TPS51640RSLT - 2+1 IMVP7 CPU Controller | Texas Instruments
N.º de pieza: TPS51640RSLT ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
TPS51640RSLT Descripción general
A CPU voltage-regulator controller is a power-management semiconductor that coordinates multiple synchronous step-down converter phases to produce the low-voltage rails required by a processor. In a 2+1 arrangement, two controller channels can serve the CPU and a third channel can serve the GPU or another associated load. The controller typically coordinates power sequencing, voltage regulation, current balancing, and fault handling, while external MOSFETs and inductors perform the power conversion. This places the device between the system’s input rail and the high-current CPU/GPU rails.
The verified search result describes the TPS51640 family as a “Dual-Channel (3-Phase CPU/1-Phase GPU) SVID, D-CAP+ Step-Down” controller. That wording indicates a digitally controlled, multi-phase CPU power architecture using SVID-related processor signaling and D-CAP+ support, but the supplied data does not provide numerical thresholds, timing values, current ratings, or compensation requirements. Engineers should use the manufacturer datasheet and application materials before finalizing rail settings, component selection, and stability checks.
The TPS51640RSLT ordering code includes the RSL suffix, while the verified source set does not establish the exact lead-free, temperature, or lifecycle details for this specific orderable variant. The component should therefore be treated as an integrated circuit rather than a microcontroller, despite one distributor page grouping it under microcontrollers. The package should be mapped only after the exact mechanical drawing and pin definitions are confirmed from the official TI documentation.
Typical engineering uses for this controller class include desktop-computing CPU rails, integrated CPU/GPU power systems, servers, workstations, and other high-current digital platforms. The multi-phase topology helps distribute power delivery across multiple external switching stages, while SVID-related control supports processor-managed voltage requests in compatible platforms. Exact suitability depends on the processor requirements, input rail, output voltage range, phase count, current capability, thermal environment, and controller timing specifications.
The key design consideration is that the controller is only one part of the power converter. The external MOSFETs, inductors, input capacitors, output capacitors, boot circuitry, sensing network, and PCB layout determine much of the final rail performance. Do not infer values from distributor category labels or generic controller descriptions; verify every design value against the official TI datasheet. This page distinguishes verified sourcing facts from missing technical parameters rather than presenting guesses as production-ready specifications.
Alternativas directas para TPS51640RSLT — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
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Solicitar alternativasTPS51640RSLT Valores máximos y características eléctricas
| Product Type | 2+1 IMVP7 CPU controller |
| Controller Architecture | Dual-channel, 3-phase CPU and 1-phase GPU configuration |
| Control Function | SVID, D-CAP+ step-down controller |
| Encapsulado | 48-pin QFN |
| Package Family | QFN |
| Tipo de montaje | Surface mount |
| CPU Phase Count | 3 phases per CPU channel |
| GPU Phase Count | 1 phase |
| Total Configured Phases | 7 phases across CPU and GPU channels |
| Processor Interface | SVID-related signaling |
Guía de configuración de pines de TPS51640RSLT qfn
Configuración de pines para TPS51640RSLT (encapsulado qfn). Este dispositivo de potencia presenta terminales de puerta, drenador y fuente. Para encapsulados no polarizados, consulte la hoja de datos del fabricante para conocer la orientación exacta del pin 1 y los detalles del footprint. Las aplicaciones habituales incluyen el diseño de fuentes de alimentación, el accionamiento de motores y la conmutación de cargas.
No hay datos detallados de patillaje disponibles para TPS51640RSLT.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
TPS51640RSLT es adecuado para 6 aplicacións: Desktop CPU Power Rail, Integrated CPU and GPU Platform, Server Processor Power System, Workstation Voltage Regulation, High-Current Embedded Computing, Multi-Rail Processor Platform.
Desktop CPU Power Rail
The TPS51640RSLT is relevant to desktop-computing CPU power systems because the verified family description identifies a dual-channel, 3-phase CPU controller architecture. It can coordinate multiple external step-down power stages to deliver a processor rail while distributing current and supporting controlled voltage requests through the stated SVID-related signaling. The design must still match the processor’s voltage range, current demand, load-transient limits, and sequencing requirements. External MOSFETs, inductors, capacitors, and a layout validated for the controller are required; the supplied sources do not provide those numerical values.
Recomendado
Integrated CPU and GPU Platform
The 2+1 organization makes TPS51640RSLT applicable to platforms that combine a CPU rail with a GPU or associated high-current rail. The verified description specifies 3-phase CPU operation and 1-phase GPU operation, allowing the two functions to be controlled within one controller family while retaining separate rail management. Suitability depends on the GPU’s required voltage, current, timing, and transient behavior, which are not present in the supplied data. Firmware, SVID behavior, rail sequencing, and controller configuration must be validated against the complete platform requirements.
