XC2C256-6FT256C - 256-Macrocell 1.8V CPLD | AMD Xilinx
N.º de pieza: XC2C256-6FT256C ✓ ActivoXC2C256-6FT256C Descripción general
A CPLD is a user-programmable semiconductor that combines configurable logic blocks, programmable interconnect, and I/O resources into a compact logic platform. The CPLD hierarchy places this device above individual programmable logic gates and macros, while remaining distinct from an FPGA because it uses a nonvolatile configuration architecture optimized for deterministic logic implementation. The CoolRunner-II family targets low-power, 1.8 V systems and supports in-system programming through an IEEE 1532 JTAG interface.
The XC2C256 provides 256 macrocells, 6K gates, 0.18 µm CMOS construction, and a -6 performance class with a listed 5.7 ns propagation delay. Its I/O structure supports mixed voltage operation from 1.5 V to 3.3 V, allowing integration with 1.8 V core logic and compatible external signal levels. Zero-power operation emphasizes low static consumption in designs where inactive logic sections should not create unnecessary current demand.
Because configuration data is retained in nonvolatile memory, the device can restore its programmed logic after power is restored without an external configuration PROM. In-system programming permits programming and testing on the assembled PCB, while JTAG boundary-scan support assists board bring-up and manufacturing test. These features are valuable in industrial controllers, telecommunications equipment, consumer interfaces, and compact automation modules.
The principal implementation concern is the 256-ball BGA footprint. PCB layout must follow the manufacturer's ball map, provide appropriate escape routing for JTAG and configuration signals, and account for the 17 mm by 17 mm land pattern. Pin assignments and bank voltage requirements should be checked against the pin-description table in the CoolRunner-II XC2C256 datasheet before finalizing a board.
This page combines the device specifications, real engineering search terms, same-footprint family options, application guidance, and design checks to support component selection and PCB implementation. Use the Request a Quote form for current commercial availability, while the manufacturer datasheet remains the controlling reference for pinout, timing, power, and programming details.
Alternativas directas para XC2C256-6FT256C — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
XC2C256-6FTG256C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC2C256-7FTG256C
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XC2C256-7FTG256I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC2C256-6FT256I
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XC2C256-7FT256I
✅ Sustitución directa ⚠️ Especificaciones sin verificarConsulte el precio
Ver hoja de datos →XC2C256-6FT256C Valores máximos y características eléctricas
| Device Type | CoolRunner-II complex programmable logic device |
| Macrocells | 256 macrocells |
| Gate Count | 6K gates |
| Core Supply Voltage | 1.8 V |
| I/O Voltage Range | 1.5 V to 3.3 V |
| Propagation Delay | 5.7 ns |
| Speed Grade | -6 |
| Process Technology | 0.18 µm CMOS |
| Encapsulado | 256-ball FTBGA, 17 mm x 17 mm |
| Terminal Type | Ball |
| Number of Terminals | 256 balls |
| Tipo de montaje | Surface mount |
| Programming Interface | IEEE 1532 JTAG in-system programming |
| Configuration Memory | Nonvolatile |
| Power Architecture | Zero-power operation |
| Temperature Grade | Commercial |
Guía de configuración de pines de XC2C256-6FT256C 256-ball ftbga, 17 mm x 17 mm
Configuración de pines para XC2C256-6FT256C (encapsulado 256-ball ftbga, 17 mm x 17 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC2C256-6FT256C.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC2C256-6FT256C es adecuado para 6 aplicacións: Industrial Control and Automation, Telecommunications Interface Logic, Consumer Electronics Control, Signal Conditioning and Data Acquisition, Programmable Hardware Acceleration, Board Test and JTAG Assistance.
Industrial Control and Automation
The XC2C256-6FT256C fits compact industrial controllers that coordinate sensors, actuators, interlocks, and machine-state logic. Its 256 macrocells provide more implementation capacity than small CPLDs, while the 1.8 V core and 1.5 V to 3.3 V I/O range support mixed-voltage interface logic. The listed commercial temperature grade makes it appropriate where the enclosure temperature remains within its specified limits. Place the device between field-interface circuitry and a host controller, and use the JTAG interface for programming and production test.
Recomendado
Telecommunications Interface Logic
The XC2C256-6FT256C is suitable for line-card interface logic that combines protocol formatting, status monitoring, and local control functions. Its 256 macrocells support parallel-to-serial conversion, framing logic, command decoding, and test-point routing without requiring a larger FPGA. The 5.7 ns propagation-delay class helps preserve margin in moderately timed control paths. Its 1.8 V core suits low-power telecommunications equipment, and the nonvolatile configuration architecture supports deterministic recovery after power restoration.
Recomendado
Consumer Electronics Control
The XC2C256-6FT256C can implement control hubs, display sequencing, button handling, and peripheral arbitration in compact consumer products. The zero-power-oriented CoolRunner-II architecture is useful when inactive logic should avoid unnecessary static current demand. Its 256-macrocell count accommodates moderate glue-logic networks, while multi-voltage I/O support enables interfacing with 1.8 V and compatible external circuits. Validate each I/O bank against its supply voltage and confirm the commercial temperature range against the product's intended environment.
