XC7VX690T-2FFG1157I - Virtex-7 XT FPGA 693K Logic Cells | AMD
N.º de pieza: XC7VX690T-2FFG1157I ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $721.93 | $721,93 |
XC7VX690T-2FFG1157I Descripción general
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of integrated circuits used in electronic systems. Unlike fixed-function ASICs, FPGAs offer reconfigurability, enabling rapid prototyping, hardware acceleration, and in-field updates, making them essential in aerospace, defense, automotive, industrial, and data center applications.
Key features of the XC7VX690T-2FFG1157I include 600 user I/Os, 54,190,080 bits of block RAM, and 693,120 logic cells. The device operates at a core voltage of 1V and supports a wide range of I/O standards. The -2 speed grade provides a balanced performance-power trade-off, while the industrial temperature grade (I suffix) ensures operation from -40°C to +100°C, making it suitable for harsh environments.
Technically, the Virtex-7 XT family integrates advanced clock management tiles (CMTs) with MMCM and PLL, high-speed serial transceivers, and hardened IP blocks for PCIe, Ethernet, and DDR3/DDR4 memory interfaces. The 28nm High-K Metal Gate (HKMG) process technology delivers high logic density and low power consumption. The device supports partial reconfiguration, enabling dynamic updates to specific logic regions without disrupting the entire design.
Typical applications include high-performance computing, radar and signal intelligence systems, medical imaging, broadcast video processing, and wired/wireless communications infrastructure. The 600 I/Os and high logic capacity make it ideal for complex digital signal processing (DSP) and protocol bridging.
When designing with this FPGA, careful attention must be paid to power supply decoupling, thermal management, and configuration bitstream security. The device requires multiple power rails (VCCINT, VCCAUX, VCCO) and a reliable configuration source, such as an SPI flash or JTAG interface.
Alternativas directas para XC7VX690T-2FFG1157I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con XC7VX690T-2FFG1157I (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Speed Grade, Temperature Grade.
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XC7VX690T-1FFG1157I
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XC7VX690T-2FFG1157C
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XC7VX690T-2FF1157I
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XC7VX690T-1FFG1157C
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$8000 / unidad
Ver hoja de datos →XC7VX690T-2FFG1157I Valores máximos y características eléctricas
| Family | Virtex-7 XT |
| Logic Cells | 693120 |
| Block RAM | 54190080 bits |
| Number of I/Os | 600 |
| Encapsulado | 1156-BBGA, FCBGA (FFG1157) |
| Technology | 28nm |
| Core Voltage | 1V |
| Speed Grade | -2 |
| Temperature Grade | Industrial (I) |
| Temperatura de funcionamiento | -40°C to +100°C |
| Tipo de montaje | Surface Mount |
| Número de pines | 1157 |
| Estado RoHS | Compliant |
| Lifecycle | Active |
| Lead Time | 22 weeks (as of 2026-08-20) |
Configuración de pines de XC7VX690T-2FFG1157I
| Pin A1 | GND — Ground |
| Pin A2 | IO_L1P_T0 — User I/O bank 0 |
| Pin A3 | VCCINT — Core voltage 1V |
| Pin B1 | IO_L1N_T0 — User I/O bank 0 |
| Pin B2 | VCCAUX — Auxiliary voltage 1.8V |
| Pin C1 | IO_L2P_T0 — User I/O bank 0 |
| Pin C2 | GND — Ground |
| Pin D1 | IO_L2N_T0 — User I/O bank 0 |
| Pin D2 | VCCO_0 — I/O bank 0 voltage |
| Pin E1 | IO_L3P_T0 — User I/O bank 0 |
| Pin E2 | GND — Ground |
| Pin F1 | IO_L3N_T0 — User I/O bank 0 |
Aplicaciones típicas
XC7VX690T-2FFG1157I es adecuado para 6 aplicacións: High-Performance Computing, Radar and Signal Intelligence, Medical Imaging, Broadcast Video Processing, Wired and Wireless Communications, Aerospace and Defense.
High-Performance Computing
The XC7VX690T-2FFG1157I excels in high-performance computing (HPC) applications such as data center acceleration, scientific simulation, and financial modeling. Its 693,120 logic cells and 600 I/Os enable massive parallel processing, while the 28nm process ensures low power consumption. The device can implement complex arithmetic pipelines, custom accelerators, and high-bandwidth memory interfaces, delivering significant performance gains over general-purpose CPUs. Its industrial temperature grade makes it suitable for edge computing in harsh environments.
