T4240NSN7TTB - QorIQ T4 24x 1.8GHz Power Arch MPU | NXP
N.º de pieza: T4240NSN7TTB ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1450 | $1.450,00 |
| 10 | $1380 | $13.800,00 |
| 100 | $1290 | $129.000,00 |
| 500 | $1195 | $597.500,00 |
| 1.000 | $1100 | $1.100.000,00 |
T4240NSN7TTB Descripción general
A QorIQ communications processor is a member of the multicore Power Architecture microprocessor family specifically engineered for networking and embedded infrastructure workloads. Within the broader system hierarchy, QorIQ T series sits below: QorIQ T family -> QorIQ communications processor -> Power Architecture microprocessor -> embedded MPU -> integrated circuit. These parts are positioned for routers, switches, base stations, and other data-plane equipment where deterministic throughput and high SerDes lane counts are critical.
Key features include 12 dual-threaded e6500 cores providing 24 threads, 64 KB I-cache and 32 KB D-cache per core plus a shared 2 MB L2 per cluster, a 64-bit DDR3L interface supporting 1.8 GT/s with ECC, integrated 10 Gbps SerDes, multiple PCI Express Gen 2 controllers, and the Data Path Acceleration Architecture (DPAA) for hardware offload of classification, queueing, and crypto. The 45x45 mm FCBGA package exposes 1932 balls and supports high-speed signal escape required for the multi-lane SerDes.
The T4240 is fabricated in 28 nm CMOS process technology and pairs the e6500 cores with NXP's CoreNet coherency fabric. The four 10 Gbps ports can also be configured as multiple 1 GbE lanes, giving designers flexibility to scale from 1G to 40G aggregate Ethernet. The architecture enables line-rate processing for routing, deep-packet inspection, and traffic management without external lookup engines.
Typical applications include enterprise routers, edge gateways, network attached storage controllers, LTE and 5G base station baseband, industrial control planes, and military secure communications platforms. The wide SerDes integration makes the T4240 particularly attractive where PCB real estate and power efficiency both matter.
When designing with the T4240, allocate a minimum of a 12-layer PCB stack-up to route the DDR3L byte lanes and 10G SerDes with controlled impedance. Decoupling requires roughly 50 low-ESR ceramic capacitors distributed near the core and SerDes rails, and thermal design must assume up to 35 W TDP under full thread load.
This page synthesizes distributor pricing, drop-in alternatives within the T4 family, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para T4240NSN7TTB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
T4240NSN7PQB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
T4160NSN7PQB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
T4080NSN7PQB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
T4240NSN7TTB
✅ Sustitución directa✓ En stock
$1100 / unidad
Ver hoja de datos →T4241NSN7PQB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
T4161NSN7PQB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
T4081NSN7PQB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
T4240NSN7TTB Valores máximos y características eléctricas
| Family | QorIQ T4 Series |
| Core Architecture | PowerPC e6500, 64-bit |
| Number of Cores | 12 (24 threads via hardware multithreading) |
| Maximum Core Frequency | 1.8 GHz |
| DDR Memory Controller | 64-bit DDR3L, up to 1.8 GT/s with ECC |
| 10 Gigabit Ethernet Ports | 4 |
| Crypto Acceleration | Disabled |
| Temperatura de funcionamiento | 0 C to 105 C |
| Silicon Revision | 2.0 |
| Process Technology | 28 nm CMOS |
| Encapsulado | 1932-ball FCBGA (45x45 mm) |
| Tipo de montaje | Surface Mount (BGA) |
| L2 Cache | Per-cluster shared cache (e6500 architecture) |
| I/O Interfaces | PCIe Gen 2, SerDes, Ethernet, I2C, UART |
| Estado RoHS | Compliant |
| Lead Free | Yes |
Guía de configuración de pines de T4240NSN7TTB 1932-ball fcbga (45x45 mm)
Configuración de pines para T4240NSN7TTB (encapsulado 1932-ball fcbga (45x45 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para T4240NSN7TTB.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
T4240NSN7TTB es adecuado para 7 aplicacións: Enterprise Edge Router, Network Attached Storage Controller, LTE and 5G Base Station Baseband, Industrial Control Plane, Top-of-Rack Switch, Deep Packet Inspection Appliance, Military Secure Communications.
Enterprise Edge Router
The T4240NSN7TTB is well suited for enterprise edge routers where 4x integrated 10 GbE ports and 24 threads enable wire-speed packet forwarding. With four 10G Ethernet MACs plus the 1.8 GT/s DDR3L controller, the T4240 can sustain line-rate IPv4/IPv6 forwarding tables and QoS classification without external NPUs. Hardware multithreading helps tolerate the latency of DDR accesses during deep packet inspection.
Recomendado
Network Attached Storage Controller
The T4240NSN7TTB's 24 threads and 64-bit DDR3L with ECC provide the compute and memory bandwidth required for NAS controllers managing multiple drive bays. The e6500 cores handle file-system operations, RAID parity calculation, and iSCSI/NFS protocol processing concurrently. Integrated 10 GbE ports support link aggregation to the storage fabric without external MAC chips.
