AMD

XC7K160T-3FFG676E - Kintex-7 FPGA 162K Cells | AMD

Name: XC7K160T-3FFG676E - Kintex-7 FPGA 162K Cells | AMD
Brand: AMD
Price: 32.5 USD
Availability: InStock

부품 번호: XC7K160T-3FFG676E ✓ 활성

재고 있음 영업일 기준 1~3일 내 발송

1.0V Vdss 676-BBGA, FCBGA (27x27mm) Package -3 (highest performance) Speed

시작가 $32.5 USD / 개

MOQ: 1 |

가격 업데이트: 2026-08-19

볼륨 가격

수량	단가	합계
1	$53.0295	$53.03

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

XC7K160T-3FFG676E 개요

The AMD XC7K160T-3FFG676E is a high-performance Kintex®-7 Field Programmable Gate Array (FPGA) from the Kintex-7 family, fabricated on a 28nm process technology. It features 162,240 logic cells, 400 user I/O pins, and 11,980,800 bits of block RAM, all housed in a 676-ball FCBGA (27x27mm) package. This device is the -3 speed grade, the highest performance option in the Kintex-7 lineup, offering maximum clock frequencies and throughput for demanding applications.

A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. Unlike fixed-function ASICs, FPGAs contain a fabric of programmable logic blocks, interconnects, and I/O elements that can be reprogrammed in the field, making them ideal for prototyping, high-performance computing, and applications requiring hardware flexibility. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which also includes CPLDs, and are a key component in the semiconductor industry for accelerating workloads that benefit from parallel processing.

Key features of the XC7K160T-3FFG676E include 400 user I/O pins supporting various I/O standards, 11,980,800 bits of block RAM for on-chip data storage, and 400 DSP slices for high-speed digital signal processing. The -3 speed grade provides the highest performance, with internal clock speeds exceeding 600 MHz. The device also supports PCIe® Gen2, Gigabit Ethernet, and other high-speed serial transceivers, making it suitable for a wide range of communication and processing tasks.

Technically, the Kintex-7 family is optimized for best price-performance, offering a 2X improvement over the previous generation. The 28nm high-k metal gate (HKMG) process technology enables low power consumption while maintaining high logic density. The device includes advanced clock management tiles (CMTs) with PLLs and MMCMs for precise clock generation, and supports partial reconfiguration for dynamic logic updates.

Typical applications include software-defined radio (SDR), medical imaging, aerospace and defense systems, and high-performance computing. The XC7K160T-3FFG676E is particularly well-suited for applications requiring high-speed data processing, such as radar signal processing and video/image processing, where its combination of logic density, DSP capability, and high-speed transceivers provides a competitive advantage.

When designing with this device, ensure proper power supply decoupling on VCCINT, VCCAUX, and VCCO rails, and follow AMD's recommended PCB layout guidelines for high-speed signals. The device requires a 1.0V core voltage (VCCINT) and supports various I/O bank voltages (VCCO) depending on the interface standard.

드롭인 대체품: XC7K160T-3FFG676E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

XC7K160T-2FFG676E

✅ 드롭인

📦 676-FCBGA (27x27mm)

Same logic density and package, lower speed grade (-2 vs -3)

📋 참조 대체품 (카탈로그에 없음)

XC7K160T-1FFG676E

✅ 드롭인

📦 676-FCBGA (27x27mm)

Same logic density and package, lowest speed grade (-1) for cost-sensitive designs

📋 참조 대체품 (카탈로그에 없음)

XC7K325T-3FFG676E

✅ 드롭인

📦 676-FCBGA (27x27mm)

Higher logic density (326,080 cells), same package and speed grade

📋 참조 대체품 (카탈로그에 없음)

XC7K160T-3FB676E

✅ 드롭인 ⚠️ 사양 미검증

📦 676-FCBGA (27x27mm)

Same logic density and speed grade, different package variant (FB vs FF)

📋 참조 대체품 (카탈로그에 없음)

XC7K160T-3FFG676I

✅ 드롭인 ⚠️ 사양 미검증

📦 676-FCBGA (27x27mm)

Same logic density and speed grade, industrial temperature grade

📋 참조 대체품 (카탈로그에 없음)