Recomendado
Radar and Signal Intelligence
In radar and signal intelligence (SIGINT) systems, the XC7VX690T-2FFG1157I provides the logic density and DSP capabilities needed for real-time signal processing. Its 54,190,080 bits of block RAM support large FFT buffers and filter coefficients, while 600 I/Os interface with high-speed ADCs and DACs. The device's 28nm technology and industrial temperature range ensure reliable operation in defense and aerospace environments. Designers can implement beamforming, pulse compression, and spectrum analysis algorithms with high throughput and low latency.
Recomendado
Medical Imaging
The XC7VX690T-2FFG1157I is ideal for medical imaging systems such as CT scanners, MRI, and ultrasound. Its high logic capacity enables real-time image reconstruction, filtering, and enhancement algorithms. The 600 I/Os connect to high-resolution sensors and display interfaces, while the block RAM supports large image buffers. The industrial temperature grade ensures reliable operation in clinical environments. The device's reconfigurability allows for algorithm updates without hardware changes, extending product lifespan and reducing time-to-market.
Recomendado
Broadcast Video Processing
In broadcast video processing, the XC7VX690T-2FFG1157I handles high-resolution video streams (4K/8K) with its 693,120 logic cells and 600 I/Os. It can implement video codecs, scaling, color correction, and frame rate conversion in real time. The block RAM supports line buffers and frame stores, while the high-speed transceivers enable SDI and HDMI interfaces. The device's 28nm process reduces power consumption, making it suitable for studio and field equipment. Its reconfigurability allows for format upgrades and new feature additions.
Recomendado
Wired and Wireless Communications
The XC7VX690T-2FFG1157I is well-suited for wired and wireless communications infrastructure, including base stations, routers, and switches. Its high logic capacity supports protocol processing, packet inspection, and encryption. The 600 I/Os interface with PHY chips and network processors, while the block RAM handles packet buffers. The device's 28nm technology and industrial temperature grade ensure reliable operation in central offices and cell sites. Designers can implement flexible, software-defined networking (SDN) functions with hardware acceleration.
Recomendado
Aerospace and Defense
In aerospace and defense, the XC7VX690T-2FFG1157I provides the performance and reliability required for avionics, electronic warfare, and secure communications. Its industrial temperature grade (-40°C to +100°C) and 28nm process ensure operation in extreme conditions. The 693,120 logic cells enable complex signal processing, encryption, and sensor fusion. The device's reconfigurability allows for in-field updates and mission-specific configurations. FPGAX and other specialized distributors support long-term supply and traceability for defense programs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC7VX690T-2FFG1157I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC7VX690T-1FFG1157I | XC7VX690T-2FFG1157C | XC7VX690T-2FF1157I | XC7VX690T-2FFG1158I |
|---|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA (FFG1157) | 1156-BBGA, FCBGA (FFG1157) - same | 1156-BBGA, FCBGA (FFG1157) - same | 1156-BBGA, FCBGA (FF1157) - same | 1158-BBGA, FCBGA (FFG1158) - different |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 693120 | 693120 | 693120 | 693120 | 693120 |
| Number of I/Os | 600 | 600 | 600 | 600 | 600 |
| Block RAM | 54190080 bits | 54190080 bits | 54190080 bits | 54190080 bits | 54190080 bits |
| Speed Grade | -2 | -1 | -2 | -2 | -2 |
| Temperature Grade | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) | Commercial (0°C to +85°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) |
| RoHS | Compliant | Compliant | Compliant | Non-compliant (FF suffix) | Compliant |
Diferenciadores clave
- Industrial temperature grade (frente a XC7VX690T-2FFG1157C)
- Higher speed grade (frente a XC7VX690T-1FFG1157I)
- RoHS compliant package (frente a XC7VX690T-2FF1157I)
Notas de diseño
The XC7VX690T-2FFG1157I requires multiple power rails: VCCINT at 1V, VCCAUX at 1.8V, and VCCO depending on I/O standards. Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each power pin. A dedicated power management IC with sequencing is recommended to ensure proper power-up order (VCCINT, then VCCAUX, then VCCO).
With 693,120 logic cells, the XC7VX690T-2FFG1157I can dissipate significant power. The FCBGA package requires a heatsink or active cooling for high utilization designs. Ensure adequate airflow and consider thermal vias under the package. The industrial temperature grade allows operation up to +100°C junction temperature, but derating may be necessary.
The 1156-ball FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Follow AMD's layout guidelines for decoupling, ground planes, and signal integrity. Use the package pinout files from AMD's website (UG865) to ensure correct pin assignments. Avoid routing high-speed signals near the configuration pins.
Información de cumplimiento
RoHS compliance indicated by FFG package suffix. Other compliance data not specified in verified sources.