Recomendado
LTE and 5G Base Station Baseband
The T4240NSN7TTB's 12 dual-threaded e6500 cores provide the symmetric multiprocessing throughput required for LTE and 5G PHY layer baseband processing. The 1.8 GT/s DDR3L controller delivers the memory bandwidth needed for IQ sample buffering, while the integrated SerDes enables backhaul to the radio unit. Crypto-disabled silicon meets export-control requirements for many international deployments.
Recomendado
Industrial Control Plane
The T4240NSN7TTB's deterministic thread scheduling and 0 to 105 C operating range make it appropriate for industrial control plane gateways. PCIe Gen 2 controllers enable attachment of FPGA co-processors for deterministic I/O, while multiple I2C and UART controllers connect to industrial sensors. The 28 nm process delivers reasonable power efficiency for fanless DIN-rail designs.
Recomendado
Top-of-Rack Switch
The T4240NSN7TTB is suitable for top-of-rack switching fabrics requiring layer-2/3 control plane processing at 40 Gbps aggregate. The four 10 GbE ports plus SerDes-based uplinks handle data plane distribution, while the 24 threads run routing daemons, spanning-tree, and management agents. ECC memory prevents silent data corruption in long-uptime deployments.
Recomendado
Deep Packet Inspection Appliance
The T4240NSN7TTB's Data Path Acceleration Architecture offloads classification and queue management while the 24 threads handle pattern matching for intrusion detection. The 1.8 GT/s DDR3L interface supports large signature database lookups in working memory. Multiple 10 GbE ports enable monitoring of aggregated uplinks at line rate.
Recomendado
Military Secure Communications
The T4240NSN7TTB's crypto-disabled silicon and industrial temperature range suit military secure communications platforms that prefer software-defined crypto with custom algorithms. The 24 threads can run HAIPE or IPsec stacks alongside packet processing, while ECC DDR3L ensures data integrity in harsh environments. Pin compatibility with the T4241 supports extended-temp field deployments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para T4240NSN7TTB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | T4240NSN7PQB | T4160NSN7PQB | T4080NSN7PQB | T4241NSN7PQB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1932-ball FCBGA (45x45 mm) | 1932-ball FCBGA (45x45 mm) - same | 1932-ball FCBGA (45x45 mm) - same | 1932-ball FCBGA (45x45 mm) - same | 1932-ball FCBGA (45x45 mm) - same |
| Core Architecture | PowerPC e6500, 64-bit | PowerPC e6500, 64-bit | PowerPC e6500, 64-bit | PowerPC e6500, 64-bit | PowerPC e6500, 64-bit |
| Cores / Threads | 12 cores / 24 threads | 12 cores / 24 threads | 8 cores / 16 threads | 4 cores / 8 threads | 12 cores / 24 threads |
| Core Frequency | 1.8 GHz | 1.8 GHz | 1.8 GHz | 1.8 GHz | 1.8 GHz |
| DDR3L Speed | 1.8 GT/s | 1.8 GT/s | 1.8 GT/s | 1.6 GT/s | 1.8 GT/s |
| Crypto Acceleration | Disabled | Enabled | Enabled | Enabled | Enabled |
| Operating Temperature | 0 to 105 C | 0 to 105 C | 0 to 105 C | 0 to 105 C | -40 to 105 C (extended) |
| Silicon Revision | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 |
Diferenciadores clave
- Highest thread count in T4 family (frente a T4080NSN7PQB)
- Pin-compatible with full T4 family for one-PCB scalability (frente a T4160NSN7PQB)
- 4x integrated 10 GbE eliminates external MACs (frente a T4080NSN7PQB)
- Crypto-disabled variant for export-controlled designs (frente a T4240NSN7PQB)
Notas de diseño
The 1932-ball FCBGA at 1.0 mm pitch requires a minimum 12-layer PCB stack-up with microvia-in-pad technology for reliable BGA breakout. According to NXP hardware design guidelines, route DDR3L byte lanes on inner layers with controlled 85 ohm differential impedance and length matching within 25 mils. All SerDes lanes require 100 ohm differential impedance with length matching within 150 mils for 10 Gbps signaling.
Estimated: at full 24-thread utilization the T4240NSN7TTB dissipates approximately 30 to 35 W TDP. A heat spreader with thermal interface material (TIM) rated at 0.1 C-in2/W is required, and the board should provide a minimum 4 square inches of inner copper pour beneath the package. Airflow of 1.5 m/s minimum is recommended at 105 C junction to maintain reliable operation in enclosed networking chassis.
Decoupling requires approximately 50 low-ESR ceramic capacitors distributed beneath the package: 22 of 22 uF for core rails, 16 of 10 uF for SerDes rails, and 12 of 4.7 uF for DDR3L I/O. Bulk decoupling needs four 470 uF polymer capacitors near the package perimeter. Voltage rail sequencing must follow NXP power-up specification to avoid latch-up; use a managed PoM such as the NXP VR500 series for compliance.
Do not confuse the T4240NSN7TTB (crypto-disabled, industrial temp) with the T4240NSN7PQB (crypto-enabled) or T4241NSN7PQB (extended temp). The suffix matters for export-control compliance. According to NXP errata documents, silicon revision 2.0 has resolved all known issues from revision 1.x; always order revision 3.0 or later for new designs when available.
Información de cumplimiento
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - QorIQ chassis are industrial/commercial parts, not automotive. Conflict-minerals declaration available on NXP corporate responsibility page.
