STM32H753VIH6 - 480MHz Cortex-M7 2MB Flash 1MB RAM 100-TFBGA MCU | STMicroelectronics
N.º de pieza: STM32H753VIH6 ✓ ActivoSTM32H753VIH6 Descripción general
A microcontroller is an integrated circuit that combines a CPU core, memory and a rich set of peripherals on a single die. The Cortex-M7 core belongs to the Arm Cortex-M family of RISC processors designed for embedded control; it sits in the hierarchy microcontroller -> embedded processor -> RISC core -> semiconductor, and is the highest-performance member of the M-series. STM32 devices combine that core with memory, analog and digital peripherals, and STMicroelectronics supplies the surrounding ecosystem of tools, middleware and reference designs that turns a bare die into a design-ready part.
Key features of the STM32H753VIH6 include the 480 MHz Cortex-M7 core, 2 MB of Flash, 1 MB of RAM, 46 communication and analog interfaces, and integrated cryptographic capability as documented in the manufacturer datasheet. The 100-ball TFBGA package keeps the footprint to 8x8 mm while still exposing high-speed I/O, which suits compact industrial and communications equipment. The device is offered in tray packaging and is listed as an active part.
Technologically, the STM32H753xI family pairs a 32-bit Arm Cortex-M7 RISC core operating up to 480 MHz with large on-chip memory resources and a dense peripheral set. Because Flash and SRAM are integrated on-die, the device supports complex control loops, digital signal processing and network stacks without external memory, and the cryptographic blocks offload security workloads that would otherwise burden the core.
Typical applications include industrial motor and motion control, industrial gateways and communications equipment, professional audio and signal processing, medical instrumentation, and human-machine-interface panels with graphics-capable displays. The wide peripheral complement lets a single device host several communication interfaces simultaneously.
When designing around this part, plan the PCB for a 0.5 mm-pitch ball grid with careful via-in-pad and thermal management, and confirm the ball map in the manufacturer pinout table before assigning signals. Because the package is a fine-pitch BGA, assembly houses should be briefed on the pad design and the X-ray inspection requirement.
This page consolidates manufacturer and distributor technical information, drop-in alternative candidates, parameter-by-parameter comparisons, and practical design notes that are not consolidated in a single manufacturer document, helping engineers shortlist and qualify the part faster.
Alternativas directas para STM32H753VIH6 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con STM32H753VIH6 (mismo factor de forma y huella) — difiere en Core, Flash Memory, Package.
STM32H743VIH6
✅ Sustitución directa ⚠️ Especificaciones sin verificarConsulte el precio
Ver hoja de datos →STM32H7A3VIH6
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
STM32H7B3VIH6
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
STM32H725VGH6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
STM32H735VGH3
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
STM32H723VIH6
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
STM32H753VIH6 Valores máximos y características eléctricas
| Core | Arm Cortex-M7, 32-bit RISC |
| Maximum Core Frequency | 480 MHz |
| Flash Memory | 2 MB (2M x 8) |
| RAM | 1 MB |
| Communication and Analog Interfaces | 46 communication and analog interfaces |
| Cryptographic Capability | Integrated cryptographic accelerators |
| Encapsulado | TFBGA-100, 8x8 mm, 0.5 mm pitch |
| Recuento de pines | 100 balls |
| Tipo de montaje | Surface Mount |
| Packaging | Tray |
| Product Status | Active |
| RoHS | Compliant |
| REACH | Compliant |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.01 |
| AEC-Q100 Qualification | Not qualified |
| Lead-Free | Yes |
Guía de configuración de pines de STM32H753VIH6 tfbga-100, 8x8 mm, 0.5 mm pitch
Configuración de pines para STM32H753VIH6 (encapsulado tfbga-100, 8x8 mm, 0.5 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para STM32H753VIH6.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
STM32H753VIH6 es adecuado para 6 aplicacións: Industrial Motor and Motion Control, Industrial Gateway and Communications Equipment, Professional Audio and Signal Processing, Medical Instrumentation and Diagnostic Equipment, Human-Machine Interface and Graphical Panels, High-Performance Test and Measurement Front Ends.
