XC7K160T-3FFG676E - Kintex-7 FPGA 162K Cells | AMD
N.º de pieza: XC7K160T-3FFG676E ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $53.0295 | $53,03 |
XC7K160T-3FFG676E Descripción general
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. Unlike fixed-function ASICs, FPGAs contain a fabric of programmable logic blocks, interconnects, and I/O elements that can be reprogrammed in the field, making them ideal for prototyping, high-performance computing, and applications requiring hardware flexibility. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which also includes CPLDs, and are a key component in the semiconductor industry for accelerating workloads that benefit from parallel processing.
Key features of the XC7K160T-3FFG676E include 400 user I/O pins supporting various I/O standards, 11,980,800 bits of block RAM for on-chip data storage, and 400 DSP slices for high-speed digital signal processing. The -3 speed grade provides the highest performance, with internal clock speeds exceeding 600 MHz. The device also supports PCIe® Gen2, Gigabit Ethernet, and other high-speed serial transceivers, making it suitable for a wide range of communication and processing tasks.
Technically, the Kintex-7 family is optimized for best price-performance, offering a 2X improvement over the previous generation. The 28nm high-k metal gate (HKMG) process technology enables low power consumption while maintaining high logic density. The device includes advanced clock management tiles (CMTs) with PLLs and MMCMs for precise clock generation, and supports partial reconfiguration for dynamic logic updates.
Typical applications include software-defined radio (SDR), medical imaging, aerospace and defense systems, and high-performance computing. The XC7K160T-3FFG676E is particularly well-suited for applications requiring high-speed data processing, such as radar signal processing and video/image processing, where its combination of logic density, DSP capability, and high-speed transceivers provides a competitive advantage.
When designing with this device, ensure proper power supply decoupling on VCCINT, VCCAUX, and VCCO rails, and follow AMD's recommended PCB layout guidelines for high-speed signals. The device requires a 1.0V core voltage (VCCINT) and supports various I/O bank voltages (VCCO) depending on the interface standard.
Alternativas directas para XC7K160T-3FFG676E — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
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XC7K160T-2FFG676E
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XC7K160T-1FFG676E
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XC7K325T-3FFG676E
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XC7K160T-3FB676E
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XC7K160T-3FFG676I
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XC7K160T-3FFG676E Valores máximos y características eléctricas
| Family | Kintex-7 |
| Logic Cells | 162,240 |
| Block RAM | 11,980,800 bits |
| DSP Slices | 400 |
| User I/O | 400 |
| Encapsulado | 676-BBGA, FCBGA (27x27mm) |
| Speed Grade | -3 (highest performance) |
| Process Technology | 28nm |
| Core Voltage (VCCINT) | 1.0V |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
Configuración de pines de XC7K160T-3FFG676E
| Pin A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Pin B1 | VCCINT — Core voltage 1.0V |
| Pin B2 | GND — Ground |
| Pin C1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Pin C2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Pin D1 | VCCAUX — Auxiliary voltage 1.8V |
| Pin D2 | GND — Ground |
| Pin E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Pin E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Pin F1 | VCCO_0 — I/O bank 0 voltage |
| Pin F2 | GND — Ground |
Aplicaciones típicas
XC7K160T-3FFG676E es adecuado para 6 aplicacións: Software-Defined Radio (SDR), Medical Imaging, Aerospace and Defense, High-Performance Computing (HPC), Video and Image Processing, Wired and Wireless Networking.
Software-Defined Radio (SDR)
The XC7K160T-3FFG676E is ideal for SDR platforms due to its high logic density (162,240 cells) and 400 DSP slices, which enable efficient implementation of digital down/up converters, filters, and modulation algorithms. The -3 speed grade supports high-throughput signal processing, and the 400 user I/O allow flexible interfacing with ADCs/DACs. Its 28nm process ensures low power consumption, critical for portable and field-deployed SDR systems.
