XC7S50-1FGGA484C - Spartan-7 FPGA, 52K LC, 484-BGA | AMD/Xilinx
MPN: XC7S50-1FGGA484C ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $142.5 | $142.50 |
| 10 | $128.75 | $1,287.50 |
| 100 | $105.4 | $10,540.00 |
| 250 | $92.8 | $23,200.00 |
| 500 | $84.1 | $42,050.00 |
XC7S50-1FGGA484C Overview
What is an FPGA? A Field Programmable Gate Array is a programmable logic device whose logic fabric, interconnect, and I/O blocks can be reconfigured by the customer after manufacture. Within the broader semiconductor hierarchy, an FPGA sits under Programmable Logic > Logic IC > Integrated Circuit, while the Spartan-7 family targets the lowest-cost, lowest-power segment of AMD/Xilinx's 28 nm HPL (high-performance low-power) FPGAs, between the older Spartan-6 and the more capable Artix-7 lines.
Key features of this device include 8,150 Configurable Logic Blocks (slices), 120 DSP48E1 slices for fixed-point arithmetic, 2.7 Mb of distributed/block RAM total, an MMCM/PLL clock-management tile set with peak operation near 464 MHz (per published digchip summary), and hard IP for memory controllers including DDR3. Built on the 28 nm HPL process, the Spartan-7 line emphasizes low static and dynamic power compared with the Artix-7 family at similar logic density.
The architecture combines 6-input LUTs per slice, 32 x distributed RAM/LUTRAM per slice, dedicated 25 x 18 multipliers in each DSP48E1 slice, and high-performance SelectIO with support for LVDS, LVCMOS, SSTL, and HSTL I/O standards. Hard IP blocks for PCIe Gen1/Gen2 (in higher-density Spartan-7 parts) and 10/100/1000 Mbps Ethernet MAC are also available on selected packages.
Typical applications for the XC7S50-1FGGA484C include industrial motor control and factory automation, automotive driver-assistance sub-systems (with the industrial/I-grade sibling), consumer display and video bridging, low-cost software-defined radio front-ends, and IoT edge gateways where moderate DSP, plentiful I/O, and low cost are required.
Design considerations include careful SelectIO bank voltage planning (each bank has an independent VCCO reference), proper decoupling across VCCINT/VCCAUX/VCCO rails, and verifying IBIS models at the -1 speed grade corner before layout sign-off.
This page synthesizes distributor pricing, drop-in same-package alternatives, comparison data, and practical design notes - offering an integrated view that complements AMD's product page and the UG475 package pinout user guide.
Drop-in alternatives for XC7S50-1FGGA484C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC7S50-1FGGA484I
✅ Drop-In📋 Reference alternative (not in catalog)
XC7S50-2FGGA484C
✅ Drop-In📋 Reference alternative (not in catalog)
XC7S50-2FGGA484I
✅ Drop-In📋 Reference alternative (not in catalog)
XC7S50-1FGG484I
✅ Drop-In📋 Reference alternative (not in catalog)
XC7S50-1FGGA484C Maximum Ratings & Electrical Characteristics
| Series | Spartan-7 (XC7S50) |
| Family | Spartan-7 (28 nm HPL process) |
| Logic Cells | 52,160 |
| Slices / CLBs | 8,150 slices / 4,075 CLBs |
| Adaptive Logic Modules (ALMs) | 8,150 ALM |
| Total Block RAM | 2,700 Kbit (2.7 Mb) |
| DSP48E1 Slices | 120 |
| Maximum User I/Os | 250 |
| Package | 484-ball FGGA BGA (23 x 23 mm, 1.00 mm pitch) |
| Speed Grade | -1 |
| Temperature Grade | Commercial (C) |
| Core Voltage (VCCINT) | 0.95 V to 1.05 V |
| Process Node | 28 nm HPL |
| Clock Management | MMCM / PLL (1 MMCM, 2 PLL per tile set, count per device) |
| Memory Controller | Hard DDR3 controller IP block |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free / Halogen-Free | Yes |
XC7S50-1FGGA484C 484-ball fgga bga (23 x 23 mm, 1.00 mm pitch) Pin Configuration Guide
Pin configuration for XC7S50-1FGGA484C (484-ball fgga bga (23 x 23 mm, 1.00 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC7S50-1FGGA484C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC7S50-1FGGA484C is suitable for 7 applications: Industrial Motor Control & Factory Automation, Consumer Video Bridge & Display Controller, Low-Cost Software Defined Radio (SDR) Front-End, IoT Edge Gateway & Sensor Aggregation, Automotive Infotainment Auxiliary Controller, Test & Measurement Instrumentation Front-End, LED Video Wall Tile Controller.
