Texas Instruments

SN65MLVD200ADR - Half-Duplex M-LVDS Transceiver, 8-SOIC | TI

N.º de pieza: SN65MLVD200ADR ✓ Activo
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3.3 V (typical) Vdss 24 mA (typical) Id TIA/EIA-899 (M-LVDS); TIA/EIA-644 (LVDS reference) Rds(on) 8-pin SOIC Package
Desde $1.78 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-21
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Cant. Precio unitario Total
1 $3.2 $3,20
10 $2.88 $28,80
100 $2.55 $255,00
500 $2.1 $1.050,00
1.000 $1.78 $1.780,00
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SN65MLVD200ADR Descripción general

The Texas Instruments SN65MLVD200ADR is a half-duplex Multipoint-LVDS (M-LVDS) transceiver in an 8-pin SOIC package, with one driver and one receiver sharing a single differential bus pair. It conforms to the M-LVDS standard (TIA/EIA-899) and supports data rates up to 100 Mbps (200 Mbps in some drive modes) with low 700 ps driver output skew, making it suitable for high-speed multipoint backplane and clock-distribution links. The IC operates from a single 3.3 V supply and provides 24 mA of drive current on the M-LVDS bus pins, with internal fail-safe biasing on the receiver inputs.

Background: An LVDS (Low-Voltage Differential Signaling) transceiver is a type of high-speed differential interface IC that transmits data across a balanced pair of wires using low-swing, current-mode signaling, achieving high noise immunity at low power. M-LVDS is an extension of LVDS (TIA/EIA-899) that adds a stronger driver and controlled bus-edge transition so multiple drivers and receivers can coexist on a single twisted pair - typical of multipoint backplane buses. Within the broader taxonomy: LVDS transceiver -> differential interface IC -> interface IC -> integrated circuit.

Key features include ±9 kV HBM ESD protection on the bus pins (enhancing ruggedness for cable and connector exposure), driver output rise/fall times around 1 ns, and a wide common-mode range on the receiver. The 8-SOIC footprint is industry-standard, allowing easy board integration and pin-compatible second sourcing. The device is characterized for operation from -40 °C to +85 °C and is targeted at clock distribution, telecom backplanes, and base-station equipment.

Typical applications include cellular base stations, central-office switches, network routers and switches, multipoint clock distribution, and industrial backplane data links. In clock-distribution trees the SN65MLVD200ADR fans out a low-jitter reference to multiple cards. Compared to a single-ended bus (such as TTL/CMOS parallel), M-LVDS offers superior EMI and ground-noise immunity at lower power per bit.

Design consideration: Because multiple transceivers share one bus, only one driver may be enabled at a time. The driver-enable / receiver-enable logic (DE, RE) supports wired-OR bus arbitration; unused output nodes should not float. Always confirm bus termination and stub length against the TIA/EIA-899 standard for the chosen data rate.

This page synthesizes distributor stock data, same-family TI M-LVDS drop-in alternatives, and cross-brand pin-compatible substitutes from TIA/EIA-899 compliant parts - information not consolidated on the manufacturer datasheet alone.

Alternativas directas para SN65MLVD200ADR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

SN65MLVD200AD

✅ Sustitución directa
📦 8-SOIC
same die, tube packaging instead of tape-and-reel

📋 Alternativa de referencia (no en el catálogo)

SN65MLVD200ADRG4

✅ Sustitución directa
📦 8-SOIC
same die, RoHS/G4 qualified tape-and-reel variant

📋 Alternativa de referencia (no en el catálogo)

SN65MLVD200A-Q1

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 8-SOIC
AEC-Q100 qualified, ±9 kV ESD on bus pins (enhanced robustness)

📋 Alternativa de referencia (no en el catálogo)

SN65MLVD200ADG4

✅ Sustitución directa
📦 8-SOIC
G4 version of base die, same package and pinout

📋 Alternativa de referencia (no en el catálogo)

ADN4690EBRZ

✅ Sustitución directa
📦 8-SOIC
cross-brand M-LVDS, TIA/EIA-899 compliant, verify enable polarity vs TI pinout

📋 Alternativa de referencia (no en el catálogo)

ADN4690EBRZ-RL7

✅ Sustitución directa
📦 8-SOIC
same die as ADN4690EBRZ, 7-inch reel packaging

📋 Alternativa de referencia (no en el catálogo)

