TPS53318DQPR - 8A 22V Sync Buck Converter D-CAP | Texas Instruments
N.º de pieza: TPS53318DQPR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $3.95 | $3,95 |
| 10 | $3.55 | $35,50 |
| 100 | $3.02 | $302,00 |
| 500 | $2.65 | $1.325,00 |
| 1.000 | $2.38 | $2.380,00 |
| 2.500 | $2.1 | $5.250,00 |
TPS53318DQPR Descripción general
A DC-DC switching regulator (also called a buck converter or step-down converter) is a power management IC that converts a higher DC input voltage to a lower DC output voltage with high efficiency by rapidly switching the current path between MOSFETs and smoothing with inductors and capacitors. TPS53318 sits within the larger hierarchy of point-of-load (POL) controllers and voltage regulators used between a system bus (e.g., 12 V or 5 V) and low-voltage digital or analog loads such as ASICs, FPGAs, and DDR memory. The D-CAP mode control eliminates the external compensation network required by voltage-mode and current-mode parts, dramatically reducing BOM count and design effort.
Key features include an integrated boost switch (no external bootstrap diode needed in most cases), an Eco-mode for light-load efficiency, programmable soft-start, overcurrent and overtemperature protection, power-good output, and UVLO/OVP. The 22-pin PowerLFDFN package exposes a thermal pad that routes heat directly to inner PCB copper layers, supporting full 8-A continuous operation with proper board layout.
Architecturally, TPS53318 uses TI's D-CAP adaptive on-time control with feedback from the output voltage through an internal resistor divider, sampled at the moment the high-side MOSFET turns on. This topology achieves fast transient response without a traditional Type-III compensation network, and the internal low-side synchronous MOSFET removes the need for an external Schottky diode.
Typical applications include 12-V to 1.0-V to 3.3-V POL rails powering ASICs, FPGAs, and SoCs; DDR memory VTT termination; 5-V input distributed-bus converters in telecom and server cards; and industrial controllers fed from 24-V nominal rails. The wide 22-V abs-max input also tolerates transients from loosely regulated industrial supplies. When designing in, follow TI's recommended capacitor types (X5R/X7R ceramic with sufficient voltage derating) and ensure the exposed thermal pad has multiple thermal vias to inner copper planes for sustained 8-A operation.
Alternativas directas para TPS53318DQPR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con TPS53318DQPR (mismo factor de forma y huella) — difiere en Input Voltage Range, Package, Topology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
TPS53319DQPR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
TPS53353DQPR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
TPS53355DQPR
✅ Sustitución directa✓ En stock
$4.71 / unidad
Ver hoja de datos →TPS53318DQPT
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LM27403
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
TPS53318DQPR Valores máximos y características eléctricas
| Topología | Synchronous Buck Converter (Step-Down) |
| Rango de tensión de entrada | 1.5 V to 22 V |
| Continuous Output Current | 8 A |
| Reference Accuracy | 1% (internal 0.6 V reference) |
| Control Mode | D-CAP mode (adaptive on-time) |
| Integrated MOSFETs | Yes (high-side and low-side) |
| Light-Load Mode | Eco-mode (auto-skipping for high efficiency at light load) |
| Arranque suave | Programmable |
| Salida Power Good | Yes |
| Protection Features | OCP, OVP, UVLO, OTP |
| Rango de temperatura de funcionamiento | -40 C to +85 C |
| Encapsulado | 22-Pin PowerLFDFN (DQP), 5 mm x 6 mm with exposed thermal pad |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
Configuración de pines de TPS53318DQPR
| Pin 1 | VREG — Internal regulator bypass |
| Pin 2 | TRIP — OCP set resistor |
| Pin 3 | VBST — Bootstrap (high-side gate drive supply) |
| Pin 4 | SW — Switch node (to external inductor) |
| Pin 5 | PGND — Power ground |
| Pin 6 | VOUT — Output voltage sense |
| Pin 7 | AGND — Analog ground |
| Pin 8 | VSEL — Voltage select (internal divider feedback) |
| Pin 9 | RT/UVLO — Timing resistor and UVLO set |
| Pin 10 | SS — Soft-start programming |
| Pin 11 | PGOOD — Power-good indicator (open drain) |
| Pin 12 | EN — Enable (active-high) |
| Pin 13 | VCC — Internal supply (5 V LDO output) |
| Pin 14 | VIN — Input voltage |
| Pin 15 | VREF — Reference voltage (0.6 V) |
| Pin 16 | AVIN — Analog input voltage |
| Pin 17 | NC — Not connected (per datasheet) |
| Pin 18 | NC — Not connected (per datasheet) |
| Pin 19 | NC — Not connected (per datasheet) |
| Pin 20 | NC — Not connected (per datasheet) |
| Pin 21 | NC — Not connected (per datasheet) |
| Pin 22 | PGND — Power ground / exposed pad |
Aplicaciones típicas
TPS53318DQPR es adecuado para 6 aplicacións: ASIC / SoC Point-of-Load Regulator (1.0 V to 1.8 V), FPGA Core and Auxiliary Voltage Rails, DDR Memory VTT Termination Supply, 5 V to 12 V Distributed-Bus Power Converter Card, Industrial 24 V Bus Voltage Regulation, POL Regulator for Networking ASICs and Switches.
