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XC7VX690T-2FFG1157I - Virtex-7 XT FPGA 693K Logic Cells | AMD

MPN: XC7VX690T-2FFG1157I βœ“ Active
In Stock Ships in 1-3 business days
1V Vdss 1156-BBGA, FCBGA (FFG1157) Package -2 Speed
From $560 USD / Unit
MOQ: 1 |
Price updated: 2026-08-19
Volume Pricing
Qty Unit Price Extended
1 $721.93 $721.93
10 $680 $6,800.00
100 $640 $64,000.00
500 $600 $300,000.00
1,000 $560 $560,000.00
ℹ️ All prices are in USD

Drop-in alternatives for XC7VX690T-2FFG1157I β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

XC7VX690T-1FFG1157I

βœ… Drop-In
πŸ“¦ 1156-BBGA, FCBGA (FFG1157)
Same package and logic capacity, -1 speed grade (slower)

πŸ“‹ Reference alternative (not in catalog)

XC7VX690T-2FFG1157C

βœ… Drop-In
πŸ“¦ 1156-BBGA, FCBGA (FFG1157)
Same package and logic, commercial temperature grade (0Β°C to +85Β°C)

πŸ“‹ Reference alternative (not in catalog)

XC7VX690T-2FF1157I

βœ… Drop-In
πŸ“¦ 1156-BBGA, FCBGA (FF1157)
Same package and logic, non-RoHS package variant

πŸ“‹ Reference alternative (not in catalog)

XC7VX690T-1FFG1157C

βœ… Drop-In
AMD
πŸ“¦ 1156-BBGA, FCBGA (FFG1157)
Virtex-7 XT Β· 693120 Β· 54190080 bits Β· 600 Β· 1157-pin FC-BGA (FFG1157) Β· 28nm Β· 1V Β· -1

βœ“ In Stock

$8000 / Unit

View Datasheet β†’
ℹ️ 1 cross-package part(s) hidden β€” different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

XC7VX690T-2FFG1157I Maximum Ratings & Electrical Characteristics

Family Virtex-7 XT
Logic Cells 693120
Block RAM 54190080 bits
Number of I/Os 600
Package 1156-BBGA, FCBGA (FFG1157)
Technology 28nm
Core Voltage 1V
Speed Grade -2
Temperature Grade Industrial (I)
Operating Temperature -40Β°C to +100Β°C
Mounting Type Surface Mount
Number of Pins 1157
RoHS Status Compliant
Lifecycle Active
Lead Time 22 weeks (as of 2026-08-20)

XC7VX690T-2FFG1157I Pin Configuration

Electronic Component Package Diagram Default generic electronic component package diagram 1 2 3 Package
Pin A1 GND β€” Ground
Pin A2 IO_L1P_T0 β€” User I/O bank 0
Pin A3 VCCINT β€” Core voltage 1V
Pin B1 IO_L1N_T0 β€” User I/O bank 0
Pin B2 VCCAUX β€” Auxiliary voltage 1.8V
Pin C1 IO_L2P_T0 β€” User I/O bank 0
Pin C2 GND β€” Ground
Pin D1 IO_L2N_T0 β€” User I/O bank 0
Pin D2 VCCO_0 β€” I/O bank 0 voltage
Pin E1 IO_L3P_T0 β€” User I/O bank 0
Pin E2 GND β€” Ground
Pin F1 IO_L3N_T0 β€” User I/O bank 0

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for XC7VX690T-2FFG1157I Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC7VX690T-2FFG1157I is suitable for 6 applications: High-Performance Computing, Radar and Signal Intelligence, Medical Imaging, Broadcast Video Processing, Wired and Wireless Communications, Aerospace and Defense.

πŸ–₯️

High-Performance Computing

The XC7VX690T-2FFG1157I excels in high-performance computing (HPC) applications such as data center acceleration, scientific simulation, and financial modeling. Its 693,120 logic cells and 600 I/Os enable massive parallel processing, while the 28nm process ensures low power consumption. The device can implement complex arithmetic pipelines, custom accelerators, and high-bandwidth memory interfaces, delivering significant performance gains over general-purpose CPUs. Its industrial temperature grade makes it suitable for edge computing in harsh environments.

✈️

Radar and Signal Intelligence

In radar and signal intelligence (SIGINT) systems, the XC7VX690T-2FFG1157I provides the logic density and DSP capabilities needed for real-time signal processing. Its 54,190,080 bits of block RAM support large FFT buffers and filter coefficients, while 600 I/Os interface with high-speed ADCs and DACs. The device's 28nm technology and industrial temperature range ensure reliable operation in defense and aerospace environments. Designers can implement beamforming, pulse compression, and spectrum analysis algorithms with high throughput and low latency.

πŸ’Š

Medical Imaging

The XC7VX690T-2FFG1157I is ideal for medical imaging systems such as CT scanners, MRI, and ultrasound. Its high logic capacity enables real-time image reconstruction, filtering, and enhancement algorithms. The 600 I/Os connect to high-resolution sensors and display interfaces, while the block RAM supports large image buffers. The industrial temperature grade ensures reliable operation in clinical environments. The device's reconfigurability allows for algorithm updates without hardware changes, extending product lifespan and reducing time-to-market.