SN65MLVD200ADR Especificaciones

Función Half-duplex M-LVDS transceiver (1 driver + 1 receiver)
Velocidad de datos Up to 100 Mbps (typical)
Driver Skew 700 ps (typical)
Tensión de alimentación 3.3 V (typical)
Output Drive Current 24 mA (typical)
ESD Protection (Bus Pins) ±9 kV HBM
Common-Mode Range (Receiver) -1 V to +3.4 V (M-LVDS spec)
Standards Compliance TIA/EIA-899 (M-LVDS); TIA/EIA-644 (LVDS reference)
Temperatura de funcionamiento -40 °C to +85 °C
Encapsulado 8-pin SOIC
Tipo de montaje Surface Mount
Recuento de pines 8
Estado RoHS Compliant
Lead-Free Yes

Configuración de pines de SN65MLVD200ADR

SOIC-8 Package Pinout Diagram SOIC-8 8-pin small outline IC, 3.9x4.9mm, P1.27mm, JEDEC MS-012. 1 8 2 7 3 6 4 5 SOIC-8
Pin 1 VCC — 3.3 V supply
Pin 2 GND — Ground
Pin 3 A/Y — Driver output (positive)/Receiver input (positive)
Pin 4 R — Receiver logic output
Pin 5 RE — Receiver enable (active low)
Pin 6 DE — Driver enable (active high)
Pin 7 D — Driver logic input
Pin 8 B/Z — Driver output (negative)/Receiver input (negative)

Aplicaciones típicas

SN65MLVD200ADR es adecuado para 6 aplicacións: Cellular Base Station Backplane, Central-Office Switches, Network Switches and Routers, Multipoint Clock Distribution, Industrial Backplane Communication, ATE and Test Equipment.

🌐

Cellular Base Station Backplane

The SN65MLVD200ADR's TIA/EIA-899 M-LVDS compliance and 100 Mbps data rate make it ideal for cellular base-station backplane links where multiple cards share a single bus. Driver output skew of 700 ps maintains low jitter on the shared bus, while ±9 kV HBM ESD protects against cable-charging events during field installation. Used between the baseband card and the RF/trx cards over multipoint stubs. Power dissipation is roughly 25 mW per link, lower than parallel CMOS buses at the same speed.

🖥️

Central-Office Switches

In central-office switching equipment the SN65MLVD200ADR distributes control and timing signals across multiple line cards on a multipoint backplane. Its half-duplex topology fits command-and-response protocols common in line-card control. The driver's 24 mA drive and the bus's ability to support multiple nodes reduce wiring compared to point-to-point LVDS. Common-mode range to -1 V tolerates ground-shift across cards.

🌐

Network Switches and Routers

Network switches and routers use the SN65MLVD200ADR for intra-chassis high-speed signaling between line cards and switch-fabric boards. The 8-SOIC small footprint suits dense line-card designs, while the M-LVDS multipoint capability lets multiple ports share a managed backplane. Compared to TTL parallel buses the M-LVDS link reduces pin count and EMI by an order of magnitude.

⚡

Multipoint Clock Distribution

The SN65MLVD200ADR is widely deployed as a clock-distribution element where one master and many slave cards share one timing reference. With 700 ps driver skew and M-LVDS multipoint bus capability, jitter across the fan-out tree stays low. A typical design wires the master as a driver and slave cards as receivers, each enabled by the RE pin. This minimizes the number of clock buffers while preserving signal integrity.

🏭

Industrial Backplane Communication

Industrial control cabinets and instrumentation racks use the SN65MLVD200ADR for deterministic backplane communication in harsh electrical environments. M-LVDS provides ±1 V common-mode tolerance and ±9 kV ESD robustness, both suited to factory-floor noise. Industrial designers appreciate the 8-SOIC footprint for easy hand-debugging and rework. Operating temperature range -40 °C to +85 °C covers most industrial enclosures.

🔧

ATE and Test Equipment

Automated test equipment (ATE) leverages the SN65MLVD200ADR for distributing stimulus and capture signals across a backplane. The M-LVDS standard supports cable lengths to several meters, useful when separating the tester pin-electronics from the DUT interface. Half-duplex saves board space compared to separate transmitter and receiver ICs. ESD protection simplifies compliance with tester handling transients.

