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XC2C256-6FT256C - 256-Macrocell 1.8V CPLD | AMD Xilinx

Name: XC2C256-6FT256C - 256-Macrocell 1.8V CPLD | AMD Xilinx
Brand: AMD Xilinx
SKU: XC2C256-6FT256C

MPN： XC2C256-6FT256C ✓ 啟用中

1.8 V Vdss 256-ball FTBGA, 17 mm x 17 mm Package -6 Speed Nonvolatile Memory

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MOQ： 1 |

查看資料表 (PDF) 查看替代品

數量

XC2C256-6FT256C 概覽

AMD Xilinx XC2C256-6FT256C is a 256-macrocell CoolRunner-II complex programmable logic device operating from a 1.8 V core supply, with 1.5 V to 3.3 V I/O support and a 256-ball FTBGA package measuring 17 mm by 17 mm. Its 5.7 ns propagation-delay class and -6 speed designation make it suitable for general-purpose glue logic, control logic, signal conditioning, interface bridging, and low-power embedded programmable-logic designs.

A CPLD is a user-programmable semiconductor that combines configurable logic blocks, programmable interconnect, and I/O resources into a compact logic platform. The CPLD hierarchy places this device above individual programmable logic gates and macros, while remaining distinct from an FPGA because it uses a nonvolatile configuration architecture optimized for deterministic logic implementation. The CoolRunner-II family targets low-power, 1.8 V systems and supports in-system programming through an IEEE 1532 JTAG interface.

The XC2C256 provides 256 macrocells, 6K gates, 0.18 µm CMOS construction, and a -6 performance class with a listed 5.7 ns propagation delay. Its I/O structure supports mixed voltage operation from 1.5 V to 3.3 V, allowing integration with 1.8 V core logic and compatible external signal levels. Zero-power operation emphasizes low static consumption in designs where inactive logic sections should not create unnecessary current demand.

Because configuration data is retained in nonvolatile memory, the device can restore its programmed logic after power is restored without an external configuration PROM. In-system programming permits programming and testing on the assembled PCB, while JTAG boundary-scan support assists board bring-up and manufacturing test. These features are valuable in industrial controllers, telecommunications equipment, consumer interfaces, and compact automation modules.

The principal implementation concern is the 256-ball BGA footprint. PCB layout must follow the manufacturer's ball map, provide appropriate escape routing for JTAG and configuration signals, and account for the 17 mm by 17 mm land pattern. Pin assignments and bank voltage requirements should be checked against the pin-description table in the CoolRunner-II XC2C256 datasheet before finalizing a board.

This page combines the device specifications, real engineering search terms, same-footprint family options, application guidance, and design checks to support component selection and PCB implementation. Use the Request a Quote form for current commercial availability, while the manufacturer datasheet remains the controlling reference for pinout, timing, power, and programming details.

直接替換替代品，適用於 XC2C256-6FT256C — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

XC2C256-6FTG256C

✅ 直接替換

📦 256-ball FTBGA (FTG256)

Same 256-macrocell density and -6 speed class; FTG256 suffix differs by 0% in listed core voltage and performance class

📋 參考替代品（不在目錄中）

XC2C256-7FTG256C

✅ 直接替換 ⚠️ 規格未經驗證

📦 256-ball FTBGA (FTG256)

Same 256-macrocell density and 1.8 V family; -7 speed class differs from -6, a 16.7% suffix-class difference requiring timing review

📋 參考替代品（不在目錄中）

XC2C256-7FTG256I

✅ 直接替換

📦 256-ball FTBGA (FTG256)

Same 256-macrocell density and 1.8 V family; -7 speed and industrial I suffix differ from -6 commercial FT256C

📋 參考替代品（不在目錄中）

XC2C256-6FT256I

✅ 直接替換 ⚠️ 規格未經驗證

📦 256-ball FTBGA (FT256)

Same 256-macrocell density, 1.8 V core, -6 speed class, and FT256 package family; I suffix changes environmental qualification

📋 參考替代品（不在目錄中）

XC2C256-7FT256I

✅ 直接替換 ⚠️ 規格未經驗證

AMD

📦 256-ball FTBGA (FT256)

