PHY in an undefined state during panel bring-up.
Most blank-panel failures on first silicon bring-up trace to I2C configuration rather than hardware: wrong slave address strap, incorrect DSI lane count or lane mapping, or video timing that does not match the panel EDID/panel spec. TI datasheet register documentation defines the required initialization sequence; write it before enabling the DSI stream. Also confirm the panel requires continuous vs. burst-mode DSI operation and set the register bits accordingly. Keep a logic analyzer on the I2C bus during development to confirm each register write is ACKed.
The 64-HTQFP exposed pad is the primary thermal path; connect it to a stitched ground pour with an array of thermal vias (typically 5x5, 0.3 mm drill) to the inner ground plane. Estimated: at typical bridge dissipation in the hundreds of milliwatts, the exposed pad plus a modest copper area keeps the junction well below the datasheet maximum, but do not rely on the package leads alone for heat removal. Verify junction temperature at maximum resolution and refresh rate, which is the worst-case traffic pattern.
Información de cumplimiento
-Q1 suffix denotes AEC-Q100 qualification per TI product page. RoHS and lead-free status per standard TI automotive-qualified packaging; REACH and halogen-free status not stated in retrieved data.
