FPGA و CPLD
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M2GL010-VF256I - 12K LEs Industrial IGLOO2 FPGA | Microchip
The Microchip Technology M2GL010-VF256I is an IGLOO2 low-density field-programmable gate array with 12,084 logic elements, 138 I/O, and a 256-ball LFBGA package. It is an FPGA, meaning an integrated circuit whose digital logic can be configured after manufacture for bridging, I/O expansion, conversion, system management, and secure connectivity functions. The verified manufacturer product page identifies M2GL010 as an in-production device, while distributor listings identify M2GL010-VF256I as an industrial-temperature IGLOO2 FPGA with 256 LFBGA balls and 138 I/O. The M2GL010 family is described by Microchip as suitable for communications, industrial, and embedded applications. The IGLOO2 architecture combines programmable logic, embedded memory, and configurable I/O in a low-power package. The M2GL010-VF256I provides 12,084 logic elements, making it appropriate for compact control, interface, and signal-processing designs that require programmable hardware rather than a fixed-function ASIC. The 256-ball LFBGA package provides a high pin count and supports dense board layouts when the associated I/O and power requirements are carefully managed. Key verified attributes include the 12K LEs logic capacity, 138 I/O, 256 LFBGA package, industrial temperature grade, and surface-mount ball-grid construction. The product is associated with a 1.2 V device supply in the cross-reference data, while detailed operating conditions, memory configuration, I/O standards, power consumption, and timing figures were not included in the supplied verified results and are therefore not inferred here. A complete design should use the manufacturer datasheet and IGLOO2 pin-description guide for exact bank, voltage, and I/O rules. Typical applications include communications equipment, industrial automation, bridging functions, input/output expansion, protocol conversion, system management, and secure connectivity. The programmable architecture allows a design to be adapted after hardware fabrication, which can shorten development cycles for low-volume or evolving systems. The industrial grade designation is useful for equipment expected to operate beyond consumer-temperature environments, subject to the complete datasheet limits. Layout requires careful treatment of the 256-ball BGA, including via-in-pad or via-under-ball escape routing, plane continuity, and thermal management. The 1.2 V core rail and associated I/O supplies should be separated and decoupled according to the manufacturer guidance. Designers should also confirm the exact package ball map, unused-ball treatment, configuration mechanism, clocking requirements, and power-up behavior before releasing a PCB. This page combines verified distributor listings, the Microchip product page, and the IGLOO2 family datasheet resources with engineering-focused application guidance. It distinguishes confirmed M2GL010 attributes from parameters that require confirmation from the manufacturer datasheet, helping procurement, hardware, and firmware engineers evaluate the M2GL010-VF256I without relying on unsupported substitute claims.
M2GL010-VF400 - 12K LEs, 195 I/O IGLOO2 FPGA | Microchip
The Microchip Technology M2GL010-VF400 is an IGLOO2 low-density flash FPGA with 12K logic elements, 195 I/O, and a 400-LFBGA package. It is identified as a 400 VFBGA device in distributor data and uses 0.8 mm ball pitch according to the supplied Hotenda result. The device is intended for programmable logic, I/O expansion, signal conversion, bridging, system management, communications, industrial, medical, defense, and aviation applications. An FPGA is a programmable semiconductor containing configurable logic, memory, and I/O resources that can be reconfigured after manufacture. Microchip positions the IGLOO2 family for general-purpose functions such as bridging, I/O expansion, data conversion, secure connectivity, video or image processing, and system management. The M2GL010 device is the smallest density shown in the supplied IGLOO2 datasheet result, which covers M2GL005, M2GL010, M2GL025, M2GL050, M2GL060, M2GL090, and M2GL150 variants. The verified distributor information identifies the M2GL010-VF400 as an IGLOO2 FPGA with 12K logic elements, 195 I/O, and a 400-LFBGA package. Other verified commercial data reports 2,528 pieces in stock at Heisener, a unit price of $37.1987, and a lead time to be confirmed, with an estimated delivery window of October 12 through October 17. These commercial figures are source-specific and should be reconfirmed before procurement. The 400-LFBGA package provides a high pin count for systems that require extensive programmable I/O, making the device suitable for parallel interfaces, control logic, protocol bridges, and mixed signal interface conditioning. The supplied pin-description user guide is the appropriate reference for ball assignments, bank information, and package details. The manufacturer product page states that the M2GL010 is in production. A practical design must confirm the exact temperature grade, voltage requirements, configuration method, supported I/O standards, clocking resources, and bank constraints before layout begins. The 400-ball package also requires careful ball-out planning, escape routing, power-plane integrity, and manufacturing capability appropriate for fine-pitch BGA assembly. Do not infer those electrical limits from the distributor summaries alone. This page consolidates the verified Microchip and distributor references, compares the available same-footprint ordering variants, and separates confirmed commercial information from parameters that still require manufacturer-datasheet confirmation. Use the official IGLOO2 datasheet and pin-description guide for sign-off design decisions. The M2GL010-VF400 combines a compact low-density IGLOO2 FPGA platform with a high-pin-count 400-LFBGA package. Its 12K logic elements and 195 I/O position it for embedded control, interface conversion, protocol bridging, system management, and communications infrastructure where deterministic programmable logic is useful. Microchip's product page identifies the M2GL010 family as in production and describes IGLOO2 devices as flash FPGAs for general-purpose logic, I/O expansion, conversion, communications, industrial, medical, defense, and aviation markets. The verified distributor record specifies a 400-LFBGA package, 195 I/O, and 12K logic elements, while another distributor result describes the package as 0.8 mm ball pitch. Because the supplied data does not provide complete AC, DC, timing, pin-level, or environmental specifications, those values are not guessed here. The IGLOO2 architecture is a flash-programmable FPGA family intended to provide reconfigurable logic, memory, and I/O resources within a compact device. In system terms, an FPGA sits below programmable logic devices, digital logic ICs, and semiconductors, while providing higher implementation flexibility than a fixed-function controller. Microchip identifies the family for general-purpose functions including bridging, I/O expansion, conversion, system management, and secure connectivity. The supplied IGLOO2 datasheet result covers multiple M2GL densities, including M2GL005, M2GL010, M2GL025, M2GL050, M2GL060, M2GL090, and M2GL150, with the target device being the M2GL010 density. The verified feature set for this exact ordering code is its 12K logic-element count, 195 I/O, and 400-LFBGA package. The high I/O count is the key implementation feature for systems requiring many external connections, parallel data paths, or interface translation. The package also changes board-level manufacturing requirements compared with a leaded device: the design must account for 400 balls, fine-pitch escape routing, via-in-pad or via structures where appropriate, and controlled assembly. The supplied data does not state the exact I/O standards, I/O voltage, maximum clock frequency, memory bits, configuration interface, or operating-temperature grade, so those values require confirmation from the official datasheet. Microchip's product page lists the M2GL010 as in production. This makes it a relevant candidate for new low-density FPGA designs, provided that the selected temperature, package, qualification, and lifecycle requirements match the system. The product-family page describes IGLOO2 devices as suitable for