XC7S50-1FGGA484C - Spartan-7 FPGA, 52K LC, 484-BGA | AMD/Xilinx
N.º de pieza: XC7S50-1FGGA484C ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $142.5 | $142,50 |
| 10 | $128.75 | $1.287,50 |
| 100 | $105.4 | $10.540,00 |
| 250 | $92.8 | $23.200,00 |
| 500 | $84.1 | $42.050,00 |
XC7S50-1FGGA484C Descripción general
What is an FPGA? A Field Programmable Gate Array is a programmable logic device whose logic fabric, interconnect, and I/O blocks can be reconfigured by the customer after manufacture. Within the broader semiconductor hierarchy, an FPGA sits under Programmable Logic > Logic IC > Integrated Circuit, while the Spartan-7 family targets the lowest-cost, lowest-power segment of AMD/Xilinx's 28 nm HPL (high-performance low-power) FPGAs, between the older Spartan-6 and the more capable Artix-7 lines.
Key features of this device include 8,150 Configurable Logic Blocks (slices), 120 DSP48E1 slices for fixed-point arithmetic, 2.7 Mb of distributed/block RAM total, an MMCM/PLL clock-management tile set with peak operation near 464 MHz (per published digchip summary), and hard IP for memory controllers including DDR3. Built on the 28 nm HPL process, the Spartan-7 line emphasizes low static and dynamic power compared with the Artix-7 family at similar logic density.
The architecture combines 6-input LUTs per slice, 32 x distributed RAM/LUTRAM per slice, dedicated 25 x 18 multipliers in each DSP48E1 slice, and high-performance SelectIO with support for LVDS, LVCMOS, SSTL, and HSTL I/O standards. Hard IP blocks for PCIe Gen1/Gen2 (in higher-density Spartan-7 parts) and 10/100/1000 Mbps Ethernet MAC are also available on selected packages.
Typical applications for the XC7S50-1FGGA484C include industrial motor control and factory automation, automotive driver-assistance sub-systems (with the industrial/I-grade sibling), consumer display and video bridging, low-cost software-defined radio front-ends, and IoT edge gateways where moderate DSP, plentiful I/O, and low cost are required.
Design considerations include careful SelectIO bank voltage planning (each bank has an independent VCCO reference), proper decoupling across VCCINT/VCCAUX/VCCO rails, and verifying IBIS models at the -1 speed grade corner before layout sign-off.
This page synthesizes distributor pricing, drop-in same-package alternatives, comparison data, and practical design notes - offering an integrated view that complements AMD's product page and the UG475 package pinout user guide.
Alternativas directas para XC7S50-1FGGA484C — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
XC7S50-1FGGA484I
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XC7S50-2FGGA484C
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XC7S50-2FGGA484I
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XC7S50-1FGG484I
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XC7S50-1FGGA484C Valores máximos y características eléctricas
| Series | Spartan-7 (XC7S50) |
| Family | Spartan-7 (28 nm HPL process) |
| Logic Cells | 52,160 |
| Slices / CLBs | 8,150 slices / 4,075 CLBs |
| Adaptive Logic Modules (ALMs) | 8,150 ALM |
| Total Block RAM | 2,700 Kbit (2.7 Mb) |
| DSP48E1 Slices | 120 |
| Maximum User I/Os | 250 |
| Encapsulado | 484-ball FGGA BGA (23 x 23 mm, 1.00 mm pitch) |
| Speed Grade | -1 |
| Temperature Grade | Commercial (C) |
| Core Voltage (VCCINT) | 0.95 V to 1.05 V |
| Process Node | 28 nm HPL |
| Clock Management | MMCM / PLL (1 MMCM, 2 PLL per tile set, count per device) |
| Memory Controller | Hard DDR3 controller IP block |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Lead-Free / Halogen-Free | Yes |
Guía de configuración de pines de XC7S50-1FGGA484C 484-ball fgga bga (23 x 23 mm, 1.00 mm pitch)
Configuración de pines para XC7S50-1FGGA484C (encapsulado 484-ball fgga bga (23 x 23 mm, 1.00 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC7S50-1FGGA484C.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC7S50-1FGGA484C es adecuado para 7 aplicacións: Industrial Motor Control & Factory Automation, Consumer Video Bridge & Display Controller, Low-Cost Software Defined Radio (SDR) Front-End, IoT Edge Gateway & Sensor Aggregation, Automotive Infotainment Auxiliary Controller, Test & Measurement Instrumentation Front-End, LED Video Wall Tile Controller.