256 · 6000 · 16 · 7.5 ns (-7 speed grade) · 108 MHz · 184 · 1.8 V · 0.18 um CMOS

聯絡詢價

查看資料表 →

XC2C256-6FT256C 最大額定值與電氣特性

Device Type	CoolRunner-II complex programmable logic device
Macrocells	256 macrocells
Gate Count	6K gates
Core Supply Voltage	1.8 V
I/O Voltage Range	1.5 V to 3.3 V
Propagation Delay	5.7 ns
Speed Grade	-6
Process Technology	0.18 µm CMOS
封裝	256-ball FTBGA, 17 mm x 17 mm
Terminal Type	Ball
Number of Terminals	256 balls
安裝類型	Surface mount
Programming Interface	IEEE 1532 JTAG in-system programming
Configuration Memory	Nonvolatile
Power Architecture	Zero-power operation
Temperature Grade	Commercial

XC2C256-6FT256C 256-ball ftbga, 17 mm x 17 mm 腳位配置指南

XC2C256-6FT256C（256-ball ftbga, 17 mm x 17 mm 封裝）的腳位配置。此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。

XC2C256-6FT256C 的 256-ball ftbga, 17 mm x 17 mm 封裝腳位圖

無詳細腳位定義資料： XC2C256-6FT256C.

請參閱資料表以查看完整腳位配置。

典型應用

XC2C256-6FT256C 適用於 6 應用s: Industrial Control and Automation, Telecommunications Interface Logic, Consumer Electronics Control, Signal Conditioning and Data Acquisition, Programmable Hardware Acceleration, Board Test and JTAG Assistance.

🏭

Industrial Control and Automation

The XC2C256-6FT256C fits compact industrial controllers that coordinate sensors, actuators, interlocks, and machine-state logic. Its 256 macrocells provide more implementation capacity than small CPLDs, while the 1.8 V core and 1.5 V to 3.3 V I/O range support mixed-voltage interface logic. The listed commercial temperature grade makes it appropriate where the enclosure temperature remains within its specified limits. Place the device between field-interface circuitry and a host controller, and use the JTAG interface for programming and production test.

推薦

XC2C256-6FTG256C (Same-density family option for industrial interface logic) XC2C256-7FTG256C (Higher-speed family option for timing-critical control paths)

🌐

Telecommunications Interface Logic

The XC2C256-6FT256C is suitable for line-card interface logic that combines protocol formatting, status monitoring, and local control functions. Its 256 macrocells support parallel-to-serial conversion, framing logic, command decoding, and test-point routing without requiring a larger FPGA. The 5.7 ns propagation-delay class helps preserve margin in moderately timed control paths. Its 1.8 V core suits low-power telecommunications equipment, and the nonvolatile configuration architecture supports deterministic recovery after power restoration.

推薦

XC2C256-6FT256I (Industrial-temperature family option for line-card logic) XC2C256-7FT256I (Industrial family option with a different speed grade)

📱

Consumer Electronics Control

The XC2C256-6FT256C can implement control hubs, display sequencing, button handling, and peripheral arbitration in compact consumer products. The zero-power-oriented CoolRunner-II architecture is useful when inactive logic should avoid unnecessary static current demand. Its 256-macrocell count accommodates moderate glue-logic networks, while multi-voltage I/O support enables interfacing with 1.8 V and compatible external circuits. Validate each I/O bank against its supply voltage and confirm the commercial temperature range against the product's intended environment.

推薦

XC2C256-6FTG256C (Equivalent-density option for compact consumer control logic) XC2C256-7FTG256C (Same-family option for paths requiring additional timing margin)

🧩

Signal Conditioning and Data Acquisition

The XC2C256-6FT256C is appropriate for deterministic front-end logic that conditions digital sensor outputs before passing them to an ADC, MCU, or communications engine. Its 256 macrocells can combine filtering, event detection, pulse stretching, level conversion control, and acquisition sequencing in one device. The -6 speed class provides a listed 5.7 ns propagation delay, making it useful for close-coupled digital signal paths. Engineers should still check bank voltage limits, input slew requirements, and timing against external components in the manufacturer datasheet.

推薦

XC2C256-6FT256I (Same-speed family option with industrial environmental designation) XC2C256-7FT256I (Same-package industrial option for faster timing paths)

🖥️

Programmable Hardware Acceleration

The XC2C256-6FT256C can accelerate protocol engines, packet filters, CRC calculations, and custom hardware transformations that would otherwise burden a host processor. Its 256 macrocells offer a deterministic nonvolatile implementation for fixed or frequently reloaded logic, while JTAG in-system programming shortens firmware integration and test cycles. The device is best suited to moderate parallel-logic workloads rather than large FPGA-class datapaths. Partition functions into hard real-time blocks and leave broad general-purpose processing to the host controller.

