STM32H745IIK6 - Dual-Core M7+M4 MCU 2MB Flash UFBGA-176 | STMicroelectronics
N.º de pieza: STM32H745IIK6 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $17.2 | $172,00 |
| 100 | $15.4 | $1.540,00 |
| 500 | $13.8 | $6.900,00 |
| 1.000 | $12.6 | $12.600,00 |
STM32H745IIK6 Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (RAM), and a rich set of peripherals into one package. Within the broader taxonomy, the STM32H745IIK6 belongs to the hierarchy: microcontroller -> embedded processor -> integrated circuit -> semiconductor. Dual-core MCUs are a specialized sub-category that combines a high-performance core with a real-time or DSP-capable core to split application-defined tasks, allowing real-time control and DSP/HMI layers to run independently on the same silicon.
Key features include a built-in SMPS step-down converter for low-power operation, 46 communication and analog interfaces (UART/USART, SPI, I2C, CAN, USB, Ethernet, SDMMC), three 16-bit ADCs, two DACs, and an integrated TFT-LCD controller. The device also embeds a Chrom-ART graphics accelerator, an MMU for Linux-style OS support, and AES-256 plus two SAI audio interfaces, targeting HMI, motor control, and audio applications.
The Cortex-M7 core delivers 1320 CoreMark / 2400 DMIPS while the Cortex-M4 handles up to 600 CoreMark / 300 DMIPS, with both cores sharing internal SRAM and peripherals through a multi-AHB bus matrix. This asymmetric architecture lets developers run an RTOS on one core while running DSP or graphics on the other.
Typical applications include industrial HMI panels with TFT-LCD, motor control and field-oriented control (FOC) drives, audio processing products, IoT gateways, point-of-sale terminals, and smart appliances. Designers usually pair this MCU with external SDRAM, a TFT-LCD panel, and isolated CAN/RS-485 transceivers. The built-in SMPS makes it especially suitable for USB-powered and battery-operated systems.
When designing with this MCU, distribute the UFBGA-176 ball escape carefully across at least 4 PCB layers with a dedicated ground/power plane, and ensure the SMPS external LC filter follows the datasheet reference layout within 5 mm of the VCORE/VDD pins. The internal regulator and backup domain require a 1 µF plus 100 nF decoupling combination on each supply pin for stable operation.
Alternativas directas para STM32H745IIK6 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con STM32H745IIK6 (mismo factor de forma y huella) — difiere en ADC, Package, DAC, Communication Interfaces, Core Architecture.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
STM32H755IIK6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
STM32H743IIK6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
STM32H742IIK6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
STM32H725IGK6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
STM32H735IGK6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
STM32H745IIK6 Valores máximos y características eléctricas
| Core Architecture | Dual-core Arm Cortex-M7 (480 MHz) + Cortex-M4 (240 MHz) |
| Flash Memory | 2 MB (dual-bank, 2M x 8) |
| SRAM | 1 MB |
| Backup SRAM | 4 KB |
| Encapsulado | 176+25 UFBGA (10x10 mm) |
| Tensión de alimentación | 1.62 V to 3.6 V |
| Temperatura de funcionamiento | -40 C to +85 C |
| Communication Interfaces | 46 (UART, SPI, I2C, CAN, USB, Ethernet, SDMMC) |
| ADC | 3 x 16-bit |
| DAC | 2 x 12-bit |
| On-chip SMPS | Yes (step-down for VCORE) |
| Graphics Accelerator | Chrom-ART |
| External Memory Controller | Yes (SDRAM/NOR/NAND/CompactFlash) |
| TFT-LCD Interface | Yes |
| AES Hardware | AES-256 |
| Tipo de montaje | Surface Mount (UFBGA) |
Guía de configuración de pines de STM32H745IIK6 176+25 ufbga (10x10 mm)
Configuración de pines para STM32H745IIK6 (encapsulado 176+25 ufbga (10x10 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para STM32H745IIK6.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
STM32H745IIK6 es adecuado para 6 aplicacións: Industrial HMI with TFT-LCD, Motor Control and FOC Drives, Audio Processing Products, IoT Gateways and Edge Devices, Point-of-Sale and Payment Terminals, Smart Appliances and White Goods.
Industrial HMI with TFT-LCD
The STM32H745IIK6 drives industrial human-machine interfaces (HMI) with color TFT-LCDs up to XGA. The Cortex-M7 runs the TouchGFX/LVGL GUI stack at 480 MHz while the Cortex-M4 executes real-time control tasks like Modbus, CANopen, and EtherCAT slave protocols. The integrated Chrom-ART accelerator offloads 2D rendering, the TFT-LCD controller supports up to 1024x768 with double-buffered SDRAM, and the 1 MB SRAM holds framebuffers and application stacks. Pair the MCU with external SDRAM (e.g. 16MB AS4C16M32) and an FT813-style graphics controller if higher resolutions are needed.
Recomendado
Motor Control and FOC Drives
The STM32H745IIK6 is well suited for field-oriented control (FOC) of PMSM, BLDC, and induction motors up to several kW. The Cortex-M7 executes the 10-20 kHz current loop with hardware FPU and DSP extensions, while the Cortex-M4 runs the slower speed/torque loop and CAN/RS-485 supervisory communication. Three 16-bit ADCs sample phase currents simultaneously with hardware trigger from advanced timers, and the dedicated timer channels generate center-aligned PWM with 1 ns resolution. Designers add external gate drivers (e.g. STGAP1AS) and a CAN transceiver (e.g. SN65HVD230) to complete the drive stage.
