STM32H750XBH6U - 480MHz 128KB MCU | STMicroelectronics
N.º de pieza: STM32H750XBH6U ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $7.9992 | $8,00 |
| 10 | $7.9992 | $79,99 |
| 100 | $7.9992 | $799,92 |
| 500 | $7.9992 | $3.999,60 |
| 1.000 | $7.9992 | $7.999,20 |
STM32H750XBH6U Descripción general
A microcontroller is an embedded semiconductor that integrates a processor core, memory, peripherals, and communication interfaces on one device. The STM32H7 family belongs to the Arm Cortex-M microcontroller hierarchy and combines real-time control capability with substantial data-processing throughput. This product is therefore positioned between a conventional embedded control MCU and a higher-performance Cortex-M7 system for control, communications, graphics, and signal-processing workloads.
The verified listing identifies an Arm Cortex-M7 processor, 32-bit architecture, 480MHz maximum frequency, 128KB flash, and a 265-TFBGA package. The cross-reference data also describes 1MB RAM and 46 communication and analog interfaces, but these values were not explicitly tied to the complete STM32H750XBH6U manufacturer record and are therefore treated cautiously. The device's high-frequency Arm Cortex-M7 core provides substantial processing headroom for interrupt-heavy control, protocol handling, and embedded user-interface logic.
Applications supported by the device class include industrial automation, networking equipment, motor control, test and measurement, human-machine interfaces, and connected embedded systems. At 480MHz, the MCU can process complex state machines and peripheral data faster than lower-frequency general-purpose microcontrollers. Designers must still budget for cache configuration, memory latency, clock-tree setup, thermal behavior, and deterministic peripheral timing rather than interpreting clock speed as the only performance measure.
The BGA package supports dense PCB routing but requires inspection and assembly capability. A 0.5 mm pitch package is mechanically demanding, so fine-pitch assembly, via-in-pad considerations, solder mask definition, and adequate thermal-via distribution should be reviewed before release to manufacturing. The board should also follow the manufacturer's pinout, power, decoupling, clock, and exposed-pad guidance in the official device documentation.
This page consolidates verified distributor pricing, availability, package details, and cross-reference findings. It distinguishes confirmed target-device data from family-level information and avoids treating merely related STM32H7 devices as drop-in replacements. Engineers should use the manufacturer documentation and exact MPN comparison before approving any substitution.
Alternativas directas para STM32H750XBH6U — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con STM32H750XBH6U (mismo factor de forma y huella) — difiere en Package, RAM, Mounting Type, Flash Memory, Architecture.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
STM32H750XBH6
✅ Sustitución directa✓ En stock
$4.95 / unidad
Ver hoja de datos →STM32H743XIH6
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →STM32H753XIH6
✅ Sustitución directa✓ En stock
$13.2 / unidad
Ver hoja de datos →STM32H747XIH6
✅ Sustitución directa✓ En stock
$16.2 / unidad
Ver hoja de datos →STM32G473VEH6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
STM32H750XBH6U Valores máximos y características eléctricas
| Product Type | 32-bit Arm Cortex-M7 microcontroller |
| Processor Core | Arm Cortex-M7 |
| Maximum Frequency | 480 MHz |
| Flash Memory | 128 KB |
| Flash Organization | 128K x 8 bits |
| Encapsulado | 265-TFBGA, 14 mm x 14 mm |
| Ball Count | 240 signal and power balls plus 25 additional balls |
| Architecture | 32-bit |
| Product Series | STM32H7 |
| Tipo de montaje | Surface mount |
| Lead Time | To be confirmed |
| Estado RoHS | unknown |
| REACH Status | unknown |
Guía de configuración de pines de STM32H750XBH6U 265-tfbga, 14 mm x 14 mm
Configuración de pines para STM32H750XBH6U (encapsulado 265-tfbga, 14 mm x 14 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para STM32H750XBH6U.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
STM32H750XBH6U es adecuado para 6 aplicacións: Industrial Automation Controller, Motor Drive and Power Control, Networked Embedded Gateway, Test and Measurement Instrument, Human-Machine Interface Controller, High-Speed Data Acquisition.
Industrial Automation Controller
The STM32H750XBH6U fits demanding industrial-control tasks because its Arm Cortex-M7 core operates up to 480MHz, providing more instruction throughput than ordinary low-frequency control MCUs. That headroom can support state-machine execution, communications, diagnostics, and data preparation without splitting one control function across multiple processors. The 128KB flash capacity must be reconciled carefully against bootloader, firmware, application, and update requirements. In a controller, the MCU would manage inputs, sequencing, communications, and real-time peripherals while the design team validates cache settings, interrupt latency, and memory bandwidth. Its 265-TFBGA package also demands assembly capability well beyond basic through-hole or coarse-pitch SMD construction. Before deployment, confirm the exact pin functions, independent analog and timer requirements, operating temperature, and long-term supply status.
Recomendado
Motor Drive and Power Control
The STM32H750XBH6U is a strong candidate when a motor-control system needs substantial protocol processing alongside deterministic control tasks. Its verified 480MHz Cortex-M7 performance gives designers more compute margin than lower-speed MCUs, potentially accelerating current-loop calculations, parameter management, diagnostics, and communications. The controller still depends on verified PWM, ADC, timer, and fast-I/O functions in the exact ordering code. Firmware must account for cache coherency and predictable interrupt behavior rather than equating nominal clock rate with guaranteed loop latency. Power conversion introduces separate thermal and electrical risks that the MCU package does not solve. Use the exact MPN documentation to validate complementary signals, break inputs, analog synchronization, and fault handling. The fine-pitch TFBGA layout also requires disciplined power delivery and thermal design.