Industrial Motor and Motion Control
The STM32H753VIH6 is a natural fit for servo drives, stepper controllers and machine-tool axes because the 480 MHz Arm Cortex-M7 core executes current-control and motion loops with very low latency, while the 1 MB of RAM holds multi-axis control state and the 2 MB of Flash stores the motion firmware plus field-upgrade images. The 46 communication and analog interfaces documented in the manufacturer datasheet let one device host encoder inputs, PWM outputs, and CAN/RS-485 links to other axes. In the 8x8 mm 100-ball TFBGA package, it fits compact drive electronics where board area is constrained, and the integrated cryptographic blocks allow secure field upgrades and remote diagnostics.
Recomendado
Industrial Gateway and Communications Equipment
Gateways, protocol converters and data concentrators benefit from the STM32H753VIH6's combination of 2 MB Flash for TLS stacks and firmware plus 1 MB RAM for packet buffering, with the 480 MHz Cortex-M7 core leaving headroom for encryption and compression alongside network traffic. The wide set of 46 communication and analog interfaces supports simultaneously running industrial Ethernet, serial and fieldbus links, so a single device can bridge legacy RS-485 equipment to modern networks. The fine-pitch 100-ball TFBGA footprint keeps the board compact, while the integrated cryptographic capability supports secure remote management and firmware authentication in unattended installations.
Recomendado
Professional Audio and Signal Processing
In professional audio equipment and DSP front ends, the STM32H753VIH6 supplies the real-time processing headroom that audio codecs and mixing engines require: the 480 MHz Cortex-M7 core with FPU handles multi-channel sample-rate conversion, filtering and mixing, and the 1 MB of RAM accommodates large ring buffers without external memory. The 46 communication and analog interfaces allow simultaneous control of multiple codec channels alongside USB, I2S and S/PDIF links. The on-chip cryptographic blocks are useful for DRM and encrypted content delivery, and the compact 8x8 mm TFBGA package suits rack and console form factors where front-panel density matters.
Recomendado
Medical Instrumentation and Diagnostic Equipment
Diagnostic and laboratory instruments need deterministic control plus data integrity, which the STM32H753VIH6 provides through a 480 MHz Cortex-M7 core handling acquisition sequencing, filtering and UI logic, and 2 MB of Flash for algorithms and calibration data. The integrated cryptographic capability supports encrypted data transfer and authenticated firmware, an increasingly common requirement for connected clinical devices. With 46 communication and analog interfaces, the MCU can manage sensor front ends, display updates, isolated serial links and USB connectivity from a single device, and the 8x8 mm 100-ball package allows compact handheld or cart-mounted designs without compromising thermal or routing headroom.
Recomendado
Human-Machine Interface and Graphical Panels
The STM32H753VIH6 suits touch panels and operator interfaces where a responsive graphical update rate matters: the 480 MHz Cortex-M7 core and 1 MB of RAM can drive framebuffer compositing and touch input handling while running the protocol stack behind it. The 2 MB Flash accommodates the application, fonts and assets, and the 46 communication and analog interfaces cover display links, touch controller I2C and the fieldbus used to talk to the machine controller. The 8x8 mm 100-ball TFBGA package keeps the electronics footprint small enough for slim panel electronics, and the integrated crypto blocks enable secure UI configuration and licensed feature activation.
