XC7A50T-1CS324I - 52,160 Logic Cell Artix-7 FPGA | AMD
N.º de pieza: XC7A50T-1CS324I ✓ Activo| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
XC7A50T-1CS324I Descripción general
An FPGA is a semiconductor whose digital function is defined by loading a configuration bitstream after fabrication. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed during development, revision, or field updates. Artix-7 devices combine programmable logic, configurable I/O, block RAM, digital signal-processing resources, clocking, and memory interfaces in one integrated device.
The XC7A50T-1CS324I provides 4,075 configurable logic blocks according to the supplied product data. Its 52,160 logic elements, 2,764,800 RAM bits, and 210 programmable I/O pins make it suitable for embedded control, industrial automation, communications, instrumentation, data acquisition, interface aggregation, and compact custom signal-processing systems. The CSPBGA package supports high-density PCB integration but requires careful escape routing and package-aware layout.
The suffix identifies the speed grade, package, and temperature qualification of the selected orderable device. The verified manufacturer-linked data describes a 0.95 V to 1.05 V supply range and an industrial junction-temperature range of -40°C to 100°C. Designers should therefore verify the complete electrical, timing, pinout, power, and configuration requirements against the applicable AMD Artix-7 documentation before schematic capture.
Typical design work involves assigning clocking and configuration pins, planning bank-specific supply rails, decoupling the package power balls, routing high-speed interfaces with controlled impedance, and validating the selected configuration bitstream on the finished board. Because FPGA designs depend on device, package, speed grade, and tool settings, a board should not be treated as interchangeable with another FPGA merely because its logic-cell count is similar.
This product page consolidates verified source links and package-oriented engineering guidance, while separating unavailable pricing, pin mapping, and detailed timing data instead of estimating them. It supports sourcing and initial design planning for engineers who need an AMD Artix-7 device with 52,160 logic elements, 210 I/O pins, and a 324-CSPBGA package.
Alternativas directas para XC7A50T-1CS324I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con XC7A50T-1CS324I (mismo factor de forma y huella) — difiere en Package, RoHS Status, DSP Slices, Process Technology, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
XC7A50T-1CSG324I
✅ Sustitución directa✓ En stock
$60.2 / unidad
Ver hoja de datos →XC7A50T-CSG324
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC7A50T-2CSG324I
✅ Sustitución directa✓ En stock
$25.4545 / unidad
Ver hoja de datos →XC7A50T-3CSG324I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
CWC2P50T-CSG324I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC7A50T-1CS324I Valores máximos y características eléctricas
| Device Type | Artix-7 FPGA |
| Programmable Logic Cells | 52,160 |
| Configurable Logic Blocks | 4,075 |
| RAM Bits | 2,764,800 |
| Programmable I/O Pins | 210 |
| Process Technology | 28 nm |
| Core Supply Voltage | 0.95 V to 1.05 V |
| Junction Temperature Range | -40°C to 100°C |
| Encapsulado | 324-CSPBGA |
| Package Pin or Ball Count | 324 |
| Tipo de montaje | Surface Mount |
| Logic Density | 52,160 logic elements |
| Device Family | Artix-7 |
| FPGA Type | Field-programmable gate array |
| Estado RoHS | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | not_applicable |
Guía de configuración de pines de XC7A50T-1CS324I 324
Configuración de pines para XC7A50T-1CS324I (encapsulado 324). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC7A50T-1CS324I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC7A50T-1CS324I es adecuado para 6 aplicacións: Industrial Control and Automation, Data Acquisition and Instrumentation, Communications and Interface Aggregation, Embedded Video and Image Processing, Test and Measurement Systems, Industrial Networking Gateways.
Industrial Control and Automation
The XC7A50T-1CS324I is a strong candidate for industrial controllers because it provides 52,160 logic cells, 4,075 configurable logic blocks, 2,764,800 RAM bits, and 210 programmable I/O pins in one Artix-7 device. These resources can combine state-machine logic, machine-control sequencing, communication interfaces, and local data buffering without requiring a separate controller for every function. The 0.95 V to 1.05 V core supply and -40°C to 100°C junction rating provide a defined starting point for industrial equipment, although the complete system still needs thermal, EMC, and functional-safety review. The 324-CSPBGA package also demands careful ball-escape routing, local decoupling, and package-aware constraint setup in the FPGA toolchain.
Recomendado
Data Acquisition and Instrumentation
Use the XC7A50T-1CS324I when an acquisition system needs programmable timing, parallel data handling, and interface aggregation close to the sensor or analog front end. Its 52,160 logic elements and 4,075 configurable logic blocks can implement acquisition state machines, channel control, data packing, trigger logic, and test-sequence orchestration, while 2,764,800 RAM bits provide on-chip buffering for short data bursts. The 210 programmable I/O pins can support multiple digital channels, subject to bank voltage, differential-pair, and package-specific constraints. Because the verified data does not state block RAM organization, DSP count, or maximum I/O rate, the design must use the current AMD data sheets and pinout files before selecting converters or clocking schemes.
Recomendado
Communications and Interface Aggregation
The XC7A50T-1CS324I fits communications equipment that needs adaptable protocol handling and multiple interface lanes. Its 52,160 logic cells can support packet framing, FIFOs, protocol converters, CRC processing, and control logic, while 4,075 configurable logic blocks allow parallel datapaths to be combined with serialized interfaces. The 210 I/O pins provide substantial board-level connectivity, but each interface must be checked against the exact package ballout, I/O-standard support, bank supply limits, and timing constraints. The 28 nm Artix-7 implementation should be paired with disciplined length matching, return-path continuity, and clocking architecture; the verified data confirms process technology and logic resources but does not provide a universal pinout or I/O performance table.