communications, industrial, medical, defense, and aviation markets. These are application domains, not proof that the exact M2GL010-VF400 ordering code has every corresponding qualification. The ordering suffix, grade, and compliance qualification must be checked separately. Typical implementation uses include interface bridging, parallel-to-serial conversion, I/O expansion, control-plane logic, data acquisition front ends, and system-management functions. In these designs, the FPGA's 195 I/O allow external buses and protocols to be mapped through configurable logic, while the 12K logic-element density is intended for moderate control and datapath complexity rather than unrestricted high-end processing. The exact timing margin, supported standards, and power performance depend on the selected I/O bank, clock configuration, voltage, and operating grade. The primary design consideration is that the 400-LFBGA package requires disciplined power, clock, and signal-integrity planning. Confirm the complete pinout, bank voltages, configuration pins, clock pins, ground distribution, and decoupling requirements in the manufacturer pin-description guide before schematic capture. Keep sensitive clock and interface routes short, provide continuous return paths, and validate the design with the manufacturer's recommended FPGA design flow. Do not use the distributor snippets as a substitute for the complete electrical datasheet. This page synthesizes verified manufacturer status, package identity, logic capacity, I/O count, distributor inventory, pricing, and the available ordering references. It also adds practical selection and design guidance that is not present in a raw distributor listing. For purchasing, request a current quote and stock confirmation; for engineering, use the official IGLOO2 datasheet and packaging user guide for all release-critical specifications. The M2GL010-VF400 is a 12K-logic-element, 195-I/O IGLOO2 flash FPGA in a 400-LFBGA package, and Microchip lists the M2GL010 family as in production. It is suitable for programmable logic, interface bridging, I/O expansion, protocol conversion, system management, communications, industrial control, medical equipment, defense, and aviation designs where configurable hardware is useful. The verified distributor data identifies 2,528 pieces at Heisener at a unit price of $37.1987 and reports lead time to be confirmed; pricing and availability are as of the supplied search snapshot dated 2026-10-23. The package result states 0.8 mm ball pitch and 400 VFBGA. Engineering values not present in the supplied sources are marked for data collection rather than estimated. An FPGA is a configurable digital semiconductor that combines programmable logic, memory, and input/output resources. A low-density flash FPGA such as IGLOO2 can implement fixed control logic, data paths, and interface functions that would otherwise require multiple fixed-function devices. Microchip describes IGLOO2 devices as useful for general-purpose bridging, I/O expansion, conversion, system management, and secure connectivity. The supplied family datasheet result covers M2GL005, M2GL010, M2GL025, M2GL050, M2GL060, M2GL090, and M2GL150 devices, confirming that M2GL010 belongs to a broader low-density device family. The target's confirmed commercial features are 12K logic elements, 195 I/O, and a 400-LFBGA package. The package result additionally specifies 0.8 mm ball pitch and 400 VFBGA. These figures make the device relevant where a high number of external connections and moderate programmable logic density are needed. They do not establish the exact I/O voltage, supported interface standards, maximum operating frequency, embedded-memory capacity, configuration pins, or temperature grade; those values must come from the official datasheet and pin-description guide. Microchip's product page states that M2GL010 is in production. The IGLOO2 family page identifies communications, industrial, medical, defense, and aviation as target markets, while also listing Gigabit Ethernet, dual PCI Express control planes, bridging, I/O expansion, conversion, video or image processing, system management, and secure connectivity as representative use cases. Availability in those markets does not automatically mean that the exact ordering code has the required automotive, military, or space qualification. Qualification and temperature grade must be confirmed independently. A practical implementation can place the FPGA between sensors, processors, memories, transceivers, and external connectors. The 195 I/O provide a large pin budget for buses, control signals, and protocol interfaces, while the 12K logic-element count supports moderate finite-state machines, packet handling, data alignment, and control logic. The 400-LFBGA package requires a high-density board layout with careful escape routing, power distribution, thermal analysis, and assembly capability. The design should be checked against the manufacturer's pinout, bank rules, configuration procedure, and recommended decoupling before PCB release. The most important selection trade-off is flexibility versus integration. Compared with a small MCU or fixed-function logic device, the FPGA provides reconfigurable parallel interfaces and hardware-level timing control. Compared with a larger or higher-density FPGA, the M2GL010 offers a smaller logic resource budget while retaining many I/O and package options. The exact speed, power, reliability, and lifecycle commitments should be taken from the current Microchip documentation rather than inferred from the distributor summary. This page combines verified product identity, family positioning, package information, commercial availability, and procurement context with engineering guidance for FPGA integration. It is intended to accelerate initial selection and sourcing, while clearly separating confirmed facts from parameters that still require official-datasheet confirmation.
M2GL010-VFG400 - 12K Low-Power IGLOO2 FPGA | Microchip
The Microchip Technology M2GL010-VFG400 is a low-density IGLOO2 flash-based field-programmable gate array with 12K logic elements, 12,084 programmable cells, a 1.2 V core voltage, and a 400-LFBGA package. It provides 195 I/O positions according to the verified distributor listing and is designed for cost-sensitive embedded applications that require reconfigurable logic, serial connectivity, and low static power consumption. An FPGA is a programmable semiconductor in the broader logic-device and semiconductor hierarchy. Its configurable logic fabric can implement digital control, interface, protocol, and signal-processing functions that would otherwise require several fixed-function ICs. The IGLOO2 family combines this reprogrammable fabric with embedded flash, SRAM, and communications interfaces, making it useful for compact industrial, communications, consumer, and system-management designs. The fourth-generation flash-based IGLOO2 fabric provides nonvolatile configuration storage, while the device includes a high-performance memory subsystem with 32 KB embedded SRAM and multiple DMA controllers. The 195 available I/O positions support external interfaces and board-level integration. Because configuration is retained in flash, the M2GL010 can resume its programmed function after power is restored without requiring an external configuration loader. Mouser identifies the M2GL010-VFG400 as an IGLOO2 low-density FPGA with 12K logic elements, while Microchip describes the M2GL010 family as being in production. Its intended use cases include bridging functions, input/output expansion and conversion, system management, and secure connectivity. These applications benefit from integrating programmable control logic close to external interfaces while limiting board area. For new hardware, the key trade-off is flexibility versus a fixed-function MCU or CPLD. The FPGA supports parallel logic, adaptable interfaces, and in-system updates, but programming tools, timing validation, and board-level power planning require additional engineering effort. Designers should verify every ball assignment against the Microchip pin-information guide before schematic capture or PCB routing. This page consolidates verified distributor and manufacturer information, application guidance, package details, and same-family replacement options. It also distinguishes a genuine 400-LFBGA drop-in candidate from related IGLOO2 devices offered in smaller packages, preventing package-mismatch substitutions.