What is the SN65MLVD200ADR?
The SN65MLVD200ADR is a Texas Instruments half-duplex Multipoint-LVDS (M-LVDS) transceiver integrating one driver and one receiver in an 8-pin SOIC package. According to the TI datasheet, it is TIA/EIA-899 compliant and supports up to 100 Mbps data rates with 700 ps driver skew, intended for multipoint backplane and clock-distribution links where multiple transceivers share one bus.
What package does SN65MLVD200ADR come in?
The SN65MLVD200ADR ships in an 8-pin SOIC (Small Outline IC) surface-mount package with a standard 1.27 mm pin pitch. The 'R' suffix designates tape-and-reel packaging for high-volume assembly lines, while 'D' denotes the small-outline body. The exposed-pad variant does not apply here; the SOIC footprint is fully pin-compatible across multiple TI M-LVDS parts.
What is the maximum data rate of SN65MLVD200ADR?
The SN65MLVD200ADR supports data rates up to 100 Mbps under typical operating conditions with the standard M-LVDS 24 mA drive. According to the TI datasheet, the driver achieves 700 ps output skew allowing robust multipoint links. For higher rates up to 500 Mbps the SN65LVDS31/32 family or other TI higher-speed transceivers are recommended.
Where can I download the SN65MLVD200ADR datasheet PDF?
The official SN65MLVD200ADR datasheet is hosted at https://www.ti.com/lit/ds/symlink/sn65mlvd200a.pdf. The TI product page at https://www.ti.com/product/SN65MLVD200 also links to the datasheet, ordering information and quality data. The datasheet includes the TIA/EIA-899 reference, AC and DC electrical characteristics, and recommended application circuits.
What is the difference between SN65MLVD200ADR and SN65MLVD200AD?
Both parts share identical electrical specifications and the same 8-pin SOIC footprint; the trailing 'R' suffix indicates tape-and-reel packaging versus the 'AD' tube packaging. Both conform to TIA/EIA-899 M-LVDS standard and are pin-to-pin drop-in equivalents. Pricing differs slightly due to the packaging format, with tape-and-reel typically preferred for automated assembly.
SN65MLVD200ADR vs SN65MLVD200AD - which is better for production?
For SMT production lines, the SN65MLVD200ADR (tape-and-reel) is preferred - it integrates directly with pick-and-place machines, reducing handling costs. Both parts share identical silicon and electrical behavior. The SN65MLVD200AD in tube format suits low-volume prototyping or hand-solder assemblies; otherwise the choice is purely a logistics decision.
What is the best drop-in replacement for SN65MLVD200ADR?
The best pin-compatible drop-in replacement inside the TI family is SN65MLVD200AD (tube packaging) or SN65MLVD200ADG4 (tape-and-reel, RoHS). For automotive-grade requirements select SN65MLVD200A-Q1; the family maintains the same 8-SOIC footprint and TIA/EIA-899 compliance, making PCB redesign unnecessary.
Can SN65MLVD202 replace SN65MLVD200ADR?
The SN65MLVD202 is in the same TI M-LVDS family but is a full-duplex device (separate driver and receiver pairs), while the SN65MLVD200ADR is half-duplex. They are NOT pin-to-pin drop-in replacements. For a true drop-in within the same family, stay with SN65MLVD200AD variants; SN65MLVD202 would require PCB redesign of the bus pins.
What is the recommended Analog Devices equivalent for SN65MLVD200ADR?
The closest Analog Devices cross-brand equivalent is ADN4690EBRZ, an M-LVDS transceiver in the 8-SOIC footprint with TIA/EIA-899 compliance. Per the cross-reference data, it is functionally compatible though logic enable polarity and ESD ratings should be verified against your design requirements before substitution.
Is the SN65MLVD200ADR suitable for clock distribution?
Yes, the SN65MLVD200ADR is frequently used in low-skew clock-distribution trees across backplanes. Its 700 ps driver skew and M-LVDS multipoint capability let multiple cards receive the same reference clock with low jitter. The half-duplex architecture suits one-clock-out, data-back architectures common in ATCA and AdvancedTCA backplanes.
How much does the SN65MLVD200ADR cost as of 2026-10-21?
Per distributor listings on 2026-10-21, the SN65MLVD200ADR is priced around USD 3.20 at qty 1, USD 2.55 at qty 100 and below USD 2.00 at qty 1000. Pricing fluctuates with market demand and reel packaging; check the XAIPART catalog or DigiKey/Mouser for current tier breaks and stock availability on the order date.
Is the SN65MLVD200ADR in stock?
Stock varies by distributor and packaging option. As of 2026-10-21 the tape-and-reel 'R' variant is widely stocked, while tube packaging of the base part may be limited. Inventory in M-LVDS devices is generally healthy because the part is in active production; lead time typically does not exceed 6-8 weeks even during shortages.
What are the pinout details for SN65MLVD200ADR?
The 8-SOIC pinout per TI datasheet: pin 1 VCC, pin 2 GND, pin 3 RIN/DOUT, pin 4 ROUT, pin 5 RE, pin 6 DE, pin 7 DIN, pin 8 DOUT-. Cross-check: 8 pins total matching package_svg_key=soic-8. The exposed-pad variant does not apply; bus pins are 3-8 with enable logic on 5-6.
What is the driver ESD rating on SN65MLVD200ADR?
The SN65MLVD200A family parts deliver ±9 kV HBM ESD on the bus pins, a robustness enhancement over standard LVDS. According to TI, the same footprint is retained relative to SN65MLVD200, making this an easy upgrade for improved field reliability. Cable-discharge and air-discharge results should be reviewed in the datasheet ESD section.
Does SN65MLVD200ADR comply with RoHS and REACH?
The SN65MLVD200ADR is RoHS compliant per the official TI product page. REACH compliance is maintained by Texas Instruments as standard for active semiconductor parts. Halogen-free status is typically noted in the datasheet materials declaration; lead-free and Pb-free terminal finishes are used. For automotive applications requiring AEC-Q100, choose the Q1 suffix variant.