Industrial Motor Control & Factory Automation
The XC7S50-1FGGA484C's 120 DSP48E1 slices handle field-oriented control (FOC) math for multi-axis motor drives, while 250 user I/Os accept encoder feedback (QEP, SSI, EnDat) and PWM outputs to power-stage gate drivers. Spartan-7's 28 nm HPL process gives low static power for always-on factory equipment, and the 2.7 Mb block RAM buffers diagnostic logs and oscilloscope captures. Use the hard DDR3 controller IP to external SDRAM for high-resolution current-loop sample buffers.
Recomendado
Consumer Video Bridge & Display Controller
The XC7S50's SelectIO banks support LVDS, HDMI bridge, MIPI D-PHY (via soft PHY), and TTL display interfaces through the 250 available I/Os. 2.7 Mb of block RAM acts as line buffers for 1080p60 video pipelines, and 120 DSP slices accelerate scaling, de-interlacing, and color-space conversion in real time. Spartan-7's low cost makes it ideal for retail signage, set-top boxes, and KVM switches where Artix-7 is over-spec.
Recomendado
Low-Cost Software Defined Radio (SDR) Front-End
With 120 DSP48E1 slices running at Spartan-7's typical 250-450 MHz Fmax, the XC7S50 implements wideband digital down-conversion (DDC), FIR filtering, and FFT pipelines for sub-6 GHz SDR receivers. The 484-BGA package supports large FPGA-to-ADC LVDS buses for direct RF sampling; 250 user I/Os accommodate multiple ADC/DAC data lanes plus external sync and clock distribution. This is the same silicon family used in academic and hobby SDR designs.
Recomendado
IoT Edge Gateway & Sensor Aggregation
The XC7S50 aggregates multiple SPI, I2C, UART, and Ethernet sensor streams through its 250 I/Os while running edge analytics in fabric logic. Spartan-7's low dynamic power extends battery life in solar-powered remote gateways, and the 8,150 slices handle lightweight TLS and message-queueing firmware in HDL. The hard DDR3 controller plus 2.7 Mb block RAM buffer bursty traffic from PoE-connected sensor clusters.
Recomendado
Automotive Infotainment Auxiliary Controller
Use the industrial-temperature sibling XC7S50-1FGGA484I in cabin HMI, instrument-cluster secondary displays, and rear-seat entertainment units where AEC-Q100 reliability is not required. The Spartan-7 fabric drives LVDS to display panels, parses CAN-FD traffic from the central gateway, and runs audio mixing via the DSP48E1 slices. 2.7 Mb block RAM stores graphical frame buffers and audio samples.
Recomendado
Test & Measurement Instrumentation Front-End
The XC7S50-1FGGA484C implements digital triggering, deep memory capture buffers, and protocol decoding (I2C/SPI/UART/CAN) for low-cost oscilloscopes, logic analyzers, and protocol analyzers. The 250 I/Os accept high-speed LVDS probe inputs, and the 120 DSP slices enable real-time FFT and signal-statistics computation. Spartan-7's low unit cost keeps BOM under target for entry-tier bench instruments sold in volume.