Recomendado
Server Processor Power System
A server-class processor platform can benefit from the verified 3-phase CPU configuration when its power delivery requirements exceed what a single switching stage can provide. Multi-phase operation is intended to distribute the conversion workload across external power stages while the controller coordinates regulation and processor signaling. The TPS51640RSLT may fit only if its verified input range, phase-current capability, switching behavior, and fault requirements match the server rail specification. Those ratings must be read from the official datasheet, and the complete converter must be validated for steady-state and transient performance.
Recomendado
Workstation Voltage Regulation
The TPS51640RSLT can serve as the controller for a workstation power architecture that requires coordinated CPU regulation and a separate GPU channel. The verified 2+1 description provides a clear functional reason to evaluate the device in systems combining high-performance processor rails, while the SVID and D-CAP+ references indicate that processor-controlled voltage behavior should be considered. Workstation implementations should verify rail sequencing, current limits, compensation, inductor sizing, thermal performance, and signal integrity. No workstation-specific reference design or numerical rating was included in the supplied data.
Recomendado
High-Current Embedded Computing
Embedded computing platforms that combine a processor and accelerator can evaluate TPS51640RSLT when their power architecture requires multiple CPU phases plus a dedicated auxiliary phase. The controller is not a complete regulator by itself; it coordinates external MOSFET switching stages and associated passive networks. Designers must confirm that the controller’s verified architecture matches the embedded processor’s SVID requirements, supported voltage range, startup sequence, and load-transient profile. Because the supplied source set contains no current, timing, or thermal numbers, the component should remain subject to datasheet and reference-design verification before production use.
Recomendado
Multi-Rail Processor Platform
The dual-channel nature of TPS51640RSLT is useful in a multi-rail processor platform where CPU and GPU power domains must be managed with coordinated external power stages. The verified family description supports evaluating a 3-phase CPU configuration alongside a 1-phase GPU configuration, while the controller name identifies the target as an IMVP7 CPU controller. Integration is not automatic: rail sequencing, independent voltage limits, fault responses, startup behavior, and signal routing must match the processor system. Use the official TI documentation to determine whether the device fits the exact platform and BOM revision.
Recomendado
Datos de referencia de ingeniería para TPS51640RSLT — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto |
|---|---|
| Product Type | 2+1 IMVP7 CPU controller |
| Brand | Texas Instruments |
| Package | 48-pin QFN |
| CPU Phase Configuration | 3-phase CPU |
| GPU Phase Configuration | 1-phase GPU |
| Control Interface | SVID-related signaling |
| Converter Topology | D-CAP+ step-down controller |
Diferenciadores clave
- Verified 2+1 CPU/GPU controller architecture (frente a Generic single-channel CPU controller)
- Dedicated processor-oriented control (frente a Generic voltage regulator)
- Compact 48-pin QFN integration (frente a Larger discrete controller solution)
Notas de diseño
The TPS51640RSLT is a controller rather than a complete power stage. Treat the input network, external MOSFETs, inductors, output capacitors, current-sense path, and load as one converter design. The supplied verified data does not provide input-voltage, phase-current, switching-frequency, or voltage-regulation limits, so do not select those components from the distributor snippets. Derive every power-stage value from the official TI datasheet and the target processor rail specification.
A multi-phase CPU/GPU converter requires careful placement of the controller, MOSFETs, inductors, capacitors, and feedback or sensing connections. Keep high-current switching loops compact, route gate and signal traces away from noisy power paths, and provide the layout area and copper thermal design required by the external power stage. Exact pin assignments and recommended layout geometry are not present in the supplied data and must be copied from the official package and application documentation.
Do not treat a distributor category label or a family description as a complete specification for TPS51640RSLT. In particular, verify the RSLT orderable variant, 48-pin QFN footprint, SVID behavior, D-CAP+ implementation, startup sequence, fault responses, and thermal limits before releasing a PCB. Also verify whether the distributor page’s marketplace grouping under microcontrollers reflects the actual function; the verified family text identifies a CPU power controller, not a microcontroller.
Controller temperature alone does not describe the converter’s thermal margin because most conversion loss may occur in the external MOSFETs and inductors. Review the complete regulator thermal model, including ambient temperature, copper area, current sharing, switching frequency, and the selected magnetics. The verified sources provide no thermal resistance or current-rating data, so no numerical thermal estimate is included here; obtain those values from the manufacturer datasheet and application materials.
Información de cumplimiento
Compliance status was not included in the verified distributor or cross-reference data. Do not infer RoHS, REACH, halogen-free, conflict-minerals, or automotive qualification from the manufacturer name or distributor listing.