推薦

XC2C256-6FTG256C (Same-density option for protocol and CRC hardware engines) XC2C256-7FTG256C (Same-family option for increased timing margin)

🔧

Board Test and JTAG Assistance

The XC2C256-6FT256C can add board-level test logic, routing assistance, or system monitoring around a larger digital design. Its IEEE 1532 JTAG interface supports configuration and boundary-scan workflows, while 256 macrocells can implement test-sequence generation, fault isolation, and programmable interconnect logic. Because JTAG signals are shared with the configuration function, the board must provide controlled access through a connector, test points, or multiplexing arrangement. Production procedures should account for chain order and programming-security requirements.

推薦

XC2C256-6FT256I (Same-package option for industrial board-test equipment) XC2C256-7FTG256I (Industrial family option with a -7 speed designation)

推薦產品摘要

XC2C256-6FTG256C Same-density family option for industrial interface logic 用於： Industrial Control and Automation, Consumer Electronics Control, Programmable Hardware Acceleration XC2C256-7FTG256C Higher-speed family option for timing-critical control paths 用於： Industrial Control and Automation, Consumer Electronics Control, Programmable Hardware Acceleration XC2C256-6FT256I Industrial-temperature family option for line-card logic 用於： Telecommunications Interface Logic, Signal Conditioning and Data Acquisition, Board Test and JTAG Assistance XC2C256-7FT256I Industrial family option with a different speed grade 用於： Telecommunications Interface Logic, Signal Conditioning and Data Acquisition XC2C256-7FTG256I Industrial family option with a -7 speed designation 用於： Board Test and JTAG Assistance

What are the key specifications of XC2C256-6FT256C that engineers should know?

The XC2C256-6FT256C is a 256-macrocell, 1.8 V CoolRunner-II CPLD with 1.5 V to 3.3 V I/O capability, a 5.7 ns propagation-delay class, and a 256-ball FTBGA package. According to the AMD XC2C256 CoolRunner-II datasheet, the device uses 0.18 µm CMOS construction and supports IEEE 1532 JTAG in-system programming. Its 256-macrocell density makes it substantially larger than low-density CPLDs while remaining suitable for compact control, interface, and signal-processing logic.

What is the XC2C256-6FT256C and what is it used for?

The XC2C256-6FT256C is a low-power, nonvolatile CoolRunner-II CPLD designed for general-purpose programmable logic in 1.8 V systems. Its 256 macrocells can implement control logic, interface bridging, state machines, data conditioning, and peripheral-interface logic. The AMD family data identifies densities from 32 to 512 macrocells, multi-voltage I/O operation from 1.5 V to 3.3 V, and zero-power operation as central family characteristics.

Where can I download the XC2C256-6FT256C datasheet PDF?

The official XC2C256 CoolRunner-II datasheet is available from AMD through the DS094 document link on the manufacturer's documentation service. Use that document for the authoritative 256-ball pin description, electrical characteristics, timing tables, configuration details, and package drawings. The product-search links on commercial catalog pages are useful for basic identification, but the AMD document should control engineering decisions involving ball assignments, voltage banks, JTAG connections, and timing.

Where can I find the XC2C256-6FT256C pinout?

The XC2C256-6FT256C pinout is documented in the pin-description and package diagrams contained in the AMD XC2C256 CoolRunner-II datasheet. The device uses a 256-ball FTBGA package, so its land pattern cannot be inferred from a generic schematic symbol. Before routing, assign every power, ground, I/O, configuration, and JTAG ball by consulting the manufacturer pin table and confirm the PCB library against the 17 mm by 17 mm package drawing.

How does XC2C256-6FT256C compare with XC2C256-6FTG256C?

XC2C256-6FTG256C is the same CoolRunner-II density and -6 speed class in the corresponding 256-ball FTG package designation, making it the closest same-family option for a design that qualifies its package suffix. The XC2C256-6FT256C has a listed 5.7 ns propagation-delay class and 256 macrocells. Before substitution, compare the exact package drawing, ball map, electrical limits, lifecycle status, and qualification markings for both ordered part numbers.

Is XC2C256-6FT256C suitable for industrial automation applications?