Recomendado
LED Video Wall Tile Controller
The XC7S50 drives hundreds of PWM channels for high-density LED video walls through its 250 I/Os, using 120 DSP slices for gamma correction, color-temperature adjustment, and refresh-rate management. Spartan-7's deterministic fabric timing avoids the flicker artifacts seen with general-purpose MCUs at high refresh rates. The 2.7 Mb block RAM caches one or more video frames for seamless tile-to-tile synchronization.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC7S50-1FGGA484C — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC7S50-1FGGA484I | XC7S50-2FGGA484C | XC7S50-2FGGA484I | XC7S50-1FGG484I |
|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | FGGA-484 BGA (23x23 mm, 1.00 mm pitch) | FGGA-484 BGA (same) | FGGA-484 BGA (same) | FGGA-484 BGA (same) | FGG-484 BGA (27x27 mm, 1.00 mm pitch - different ball map) |
| Speed Grade | -1 | -1 | -2 | -2 | -1 |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Logic Cells | 52,160 | 52,160 | 52,160 | 52,160 | 52,160 |
| Block RAM | 2,700 Kbit | 2,700 Kbit | 2,700 Kbit | 2,700 Kbit | 2,700 Kbit |
| DSP48E1 Slices | 120 | 120 | 120 | 120 | 120 |
| Maximum User I/Os | 250 | 250 | 250 | 250 | 250 |
| Estimated Unit Price (1 qty, as of 2026-10-11) | ~$142.50 | ~$155-175 | ~$155-175 | ~$175-200 | ~$140-160 |
Diferenciadores clave
- Lowest-power 52K-logic-cell FPGA in AMD's 28 nm HPL portfolio (frente a XC7A50T (Artix-7 equivalent with 6.6 Gb/s transceivers))
- Wide commercial + industrial sibling variants on identical FGGA484 footprint (frente a XC7S50-1CSG324C (smaller 324-ball package))
- 120 DSP48E1 slices for fixed-point arithmetic (frente a XC7S25 (smaller Spartan-7 with 45 DSP slices))
- Hard DDR3 memory controller IP (frente a Lattice ECP5-5G (no hard DDR controller))
Notas de diseño
Estimated: at typical industrial use (VCCINT = 1.0 V, VCCAUX = 1.8 V, VCCO = 1.8-3.3 V, utilization ~70% with 50% toggle rate), the Spartan-7 XC7S50 draws roughly 1.5-2.0 A from VCCINT. Provide at least 4 x 100 uF + 20 x 100 nF ceramic decoupling local to the FGGA484 package, and use a 6-layer PCB with dedicated power planes for VCCINT/VCCAUX/VCCO. The Spartan-7 PCB Design Guide (UG483) gives exact per-rail decoupling recipes.
Spartan-7 is a low-power family, but the 23 x 23 mm FGGA484 BGA can still dissipate 2-3 W in worst-case designs. Per the Spartan-7 datasheet thermal model, theta_JA on a 6-layer JEDEC test board is approximately 12 C/W. Estimated: at 2 W dissipation the junction-to-ambient rise is ~24 C, so commercial-temperature designs should keep ambient below 60 C. For industrial designs, derate ambient by another 15 C to maintain the 100 C junction ceiling.
The 1.00 mm pitch FGGA484 BGA demands a 4-layer minimum stack-up with microvia HDI if the board exceeds 4 routing layers between BGA rows. Recommended microvia stack-up: 1 oz copper outer layers, 0.5 oz inner, with 0.10 mm laser-drilled microvias at the BGA pads. Reference the Spartan-7 Packaging and Pinout Specification (UG475) for the exact ball-array footprint dimensions.
Dedicate one PCB layer as a continuous GND plane directly under the BGA to provide a low-impedance return path for all 250 I/Os. Each SelectIO bank has an independent VCCO; route bank-power pins together and add per-bank 0.1 uF + 10 uF decoupling within 5 mm of the bank VCCO balls. Use the Spartan-7 SelectIO User Guide (UG471) for bank-VCCO pairing rules.
Do not confuse the FGGA484 (23 x 23 mm, 1.00 mm pitch) and FGG484 (27 x 27 mm, 1.00 mm pitch) packages - they share ball count and pitch but have different ball maps and are NOT drop-in compatible. Verify the exact AMD package designator in the ordering code. The C suffix (commercial) versus I suffix (industrial) also determines the operating temperature window; using a C-grade part in an industrial enclosure will fail thermal stress tests.
Información de cumplimiento
RoHS and lead-free compliance per AMD/Xilinx product page. Spartan-7 is not AEC-Q100 qualified; for AEC-Q100 automotive applications use the XA Zynq UltraScale+ or specific automotive-grade Xilinx parts instead. Always check the AMD Product Longevity Statement for current production status.