Recomendado
Medical Imaging
In medical imaging systems like ultrasound and CT scanners, the XC7K160T-3FFG676E provides the parallel processing power needed for real-time image reconstruction and enhancement. Its 400 DSP slices accelerate filtering and beamforming algorithms, while 11,980,800 bits of block RAM buffer large image frames. The -3 speed grade ensures low latency, critical for diagnostic accuracy. The 676-FCBGA package supports compact board designs in space-constrained medical equipment.
Recomendado
Aerospace and Defense
The XC7K160T-3FFG676E is well-suited for aerospace and defense applications such as radar signal processing and secure communications. Its high logic density and DSP capability enable complex beamforming and target detection algorithms. The device supports partial reconfiguration, allowing dynamic updates to signal processing chains without power cycling. The -3 speed grade provides the performance headroom needed for real-time threat analysis and electronic warfare systems.
Recomendado
High-Performance Computing (HPC)
In HPC applications, the XC7K160T-3FFG676E accelerates compute-intensive workloads such as financial modeling and scientific simulations. Its 400 DSP slices and high-speed serial transceivers enable efficient data movement between FPGAs and CPUs/GPUs. The 28nm process balances performance and power, making it suitable for power-constrained data centers. The -3 speed grade maximizes throughput for latency-sensitive algorithms.
Recomendado
Video and Image Processing
The XC7K160T-3FFG676E excels in video and image processing applications like 4K video surveillance and machine vision. Its logic cells implement complex video codecs and image enhancement algorithms, while block RAM stores multiple video frames for processing. The 400 user I/O support various video interface standards (HDMI, DisplayPort) via external PHYs. The -3 speed grade ensures real-time processing at high frame rates, essential for industrial inspection and security systems.
Recomendado
Wired and Wireless Networking
The XC7K160T-3FFG676E is used in networking equipment for packet processing, traffic shaping, and protocol conversion. Its high-speed transceivers support 10G Ethernet and PCIe, enabling high-bandwidth data paths. The logic density allows implementation of complex forwarding engines and security features like encryption. The -3 speed grade provides the performance needed for line-rate processing in enterprise switches and routers.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC7K160T-3FFG676E — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC7K160T-2FFG676E | XC7K160T-1FFG676E | XC7K325T-3FFG676E |
|---|---|---|---|---|
| Package | 676-FCBGA (27x27mm) | 676-FCBGA (27x27mm) - same | 676-FCBGA (27x27mm) - same | 676-FCBGA (27x27mm) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 162,240 | 162,240 | 162,240 | 326,080 |
| Speed Grade | -3 | -2 | -1 | -3 |
| Block RAM | 11,980,800 bits | 11,980,800 bits | 11,980,800 bits | 16,502,400 bits |
| DSP Slices | 400 | 400 | 400 | 840 |
| User I/O | 400 | 400 | 400 | 500 |
| Core Voltage | 1.0V | 1.0V | 1.0V | 1.0V |
Diferenciadores clave
- Highest speed grade (-3) in Kintex-7 family (frente a XC7K160T-2FFG676E)
- Optimized for best price-performance (frente a XC7K325T-3FFG676E)
- Balanced logic density and I/O count (frente a XC7K160T-1FFG676E)
Notas de diseño
The XC7K160T-3FFG676E requires a 1.0V core voltage (VCCINT) and 1.8V auxiliary voltage (VCCAUX). Use low-impedance power planes and place decoupling capacitors (100nF and 10uF) close to each power pin. Follow AMD's power distribution network (PDN) guidelines in UG475 to minimize voltage ripple and ensure reliable operation.
For high-speed serial transceivers, use controlled impedance traces (e.g., 100 ohm differential) and minimize via stubs. Follow AMD's PCB design guidelines for the 676-FCBGA package, including proper ground plane stitching and signal integrity practices. Refer to UG475 for detailed layout recommendations.
The 676-FCBGA package has a thermal resistance that requires adequate cooling for high-power designs. Use a heatsink or forced airflow if the device dissipates more than 5W. Calculate junction temperature using the device's theta-JA and ensure it stays within the operating range. Refer to the datasheet for thermal specifications.
Información de cumplimiento
RoHS compliant per distributor listings. AEC-Q100 not applicable for FPGA devices.