Recomendado
Signal Conditioning and Data Acquisition
The XC2C256-6FT256C is appropriate for deterministic front-end logic that conditions digital sensor outputs before passing them to an ADC, MCU, or communications engine. Its 256 macrocells can combine filtering, event detection, pulse stretching, level conversion control, and acquisition sequencing in one device. The -6 speed class provides a listed 5.7 ns propagation delay, making it useful for close-coupled digital signal paths. Engineers should still check bank voltage limits, input slew requirements, and timing against external components in the manufacturer datasheet.
Recomendado
Programmable Hardware Acceleration
The XC2C256-6FT256C can accelerate protocol engines, packet filters, CRC calculations, and custom hardware transformations that would otherwise burden a host processor. Its 256 macrocells offer a deterministic nonvolatile implementation for fixed or frequently reloaded logic, while JTAG in-system programming shortens firmware integration and test cycles. The device is best suited to moderate parallel-logic workloads rather than large FPGA-class datapaths. Partition functions into hard real-time blocks and leave broad general-purpose processing to the host controller.
Recomendado
Board Test and JTAG Assistance
The XC2C256-6FT256C can add board-level test logic, routing assistance, or system monitoring around a larger digital design. Its IEEE 1532 JTAG interface supports configuration and boundary-scan workflows, while 256 macrocells can implement test-sequence generation, fault isolation, and programmable interconnect logic. Because JTAG signals are shared with the configuration function, the board must provide controlled access through a connector, test points, or multiplexing arrangement. Production procedures should account for chain order and programming-security requirements.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC2C256-6FT256C — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC2C256-6FTG256C | XC2C256-7FTG256C | XC2C256-7FTG256I | XC2C256-6FT256I | XC2C256-7FT256I |
|---|---|---|---|---|---|---|
| Brand | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx |
| Package | 256-ball FTBGA (FT256), 17 mm x 17 mm | 256-ball FTBGA (FTG256) | 256-ball FTBGA (FTG256) | 256-ball FTBGA (FTG256) | 256-ball FTBGA (FT256) | 256-ball FTBGA (FT256) |
| Device Type | CoolRunner-II CPLD | CoolRunner-II CPLD | CoolRunner-II CPLD | CoolRunner-II CPLD | CoolRunner-II CPLD | CoolRunner-II CPLD |
| Macrocells | 256 macrocells | 256 macrocells | 256 macrocells | 256 macrocells | 256 macrocells | 256 macrocells |
| Core Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| I/O Voltage Range | 1.5 V to 3.3 V | 1.5 V to 3.3 V | 1.5 V to 3.3 V | 1.5 V to 3.3 V | 1.5 V to 3.3 V | 1.5 V to 3.3 V |
| Speed Grade | -6 | -6 | -7 | -7 | -6 | -7 |
| Temperature Grade | Commercial | Commercial | Commercial | Industrial | Industrial | Industrial |
| Programming Interface | IEEE 1532 JTAG in-system programming | IEEE 1532 JTAG in-system programming | IEEE 1532 JTAG in-system programming | IEEE 1532 JTAG in-system programming | IEEE 1532 JTAG in-system programming | IEEE 1532 JTAG in-system programming |
Diferenciadores clave
- Exact -6 speed and commercial-grade ordering configuration (frente a XC2C256-7FTG256C)
- Closest same-density FTG package-family option (frente a XC2C256-6FTG256C)
- Commercial configuration for standard-temperature deployments (frente a XC2C256-7FTG256I)
- 5.7 ns listed propagation-delay class (frente a XC2C256-6FTG256C)
Notas de diseño
Treat the 256-ball FTBGA land pattern as a constrained routing problem rather than a generic BGA symbol. Follow the AMD package drawing for ball locations, pad geometry, and solder-mask definition, and verify the PCB library against the exact FT256 order code. Keep power-distribution structures consistent with the datasheet's decoupling recommendations. Configuration and JTAG nets must be accessible during production test without introducing signal-integrity risks.
Assign 1.8 V to the core supply and configure every I/O bank only for a voltage supported by its external driver. The family supports 1.5 V to 3.3 V I/O operation, but mixed-voltage compatibility does not mean that every bank can be connected to every voltage independently. Review the pin-description table for bank boundaries and unused I/O behavior, then place the required bulk and high-frequency bypass capacitors near their associated supply balls.
Use the manufacturer timing and I/O specifications when choosing external drivers, series termination, and pull components. The listed 5.7 ns propagation-delay class describes the device class, not the complete system path through package, PCB, connectors, and receiving logic. Analyze clock, configuration, and JTAG nets for adequate rise and fall times, and keep sensitive routing away from switching nodes and high-current return paths.
Do not substitute a related XC2C256 suffix solely because the macrocell count and BGA ball count match. Speed grade, temperature grade, package suffix, lead-free construction, and ordering details can differ between otherwise similar devices. Compare the exact manufacturer pin table, electrical tables, package drawing, and qualification information for every proposed replacement. Confirm that the programmed bitstream is compatible with the selected ordering code and programmed voltage.
Información de cumplimiento
The CoolRunner-II device is an industrial programmable-logic IC and is not an automotive-grade part. Specific RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations require confirmation from the manufacturer product documentation.