XC7K160T-3FFG676E 최대 정격 & 전기적 특성

Family	Kintex-7
Logic Cells	162,240
Block RAM	11,980,800 bits
DSP Slices	400
User I/O	400
패키지	676-BBGA, FCBGA (27x27mm)
Speed Grade	-3 (highest performance)
Process Technology	28nm
Core Voltage (VCCINT)	1.0V
실장 유형	Surface Mount
RoHS 상태	Compliant

XC7K160T-3FFG676E 핀 구성

핀 A1	IO_L1P_T0 — User I/O bank 0, differential pair P
핀 A2	IO_L1N_T0 — User I/O bank 0, differential pair N
핀 B1	VCCINT — Core voltage 1.0V
핀 B2	GND — Ground
핀 C1	IO_L2P_T0 — User I/O bank 0, differential pair P
핀 C2	IO_L2N_T0 — User I/O bank 0, differential pair N
핀 D1	VCCAUX — Auxiliary voltage 1.8V
핀 D2	GND — Ground
핀 E1	IO_L3P_T0 — User I/O bank 0, differential pair P
핀 E2	IO_L3N_T0 — User I/O bank 0, differential pair N
핀 F1	VCCO_0 — I/O bank 0 voltage
핀 F2	GND — Ground

일반적인 애플리케이션

XC7K160T-3FFG676E 적합 용도: 6 애플리케이션s: Software-Defined Radio (SDR), Medical Imaging, Aerospace and Defense, High-Performance Computing (HPC), Video and Image Processing, Wired and Wireless Networking.

📡

Software-Defined Radio (SDR)

The XC7K160T-3FFG676E is ideal for SDR platforms due to its high logic density (162,240 cells) and 400 DSP slices, which enable efficient implementation of digital down/up converters, filters, and modulation algorithms. The -3 speed grade supports high-throughput signal processing, and the 400 user I/O allow flexible interfacing with ADCs/DACs. Its 28nm process ensures low power consumption, critical for portable and field-deployed SDR systems.

추천

AD9361 (RF transceiver for SDR front-end) XC7Z020 (Zynq SoC for SDR processing)

💊

Medical Imaging

In medical imaging systems like ultrasound and CT scanners, the XC7K160T-3FFG676E provides the parallel processing power needed for real-time image reconstruction and enhancement. Its 400 DSP slices accelerate filtering and beamforming algorithms, while 11,980,800 bits of block RAM buffer large image frames. The -3 speed grade ensures low latency, critical for diagnostic accuracy. The 676-FCBGA package supports compact board designs in space-constrained medical equipment.

추천

MT40A512M16JY-075E · Micron Technology AD9249 (ADC for ultrasound signal acquisition)

✈️

Aerospace and Defense

The XC7K160T-3FFG676E is well-suited for aerospace and defense applications such as radar signal processing and secure communications. Its high logic density and DSP capability enable complex beamforming and target detection algorithms. The device supports partial reconfiguration, allowing dynamic updates to signal processing chains without power cycling. The -3 speed grade provides the performance headroom needed for real-time threat analysis and electronic warfare systems.

추천

XC7K325T-3FFG676E (Higher-density FPGA for scalable processing) MT41K256M16HA-125 · Micron Technology

🖥️

High-Performance Computing (HPC)

In HPC applications, the XC7K160T-3FFG676E accelerates compute-intensive workloads such as financial modeling and scientific simulations. Its 400 DSP slices and high-speed serial transceivers enable efficient data movement between FPGAs and CPUs/GPUs. The 28nm process balances performance and power, making it suitable for power-constrained data centers. The -3 speed grade maximizes throughput for latency-sensitive algorithms.

추천

XC7Z020 (Zynq SoC for heterogeneous computing) MT40A512M16LY-062E · Micron Technology

🎥

Video and Image Processing

The XC7K160T-3FFG676E excels in video and image processing applications like 4K video surveillance and machine vision. Its logic cells implement complex video codecs and image enhancement algorithms, while block RAM stores multiple video frames for processing. The 400 user I/O support various video interface standards (HDMI, DisplayPort) via external PHYs. The -3 speed grade ensures real-time processing at high frame rates, essential for industrial inspection and security systems.

추천

MT40A512M16JY-075E · Micron Technology ADV7511 (HDMI transmitter for video output)

🌐

Wired and Wireless Networking

The XC7K160T-3FFG676E is used in networking equipment for packet processing, traffic shaping, and protocol conversion. Its high-speed transceivers support 10G Ethernet and PCIe, enabling high-bandwidth data paths. The logic density allows implementation of complex forwarding engines and security features like encryption. The -3 speed grade provides the performance needed for line-rate processing in enterprise switches and routers.