M2GL010T-VF256 - 12K Logic Cells FPGA | Microchip
Microchip Technology M2GL010T-VF256 is an IGLOO 2 low-density FPGA with 12,084 logic cells, 933,888 RAM bits, and 138 user I/O in a 256-LFBGA package. It is designed for general-purpose programmable logic, bridging, I/O expansion, data conversion, video and image processing, system management, and secure connectivity functions. The device combines a relatively compact logic footprint with 256 package contacts for systems that need substantial board-level integration without moving to a higher-density FPGA. An FPGA is a programmable semiconductor in which logic blocks, I/O resources, and embedded memory are configured after fabrication. Within the product hierarchy, the M2GL010T-VF256 is an FPGA, a programmable-logic IC, and ultimately a semiconductor. It belongs to the IGLOO 2 family, a low-density FPGA series positioned below larger devices when a design requires more logic and I/O than a small microcontroller can provide but does not justify a high-end FPGA. The verified device data identifies 12,084 logic cells, 933,888 RAM bits, and 138 I/O. These headline resources make the device suitable for parallel data acquisition, protocol conversion, custom interface logic, embedded control functions, and modest video or image-processing pipelines. Its 256-LFBGA package also supports dense routing to external memory, transceivers, converters, and other high-speed or parallel peripherals. The manufacturer identifies Gigabit Ethernet, dual PCI Express control planes, bridging, I/O expansion and conversion, video/image processing, system management, and secure connectivity as suitable application categories. The IGLOO 2 architecture is flash based, allowing the programmed configuration to be retained in the device. This is useful in production equipment, industrial controllers, communications infrastructure, and embedded systems where a stable configuration must be present immediately after power-up. Designers should still confirm the exact configuration interface, supported I/O standards, clocking resources, memory organization, and electrical limits from the applicable Microchip documentation before schematic sign-off. M2GL010T-VF256 is particularly appropriate for control-plane logic around networking equipment, industrial automation modules, data-conversion systems, and embedded security peripherals. Its 138 I/O and 933,888 RAM bits permit parallel interfaces and moderate local buffering, while 12,084 logic cells provide substantially more implementation flexibility than a fixed-function controller. The tradeoff is development complexity: synthesis, timing closure, pin planning, and programming require FPGA-aware design methods. For a new layout, place decoupling close to the power pins, assign pins according to the official IGLOO 2 packaging guide, and verify every high-speed interface against the device's supported standards and timing specifications. Do not infer bank voltage, differential-I/O support, or pin multiplexing solely from the package outline; those functions must be checked for the specific ball assignment. This page combines verified resource and package data with practical selection, design, and drop-in replacement guidance.
M2GL010T-VF400 - 12K LEs, 195 I/O IGLOO2 FPGA | Microchip
Microchip Technology M2GL010T-VF400 is an IGLOO2 low-density flash field-programmable gate array with 12,084 programmable logic elements, 195 user I/O, a 1.2 V core, and a 400-pin LFBGA package. The device combines configurable logic, embedded memory resources, and programmable I/O in a surface-mount package for compact embedded and control applications. An FPGA is a reconfigurable digital integrated circuit whose logic blocks, interconnects, memory, and I/O are configured after manufacture. The M2GL010T belongs to the IGLOO2 family hierarchy of low-density FPGAs, which combine nonvolatile flash configuration with programmable logic for control-plane, bridging, interface-conversion, video or image processing, system-management, and secure-connectivity designs. Verified product data identifies 12,084 cells, 12K LEs, 195 I/O, a 1.2 V supply, and a 400-pin VFBGA or LFBGA package. The 400-pin package exposes substantially more I/O than lower-pin-count alternatives, making the device suitable for designs requiring parallel interfaces, multiple data buses, or mixed communication and control functions. Surface-mount construction supports automated PCB assembly and high-density embedded equipment. The IGLOO2 architecture is organized around programmable logic and dedicated memory resources rather than a hardwired processor core. This makes the M2GL010T useful for parallel data acquisition, protocol conversion, state-machine control, image or video data conditioning, and system-management logic. Its flash FPGA category also supports configuration persistence, helping the programmed design remain available after power is removed and reapplied. Typical uses include Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output expansion and conversion, video and image processing, system management, and secure connectivity. These applications align with the device's combination of low-density programmable logic, 195 available I/O positions, and a high-pin-count surface-mount package. PCB design should follow the official IGLOO2 VF400 package and pin-description documentation. The 400-ball footprint requires exact escape-routing, power-plane, decoupling, and differential-pair rules; because a single via or routing error can affect numerous balls, engineers should compare the library symbol and board file against the manufacturer package data before release. This product record combines verified manufacturer and distributor information, package-specific resources, practical design guidance, and explicit comparisons with same-footprint IGLOO2 options. It distinguishes verified facts from unavailable electrical details rather than estimating missing pin, timing, power, or compliance parameters.
