VTM48EF012T130B01 - 130W 48V Sine Amplitude VTM Module | Vicor
N.º de pieza: VTM48EF012T130B01 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.75 | $257,50 |
| 100 | $22.1 | $2.210,00 |
| 500 | $19.4 | $9.700,00 |
| 1.000 | $17.85 | $17.850,00 |
VTM48EF012T130B01 Descripción general
A VTM (Voltage Transformation Module) is a sine amplitude converter - a specialized isolated DC-DC building block used in Vicor's Factorized Power Architecture (FPA). Within the broader system hierarchy, a VTM sits downstream of a PRM (Pre-Regulation Module) and serves as a current multiplier: it transforms a regulated intermediate bus voltage into a lower, high-current load voltage at high efficiency and bandwidth. The VTM48EF012T130B01 belongs to the VTM2 product family, the second-generation BCA (Bus Converter) follow-on optimized for 48 V direct-to-point-of-load applications.
Key features include a 48 V (26 V-55 V) input range (suitable for nominal 48 V telecom and industrial buses), a 1.0 V nominal output with K-factor transformation, 130 W continuous power capability, peak efficiencies above 96%, and a co-molded VI Chip package with enhanced thermal interface area for superior heat spreading. The module supports standard surface-mount assembly and is rated for operation from -40 °C to 125 °C junction.
Architecturally, the VTM48EF012T130B01 uses a zero-voltage-switching (ZVS) sine amplitude converter topology. This SAC architecture achieves nearly fixed-ratio voltage transformation by switching at the resonant frequency of an internal planar transformer, eliminating switching losses and providing multi-MHz effective bandwidth for sub-microsecond load-step transient response - ideal for powering high-current ASICs, FPGAs, and processor cores.
Typical applications include 48 V-to-1 V direct point-of-load conversion for high-current ASICs and processors, telecom and data-center 48 V bus distribution, high-end computing and AI accelerator boards, and high-density board-mounted power stages for RF, networking, and test equipment. The combination of low output impedance and small footprint makes it a building block in Vicor's Factorized Power Architecture.
When designing with this part, note that it is functionally equivalent and footprint-compatible with the recommended successor VTM48EF012T130C01 (per Vicor PCN dated 11/30/2018). Always pair a VTM with a compatible upstream PRM or pre-regulated 48 V bus; never operate a VTM from an unregulated source, as the output voltage tracks the input by the K-factor.
Alternativas directas para VTM48EF012T130B01 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
VTM48EF012T130C01
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
VTM48EF012T130A00
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
VTM48EF012M130A00
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
VTM48EF040T115A00
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
VTM48EF012T130B01 Valores máximos y características eléctricas
| Topología | Sine Amplitude Converter (SAC) / VTM Current Multiplier |
| Rango de tensión de entrada | 26 V to 55 V (48 V nominal) |
| Nominal Input Voltage | 48 V |
| Output Voltage (Nominal) | 1.0 V |
| Continuous Output Power | 130 W |
| Continuous Output Current | Up to 130 A (per K-factor ratio) |
| K-Factor | 1/40 (sine amplitude ratio per part number) |
| Peak Efficiency | Greater than 96% |
| Encapsulado | VI Chip co-molded SMD module |
| Tipo de montaje | Surface Mount (pick-and-place compatible) |
| Temperatura de funcionamiento | -40 °C to 125 °C (junction) |
| Switching Topology | Zero-voltage-switching (ZVS) resonant |
| Architecture | Factorized Power Architecture (FPA) - pairs with PRM |
| Estado RoHS | Compliant (VI Chip module) |
| Product Family | VTM2 (BCA generation) |
Guía de configuración de pines de VTM48EF012T130B01 vi chip co-molded smd module
Configuración de pines para VTM48EF012T130B01 (encapsulado vi chip co-molded smd module). Este dispositivo de potencia presenta terminales de puerta, drenador y fuente. Para encapsulados no polarizados, consulte la hoja de datos del fabricante para conocer la orientación exacta del pin 1 y los detalles del footprint. Las aplicaciones habituales incluyen el diseño de fuentes de alimentación, el accionamiento de motores y la conmutación de cargas.