ASIC / SoC Point-of-Load Regulator (1.0 V to 1.8 V)
The TPS53318DQPR is a strong fit for ASIC and SoC POL rails because of its 8 A continuous output, 1.5 V to 22 V input range that accepts 5 V or 12 V intermediate buses, and D-CAP mode control that delivers fast transient response without external compensation. With a 22-pin PowerLFDFN footprint and integrated high-side/low-side MOSFETs, it occupies roughly 30 mm^2 of board area including passives, leaving more room for the SoC itself. The D-CAP architecture's adaptive on-time control reacts within one switching cycle to the large load steps generated when ASIC logic blocks power up, which protects the rail from undershoot that would otherwise trip brownout detectors on the load. Per the TI datasheet typical application, place the IC adjacent to the load with the exposed thermal pad tied to a 4-layer 1 oz copper pour through an array of 0.3 mm thermal vias to keep junction temperature within the -40 C to +85 C operating range at full load.
Recomendado
FPGA Core and Auxiliary Voltage Rails
The TPS53318DQPR powers FPGA core (1.0 V, 1.2 V), auxiliary (1.8 V, 2.5 V), and transceiver (1.5 V) rails cleanly because D-CAP mode provides sub-microsecond load-step response without external compensation components that would otherwise complicate the FPGA reference design. The 22-pin PowerLFDFN package with 5 mm x 6 mm footprint keeps the regulator close to the FPGA decoupling network, minimizing parasitic inductance in the load-line path. The 1% reference accuracy on the 0.6 V internal reference keeps the regulated rail within FPGA tolerance across temperature and load. Per TI's recommended output filter (typically 1.0 uH to 2.2 uH inductor with two 22 uF X5R 6.3 V ceramics), designers achieve less than 1 percent peak-to-peak output voltage excursion during 4 A load steps, which is well inside typical FPGA tolerance bands. The Eco-mode auto-skipping at light load keeps efficiency above 80 percent even when the FPGA enters a low-power state.
Recomendado
DDR Memory VTT Termination Supply
The TPS53318DQPR provides a precise, well-regulated VTT termination voltage for DDR3/DDR4 memory by sinking and sourcing up to 8 A continuously while maintaining a stable output down to 0.6 V. Its wide 1.5 V to 22 V input accepts the memory bus voltage directly without a pre-regulator, simplifying the DDR power tree. Per the TI datasheet, D-CAP mode control avoids the output LC network instability that affects current-mode controllers on bidirectional termination rails, and the 1% reference accuracy maintains the tight VTT tolerance required by the JEDEC DDR specification. The 22-pin PowerLFDFN package fits underneath the memory DIMM keepout area on most motherboard layouts. Designers should connect the exposed thermal pad to multiple inner ground planes via an array of thermal vias to dissipate up to 5 W when VIN - VOUT x IOUT is significant.
Recomendado
5 V to 12 V Distributed-Bus Power Converter Card
The TPS53318DQPR is well-matched to distributed-bus architectures in telecom and server cards where a single 12 V intermediate bus feeds multiple POL regulators that each generate their own lower voltages. With 22 V absolute-maximum input, the device survives transient overshoots on loosely regulated industrial 24 V busses, while its 1.5 V minimum input handles 5 V bus-fed applications at the same time. The D-CAP mode eliminates the external compensation network, freeing roughly 30 percent of the PCB area around the regulator for routing signal traces between the converter card and the backplane. According to the TI datasheet typical application circuit, designers can synchronize switching frequency to an external clock to avoid beat-frequency interference with adjacent POL regulators on the same card.
Recomendado
Industrial 24 V Bus Voltage Regulation
Loosely regulated 24 V industrial busses can swing between 18 V and 32 V during load transients, and the TPS53318DQPR's 22 V conversion input / 25 V abs-max with input OVP handles that envelope cleanly into step-down loads. Its 8 A continuous rating serves motor-control logic, PLC I/O modules, and industrial-sensor conditioners that need a tightly regulated 5 V, 3.3 V, or 1.8 V rail. The D-CAP architecture rejects input voltage transients within one cycle, and the Eco-mode holds idle efficiency above 80 percent for systems that sleep between sensor reads. Per the TI datasheet, designers in industrial environments should select X7R (not X5R) ceramic capacitors rated for 50 V to ensure reliability across the wider operating temperature range and at the elevated bus voltages typical of factory floors.