M2GL025-FGG484 - 27.6K LEs, 484-BGA FPGA | Microchip
The Microchip Technology M2GL025-FGG484 is an IGLOO2 low-density FPGA with 27,696 logic elements, 267 I/O, 1.2 V operation, and 256 kB of embedded flash memory in a 484-ball FBGA package. The device is listed in production by Microchip and is intended for cost-sensitive programmable-logic, bridging, I/O expansion, conversion, system-management, and secure-connectivity designs. An FPGA is a semiconductor whose digital logic is configured after manufacture. It belongs to the programmable-logic hierarchy, combining an FPGA fabric, programmable I/O, embedded memory, and configuration resources in one device. Compared with a fixed-function ASIC, an FPGA allows engineers to revise hardware behavior through configuration rather than redesigning a custom integrated circuit. The IGLOO2 family targets general-purpose logic rather than high-performance processor or signal-processing applications. The M2GL025-FGG484 provides 27,696 logic elements and 267 I/O, giving it substantially more integration than Microchip's smaller M2GL005 and M2GL010 devices. Its 1.2 V core supplies the internal operating voltage, while its 484-BGA package provides a high pin count for dense board layouts and extensive external connectivity. The supplied product data also identifies 256 kB of flash memory, allowing the device to be associated with embedded configuration and application-storage resources. This part uses fourth-generation Flash-based FPGA technology, as described in the verified product material. Flash-based configuration is valuable in production systems because the configuration data is retained in nonvolatile memory, allowing the device to operate without loading configuration into SRAM at every power cycle. The exact configuration architecture, supported I/O standards, clocking resources, and performance-grade details are not included in the supplied extracted data and should be confirmed in the manufacturer documentation before design release. Typical uses include protocol bridging, parallel-to-serial interface conversion, programmable I/O expansion, industrial control, communications infrastructure, embedded system management, and secure connectivity. The Microchip family page specifically identifies bridging, I/O expansion and conversion, system management, and secure connectivity as suitable general-purpose functions. These applications benefit from combining configurable logic, a large I/O count, and nonvolatile embedded memory in a single surface-mount package. Board design should follow Microchip's IGLOO2 FG484 package and pin-description guidance, including bank voltages, configuration pins, power pins, and exposed-pad requirements. Designers must also confirm the required I/O standards, voltage tolerances, clock topology, and power-supply sequencing against the complete datasheet. The package's high pin count makes careful fan-out and multilayer PCB routing especially important. This page consolidates verified manufacturer and distributor information, price observations, package details, design guidance, and same-brand drop-in candidates. It also clearly distinguishes verified facts from parameters that still require confirmation from the complete IGLOO2 data sheet and package user guide.
M2GL025-VF256 - 27.6K LEs, 256-LFBGA FPGA | Microchip
The Microchip Technology M2GL025-VF256 is a low-density IGLOO 2 flash FPGA with 27,696 logic elements, 138 I/O, and a 1.2 V core supply in a 256-pin LFBGA package. It is marketed for general-purpose functions including bridging, I/O expansion, conversion, system management, and secure connectivity. A field-programmable gate array is a semiconductor whose digital logic and interconnect are configured after fabrication. It belongs to the programmable-logic hierarchy: FPGA → programmable-logic IC → digital semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA can support multiple interface, control, and data-processing functions through configuration programming. The verified listing identifies 27.6K logic elements, 138 I/O, a 1.2 V core, and a 256-pin LFBGA package. Microchip describes its low-density IGLOO 2 devices as suitable for general-purpose logic and control tasks. These verified attributes make the M2GL025-VF256 relevant to compact control systems, interface bridges, peripheral expansion, and industrial logic platforms. The M2GL025 belongs to the IGLOO 2 family, whose flash-based FPGA positioning supports programmable logic rather than fixed wiring. The package exposes 256 terminals and offers 138 I/O according to the distributor result, leaving the remaining package terminals associated with power, configuration, grounds, and other package-specific functions that are not enumerated in the supplied data. Typical design use includes protocol bridging, I/O expansion, data-format conversion, system management, and secure connectivity. These are family-level applications identified by Microchip; an exact implementation must be checked against the device pin descriptions, supported I/O standards, bank voltages, clocking resources, and power requirements in the official datasheet and user guide. The main design consideration is package and pinout verification. A 256-pin BGA is not interchangeable with a leaded package, and even same-density variants require exact VFBGA footprint, pin descriptions, bank compatibility, and configuration checks. This page synthesizes verified distributor listings, manufacturer resources, sourcing details, and strict engineering cautions beyond the raw catalog description.
M2GL025-VFG400 - 27.6K LEs, 400-Ball Flash FPGA | Microchip
The Microchip Technology M2GL025-VFG400 is an IGLOO 2 low-density flash field-programmable gate array with 27,696 logic elements, 195 I/O, and a 400-lead VFBGA package. The device is designed for general-purpose programmable logic, bridging, I/O expansion, conversion, system-management, and secure-connectivity functions. According to the Microchip M2GL025 product page, the M2GL025 family is in production, making it suitable for both new designs and planned industrial or communications systems. An FPGA is a programmable digital semiconductor whose logic fabric and I/O can be configured after manufacture. In the broader semiconductor hierarchy, this device belongs to the programmable-logic and programmable-logic-device families, rather than the fixed-function logic category. Flash configuration memory allows the M2GL025-VFG400 to retain its programmed configuration without requiring a separate configuration PROM for normal operation. The verified product information identifies 27.6K logic elements, 195 I/O, a 1.2 V supply indication, and a 400-pin VFBGA package. These specifications make the device appropriate for designs requiring substantial programmable logic, a large pin count, and a compact surface-mount footprint. The 195 I/O can support communication interfaces, data converters, peripheral bridging, control logic, and mixed signal system-management functions when the selected I/O standards and voltage banks permit the intended signaling. The IGLOO 2 architecture is positioned for low-density embedded applications where designers need more flexibility than fixed-function logic can provide. The flash-based configuration approach simplifies standalone implementation because the FPGA can be programmed through its programming interface and then operate from its internal configuration memory. The 400-ball package also provides high I/O availability for designs connecting multiple buses, converters, memories, and communication blocks. Typical applications include industrial control modules, communications infrastructure, medical instrumentation, defense and aviation subsystems, video or image-processing front ends, and general-purpose embedded control. The exact speed grade, temperature range, supported I/O standards, electrical limits, and package dimensions are not included in the supplied verified results and should be confirmed in the manufacturer datasheet before release. For a new board, engineers should review the Microchip IGLOO 2 packaging and pin-description user guide, verify every bank voltage against the intended peripherals, and confirm the selected package variant against the footprint. The M2GL025-VFG400 should be selected when a 27.6K-LE flash FPGA, approximately 195 I/O, and the 400-lead VFBGA package meet the mechanical and electrical requirements of the system. This page combines verified distributor availability, manufacturer status, package information, and practical replacement considerations without inferring undocumented electrical ratings.