πŸ“Ί

Broadcast Video Processing

In broadcast video processing, the XC7VX690T-2FFG1157I handles high-resolution video streams (4K/8K) with its 693,120 logic cells and 600 I/Os. It can implement video codecs, scaling, color correction, and frame rate conversion in real time. The block RAM supports line buffers and frame stores, while the high-speed transceivers enable SDI and HDMI interfaces. The device's 28nm process reduces power consumption, making it suitable for studio and field equipment. Its reconfigurability allows for format upgrades and new feature additions.

🌐

Wired and Wireless Communications

The XC7VX690T-2FFG1157I is well-suited for wired and wireless communications infrastructure, including base stations, routers, and switches. Its high logic capacity supports protocol processing, packet inspection, and encryption. The 600 I/Os interface with PHY chips and network processors, while the block RAM handles packet buffers. The device's 28nm technology and industrial temperature grade ensure reliable operation in central offices and cell sites. Designers can implement flexible, software-defined networking (SDN) functions with hardware acceleration.

✈️

Aerospace and Defense

In aerospace and defense, the XC7VX690T-2FFG1157I provides the performance and reliability required for avionics, electronic warfare, and secure communications. Its industrial temperature grade (-40Β°C to +100Β°C) and 28nm process ensure operation in extreme conditions. The 693,120 logic cells enable complex signal processing, encryption, and sensor fusion. The device's reconfigurability allows for in-field updates and mission-specific configurations. FPGAX and other specialized distributors support long-term supply and traceability for defense programs.

What is the XC7VX690T-2FFG1157I?
The XC7VX690T-2FFG1157I is a Virtex-7 XT FPGA from AMD with 693,120 logic cells, 600 I/Os, and 54,190,080 bits of block RAM, packaged in a 1156-ball FCBGA. It operates at 1V core voltage and is built on 28nm technology, targeting high-performance applications.
What is the price of XC7VX690T-2FFG1157I?
As of 2026-08-20, the XC7VX690T-2FFG1157I is priced at approximately $721.93 per unit at LCSC, with volume discounts available. Prices vary by distributor and quantity; check DigiKey, Mouser, and Octopart for current quotes.
Where can I buy XC7VX690T-2FFG1157I online?
You can purchase the XC7VX690T-2FFG1157I from authorized distributors including DigiKey, Mouser, LCSC, and Avnet. These distributors offer real-time inventory, pricing, and datasheet downloads. Lead times are approximately 22 weeks as of May 2026.
What is the lead time for XC7VX690T-2FFG1157I?
The lead time for XC7VX690T-2FFG1157I is approximately 22 weeks as of May 2026, according to icallin.com. This extended lead time is due to high demand and supply chain constraints. Plan your procurement accordingly and consider alternative speed grades if urgent.
Is XC7VX690T-2FFG1157I in stock?
Yes, the XC7VX690T-2FFG1157I is currently in stock at LCSC and other distributors as of 2026-08-20. However, stock levels fluctuate; check DigiKey, Mouser, and Octopart for real-time availability and place orders early to avoid delays.
What is the difference between XC7VX690T-2FFG1157I and XC7VX690T-2FFG1157C?
The XC7VX690T-2FFG1157I is the industrial temperature grade (-40Β°C to +100Β°C), while the XC7VX690T-2FFG1157C is the commercial grade (0Β°C to +85Β°C). Both share the same 1157-pin footprint and logic capacity, making them drop-in replacements on the PCB, but the I version is suitable for harsher environments.
Can XC7VX690T-2FFG1157C replace XC7VX690T-2FFG1157I?
Yes, the XC7VX690T-2FFG1157C can replace the XC7VX690T-2FFG1157I in terms of physical footprint and logic capacity, as confirmed by icallin.com. However, the commercial grade has a narrower temperature range (0Β°C to +85Β°C), so ensure your application's operating environment is within this range.
What is the best drop-in replacement for XC7VX690T-2FFG1157I?
The best drop-in replacement for XC7VX690T-2FFG1157I is the XC7VX690T-1FFG1157I, which shares the same 1157-pin FCBGA package and logic capacity but has a -1 speed grade (slower). For higher performance, consider the XC7VX690T-2FFG1158I, but note it has 1158 pins and requires a different footprint.
Where can I download the XC7VX690T-2FFG1157I datasheet PDF?
You can download the XC7VX690T-2FFG1157I datasheet PDF from LCSC at https://www.lcsc.com/datasheet/C2684995.pdf, or from AMD's official website. The datasheet provides full specifications, pinout diagrams, and application notes.
Where can I find the XC7VX690T-2FFG1157I pinout?
The XC7VX690T-2FFG1157I pinout is available in the AMD Virtex-7 package pinout files, downloadable from AMD's developer resources page. The files include ASCII and CSV formats, as described in UG865. The pinout is also in the datasheet PDF.
What are the key specifications of XC7VX690T-2FFG1157I that engineers should know?
Engineers should know that the XC7VX690T-2FFG1157I has 693,120 logic cells, 600 user I/Os, 54,190,080 bits of block RAM, operates at 1V core voltage, and is packaged in a 1156-ball FCBGA. It is built on 28nm technology and supports industrial temperature ranges, making it suitable for high-performance, rugged applications.
Is XC7VX690T-2FFG1157I suitable for aerospace applications?
Yes, the XC7VX690T-2FFG1157I is suitable for aerospace applications due to its industrial temperature grade and high reliability. FPGAX specializes in sourcing FPGAs for aerospace, automotive, industrial, and defense sectors, indicating the device's suitability for these demanding environments.
What is the difference between XC7VX690T-2FFG1157I and XC7VX690T-2FF1157I?
The XC7VX690T-2FFG1157I and XC7VX690T-2FF1157I are nearly identical, both with 600 I/Os and 1157-pin FCBGA packages. The main difference is the package suffix: 'FFG' indicates a lead-free, RoHS-compliant package, while 'FF' may indicate an older or non-RoHS version. Verify the exact specifications in the datasheet.
What is the best AMD equivalent for XC7VX690T-2FFG1157I?
The best AMD equivalent for XC7VX690T-2FFG1157I is the XC7VX690T-1FFG1157I, which is pin-compatible and shares the same logic capacity but has a lower speed grade. For higher performance, the XC7VX690T-2FFG1158I offers similar logic but with 1158 pins, requiring a different PCB footprint.
What are the power supply requirements for XC7VX690T-2FFG1157I?
The XC7VX690T-2FFG1157I requires multiple power rails: VCCINT at 1V, VCCAUX at 1.8V, and VCCO depending on I/O standards. Proper decoupling with low-ESR capacitors is essential. Refer to the Virtex-7 datasheet and power management application notes for detailed requirements.