Recomendado
Networked Embedded Gateway
A networking gateway can use the STM32H750XBH6U's 480MHz Cortex-M7 throughput for protocol processing, local data handling, and embedded control in one device. Compared with a low-frequency MCU, the higher clock rate can reduce the headroom consumed by communication stacks and background tasks. The supplied records do not expose the exact Ethernet, USB, or other interface configuration for this MPN, so those capabilities must be verified before interface selection. Firmware architects should partition network, control, and update workloads, then measure worst-case latency and RAM pressure rather than depending on average benchmark results. Flash sizing is a significant constraint because only 128KB is verified for the target, potentially requiring external memory or firmware partitioning. Power sequencing and high-speed signal integrity around the TFBGA should follow the exact manufacturer reference layout.
Recomendado
Test and Measurement Instrument
The STM32H750XBH6U can suit data-acquisition and front-panel processing tasks where a 480MHz Cortex-M7 core handles acquisition control, calculations, and user-interface updates. The increased throughput can benefit filtering, calibration, signal statistics, and protocol formatting while a single MCU coordinates multiple peripherals. Exact ADC performance, sample-rate limits, DAC features, timer resolution, and analog voltage ranges are not supplied for this MPN and must be taken from the official documentation. Precision designs should also separate analog and digital grounding appropriately, account for converter latency, and avoid treating digital processing speed as a substitute for analog accuracy. The 265-TFBGA package requires fine-pitch assembly and inspection, while its power and ground balls need low-impedance distribution. Firmware should use deterministic buffers and DMA where the exact pin and peripheral map support it.
Recomendado
Human-Machine Interface Controller
The STM32H750XBH6U's 480MHz core can manage graphical data preparation, touch and display updates, communications, and application logic in a compact embedded HMI controller. This processing headroom is useful when the interface performs local rendering, logging, or protocol conversion rather than only scanning simple keys and pixels. The 128KB flash figure leaves relatively little internal program space for assets, so designers may need an external memory strategy, optimized assets, or code partitioning. Exact LCD, touch-controller, camera, or USB interface assignments must be verified against the precise ball map because the supplied target record does not include a pin table. Use short DMA-driven transfers, carefully controlled frame buffers, and power-state transitions to preserve responsiveness and energy efficiency. Fine-pitch BGA assembly and signal-integrity review remain essential for high-speed display or camera interfaces.
Recomendado
High-Speed Data Acquisition
The STM32H750XBH6U can act as the control and processing element in a compact acquisition platform because its Arm Cortex-M7 core runs up to 480MHz while operating alongside high-speed converters or digital interfaces. The core can manage data movement, buffer selection, triggering, filtering, and host communication, provided the exact package exposes the required pins and the selected peripherals have adequate throughput. The 128KB flash requirement makes data logging strategy important: streaming to external storage or a communications link is generally more realistic than storing large captures internally. Designers should quantify DMA arbitration, cache effects, buffer latency, and worst-case interrupt load to avoid dropped samples. Analog front-end design remains separate from MCU processing and must account for grounding, reference noise, and input bandwidth. PCB construction and fine-pitch inspection require a controlled manufacturing process.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para STM32H750XBH6U — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | STM32H750XBH6 | STM32H743XIH6 | STM32H753XIH6 | STM32H747XIH6 | STM32G473VEH6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Architecture | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Series | STM32H7 | STM32H7 | STM32H7 | STM32H7 | STM32H7 | STM32G4 |
Diferenciadores clave
- Verified 128KB flash target configuration (frente a STM32H743XIH6)
- Exact U-suffix ordering target (frente a STM32H750XBH6)
- Different performance family from STM32G4 alternatives (frente a STM32G473VEH6)
Notas de diseño
Treat the 265-TFBGA as a fine-pitch assembly constraint. Assign a controlled land pattern only from the exact STM32H750XBH6U package drawing, and verify ball counts against the related 240+25-ball listing. Confirm pad, solder-mask, paste, via, and stencil geometry with the PCB assembler rather than extrapolating from a generic BGA library. Inspection should include X-ray or equivalent process controls for solder joints that cannot be visually inspected from the board side.
Power delivery and clock integrity require a layout review against the exact manufacturer guidance. Place local decoupling close to the appropriate supply and ground balls, use multiple supply and ground connections when prescribed, and avoid routing high-speed signals through power-plane splits. No target-specific voltage, decoupling, or clock values were supplied, so do not invent them. Validate the final stack-up, return paths, and external oscillator arrangement with pre-compliance measurements before volume production.
Do not confuse peak CPU frequency with guaranteed real-time response. At 480MHz, cache state, memory contention, interrupts, DMA, and peripheral synchronization can affect worst-case latency. Build firmware around measured timing budgets, enable only the required memory regions, and stress-test startup, fault handling, and communication bursts. Also do not treat STM32H743XIH6, STM32H753XIH6, STM32H747XIH6, or STM32G473VEH6 as automatic substitutes merely because they are STM32 microcontrollers.
Información de cumplimiento
The supplied target-MPN records do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is marked not applicable because the available data does not identify this part as automotive-qualified.