Recomendado
Embedded Video and Image Processing
The XC7A50T-1CS324I can be used in embedded image and video-processing systems when the design fits within its verified Artix-7 resource envelope. Programmable logic can implement pixel transport, timing generation, format conversion, test-pattern insertion, and control interfaces, while the 2,764,800 RAM bits can support line buffers or small frame-storage structures. The 210 I/O pins are useful for parallel sensor, display, or processor connectivity, although actual usable channels depend on package assignment and I/O-bank configuration. This is not a complete video subsystem: the verified source does not establish DSP resource count, maximum video lane rate, or specific display interface support, so engineers should validate the selected IP, pin placement, and timing with the current AMD toolchain and device documentation.
Recomendado
Test and Measurement Systems
For test and measurement equipment, the XC7A50T-1CS324I provides a flexible platform for sequencing, pattern generation, data capture, and instrument-control logic. The 52,160 logic elements can accommodate multiple parallel engines, while 2,764,800 RAM bits can buffer samples or pattern data and 4,075 configurable logic blocks provide implementation granularity for high-density control paths. The -40°C to 100°C industrial junction rating supports equipment designs that operate across controlled industrial environments, but the enclosure, airflow, and board thermal design determine the actual internal temperature. The 324-CSPBGA package requires careful power-plane partitioning and via access, and the design must use verified AMD pinout and timing resources before assigning sensitive analog or high-speed digital functions.
Recomendado
Industrial Networking Gateways
The XC7A50T-1CS324I is suitable as the programmable core in a gateway that bridges multiple local interfaces, applies protocol conversion, and buffers short packet or message bursts. Its 52,160 logic cells, 4,075 configurable logic blocks, and 210 I/O pins give designers room for parallel control logic and multiple external interfaces, while 2,764,800 RAM bits support local buffering. The -40°C to 100°C junction specification makes the device a candidate for industrial environments, but the final product must address power integrity, thermal rise, surge exposure, and long-term availability. Use the exact package ballout to reserve configuration pins and maintain high-speed return paths; do not infer a pin-compatible alternative from another Artix-7 density or suffix without validation.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC7A50T-1CS324I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC7A50T-1CSG324I | XC7A50T-CSG324 | XC7A50T-2CSG324I | XC7A50T-3CSG324I | CWC2P50T-CSG324I |
|---|---|---|---|---|---|---|
| Package | 324-CSPBGA | 324-LFBGA/CSPBGA | 324-CSPBGA family package | 324-CSPBGA | 324-CSPBGA | 324-CSPBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Artix-7 | Artix-7 | Artix-7 family | Artix-7 family | Artix-7 family | Artix-7-related localization candidate |
Diferenciadores clave
- Exact CS324I orderable-device identity (frente a XC7A50T-1CSG324I)
- Verified resource envelope (frente a CWC2P50T-CSG324I)
- Industrial temperature specification (frente a XC7A50T-1CSG324I)
- Documented 28 nm process (frente a CWC2P50T-CSG324I)
Notas de diseño
Use the current AMD Artix-7 package pinout file as the authority for every 324-CSPBGA ball assignment. The verified data establishes the package and 210 programmable I/O pins, but not the complete ball map. Assign power, ground, configuration, clock, and user I/O pins before placing decoupling or high-speed routes, and check differential pairs and I/O standards against the selected bank plan. Because the package has 324 balls, provide adequate via access and escape-routing channels rather than relying on a generic BGA footprint.
Implement the 0.95 V to 1.05 V core supply requirement with a power architecture that separates core and I/O-bank requirements, checks sequencing, and provides local ceramic decoupling at the package balls. The supplied data does not provide recommended capacitor values, current limits, or power-up timing, so do not infer those values from the nominal voltage. Validate the regulator, plane geometry, via current, ripple, startup behavior, and worst-case utilization against the current AMD power guidance before schematic release.
Route clocks, high-speed serial interfaces, and parallel source-synchronous paths with controlled impedance and continuous return paths. The XC7A50T-1CS324I has 210 programmable I/O pins, but available channels depend on package placement, voltage banks, and device constraints. Keep sensitive configuration and clock routing away from noisy switching nodes, use symmetry where required by the interface specification, and constrain timing in the FPGA toolchain. Verify the final layout with the exact package files and post-route timing rather than relying on nominal logic-cell count.
The verified industrial junction-temperature range is -40°C to 100°C, but that rating is not a substitute for board thermal analysis. Estimate total dissipation from the actual design utilization, I/O activity, core voltage, and auxiliary rails, then size copper planes, thermal vias, airflow, or enclosure heat paths accordingly. Keep sensitive converters and clocks away from the hottest FPGA region where practical, and validate both steady-state and transient operation. The supplied data does not provide thermal resistance or power numbers, so these calculations remain design-team estimates until confirmed in the manufacturer documentation.
Do not substitute a similarly named Artix-7 MPN without checking the exact ordering code. XC7A50T-1CSG324I, XC7A50T-CSG324, XC7A50T-2CSG324I, and XC7A50T-3CSG324I appear in the supplied search results, but shared package or family names do not prove identical speed grade, temperature grade, timing, configuration, or lifecycle status. Before a board change is approved, compare the manufacturer device table, package pinout, power specification, timing data, and approved configuration image.
Información de cumplimiento
The supplied web data does not provide verified RoHS, REACH, lead-free, halogen-free, or conflict-minerals statements for the target MPN. The industrial temperature grade is not, by itself, an AEC-Q100 automotive qualification.