Engineering reference data for XC7VX690T-2FFG1157I β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the XC7VX690T-2FFG1157I when you need the highest performance (-2 speed grade) and industrial temperature range for demanding applications like aerospace, defense, and industrial signal processing. If your application operates in commercial temperatures (0Β°C to +85Β°C), the XC7VX690T-2FFG1157C offers the same logic capacity at a lower cost. For cost-sensitive designs where speed is less critical, the XC7VX690T-1FFG1157I provides a slower but more affordable option. If you require RoHS compliance, ensure the 'FFG' suffix; the 'FF' variant may not be lead-free. For designs needing a different footprint, consider the XC7VX690T-2FFG1158I, but note the 1158-pin package requires PCB changes. All alternatives share the same logic capacity and I/O count, enabling design reuse.

Comparison with Alternatives

Parameter This Product XC7VX690T-1FFG1157I XC7VX690T-2FFG1157C XC7VX690T-2FF1157I XC7VX690T-2FFG1158I
Package 1156-BBGA, FCBGA (FFG1157) 1156-BBGA, FCBGA (FFG1157) - same 1156-BBGA, FCBGA (FFG1157) - same 1156-BBGA, FCBGA (FF1157) - same 1158-BBGA, FCBGA (FFG1158) - different
Brand AMD AMD AMD AMD AMD
Logic Cells 693120 693120 693120 693120 693120
Number of I/Os 600 600 600 600 600
Block RAM 54190080 bits 54190080 bits 54190080 bits 54190080 bits 54190080 bits
Speed Grade -2 -1 -2 -2 -2
Temperature Grade Industrial (-40Β°C to +100Β°C) Industrial (-40Β°C to +100Β°C) Commercial (0Β°C to +85Β°C) Industrial (-40Β°C to +100Β°C) Industrial (-40Β°C to +100Β°C)
RoHS Compliant Compliant Compliant Non-compliant (FF suffix) Compliant

Key Differentiators

  • Industrial temperature grade (vs XC7VX690T-2FFG1157C)
  • Higher speed grade (vs XC7VX690T-1FFG1157I)
  • RoHS compliant package (vs XC7VX690T-2FF1157I)

Design Notes

The XC7VX690T-2FFG1157I requires multiple power rails: VCCINT at 1V, VCCAUX at 1.8V, and VCCO depending on I/O standards. Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each power pin. A dedicated power management IC with sequencing is recommended to ensure proper power-up order (VCCINT, then VCCAUX, then VCCO).

With 693,120 logic cells, the XC7VX690T-2FFG1157I can dissipate significant power. The FCBGA package requires a heatsink or active cooling for high utilization designs. Ensure adequate airflow and consider thermal vias under the package. The industrial temperature grade allows operation up to +100Β°C junction temperature, but derating may be necessary.

The 1156-ball FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Follow AMD's layout guidelines for decoupling, ground planes, and signal integrity. Use the package pinout files from AMD's website (UG865) to ensure correct pin assignments. Avoid routing high-speed signals near the configuration pins.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliance indicated by FFG package suffix. Other compliance data not specified in verified sources.

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