SPC5748GHK0AMMN6 - 32-Bit Tri-Core MCU 6MB Flash | NXP
N.º de pieza: SPC5748GHK0AMMN6 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $48.65 | $48,65 |
| 10 | $44.2 | $442,00 |
| 100 | $39.85 | $3.985,00 |
| 500 | $36.1 | $18.050,00 |
| 1.000 | $32.5 | $32.500,00 |
SPC5748GHK0AMMN6 Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (RAM), and peripheral interfaces (CAN, LIN, SPI, timers, ADCs) into one package. In the hierarchy of embedded systems, MCUs sit below microprocessors in raw compute power but above discrete logic in integration density. Within the automotive electronics stack, 32-bit MCUs like the SPC5748GHK0AMMN6 serve as the central processing hub for body control modules, where deterministic real-time response, functional safety, and cryptographic integrity are mandatory.
Key features of the SPC5748GHK0AMMN6 include three Power Architecture cores (2x e200z4 + 1x e200z2) for lockstep operation, 6MB embedded Flash with ECC, 768KB SRAM, hardware security module (HSM) for secure boot and cryptographic acceleration, multiple CAN-FD and LIN interfaces, dual 12-bit ADCs, and an integrated voltage regulator. The 324 MAPBGA package provides high pin density for the parallel external bus, multiple serial interfaces, and ADC channels.
The architecture combines lockstep cores for fault detection with a separate peripheral management core, enabling ISO 26262 ASIL-B/D capable designs without external watchdog supervision. The 160MHz maximum frequency is split between two lockstep domains (80MHz each) for the safety-critical tasks and one application-domain core.
Typical applications include automotive body control modules, central gateway ECUs, instrument clusters, industrial PLCs, and secure IoT edge nodes. The device is also used in chassis domain controllers and ADAS sensor fusion preprocessing where functional safety and security converge.
Designers should pair this MCU with an external CAN-FD transceiver, an automotive-grade voltage regulator (such as NXP's TJA series), and external watchdog or supervisor logic when targeting ASIL-D. Boot configuration straps and debug port access must follow NXP's reference manual to enable secure boot and JTAG locking in production.
This page synthesizes distributor pricing, drop-in alternatives from the same MPC574xB/C/G family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para SPC5748GHK0AMMN6 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
SPC5746CCMK0AMMN6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SPC5747CCMK0AMMN6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SPC5748GGK0AMMN6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC5748GCMMN6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SPC5744PGK0AMMN6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SPC5745SGK0AMMN6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SPC5748GHK0AMMN6 Valores máximos y características eléctricas
| Core Architecture | Power Architecture e200z |
| Number of Cores | 3 (2x e200z4 + 1x e200z2) |
| Maximum Core Frequency | 160 MHz (z4) / 80 MHz (z2) |
| Program Memory Type | Flash |
| Program Memory Size | 6 MB (6M x 8) |
| RAM Size | 768 KB |
| Rango de temperatura de funcionamiento | -40C to +125C (automotive grade) |
| Package Type | MAPBGA-324 |
| Package Dimensions | 19 mm x 19 mm |
| Tipo de montaje | Surface Mount |
| Hardware Security Module | Yes (secure boot, crypto) |
| CAN Interfaces | Multiple CAN-FD controllers |
| ADC Resolution | 12-bit |
| Functional Safety | ISO 26262 capable |
| Estado RoHS | Compliant |
Configuración de pines de SPC5748GHK0AMMN6
| Pin A1 | VDD_HV — High-voltage supply input (5V/3.3V domain) |
| Pin B5 | GND — Ground reference |
| Pin C12 | CAN0_TX — CAN-FD channel 0 transmit |
| Pin D14 | CAN0_RX — CAN-FD channel 0 receive |
| Pin E3 | RESET_b — External reset input (active low) |
| Pin F8 | JTAG_TDI — JTAG test data in |
| Pin G10 | JTAG_TDO — JTAG test data out |
| Pin H15 | ADC0_AN0 — 12-bit ADC channel 0 input |
| Pin J2 | XTAL_IN — Crystal oscillator input |
| Pin K18 | GPIO_101 — General purpose I/O |
Aplicaciones típicas
SPC5748GHK0AMMN6 es adecuado para 6 aplicacións: Automotive Central Body Control Module, Central Gateway ECU, Industrial Functional Safety PLC, ADAS Sensor Fusion Preprocessor, Secure IoT Edge Node, Instrument Cluster Controller.
Automotive Central Body Control Module
The SPC5748GHK0AMMN6 is a natural fit for central body control modules (BCM) because of its 6MB Flash, dual lockstep e200z4 cores, and 768KB SRAM that can host the full AUTOSAR RTE plus body control firmware. The HSM enables secure OTA updates, while the multiple CAN-FD channels aggregate body domain messages without an external transceiver matrix. The 324 MAPBGA package fits the typical BCM PCB form factor, and the -40C to +125C operating range handles under-hood thermal stress.
Recomendado
Central Gateway ECU
For central gateway ECUs, the SPC5748GHK0AMMN6's tri-core architecture routes Ethernet-CAN-LIN traffic with deterministic latency while the lockstep cores satisfy ISO 26262 ASIL-B requirements. The 6MB Flash accommodates full AUTOSAR stacks, UDS diagnostics, and routing tables; the 768KB SRAM buffers message frames without external memory. Multiple CAN-FD controllers aggregate chassis, powertrain, and body domains into one node.