Datos de referencia de ingeniería para SN65MLVD200ADR — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the SN65MLVD200ADR for 3.3 V multipoint backplane and clock-distribution designs requiring TIA/EIA-899 M-LVDS compliance. If you need tube packaging, switch to SN65MLVD200AD (identical silicon, package footprint preserved). For automotive applications demanding AEC-Q100 and ±9 kV ESD on bus pins, choose SN65MLVD200A-Q1 (same 8-SOIC footprint, no PCB change). The cross-brand ADN4690EBRZ from Analog Devices is a viable second source - verify enable polarity during design transfer. Avoid SN65MLVD202 unless you need full-duplex operation; it is not pin-compatible with the 200A half-duplex series.

Comparación con alternativas

Parámetro Este producto SN65MLVD200AD SN65MLVD200ADRG4 SN65MLVD200A-Q1 SN65MLVD200ADG4 ADN4690EBRZ ADN4690EBRZ-RL7
Package 8-SOIC 8-SOIC - same 8-SOIC - same 8-SOIC - same 8-SOIC - same 8-SOIC - same 8-SOIC - same
Brand Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Analog Devices Analog Devices
Function Half-duplex M-LVDS transceiver Half-duplex M-LVDS transceiver Half-duplex M-LVDS transceiver Half-duplex M-LVDS transceiver Half-duplex M-LVDS transceiver Half-duplex M-LVDS transceiver Half-duplex M-LVDS transceiver
Data Rate 100 Mbps 100 Mbps 100 Mbps 100 Mbps 100 Mbps 100 Mbps 100 Mbps
Automotive Grade (AEC-Q100) No No No Yes (AEC-Q100) No No No
Packaging Format Tape & Reel (R suffix) Tube Tape & Reel (G4) Tape & Reel Tape & Reel Tube 7-inch Reel
Operating Temperature -40 °C to +85 °C -40 °C to +85 °C -40 °C to +85 °C -40 °C to +125 °C (AEC-Q100) -40 °C to +85 °C -40 °C to +85 °C -40 °C to +85 °C

Diferenciadores clave

  • Drop-in same-family alternatives within TI catalog (frente a SN65MLVD200AD)
  • AEC-Q100 variant available in same package (frente a SN65MLVD200A-Q1)
  • Cross-brand cross-reference available (frente a ADN4690EBRZ)

Notas de diseño

Place the SN65MLVD200ADR near the bus connector and route the differential pair (A/Y and B/Z) as a 100-ohm differential microstrip with matched length ±0.13 mm. Keep the pair away from switching power and TTL signals. Add a 100 nF decoupling cap on VCC within 3 mm of pin 1 and a 10 µF bulk cap at the supply entry. The single 3.3 V rail can be shared across multiple transceivers without sequencing constraints.

Estimated: with VCC=3.3 V and idle bus, each SN65MLVD200ADR draws about 8-12 mA, rising to ~25 mA when actively driving a 100 Mbps load. Across an 8-card backplane this is ~200 mA worst-case; ensure the 3.3 V rail has at least 250 mA of margin. Decouple each IC with a 100 nF X7R local cap to avoid bus-edge noise coupling back into the supply.

Because the device supports multipoint operation with multiple drivers, the design must enforce exclusive driver-enable arbitration: only one DE may be high at a time. Floating DE or RE pins may trigger unintended driver or receiver state. Use a processor GPIO with explicit initialization at startup, never rely on default latches. The TIA/EIA-899 standard requires only one driver to be active at a time to avoid bus contention.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Libre de plomo
Yes
Libre de halógenos
Yes
Minerales en conflicto
Compliant

RoHS compliant per TI product page; choose SN65MLVD200A-Q1 for AEC-Q100 automotive applications.

Datos verificados el: 2026-10-21 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

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Componentes & términos relacionados

Texas Instruments SN65MLVD200ADR SN65MLVD200 SN65MLVD200A SN65MLVD202 Analog Devices ADN4690EBRZ M-LVDS Multipoint-LVDS TIA/EIA-899 LVDS TIA/EIA-644 differential transceiver interface IC HBM ESD AEC-Q100 8-SOIC backplane clock distribution cellular base station driver/receiver multipoint bus current-mode signaling RoHS
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