Recomendado
High-Performance Test and Measurement Front Ends
Oscilloscopes, data loggers and protocol analyzers use the STM32H753VIH6 for acquisition crunching and real-time analysis, because the 480 MHz Cortex-M7 core with hardware FPU performs FFT, filtering and trigger logic in real time. The 1 MB of RAM holds capture buffers and the 2 MB Flash stores firmware and calibration tables, while the 46 communication and analog interfaces connect front-end ADCs, displays, storage and remote-control ports. The 8x8 mm 100-ball package lets the processing core sit close to the analog section on a densely routed board, and the crypto capability supports licence protection and secure firmware update over USB or Ethernet.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para STM32H753VIH6 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | STM32H743VIH6 | STM32H7A3VIH6 | STM32H7B3VIH6 | STM32H725VGH6 | STM32H735VGH3 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | TFBGA-100 (8x8 mm) | TFBGA-100 (8x8 mm) - same | TFBGA-100 (8x8 mm) - same | TFBGA-100 (8x8 mm) - same | TFBGA-100 - same class | TFBGA-100 - same class |
| Core | Arm Cortex-M7, 32-bit RISC | Arm Cortex-M7 - same | Arm Cortex-M7 - same | Arm Cortex-M7 - same | Arm Cortex-M7 - same | Arm Cortex-M7 - same |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 512 KB (-75%) | 512 KB (-75%) |
| RoHS / REACH Status | RoHS compliant / REACH compliant | RoHS compliant | RoHS compliant | RoHS compliant | RoHS compliant | RoHS compliant |
Diferenciadores clave
- Full 2 MB Flash with 1 MB RAM on a 100-ball TFBGA (frente a STM32H725VGH6)
- Integrated cryptographic accelerators within the STM32H753xI family (frente a STM32H7A3VIH6)
- Industrial-grade H6 ordering code with 480 MHz Cortex-M7 (frente a STM32H735VGH3)
- Deterministic drop-in path within the same STM32H7 toolchain and ecosystem (frente a GD32 series Cortex-M7 alternatives)
Notas de diseño
The STM32H753VIH6 is a 100-ball TFBGA on a 0.5 mm pitch, so the land pattern must be taken directly from the ball map in the manufacturer datasheet rather than generated from a generic library symbol. Keep the ball map as the source of truth for every net. Provide a continuous ground plane under the device for return-path integrity, route high-speed signals on the top layer with short references to the ground plane, and confirm with the assembly house whether filled via-in-pad is allowed, because solder can wick into 0.5 mm vias and create voiding under the balls.
Estimated: with the device running at 480 MHz and typical H7 application current on the order of 300-400 mA across the core and I/O rails, the total supply power lands in the 0.5-1.5 W range depending on workload and selected SMPS or LDO mode. Estimated junction temperature rise with a 1 W dissipation and a junction-to-ambient resistance in the 30-40 C/W range for a 100-ball TFBGA is approximately 30-40 C, so a via-stitched thermal array under the BGA and copper pour on the opposite layer are needed. Confirm the actual figures against the manufacturer electrical characteristics and your PCB stack-up before committing to the thermal design.
Place the bulk and high-frequency decoupling capacitors on the same side of the board as the BGA and directly adjacent to the corresponding supply balls, with the smallest ceramic closest to the ball. Separate noisy switched-supply routing from analog and communication nets, and keep the on-chip debug and boot pins free of long copper stubs. Because the STM32H7 family supports multiple internal regulator modes, keep the power-supply selection and decoupling values consistent with the mode configured in the option bytes.
The most common mistake is confusing STM32H753VIH6 with the STM32H753VIT6: one is a 100-ball TFBGA and the other is an LQFP-100, so the footprints, paste stencils and assembly processes are not interchangeable even though the device functions are similar. A second pitfall is ordering the -H6 industrial-grade variant when the -G3 temperature grade is required by the end application. Record the exact ordering code in the BOM, and verify the ball map and the option-byte configuration (boot mode, regulator mode, clock tree) against the manufacturer datasheet before releasing the design.
Información de cumplimiento
RoHS and REACH compliance, ECCN 5A992.C, HTS 8542.31.00.01, active part lifecycle code. AEC-Q100 automotive qualification is not stated for this part; halogen-free and conflict-minerals declarations are not listed for this device.