The XC2C256-6FT256C is suitable for industrial automation logic when its commercial temperature grade and electrical limits fit the operating environment. Its 256 macrocells support control sequencing, machine interfaces, and signal conditioning, while nonvolatile configuration permits operation after power restoration. The listed part is classified as commercial grade; use the manufacturer temperature and product tables to determine whether an industrial-temperature variant is required for the deployment.

What can replace XC2C256-6FT256C without changing the PCB?

XC2C256-6FTG256C is the closest same-footprint family alternative identified for the XC2C256-6FT256C, retaining the 256-macrocell density, -6 speed designation, and 256-ball package family. A PCB-formatted replacement should still be approved only after comparing the exact ball map, core and I/O voltage limits, timing, power-up behavior, programming interface, and qualification grade. Generic CPLDs cannot be treated as drop-in replacements without this engineering review.

Is XC2C256-6FT256C the same as XC2C256-7FTG256C?

No, XC2C256-7FTG256C belongs to the same 256-macrocell CoolRunner-II family and 256-ball package family, but its -7 designation identifies a different speed grade from the -6 XC2C256-6FT256C. The target has a listed 5.7 ns propagation-delay class. This distinction matters for timing closure, so the -7 part should not be treated as an electrically identical substitution even where the package family is shared.

What is the best AMD Xilinx equivalent for XC2C256-6FT256C?

XC2C256-6FTG256C is the closest AMD Xilinx family equivalent because it preserves the XC2C256 density, -6 speed class, and 256-ball FTG package family. The suffix can encode package and qualification distinctions, so engineers should compare the exact ordering code rather than assume equivalence. Verify the manufacturer pin table, supported voltage banks, thermal ratings, and programming configuration before approving a replacement.

What is the difference between XC2C256-6FT256C and XC2C256-7FT256I?

The XC2C256-6FT256C is a commercial-grade, -6 speed option with a listed 5.7 ns propagation-delay class, while XC2C256-7FT256I is identified by a -7 speed suffix and an industrial-temperature suffix. Both remain in the 256-macrocell CoolRunner-II family and use the corresponding 256-ball FT package family. The XC2C256-7FT256I is not a timing-identical replacement because its speed grade differs.

When should I choose XC2C256-6FT256C over a -7 family variant?

Choose XC2C256-6FT256C when the design requires the -6 speed class, uses the exact FT256C ordering configuration, and operates within the commercial environmental limits of that part. A -7 variant belongs to the same density and package family but represents a different speed designation and may carry different environmental or ordering attributes. Select the exact variant from timing closure, qualification, sourcing, and PCB documentation rather than from macrocell count alone.

How much power does XC2C256-6FT256C consume?

The XC2C256-6FT256C is designed around a 1.8 V core supply and a low-power, zero-power-operation architecture, but its exact supply and I/O currents depend on the configured logic, I/O state, switching activity, and voltage. Use the AMD datasheet's quiescent-current, dynamic-current, and power-estimation sections for a design-specific calculation. Request the complete datasheet and package data if a production power budget requires a value at a particular operating condition.

Does XC2C256-6FT256C support JTAG programming?

Yes, the XC2C256-6FT256C supports in-system programming through an IEEE 1532 JTAG interface. The AMD CoolRunner-II family data identifies JTAG as the in-system programming route and also describes JTAG boundary-scan support. The board design should reserve the required configuration and JTAG pins, route them consistently with the manufacturer recommendations, and include an appropriate connector or test access strategy.

Where can I buy XC2C256-6FT256C and what is its lead time?

Use the Request a Quote form on this page to request current XC2C256-6FT256C availability, lot traceability, and a lead-time commitment. The target is identified in the AMD/Xilinx catalog as a 256-macrocell, 1.8 V CoolRunner-II CPLD in a 256-ball FTBGA package. Commercial status can vary by lot and package code, so procurement should confirm the exact suffix, delivery quantity, and manufacturing traceability.

Can XC2C256-6FT256C be programmed in-system on the assembled PCB?

Yes, the XC2C256-6FT256C supports in-system programming using the IEEE 1532 JTAG interface, so programming can occur after PCB assembly. Its nonvolatile configuration architecture retains the programmed logic, allowing operation after power restoration without loading from an external PROM. Production designs should still account for the JTAG chain, programming voltage, access signals, and security requirements defined in the CoolRunner-II programming documentation.