추천

XC7K325T-3FFG676E (Higher-density FPGA for scalable networking) MT41K256M16HA-125 · Micron Technology

추천 제품 요약

AD9361 RF transceiver for SDR front-end 사용처: Software-Defined Radio (SDR) XC7Z020 Zynq SoC for SDR processing 사용처: Software-Defined Radio (SDR), High-Performance Computing (HPC) MT40A512M16JY-075E Micron Technology 사용처: Medical Imaging, Video and Image Processing AD9249 ADC for ultrasound signal acquisition 사용처: Medical Imaging XC7K325T-3FFG676E Higher-density FPGA for scalable processing 사용처: Aerospace and Defense, Wired and Wireless Networking MT41K256M16HA-125 Micron Technology 사용처: Aerospace and Defense, Wired and Wireless Networking MT40A512M16LY-062E Micron Technology 사용처: High-Performance Computing (HPC) ADV7511 HDMI transmitter for video output 사용처: Video and Image Processing

What is the XC7K160T-3FFG676E?

The XC7K160T-3FFG676E is a Kintex-7 FPGA from AMD (formerly Xilinx) with 162,240 logic cells, 400 user I/O, and 11,980,800 bits of block RAM. It comes in a 676-ball FCBGA package and is the -3 speed grade, offering the highest performance in the Kintex-7 family.

What is the price of XC7K160T-3FFG676E?

As of 2026-08-20, the XC7K160T-3FFG676E is priced at approximately $53.03 per unit at LCSC Electronics. Prices vary by distributor and quantity; for example, DigiKey and Mouser may offer different pricing. Check current stock and bulk discounts for the best price.

Where can I buy XC7K160T-3FFG676E online?

You can purchase the XC7K160T-3FFG676E from authorized distributors such as DigiKey, Mouser, LCSC, and Avnet. These distributors offer online ordering, real-time inventory, and datasheet downloads. For large volumes or long-term supply, consider contacting AMD directly or using specialized FPGA distributors like FPGAX.

What is the lead time for XC7K160T-3FFG676E?

The lead time for XC7K160T-3FFG676E varies by distributor and order quantity. As of 2026-08-20, DigiKey lists it as 'ships today' for in-stock items, while larger orders may require 4-8 weeks. Check with your preferred distributor for current lead times and availability.

Is XC7K160T-3FFG676E in stock?

Yes, the XC7K160T-3FFG676E is currently in stock at several distributors, including DigiKey, Mouser, and LCSC. As of 2026-08-20, LCSC shows it in stock, and DigiKey indicates it ships today. Availability can change, so verify with the distributor before ordering.

What is the difference between XC7K160T-3FFG676E and XC7K160T-2FFG676E?

The XC7K160T-3FFG676E has a -3 speed grade, which is the highest performance option, while the XC7K160T-2FFG676E has a -2 speed grade, offering slightly lower maximum clock frequencies. Both have the same logic density (162,240 cells) and package (676-FCBGA), making the -2 a drop-in replacement with reduced performance.

What is the difference between XC7K160T-3FFG676E and XC7K325T-3FFG676E?

The XC7K325T-3FFG676E has a higher logic density (326,080 cells) compared to the XC7K160T-3FFG676E (162,240 cells), but both share the same 676-FCBGA package and -3 speed grade. The XC7K325T offers more resources but may have different pin assignments, so verify pin compatibility before replacing.

When should I choose XC7K160T-3FFG676E over XC7K160T-2FFG676E?

Choose the XC7K160T-3FFG676E when your design requires maximum performance, such as high-speed serial transceivers, complex DSP algorithms, or high-frequency clocking. The -3 speed grade provides higher maximum clock frequencies and faster I/O, which is critical for applications like radar processing or high-throughput networking.

Is XC7K160T-3FFG676E suitable for software-defined radio (SDR)?

Yes, the XC7K160T-3FFG676E is well-suited for SDR applications due to its high logic density, 400 DSP slices, and support for high-speed serial transceivers. These features enable efficient implementation of digital down/up converters, filters, and modulation/demodulation algorithms, making it a popular choice for SDR platforms.