M2GL050-FG484 - 56,340-Cell IGLOO2 FPGA | Microchip
The Microchip Technology M2GL050-FG484 is a 56,340-cell IGLOO2 flash field-programmable gate array with 267 I/O, a 1.2 V device core, and a 484-pin FBGA package. It is designed for general-purpose programmable logic, bridging, I/O expansion, protocol conversion, system management, and secure connectivity. An FPGA is a reconfigurable digital semiconductor whose logic, interconnect, and I/O behavior can be programmed after manufacture. The M2GL050 belongs to the IGLOO2 family, which sits within the broader hierarchy of programmable-logic devices, FPGAs, and semiconductors. Its flash configuration memory allows designs to be loaded and retained without the external configuration devices normally associated with SRAM-based FPGAs. Key device attributes include 56,340 programmable logic cells, 1,869,824 gates as reported by the distributor listing, 267 I/O, a 1.2 V supply specification, and a 484-pin FBGA package. The M2GL050 family is identified by Microchip as being in production and is positioned for communications, industrial, medical, defense, and aviation applications. The device is particularly useful when a design requires programmable logic alongside conventional processor-managed systems. Typical implementation tasks include protocol bridging, data-format conversion, I/O expansion, control-plane logic, and secure connectivity functions. Its large ball-grid-array footprint also supports dense connection to external memories, transceivers, converters, and mixed-signal systems while exposing numerous programmable I/O resources. Typical uses include industrial interface conversion, communications infrastructure, medical monitoring equipment, image or video processing, and embedded control systems where deterministic hardware logic provides useful parallelism or offloads work from a host processor. Designs must account for the complex BGA routing, bank-based power architecture, configuration requirements, and signal-integrity constraints of a 484-ball programmable device. For new designs, engineers should verify the current Microchip lifecycle, supported toolchain, pin-bank assignments, and package documentation before layout release. The Microchip AC402 application note states that footprint compatibility is possible among M2GL025, M2GL050, and M2GL090 FG484 devices, but some pins have a reduced compatibility feature set; migration therefore requires detailed pin review rather than assuming every function is interchangeable. This page combines verified pricing, package information, manufacturer guidance, and application-specific engineering context to help engineers evaluate the M2GL050-FG484 beyond a basic distributor specification sheet.
M2GL050-FG896 - 56K IGLOO2 FPGA | Microchip Technology
The Microchip Technology M2GL050-FG896 is an IGLOO2 flash field-programmable gate array with 56,340 logic cells, a 1.2 V core supply, and 896-pin FBGA packaging. The device combines programmable logic resources, embedded memory, user I/O, and configuration flash in a single surface-mount FPGA. Its 896-ball package provides a large pin count and substantial I/O capacity for bridging, protocol conversion, I/O expansion, system management, and secure-connectivity applications. An FPGA is a reconfigurable digital integrated circuit whose interconnect and logic blocks can be programmed after manufacture. Within the programmable-logic hierarchy, an FPGA sits above fixed-function logic devices and below application-specific programmable systems. The M2GL050 belongs to Microchip's IGLOO2 family, a flash-based FPGA architecture intended to provide nonvolatile configuration and general-purpose programmable logic without an external configuration PROM. The verified product information identifies the M2GL050-FG896 as a 56,340-cell IGLOO2 device in an 896-pin FBGA package. The IGLOO2 family includes devices ranging from 5,000 to 150,000 logic cells, allowing designers to select a device according to logic capacity, I/O count, package, speed grade, and temperature grade. The target ordering code uses the FG896 package designation, while related M2GL050 order codes identify different temperature or speed options. IGLOO2 devices use embedded flash to retain the programmed configuration. This architecture supports field updates and eliminates a separate serial configuration memory in designs that use the device's native configuration features. The wide package pin count also supports numerous user I/Os, but exact I/O counts, voltage standards, differential capabilities, and bank restrictions must be selected from the device's pin-description document for the specific package and bank. Typical uses include communications infrastructure, industrial control, medical equipment, defense systems, video and image processing, storage interfaces, and embedded control planes. The 56,340-cell M2GL050 is particularly useful when a design needs substantially more parallel logic and I/O than small FPGAs provide, while retaining the simplicity of a single-package programmable solution. Design planning should begin with the complete M2GL050 pin-description document, because FG896 package assignments and bank features are device-specific. Designers should also verify voltage-tolerance rules, configuration pins, clock resources, differential-pair constraints, decoupling requirements, thermal performance, and the exact supported I/O standards before committing the 896-ball layout to production. This page combines the verified 56,340-cell, 1.2 V, 896-pin FBGA characteristics with procurement data, ordered replacement candidates, and practical migration guidance. It is intended to help engineers distinguish genuine package-compatible order codes from broader M2GL050 devices that require a different footprint and therefore are not drop-in replacements.
M2GL060-FG484 - 56.5K Logic Cells, 267 I/O FPGA | Microchip
Microchip M2GL060-FG484 is an IGLOO2 flash FPGA with 56,500 logic elements, 267 I/O, and a 484-ball BGA package. The device is designed for general-purpose programmable logic, I/O expansion, bridging, system management, secure connectivity, communications, industrial, medical, defense, and aviation systems. According to the manufacturer product page, the M2GL060 family is in production and uses nonvolatile configuration memory for programmable logic designs. An FPGA is a semiconductor whose internal digital logic, interconnect, and I/O resources are configured after manufacture. Within the product hierarchy, M2GL060-FG484 is an IGLOO2 flash FPGA, placing it below FPGA as a general category and above programmable-logic and SoC applications. Its 56,500 logic elements provide substantially more design capacity than smaller IGLOO2 members, while the 267 available I/O support interfaces that need many external connections. The 484-BGA package provides dense physical connectivity for the M2GL060 device while requiring careful PCB layout, escape routing, via-in-pad or via-beneath-pad techniques, and assembly-process qualification. Its 267 I/O count is suitable for parallel data acquisition, industrial control, communications bridging, and peripheral expansion. The flash-based configuration architecture allows the programmed design to remain in the device after power is removed. The IGLOO2 family supports general-purpose functions including bridging, input/output expansion and conversion, system management, and secure connectivity. These functions make the device applicable where fixed logic would be inflexible and where board space, field programmability, or reconfigurability provides a practical benefit. The manufacturer identifies communications, industrial, medical, defense, and aviation markets as important application areas for IGLOO2 devices. Typical implementations include industrial interface converters, protocol bridges, control-plane logic, secure communication front ends, and compact embedded systems with numerous parallel signals. The 267 I/O capability is particularly useful when a design must connect multiple buses, sensors, converters, or display and control peripherals while retaining programmable behavior. PCB design should treat the 484-BGA land pattern as a demanding assembly item. Verify the exact ball assignments, power planes, decoupling requirements, and package dimensions against the manufacturer pin-information document and datasheet before layout release. Decoupling capacitors, ball escape routing, ground-plane continuity, and assembly stencil design can materially affect signal integrity and yield. This page combines verified manufacturer and distributor information, exact package and I/O details, drop-in order-code considerations, application guidance, and practical design notes. It also distinguishes confirmed electrical specifications from parameters that still require confirmation from the official M2GL060 documentation.