Recomendado
Industrial Functional Safety PLC
In industrial PLC and safety controller applications, the SPC5748GHK0AMMN6 provides lockstep dual-core processing for IEC 61508 SIL-2/3 designs without external supervisor ICs. The 160MHz performance class supports real-time ladder logic and motion control loops, while the HSM protects firmware IP and configuration data. The 324 MAPBGA package enables high-density PCB layouts for compact DIN-rail mounted safety controllers.
Recomendado
ADAS Sensor Fusion Preprocessor
As an ADAS sensor fusion preprocessor, the SPC5748GHK0AMMN6 aggregates radar and camera data before forwarding to the main perception processor. The dual lockstep e200z4 cores at 160MHz run radar FFT and object tracking algorithms with safety redundancy, while the e200z2 core manages housekeeping and CAN-FD traffic. The 6MB Flash holds radar DSP libraries and calibration data without external storage.
Recomendado
Secure IoT Edge Node
For secure IoT edge nodes in industrial settings, the SPC5748GHK0AMMN6 integrates cryptographic acceleration, secure boot, and OTA update support on-chip via the HSM, eliminating the need for an external secure element. The 768KB SRAM buffers TLS handshake material and message queues, while multiple CAN and LIN interfaces aggregate fieldbus traffic. The automotive-grade temperature range suits outdoor deployments in harsh environments.
Recomendado
Instrument Cluster Controller
The SPC5748GHK0AMMN6 drives automotive instrument clusters by rendering graphics and managing driver display content over LVDS or RGB. The dual lockstep cores handle safety-critical telltale indicators with ASIL-B redundancy, while the 768KB SRAM holds display framebuffers. The 324 MAPBGA package and CAN-FD connectivity integrate cleanly into digital cockpit architectures with a separate applications processor.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para SPC5748GHK0AMMN6 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | SPC5746CCMK0AMMN6 | SPC5747CCMK0AMMN6 | SPC5748GGK0AMMN6 | MPC5748GCMMN6 | SPC5744PGK0AMMN6 | SPC5745SGK0AMMN6 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | MAPBGA-324 (19x19mm) | MAPBGA-324 - same | MAPBGA-324 - same | MAPBGA-324 - same | MAPBGA-324 - same | MAPBGA-324 - same | MAPBGA-324 - same |
| Flash Size | 6 MB | 4 MB (-33%) | 5 MB (-17%) | 6 MB (identical) | 6 MB (identical) | 3 MB (-50%) | 4 MB (-33%) |
| RAM Size | 768 KB | 768 KB | 768 KB | 768 KB | 768 KB | 384 KB (-50%) | 512 KB (-33%) |
| Core Architecture | 2x e200z4 + 1x e200z2 | 2x e200z4 + 1x e200z2 | 2x e200z4 + 1x e200z2 | 2x e200z4 + 1x e200z2 | 2x e200z4 + 1x e200z2 | 2x e200z4 + 1x e200z2 | 2x e200z4 + 1x e200z2 |
| Max Frequency | 160 MHz / 80 MHz | 160 MHz / 80 MHz | 160 MHz / 80 MHz | 160 MHz / 80 MHz | 160 MHz / 80 MHz | 120 MHz / 60 MHz (-25%) | 160 MHz / 80 MHz |
| Hardware Security Module | Yes | Yes | Yes | Yes | Yes | Optional | Yes |
| Functional Safety | ASIL-B/D (ISO 26262) | ASIL-B/D | ASIL-B/D | ASIL-B/D | ASIL-B/D | ASIL-B | ASIL-B/D |
Diferenciadores clave
- Highest Flash density in the MPC574x family at 6MB (frente a SPC5746CCMK0AMMN6)
- Full 768KB SRAM vs reduced RAM on lower-tier variants (frente a SPC5744PGK0AMMN6)
- Tri-core lockstep with full HSM support (frente a SPC5744PGK0AMMN6)
Notas de diseño
The SPC5748GHK0AMMN6 requires a stable 5V or 3.3V supply on VDD_HV pins with bulk decoupling of at least 10uF ceramic plus 100nF high-frequency bypass near each VDD pin group. NXP's reference designs recommend a separate LDO for the ADC analog supply to achieve 12-bit ADC accuracy. Failure to follow decoupling guidance can cause Flash programming failures and ADC noise pickup.
Estimated: At maximum core activity with all three cores at 160MHz, package dissipation may reach 1.5-2W. The 19x19mm MAPBGA package has a thermal resistance of approximately 20-25 C/W on a 4-layer JEDEC test board. For continuous full-load operation, design the PCB with a thermal via array under the exposed die pad and at least 2oz copper on outer layers to keep junction temperature below 150C.
Route the external memory bus (if used) with matched-length traces and keep the crystal oscillator traces shorter than 10mm with ground guard rings. Place the JTAG header at the PCB edge to enable boundary-scan debugging. Maintain at least 4 vias under the BGA thermal pad for proper heat spreading; missing vias cause thermal runaway during Flash programming cycles.
Common design pitfalls include omitting the external watchdog, leaving the HSM disabled in production firmware (which prevents secure boot), and mis-wiring the boot configuration straps. Always validate boot mode selection with NXP's BSDL files before first prototype bring-up. Lock the JTAG port in production via the HSM to prevent unauthorized firmware extraction.
Información de cumplimiento
Automotive grade qualified per NXP product page. AEC-Q100 qualified based on automotive temperature grade -40C to +125C and family datasheet.