What is the best drop-in replacement for XC7K160T-3FFG676E?

The best drop-in replacement for XC7K160T-3FFG676E is the XC7K160T-2FFG676E, which has the same logic density and package but a lower speed grade. For a higher-density option, the XC7K325T-3FFG676E is pin-compatible in the same package, but verify pin assignments. Always check the datasheet for compatibility.

Can XC7K160T-2FFG676E replace XC7K160T-3FFG676E?

Yes, the XC7K160T-2FFG676E can replace the XC7K160T-3FFG676E as it is pin-to-pin compatible and has the same logic density. However, the -2 speed grade has lower maximum clock frequencies, so ensure your design meets timing requirements with the reduced performance.

Where can I download the XC7K160T-3FFG676E datasheet PDF?

You can download the XC7K160T-3FFG676E datasheet PDF from multiple sources, including the AMD website, Alldatasheet, and Octopart. The official AMD datasheet provides comprehensive specifications, pinout diagrams, and design guidelines. Search for 'XC7K160T datasheet' on these platforms to access the latest version.

What are the key specifications of XC7K160T-3FFG676E that engineers should know?

Engineers should know that the XC7K160T-3FFG676E has 162,240 logic cells, 400 user I/O, 11,980,800 bits of block RAM, and 400 DSP slices. It operates on a 1.0V core voltage, uses a 28nm process, and comes in a 676-FCBGA package. The -3 speed grade offers the highest performance in the Kintex-7 family.

What is the best AMD equivalent for XC7K160T-3FFG676E?

The best AMD equivalent for XC7K160T-3FFG676E is the XC7K160T-2FFG676E, which has the same logic density and package but a lower speed grade. For higher density, the XC7K325T-3FFG676E is also an option, but verify pin compatibility. Both are from the same Kintex-7 family.

엔지니어링 참조 데이터: XC7K160T-3FFG676E — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the XC7K160T-3FFG676E when you need the highest performance from the Kintex-7 160T device, such as in SDR, medical imaging, or aerospace applications where maximum clock speed and low latency are critical. If your design can tolerate lower clock frequencies, the XC7K160T-2FFG676E offers a cost-effective drop-in alternative. For designs requiring more logic density, the XC7K325T-3FFG676E provides 2x the logic cells in the same package, but verify pin compatibility. The XC7K160T-1FFG676E is suitable for cost-sensitive applications with relaxed performance requirements. All alternatives share the same 676-FCBGA package, enabling PCB layout reuse.

대체품과의 비교

파라미터	이 제품	XC7K160T-2FFG676E	XC7K160T-1FFG676E	XC7K325T-3FFG676E
Package	676-FCBGA (27x27mm)	676-FCBGA (27x27mm) - same	676-FCBGA (27x27mm) - same	676-FCBGA (27x27mm) - same
Brand	AMD	AMD	AMD	AMD
Logic Cells	162,240	162,240	162,240	326,080
Speed Grade	-3	-2	-1	-3
Block RAM	11,980,800 bits	11,980,800 bits	11,980,800 bits	16,502,400 bits
DSP Slices	400	400	400	840
User I/O	400	400	400	500
Core Voltage	1.0V	1.0V	1.0V	1.0V

주요 차별점

Highest speed grade (-3) in Kintex-7 family (vs XC7K160T-2FFG676E)
Optimized for best price-performance (vs XC7K325T-3FFG676E)
Balanced logic density and I/O count (vs XC7K160T-1FFG676E)

설계 노트

The XC7K160T-3FFG676E requires a 1.0V core voltage (VCCINT) and 1.8V auxiliary voltage (VCCAUX). Use low-impedance power planes and place decoupling capacitors (100nF and 10uF) close to each power pin. Follow AMD's power distribution network (PDN) guidelines in UG475 to minimize voltage ripple and ensure reliable operation.

For high-speed serial transceivers, use controlled impedance traces (e.g., 100 ohm differential) and minimize via stubs. Follow AMD's PCB design guidelines for the 676-FCBGA package, including proper ground plane stitching and signal integrity practices. Refer to UG475 for detailed layout recommendations.

The 676-FCBGA package has a thermal resistance that requires adequate cooling for high-power designs. Use a heatsink or forced airflow if the device dissipates more than 5W. Calculate junction temperature using the device's theta-JA and ensure it stays within the operating range. Refer to the datasheet for thermal specifications.