M2GL060-FG676 - 56.5K Logic Cell 1.2V FPGA | Microchip
Microchip Technology M2GL060-FG676 is an IGLOO 2 low-density flash field-programmable gate array with 56.5K logic elements, 387 I/O, and a 1.2 V core supply in a 676-ball FBGA package. The device is offered in a commercial 0°C to 85°C temperature grade and is listed as in production by Microchip. Its combination of programmable logic, embedded flash configuration, and 387 package I/O positions supports general-purpose bridging, I/O expansion and conversion, system management, secure connectivity, communications, industrial, medical, defense, and aviation designs. An FPGA is a reprogrammable semiconductor in which configurable logic blocks, memory resources, and programmable I/O form a hardware system that can be modified after manufacture. Within the semiconductor hierarchy, an FPGA sits above programmable logic devices and below application-specific programmable systems. The IGLOO 2 family is specifically designed for low-density, nonvolatile flash-based programmable logic rather than fixed-function application-specific integrated circuits. The M2GL060-FG676 provides 56,520 logic cells according to distributor records, with a separate product listing identifying 56.5K logic elements. Its 387 I/O positions provide extensive board-level connectivity, while the 1.2 V core voltage identifies the device as intended for modern low-voltage digital designs. Configuration is nonvolatile because the IGLOO 2 family uses embedded flash, allowing the programmed design to remain available after power removal without an external configuration PROM. The 676-ball FBGA package makes the M2GL060-FG676 suitable for compact, multilayer PCB assemblies where perimeter lead counts would be restrictive. Its 0°C to 85°C commercial temperature range covers many indoor industrial, communications, medical, and consumer-adjacent systems. Unlike a mask-programmed ASIC, the FPGA allows logic, interfaces, and system-management functions to be revised through configuration changes, which can reduce prototype iteration and support product differentiation. Typical uses include protocol bridging, parallel-to-serial interface conversion, Ethernet or USB interface support, control-plane logic, data acquisition, industrial control, and embedded security functions. The 387 I/O count is particularly useful when a design must connect multiple buses, sensors, converters, and status signals while retaining flexible programmable logic for control and protocol handling. PCB implementation requires careful BGA layout and thermal engineering. Designers should follow Microchip's FG676 pin-information guide and the referenced board-and-layout guidelines, provide all required power and ground connections, and validate high-speed signal integrity across the multilayer stackup. Because the verified excerpt does not state the complete pin map, voltage tolerances, performance grade, or recommended high-speed capacitor values, those details must be checked against the manufacturer datasheet before release. This product page consolidates verified distributor and manufacturer information, documented application roles, procurement status, and engineering-selection guidance. It distinguishes the target from higher-density IGLOO 2 devices and avoids presenting unsupported electrical, timing, pricing, or package details as confirmed facts.
M2GL060-VF400 - 56.5K LE IGLOO2 FPGA | Microchip Technology
Microchip Technology M2GL060-VF400 is an IGLOO2 low-density flash FPGA with 56,520 logic elements, 207 I/O, and a 400-LFBGA package. It is designed for embedded applications requiring programmable logic, bridging, I/O expansion, system management, secure connectivity, and general-purpose control functions. The device combines a reprogrammable FPGA fabric with embedded memory resources and on-chip flash in a single low-power package. According to the verified manufacturer listing, the M2GL060 device family is in production, and the M2GL060-VF400 is specifically identified as a 400-pin LFBGA FPGA with 207 I/O. The IGLOO2 family targets communications, industrial, medical, defense, and aviation applications, where configurable logic can reduce the component count and accelerate prototype development compared with fixed-function logic. The 1.2 V operating value shown in the verified distributor data reflects the device’s low-voltage architecture, while the 400-terminal square ball-grid package supports dense PCB routing and high I/O availability. Engineers should select this part when the design requires substantially more logic and I/O than the smaller M2GL005 and M2GL010 devices, but does not justify moving to a different FPGA family. Production design work requires the Microchip IGLOO 2 FPGA and SmartFusion 2 SoC FPGA datasheet, the IGLOO 2 Packaging and Pin Descriptions User Guide, and the appropriate device programming and verification toolchain. Pin assignments, bank voltages, configuration behavior, and package dimensions must be checked against those authoritative documents before schematic capture or PCB layout release.