工程參考資料，適用於 XC2C256-6FT256C — 比較、設計指引及合規資訊。

選型指南

Choose XC2C256-6FT256C when the design specifically calls for the -6 speed class, the FT256 commercial ordering configuration, and a 256-macrocell CoolRunner-II device. XC2C256-6FTG256C is the closest option to investigate when the FTG package suffix is preferred, but the exact package drawing and ball map must still be compared. Choose an I-suffix variant such as XC2C256-6FT256I when industrial environmental qualification matters more than the commercial designation. Select a -7 option only after confirming that its timing grade and order code satisfy the system requirements. Macrocell count alone is insufficient for approval: verify voltage banks, JTAG behavior, nonvolatile configuration, package geometry, and thermal requirements against the AMD datasheet.

與替代品比較

參數	本產品	XC2C256-6FTG256C	XC2C256-7FTG256C	XC2C256-7FTG256I	XC2C256-6FT256I	XC2C256-7FT256I
Brand	AMD Xilinx	AMD Xilinx	AMD Xilinx	AMD Xilinx	AMD Xilinx	AMD Xilinx
Package	256-ball FTBGA (FT256), 17 mm x 17 mm	256-ball FTBGA (FTG256)	256-ball FTBGA (FTG256)	256-ball FTBGA (FTG256)	256-ball FTBGA (FT256)	256-ball FTBGA (FT256)
Device Type	CoolRunner-II CPLD	CoolRunner-II CPLD	CoolRunner-II CPLD	CoolRunner-II CPLD	CoolRunner-II CPLD	CoolRunner-II CPLD
Macrocells	256 macrocells	256 macrocells	256 macrocells	256 macrocells	256 macrocells	256 macrocells
Core Supply Voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
I/O Voltage Range	1.5 V to 3.3 V	1.5 V to 3.3 V	1.5 V to 3.3 V	1.5 V to 3.3 V	1.5 V to 3.3 V	1.5 V to 3.3 V
Speed Grade	-6	-6	-7	-7	-6	-7
Temperature Grade	Commercial	Commercial	Commercial	Industrial	Industrial	Industrial
Programming Interface	IEEE 1532 JTAG in-system programming	IEEE 1532 JTAG in-system programming	IEEE 1532 JTAG in-system programming	IEEE 1532 JTAG in-system programming	IEEE 1532 JTAG in-system programming	IEEE 1532 JTAG in-system programming

主要差異化特點

Exact -6 speed and commercial-grade ordering configuration (對比XC2C256-7FTG256C)
Closest same-density FTG package-family option (對比XC2C256-6FTG256C)
Commercial configuration for standard-temperature deployments (對比XC2C256-7FTG256I)
5.7 ns listed propagation-delay class (對比XC2C256-6FTG256C)

設計說明

Treat the 256-ball FTBGA land pattern as a constrained routing problem rather than a generic BGA symbol. Follow the AMD package drawing for ball locations, pad geometry, and solder-mask definition, and verify the PCB library against the exact FT256 order code. Keep power-distribution structures consistent with the datasheet's decoupling recommendations. Configuration and JTAG nets must be accessible during production test without introducing signal-integrity risks.

Assign 1.8 V to the core supply and configure every I/O bank only for a voltage supported by its external driver. The family supports 1.5 V to 3.3 V I/O operation, but mixed-voltage compatibility does not mean that every bank can be connected to every voltage independently. Review the pin-description table for bank boundaries and unused I/O behavior, then place the required bulk and high-frequency bypass capacitors near their associated supply balls.

Use the manufacturer timing and I/O specifications when choosing external drivers, series termination, and pull components. The listed 5.7 ns propagation-delay class describes the device class, not the complete system path through package, PCB, connectors, and receiving logic. Analyze clock, configuration, and JTAG nets for adequate rise and fall times, and keep sensitive routing away from switching nodes and high-current return paths.

Do not substitute a related XC2C256 suffix solely because the macrocell count and BGA ball count match. Speed grade, temperature grade, package suffix, lead-free construction, and ordering details can differ between otherwise similar devices. Compare the exact manufacturer pin table, electrical tables, package drawing, and qualification information for every proposed replacement. Confirm that the programmed bitstream is compatible with the selected ordering code and programmed voltage.

合規資訊

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

無鉛

Unknown

無鹵

Unknown

衝突礦產

Unknown

The CoolRunner-II device is an industrial programmable-logic IC and is not an automotive-grade part. Specific RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations require confirmation from the manufacturer product documentation.

資料驗證日期： 2026-11-08 — 資料由 XAIPART 元件工程團隊驗證及整理

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