No hay datos detallados de patillaje disponibles para VTM48EF012T130B01.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
VTM48EF012T130B01 es adecuado para 6 aplicacións: 48 V Direct-to-Point-of-Load for ASICs/Processors, Telecom 48 V Bus Distribution, AI Accelerator and GPU Boards, High-End FPGA Core Power, Industrial 48 V Robotics and Motor Control, Test and Measurement Instrumentation.
48 V Direct-to-Point-of-Load for ASICs/Processors
The VTM48EF012T130B01 is purpose-built for 48 V direct-to-POL conversion in high-current ASICs, AI accelerator cards, and processor cores. The 1.0 V nominal output at up to 130 A and 130 W continuous provides the dense low-voltage, high-current rail that modern processors require, while the greater than 96% peak efficiency and zero-voltage-switching sine amplitude topology minimize both conduction and switching losses. In a Factorized Power Architecture, the VTM sits downstream of a 48 V PRM and delivers sub-microsecond load-step transient response - critical when a single core steps from sleep to boost in nanoseconds - while its co-molded VI Chip package spreads heat across the PCB copper to eliminate point hotspots that conventional buck POLs would create.
Recomendado
Telecom 48 V Bus Distribution
In telecom equipment the -48 V (or +48 V) nominal bus is the standard distribution rail, and the VTM48EF012T130B01 steps this directly to the 1.0 V core rail without intermediate stages. The 26 V-55 V input window tolerates telecom bus transients, while the VI Chip surface-mount module drops onto standard PCB land patterns compatible with pick-and-place assembly - important for high-volume telecom board builds. The module's co-molded thermal interface replaces bulky heatsinks and reduces board height, enabling slim-line line-card designs. Pairing the VTM with a Vicor PRM upstream creates a complete isolated, regulated POL stage with greater than 96% efficiency and dramatic BOM savings compared with legacy brick-plus-buck chains.
Recomendado
AI Accelerator and GPU Boards
AI accelerator boards (GPU, TPU, custom ASIC) draw hundreds of amps at sub-1 V rails with load transients in the hundreds of amps per microsecond. The VTM48EF012T130B01's sub-microsecond bandwidth and 130 A current capability let multiple VTMs be paralleled to feed a multi-hundred-amp GPU core, while its greater than 96% efficiency keeps total board dissipation below what a multi-phase buck could deliver in the same footprint. The 48 V distribution on the backplane also slashes bus bar copper and reduces I²R losses, and the VI Chip module format permits the VTMs to be placed directly under the cold plate of the accelerator card. Designers typically parallel three to four VTM48EF012T130B01 modules per GPU with current-share interconnects to deliver 400 A-500 A rails cleanly.
Recomendado
High-End FPGA Core Power
Modern FPGAs (Stratix, Versal, Virtex, Kintex Ultrascale) require multi-hundred-amp 0.85 V-1.0 V core rails with tight tolerance and fast transient response for partial reconfiguration events. The VTM48EF012T130B01 provides the low-impedance, high-bandwidth source that FPGAs need, and its VI Chip co-molded SMD package fits beneath BGA devices on the same board. The K-factor transformation means output ripple at the load is dominated by PCB layout rather than the converter itself; with proper via and plane design the VTM easily meets FPGA ripple specs. Compared with multi-phase buck controllers, the VTM-based solution uses fewer components, has no compensation loop to tune, and offers dramatically faster transient response.
Recomendado
Industrial 48 V Robotics and Motor Control
Industrial robotics, AGVs, and high-power servo drives are increasingly migrating to 48 V distribution for better efficiency and smaller wiring harnesses. The VTM48EF012T130B01 converts the 48 V battery or bus voltage down to 1.0 V for controller SoCs, motor-control DSPs, and gate-drive auxiliary rails in a single VI Chip module. The 26 V-55 V input range covers lead-acid, Li-ion, and 48 V rectified industrial supplies. Co-molded thermal management enables mounting directly to chassis copper, supporting ruggedized enclosures without external heatsinks - critical for mobile robot platforms with strict volume and weight budgets.