M2GL090-1FG484 - 86K Logic Cell FPGA | Microchip
The Microchip Technology M2GL090-1FG484 is an IGLOO2 low-density field-programmable gate array with 86,316 programmable logic cells, 267 I/O, a 1.2 V core supply, and a 484-pin FBGA package. It combines programmable logic, embedded flash configuration storage, and high-density user I/O in a single surface-mount device. The M2GL090 is listed by Microchip as In Production and is positioned for general-purpose functions such as bridging, I/O expansion, conversion, system management, and secure connectivity. An FPGA is a programmable semiconductor whose internal logic and interconnect resources can be configured after manufacture. The M2GL090 belongs to the IGLOO2 family, placing it within the hierarchy of flash-based FPGA, programmable logic device, digital semiconductor, and integrated circuit. Its 484-ball grid array package provides substantial connectivity compared with smaller leaded packages, making it suitable for designs requiring numerous external signals and board-level integration. The device provides 86,316 logic cells and 267 I/O according to distributor and manufacturer listings. Its core operating voltage is 1.2 V. These resources make the M2GL090 useful for protocol bridging, data acquisition, industrial control logic, communications interfaces, and embedded system-management functions. Microchip identifies communications and industrial applications as principal markets for Microchip FPGAs, while the M2GL090 product page highlights bridging, I/O expansion, conversion, system management, and secure connectivity use cases. The M2GL090-1FG484 belongs to the low-density IGLOO2 portfolio and is available from multiple distributors, indicating an established supply channel. Its 484-pin FBGA construction requires careful PCB layout because the fine ball pitch constrains routing, inspection, and rework. A valid design therefore depends on accurate package data, a qualified assembly process, and power, ground, configuration, and interface verification in the Libero design flow. Typical deployments include industrial data-acquisition modules, communications bridges, embedded control systems, I/O concentrators, and secure connectivity products. Because the verified material does not provide complete power-consumption, operating-temperature, clock, memory, or signal-timing tables, those values should be confirmed in the applicable Microchip IGLOO2 documentation before schematic approval or production release. The principal design consideration is package-level implementation. Engineers should use the official IGLOO2 484-pin package and pin-description material to assign power, ground, configuration pins, and user I/O correctly. Decoupling, layer-stackup, via density, ball-pad geometry, and assembly capability should be reviewed early because those constraints can drive PCB cost and yield. This page consolidates the verified manufacturer status, distributor availability, device-family specifications, and same-package procurement alternatives. It also distinguishes electrically identical ordering codes from changes that affect qualification or sourcing, providing practical information for FPGA selection, PCB reuse, BOM standardization, and supply-chain review.
M2GL090-1FG676 - 86K IGLOO2 FPGA with 425 I/O | Microchip
The Microchip Technology M2GL090-1FG676 is an IGLOO2 field-programmable gate array with 86,316 cells, 425 I/O, a 1.2 V operating supply, and a 676-ball FBGA package. It is designed for compact programmable-logic systems requiring substantially more routing and I/O capacity than small CPLDs. The device is supplied in a tray according to the verified distributor data. An FPGA is a digital semiconductor whose logic, interconnects, and I/O behavior are configured after manufacture. In the device hierarchy, an FPGA sits above fixed-function logic and below application-specific SoCs. Its reconfigurable fabric allows designers to implement parallel processing, control logic, protocol handling, signal conditioning, and interface bridging in one device while shortening board-development cycles. The M2GL090 belongs to the IGLOO2 family and is identified as a low-density FPGA offering 86K logic elements. Its 425 I/O provide substantial board-level connectivity, while the 1.2 V supply specification identifies it as a modern low-voltage programmable-logic device. The 676-ball FBGA package supports fine-pitch, high-density assembly but requires careful PCB layout, via-in-pad-compatible manufacturing, and thermal analysis. Technically, the IGLOO2 architecture is suited to designs that benefit from reconfigurable hardware rather than repeated firmware changes alone. The verified component listings identify 86,316 cells, 425 I/O, and the M2GL090 series designation. Detailed RAM, flash, PLL, I/O-standard, security, and performance values are not included in the supplied source data and should be confirmed in the official M2GL090 documentation before design release. Typical uses include industrial control, factory automation, communications infrastructure, embedded instrumentation, and compact control systems that need many parallel I/O and moderate programmable-logic density. The large I/O count can also simplify connections among sensors, relays, converters, memory, and external processors when board space is constrained. The primary design consideration is PCB manufacturability. A 676-ball FBGA requires a fine-pitch land pattern, adequate solder-mask and paste control, and power and ground distribution that minimizes voltage drop. Designers should also verify every bank supply, configuration interface, and I/O standard against the official packaging and pin-description guide. This page consolidates verified distributor specifications, an exact industrial-temperature variant, same-family drop-in candidates, comparison parameters, and practical assembly guidance. It extends the basic catalog data with design-focused context while clearly separating verified facts from parameters that still require manufacturer-document confirmation.
M2GL090-FG484 - 86K LEs IGLOO2 FPGA, 484 FBGA | Microchip Technology
The Microchip Technology M2GL090-FG484 is an IGLOO2 low-density flash FPGA with 86,316 logic elements, 267 I/O, and a 484-ball FBGA package. The device is identified by distributor listings as an IGLOO2 Field Programmable Gate Array with 86K LEs and 1.2 V operation, making it suitable for embedded control, interface bridging, I/O expansion, system management, and secure connectivity applications. An FPGA is a programmable digital semiconductor that combines configurable logic, programmable interconnect, and programmable I/O in one device. The IGLOO2 family is a flash-based FPGA family, allowing configuration data to be stored in the device and supporting general-purpose functions such as protocol bridging, data conversion, control-plane logic, and system supervision. The M2GL090-FG484 sits at the higher end of the listed low-density IGLOO2 options, providing substantially more logic resources than smaller M2GL005, M2GL010, M2GL025, or M2GL050 devices. The verified device information identifies 86,316 FPGA cells, 267 I/O, a 1.2 V supply, and a 484-pin FBGA package with a 23 mm by 23 mm body and 1 mm pitch. The Microchip IGLOO2 family is documented for communications, industrial, medical, defense, and aviation markets. The same package family is used across several IGLOO2 density options, although Microchip application note AC402 notes that some pins have reduced compatibility between M2GL025, M2GL050, and M2GL090 devices in the FG484 package. Typical designs use the M2GL090-FG484 for moderate-complexity embedded systems requiring multiple interfaces, custom protocol conversion, control logic, data acquisition, or secure connectivity. The 267 I/O count provides a broad interface surface for parallel buses, memory interfaces, control signals, and communications peripherals. Designers should still verify the exact bank assignments, voltage standards, configuration requirements, and pin multiplexing for the selected board revision using the manufacturer pin-information documentation. For migration within the FG484 family, footprint compatibility does not automatically guarantee identical functionality. AC402 specifically identifies reduced compatibility for some pins across the M2GL025, M2GL050, and M2GL090 devices. The device should therefore be selected against the complete pin-description table, power architecture, and design migration application note rather than by package name alone. This product data combines manufacturer family information, distributor specifications, package references, and cross-reference findings. It distinguishes the target M2GL090-FG484 from related density, speed-grade, temperature-grade, and package-ordering variants, helping engineers evaluate whether a candidate is genuinely drop-in compatible before changing a PCB or production BOM.