Industrial Motor Control & Factory Automation
The XC7S50-1FGGA484C's 120 DSP48E1 slices handle field-oriented control (FOC) math for multi-axis motor drives, while 250 user I/Os accept encoder feedback (QEP, SSI, EnDat) and PWM outputs to power-stage gate drivers. Spartan-7's 28 nm HPL process gives low static power for always-on factory equipment, and the 2.7 Mb block RAM buffers diagnostic logs and oscilloscope captures. Use the hard DDR3 controller IP to external SDRAM for high-resolution current-loop sample buffers.
Recommended
Consumer Video Bridge & Display Controller
The XC7S50's SelectIO banks support LVDS, HDMI bridge, MIPI D-PHY (via soft PHY), and TTL display interfaces through the 250 available I/Os. 2.7 Mb of block RAM acts as line buffers for 1080p60 video pipelines, and 120 DSP slices accelerate scaling, de-interlacing, and color-space conversion in real time. Spartan-7's low cost makes it ideal for retail signage, set-top boxes, and KVM switches where Artix-7 is over-spec.
Recommended
Low-Cost Software Defined Radio (SDR) Front-End
With 120 DSP48E1 slices running at Spartan-7's typical 250-450 MHz Fmax, the XC7S50 implements wideband digital down-conversion (DDC), FIR filtering, and FFT pipelines for sub-6 GHz SDR receivers. The 484-BGA package supports large FPGA-to-ADC LVDS buses for direct RF sampling; 250 user I/Os accommodate multiple ADC/DAC data lanes plus external sync and clock distribution. This is the same silicon family used in academic and hobby SDR designs.
Recommended
IoT Edge Gateway & Sensor Aggregation
The XC7S50 aggregates multiple SPI, I2C, UART, and Ethernet sensor streams through its 250 I/Os while running edge analytics in fabric logic. Spartan-7's low dynamic power extends battery life in solar-powered remote gateways, and the 8,150 slices handle lightweight TLS and message-queueing firmware in HDL. The hard DDR3 controller plus 2.7 Mb block RAM buffer bursty traffic from PoE-connected sensor clusters.
Recommended
Automotive Infotainment Auxiliary Controller
Use the industrial-temperature sibling XC7S50-1FGGA484I in cabin HMI, instrument-cluster secondary displays, and rear-seat entertainment units where AEC-Q100 reliability is not required. The Spartan-7 fabric drives LVDS to display panels, parses CAN-FD traffic from the central gateway, and runs audio mixing via the DSP48E1 slices. 2.7 Mb block RAM stores graphical frame buffers and audio samples.
Recommended
Test & Measurement Instrumentation Front-End
The XC7S50-1FGGA484C implements digital triggering, deep memory capture buffers, and protocol decoding (I2C/SPI/UART/CAN) for low-cost oscilloscopes, logic analyzers, and protocol analyzers. The 250 I/Os accept high-speed LVDS probe inputs, and the 120 DSP slices enable real-time FFT and signal-statistics computation. Spartan-7's low unit cost keeps BOM under target for entry-tier bench instruments sold in volume.
Recommended
LED Video Wall Tile Controller
The XC7S50 drives hundreds of PWM channels for high-density LED video walls through its 250 I/Os, using 120 DSP slices for gamma correction, color-temperature adjustment, and refresh-rate management. Spartan-7's deterministic fabric timing avoids the flicker artifacts seen with general-purpose MCUs at high refresh rates. The 2.7 Mb block RAM caches one or more video frames for seamless tile-to-tile synchronization.