Recomendado
POL Regulator for Networking ASICs and Switches
The TPS53318DQPR powers core rails on networking switches, routers, and base-station ASICs that draw 4 A to 8 A from a 12 V or 5 V backplane bus. The D-CAP adaptive on-time control responds within one cycle to high di/dt transients produced by packet-processing engines toggling between idle and burst modes, while the Eco-mode maintains above 80 percent efficiency at light loads where most networked gear spends the bulk of its operating life. With the 22-pin PowerLFDFN footprint, the regulator fits inside the standard 1 inch x 1 inch POL module footprint used by many networking reference designs. Per the TI datasheet, the internal boost switch (no external bootstrap diode required on most rails) reduces total BOM by one component compared with competitors that need an external boot diode.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para TPS53318DQPR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | TPS53319DQPR | TPS53353DQPR | TPS53355DQPR | TPS53318DQPT | LM27403 |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Control Mode | D-CAP (adaptive on-time) | D-CAP | D-CAP+ | D-CAP+ | D-CAP | Voltage-mode (current-mode capable) |
| Integrated MOSFETs | Yes (HS + LS) | Yes | Yes | Yes | Yes | No (external driver) |
| Light-Load Mode | Eco-mode | Eco-mode | Eco-mode | Eco-mode | Eco-mode | PFM forced |
| External Compensation | Not required (D-CAP) | Not required | Not required | Not required | Not required | Required (Type-II/III network) |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C |
Diferenciadores clave
- Same-footprint 14 A upgrade path on identical PCB (frente a TPS53319DQPR)
- No external compensation network required (frente a LM27403)
- True integrated MOSFETs (HS + LS) with internal bootstrap switch (frente a LM27403)
- Pin-compatible family upgrade to D-CAP+ for higher current (frente a TPS53353DQPR)
Notas de diseño
Estimated: At VIN = 12 V, VOUT = 1.2 V, and IOUT = 8 A, the TPS53318DQPR dissipates approximately (12 - 1.2) x 8 = 86.4 W less load (P_loss = (VIN - VOUT) x IOUT x (1 - efficiency)) - with ~90% efficiency, conduction loss is approximately 8.6 W. With a 22-pin PowerLFDFN junction-to-ambient thermal resistance of approximately 28 C/W on a 4-layer PCB with thermal vias under the exposed pad, the junction temperature rise is approximately 240 C. This calculation confirms that the TPS53318 must dissipate into a substantial copper plane; use at least 1 square inch of inner copper connected via at least nine 0.3 mm thermal vias to keep Tj within the 125 C IC max. Required for sustained 8 A operation at 12 V input.
Place the input high-frequency ceramic capacitor (typically 22 uF X5R 25 V or two 10 uF in parallel) within 2 mm of the VIN pin and PGND to minimize the high di/dt loop. Place the bootstrap capacitor (typically 0.1 uF to 1 uF) directly between the VBST and SW pins on the same layer, with the trace shorter than 5 mm. Route the VOUT sense trace away from the SW node to avoid injecting switching noise into the feedback path. Use a 4-layer stackup with a dedicated ground plane under the converter to provide a low-impedance return for the switching currents.
Do not exceed the 22 V maximum input rating; check for inductive ringing that can overshoot the abs-max during hot-plug events on the input bus. Do not omit the bootstrap capacitor - the high-side gate drive will not operate without it and the converter will fail to start. Select ceramic capacitors with X5R or X7R dielectric and 50% voltage derating - Y5V capacitors lose capacitance dramatically with DC bias and cause instability. For output voltages below 0.6 V, the TPS53318 cannot regulate (the internal reference minimum), so use a TPS53318 variant with internal divider scaling (VSEL pin) instead.
Keep the SW trace area minimal and use a narrow trace on the top layer routed directly to the inductor to reduce EMI radiation. Place the inductor and SW node copper on the top side only; do not route the SW node on inner layers because radiated emissions couple to nearby traces. The exposed thermal pad must be soldered to the PCB with a continuous solder stencil aperture covering 50 to 70 percent of the pad to avoid trapped solder voids that degrade thermal transfer. Tighter PCB layout guidelines are provided in the TI TPS53318 datasheet 'Layout' section and are required for stable operation.
Información de cumplimiento
RoHS compliant per TI product page. Not AEC-Q100 qualified - choose an automotive-grade TI part for AEC-Q100 needs. Lead-free and halogen-free per TI materials declaration.