Recomendado
Test and Measurement Instrumentation
ATE and high-end test instruments (oscilloscope, logic analyzer, BERT, signal generator) need clean, low-noise, high-current rails to power their mixed-signal ASICs and high-speed ADC/DAC front ends. The VTM48EF012T130B01's zero-voltage-switching sine amplitude topology injects essentially no switching noise into the load, and its low output impedance keeps ripple well below the few-hundred-microvolt floors required by 16-bit ADCs. The VI Chip SMD module supports high-density PCB layouts typical of multi-channel instruments, and the 130 W rating covers even the most demanding FPGA-based BERT cores with margin for paralleled channels.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para VTM48EF012T130B01 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | VTM48EF012T130C01 | VTM48EF012T130A00 | VTM48EF012M130A00 | VTM48EF040T115A00 |
|---|---|---|---|---|---|
| Brand | Vicor | Vicor | Vicor | Vicor | Vicor |
| Package | VI Chip SMD module | VI Chip SMD module - same | VI Chip SMD module - same | VI Chip SMD module - same | VI Chip SMD module - same |
| Topology | VTM Current Multiplier (SAC) | VTM Current Multiplier (SAC) | VTM Current Multiplier (SAC) | VTM Current Multiplier (SAC) | VTM Current Multiplier (SAC) |
| Input Voltage Range | 26 V to 55 V | 26 V to 55 V | 26 V to 55 V | 26 V to 55 V | 26 V to 55 V |
| Output Voltage (Nominal) | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 4.0 V |
| Continuous Output Power | 130 W | 130 W | 130 W | 130 W | 115 W |
| PCN/Status | Active, PCN superseded by C01 | Recommended successor - active | Earlier revision - NRND | M-grade military variant | Active, 4V output variant |
| Drop-in Compatibility | Reference | Drop-in (100% match) | Drop-in (same footprint/die) | Drop-in (same footprint, M-grade) | Same footprint, different output voltage |
Diferenciadores clave
- Direct 48 V-to-1 V POL with >96% efficiency (frente a VTM48EF040T115A00)
- Recommended successor available with no design change (frente a VTM48EF012T130C01)
- Wide 26 V-55 V input window for telecom/industrial buses (frente a VTM48EF012M130A00)
Notas de diseño
Always pair the VTM48EF012T130B01 with a Vicor PRM (Pre-Regulation Module) upstream - never drive it from an unregulated bus. Because the VTM is a fixed K-factor transformer, the output voltage tracks the input; using a PRM such as the PRM48AF480T200A00 ensures tight load regulation. For multi-VTM parallel operation, lay out the modules symmetrically and use Vicor's current-share reference design pattern to balance currents within ±5% across the array.
The VI Chip co-molded package is designed to spread heat through the module's thermal interface area into the PCB copper. For full 130 W continuous operation, allocate at least 1 square inch (645 mm²) of 2 oz copper on top and bottom layers directly under the module, stitched with a thermal via array (0.3 mm-0.5 mm drill, 1 mm pitch). Estimated: at 130 W and ~4% total loss, the module dissipates about 5 W; without adequate copper the junction will exceed the 125 °C rating quickly.
Use a 4-layer (or more) stack-up with a dedicated inner plane for the 48 V input return and another for the 1 V output return - these must NOT share the same plane to avoid coupling transients from input to output. Place input ceramic bypass (2x 2.2 µF X7R 100 V 1210) within 5 mm of the VIN pads and output ceramics (4x 47 µF X5R 6.3 V 1210) within 3 mm of the VOUT pads. Avoid routing digital signals across the VTM footprint - the high di/dt switching edges will couple into adjacent traces.
The VTM48EF012T130B01's VI Chip package has a specific land pattern published in the Vicor datasheet mechanical section - use that pattern verbatim. Misaligned pads cause both electrical and thermal contact problems. Maintain a keep-out zone around the thermal interface area to prevent components from blocking the heat-spreading path; do not place capacitors directly under the module, as this traps heat and degrades output capacitance effectiveness.
Do not operate the VTM48EF012T130B01 from a voltage outside the 26 V-55 V window; under-voltage triggers input under-voltage lockout, over-voltage stresses the internal planar magnetics. Do not connect a VTM output in series with another VTM output - the modules are not designed for stacked output and current sharing will not work. Finally, respect the recommendation in the Vicor PCN dated 11/30/2018 and design new boards with the VTM48EF012T130C01 successor, keeping the B01 only for legacy replacement.
Información de cumplimiento
VI Chip module is RoHS and REACH compliant per Vicor product declarations; conflict-minerals status follows Vicor's published CMRT. AEC-Q100 not applicable - this is a power module, not an automotive IC; for automotive applications consult Vicor for the relevant automotive-grade VI Chip variants.