Recomendado
Audio Processing Products
The STM32H745IIK6's two SAI audio interfaces and dual-core architecture make it suitable for digital mixers, audio effects processors, and professional audio interfaces. The Cortex-M7 runs audio codecs (MP3, AAC, Opus) and DSP filters with double-precision floating-point, while the Cortex-M4 handles USB Audio Class 2.0 device enumeration and MIDI/HID input processing. The two SAI blocks support up to 8 input and 8 output channels at 192 kHz / 32-bit, enabling multi-channel audio routing.
Recomendado
IoT Gateways and Edge Devices
The STM32H745IIK6 functions as an IoT gateway aggregator combining Ethernet, Wi-Fi, and Sub-GHz wireless interfaces. The Cortex-M4 handles the network stack (LwIP TCP/IP, MQTT-SN, Thread) and security (TLS 1.3, hardware AES-256), while the Cortex-M7 runs edge inference for sensor data using CMSIS-NN. The on-chip SMPS improves efficiency for battery or PoE-powered deployments, and 1 MB SRAM buffers sensor data before cloud upload.
Recomendado
Point-of-Sale and Payment Terminals
POS and payment terminals leverage the STM32H745IIK6 dual-core architecture to separate secure transaction processing on the Cortex-M4 (with hardware AES-256 and secure boot) from the GUI rendering on the Cortex-M7. The integrated TFT-LCD controller drives the customer-facing display, while USB host and SD card interfaces handle printer and storage. Designers typically pair it with an external secure element (e.g. STSAFE-A110) and a thermal printer controller.
Recomendado
Smart Appliances and White Goods
The STM32H745IIK6 powers smart appliances like induction cookers, washing machines, and HVAC controllers. The Cortex-M7 handles the TFT touch UI and Wi-Fi/Ethernet connectivity, while the Cortex-M4 runs motor control loops, temperature regulation, and safety monitoring in real time. The integrated SMPS reduces BOM cost and improves standby efficiency (under 50 µA standby current with RTC retention), which is critical for ENERGY STAR-compliant products.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para STM32H745IIK6 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | STM32H755IIK6 | STM32H743IIK6 | STM32H742IIK6 | STM32H725IGK6 | STM32H735IGK6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | UFBGA-176 (10x10 mm) | UFBGA-176 (10x10 mm) - same | UFBGA-176 (10x10 mm) - same | UFBGA-176 (10x10 mm) - same | UFBGA-176 - same | UFBGA-176 - same |
| Core Architecture | Dual M7 (480 MHz) + M4 (240 MHz) | Dual M7 (480 MHz) + M4 (240 MHz) | Single M7 (480 MHz) | Single M7 (480 MHz) | Single M7 (550 MHz) | Single M7 (550 MHz) |
| Flash Memory | 2 MB | 2 MB | 2 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 1 MB | 1 MB | 1 MB | 1 MB | 564 KB | 564 KB |
| On-chip SMPS | Yes | Yes | Yes | Yes | Yes | Yes |
| AES Hardware | AES-256 | AES-256 | AES-256 | AES-256 | AES-256 | AES-256 + PKA |
| Unit Price (qty 1, USD) | 18.50 | 19.50 | 16.20 | 15.40 | 14.00 | 14.80 |
Diferenciadores clave
- True dual-core M7+M4 asymmetric architecture (frente a STM32H743IIK6)
- 2 MB dual-bank Flash with read-while-write support (frente a STM32H742IIK6)
- Integrated SMPS with 50 µA standby efficiency (frente a STM32H735IGK6)
Notas de diseño
The 176+25 UFBGA package at 0.65 mm pitch requires HDI PCB with microvia-in-pad technology. Use a 4-layer stack-up with a dedicated ground plane directly under the BGA and a 1 oz copper power plane. Per ST design guidelines, route all BGA signals out using dog-bone fan-out on the top layer with microvias, and escape the inner rows on layers 2 and 3. Maintain 50 ohm controlled impedance for high-speed signals (SDRAM clock, SDMMC, USB).
The integrated SMPS regulator requires a 4.7 µH inductor and 4.7 µF X5R ceramic capacitors on the SMPS_FB and SMPS_SW pins, placed within 5 mm of the MCU. Add a 100 nF decoupling capacitor on every VDDA, VDD, and VDDLDO pin. The VCORE domain can draw up to 200 mA transient at 480 MHz; ensure the SMPS external LC filter matches ST's recommended reference design to avoid core voltage droop during core activity.
Estimated: when migrating firmware from the single-core STM32H743 to the dual-core STM32H745, the unused M4 core must be held in reset or explicitly started in the bootloader - otherwise the M7 may stall waiting for the M4 handshake. Also, the LDO_DIS pin must be tied to VDD if the SMPS is not used, otherwise both regulators fight and current consumption doubles. The backup domain VBAT pin requires a 1 µF decoupling even if unused.
At 480 MHz on the Cortex-M7 with both cores active, the UFBGA-176 package dissipates approximately 0.5-0.8 W depending on peripheral usage. The 25-ball thermal pad array on the package bottom must be soldered to a 10x10 mm copper pour connected to the ground plane for thermal relief. Estimated theta_JA is approximately 25 C/W on a 4-layer JEDEC test board; without the thermal pad soldered, junction temperature can exceed 125 C with both cores at full load.
Información de cumplimiento
RoHS and REACH compliant per ST product page. Industrial-grade temperature range -40 C to +85 C; AEC-Q100 qualified automotive variants are not available in this exact part number. Industrial control and consumer applications are the primary use cases.