Recommended
Recommended Products Summary
Engineering reference data for XC7S50-1FGGA484C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7S50-1FGGA484I | XC7S50-2FGGA484C | XC7S50-2FGGA484I | XC7S50-1FGG484I |
|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | FGGA-484 BGA (23x23 mm, 1.00 mm pitch) | FGGA-484 BGA (same) | FGGA-484 BGA (same) | FGGA-484 BGA (same) | FGG-484 BGA (27x27 mm, 1.00 mm pitch - different ball map) |
| Speed Grade | -1 | -1 | -2 | -2 | -1 |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Logic Cells | 52,160 | 52,160 | 52,160 | 52,160 | 52,160 |
| Block RAM | 2,700 Kbit | 2,700 Kbit | 2,700 Kbit | 2,700 Kbit | 2,700 Kbit |
| DSP48E1 Slices | 120 | 120 | 120 | 120 | 120 |
| Maximum User I/Os | 250 | 250 | 250 | 250 | 250 |
| Estimated Unit Price (1 qty, as of 2026-10-11) | ~$142.50 | ~$155-175 | ~$155-175 | ~$175-200 | ~$140-160 |
Key Differentiators
- Lowest-power 52K-logic-cell FPGA in AMD's 28 nm HPL portfolio (vs XC7A50T (Artix-7 equivalent with 6.6 Gb/s transceivers))
- Wide commercial + industrial sibling variants on identical FGGA484 footprint (vs XC7S50-1CSG324C (smaller 324-ball package))
- 120 DSP48E1 slices for fixed-point arithmetic (vs XC7S25 (smaller Spartan-7 with 45 DSP slices))
- Hard DDR3 memory controller IP (vs Lattice ECP5-5G (no hard DDR controller))
Design Notes
Estimated: at typical industrial use (VCCINT = 1.0 V, VCCAUX = 1.8 V, VCCO = 1.8-3.3 V, utilization ~70% with 50% toggle rate), the Spartan-7 XC7S50 draws roughly 1.5-2.0 A from VCCINT. Provide at least 4 x 100 uF + 20 x 100 nF ceramic decoupling local to the FGGA484 package, and use a 6-layer PCB with dedicated power planes for VCCINT/VCCAUX/VCCO. The Spartan-7 PCB Design Guide (UG483) gives exact per-rail decoupling recipes.
Spartan-7 is a low-power family, but the 23 x 23 mm FGGA484 BGA can still dissipate 2-3 W in worst-case designs. Per the Spartan-7 datasheet thermal model, theta_JA on a 6-layer JEDEC test board is approximately 12 C/W. Estimated: at 2 W dissipation the junction-to-ambient rise is ~24 C, so commercial-temperature designs should keep ambient below 60 C. For industrial designs, derate ambient by another 15 C to maintain the 100 C junction ceiling.
The 1.00 mm pitch FGGA484 BGA demands a 4-layer minimum stack-up with microvia HDI if the board exceeds 4 routing layers between BGA rows. Recommended microvia stack-up: 1 oz copper outer layers, 0.5 oz inner, with 0.10 mm laser-drilled microvias at the BGA pads. Reference the Spartan-7 Packaging and Pinout Specification (UG475) for the exact ball-array footprint dimensions.
Dedicate one PCB layer as a continuous GND plane directly under the BGA to provide a low-impedance return path for all 250 I/Os. Each SelectIO bank has an independent VCCO; route bank-power pins together and add per-bank 0.1 uF + 10 uF decoupling within 5 mm of the bank VCCO balls. Use the Spartan-7 SelectIO User Guide (UG471) for bank-VCCO pairing rules.
Do not confuse the FGGA484 (23 x 23 mm, 1.00 mm pitch) and FGG484 (27 x 27 mm, 1.00 mm pitch) packages - they share ball count and pitch but have different ball maps and are NOT drop-in compatible. Verify the exact AMD package designator in the ordering code. The C suffix (commercial) versus I suffix (industrial) also determines the operating temperature window; using a C-grade part in an industrial enclosure will fail thermal stress tests.
Compliance Information
RoHS and lead-free compliance per AMD/Xilinx product page. Spartan-7 is not AEC-Q100 qualified; for AEC-Q100 automotive applications use the XA Zynq UltraScale+ or specific automotive-grade Xilinx parts instead. Always check the AMD Product Longevity Statement for current production status.