M2GL090-FG484I - 86K LEs, 267 I/O IGLOO2 FPGA | Microchip
Microchip Technology M2GL090-FG484I is an IGLOO2 low-density flash FPGA with 86K logic elements, 267 I/O, and a 484-ball BGA package. The device operates at 1.2 V and is supplied in the industrial temperature grade. Its in-production status and broad general-purpose logic resources make it suitable for interface conversion, I/O expansion, bridging, system management, and secure connectivity designs. The M2GL090 family is positioned within the FPGA and CPLD hierarchy as a reprogrammable logic semiconductor combining configurable logic, embedded flash configuration memory, and a high-density ball-grid-array footprint. An FPGA is a programmable semiconductor whose logic fabric and I/O behavior can be configured after manufacture. The IGLOO2 family is a flash FPGA family from Microchip Technology, which combines low-power programmable logic with embedded configuration storage. Within the broader semiconductor hierarchy, an FPGA is a programmable logic device that sits above basic fixed-function logic ICs and alongside CPLDs. This distinction matters when a design needs reconfigurable parallel logic, numerous interface pins, or product-level logic changes without a conventional ASIC fabrication cycle. The verified product data identifies 86K logic elements, 267 I/O, 1.2 V operation, 484-ball BGA construction, and industrial temperature grading. The large pin count provides substantial connectivity for buses, converters, control signals, and external memory interfaces. The 1.2 V core supports low-voltage logic implementations, while the embedded flash architecture allows configuration data to be retained without a separate external configuration PROM. Exact I/O standards, supported memory interfaces, PLL resources, and fabric performance figures are not present in the supplied excerpts and therefore require confirmation in the complete Microchip documentation. The IGLOO2 architecture is intended for general-purpose programmable logic rather than a single fixed function. The M2GL090 is described by Microchip as a low-density FPGA, and its 86K logic-element count provides substantially more design capacity than small CPLDs. This capacity is useful for combining multiple interface blocks, control logic, and protocol adaptation in one device. Because the verified excerpts do not disclose the complete speed-grade, static-power, dynamic-power, or timing tables, designs should not assume a particular frequency until the selected device, package, and speed grade are checked against the manufacturer data sheet. Typical uses include bridging functions, I/O expansion, data and protocol conversion, system management, secure connectivity, and industrial communications. The 267 available I/O positions are particularly valuable when a design connects several differently standardized buses or translates wide parallel interfaces into serial links. The same device family is also used in communications, industrial, medical, defense, and aviation markets. These applications benefit from programmable logic that can implement multiple protocol and timing functions without relying on a large collection of dedicated glue devices. PCB design should prioritize the 484-ball BGA escape-routing strategy, clean supply distribution around the 1.2 V core, and verified I/O voltage compatibility for every connected interface. Although the BGA package supports dense integration, it requires careful via-in-pad or buried-via routing, appropriate solder-mask and paste design, and thermal analysis for sustained industrial operation. Designers should also confirm the exact pin assignments and bank power requirements in the Microchip IGLOO 2 FPGA Packaging and Pin Descriptions User Guide before releasing the layout. This product record combines verified distributor and manufacturer information, same-family drop-in candidates, package-specific comparison data, and practical FPGA design guidance. It distinguishes confirmed facts from parameters that still require confirmation from the complete manufacturer data sheet, helping engineers narrow the replacement and sourcing process without treating incomplete search snippets as authoritative specifications.
M2GL090-FG676 - 86K IGLOO2 FPGA, 1.2V, 676-FBGA | Microchip
The Microchip M2GL090-FG676 is an IGLOO2 low-density FPGA with 86,316 logic cells, 425 I/O, a 1.2 V supply, and a 676-pin FBGA package. It is designed for programmable logic, system management, bridging, I/O expansion, data conversion, and secure connectivity applications. The verified distributor data identifies the device as an 86KLE IGLOO2 FPGA, while the manufacturer product page reports the M2GL090 family as in production. An FPGA is a programmable semiconductor whose logic fabric, interconnect, and programmable I/O can be configured after manufacture. Unlike a fixed-function ASIC, an FPGA supports design changes, parallel interface adaptation, and hardware customization without changing the PCB. The M2GL090 belongs to the IGLOO2 family, which is positioned for general-purpose programmable-logic functions and low-density embedded control tasks. The M2GL090-FG676 provides 86,316 logic cells and 425 I/O in a 676-pin FBGA. The verified distributor listing also shows a 2,648,064-bit configuration-memory figure for this device. Its 1.2 V operating supply is suitable for designs requiring a low-voltage programmable-logic fabric. The FG676 package provides a high pin count and supports dense signal routing, although its fine-pitch land pattern demands careful PCB layout and assembly. IGLOO2 devices include programmable logic resources and embedded SRAM for designs requiring local data storage, buffering, or stateful logic. Depending on the device configuration, the FPGA can be used for protocol conversion, bus bridging, control logic, interface aggregation, and security-related connectivity. The exact supported I/O standards, voltage combinations, timing grades, and configuration features must be confirmed in the Microchip datasheet for the selected device variant. Typical implementations include industrial control modules, communications equipment, data-acquisition systems, sensor and network interfaces, embedded security functions, and custom accelerator logic. In these systems, the FPGA can absorb parallel data paths, perform protocol translation, implement deterministic state machines, and reduce the amount of logic that would otherwise require several fixed-function devices. PCB design is a primary concern for the 676-pin FBGA. Use the Microchip IGLOO 2 layout guidance, provide a continuous power and ground distribution structure, route high-speed signals with controlled impedance, and verify the pin assignments and ball-grid orientation against the official pin-description document. Programming and configuration must follow the device-specific requirements. This product record combines verified manufacturer and distributor information with package-specific engineering guidance. Because the supplied search data does not include a complete pricing table, electrical limits, temperature grade, or full pin map, those values are explicitly marked for verification rather than inferred.
M2GL090-FG676I - 86K LEs, 425 I/O IGLOO2 FPGA | Microchip
The Microchip Technology M2GL090-FG676I is an IGLOO2 low-density FPGA with 86,000 logic elements, 425 I/O, and a 676-ball BGA package. It is identified by the verified product data as an IGLOO2 Field Programmable Gate Array intended for industrial temperature-grade applications. The M2GL090 family combines programmable logic resources with embedded FPGA fabric and is positioned for general-purpose functions such as bridging, I/O expansion, system management, and secure connectivity. An FPGA is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured after manufacture. The IGLOO2 family belongs to the broader field-programmable logic hierarchy: FPGA > programmable logic device > digital semiconductor. Unlike a fixed-function microcontroller, the M2GL090 can implement parallel control, protocol conversion, data acquisition, interface bridging, and other digital logic functions in one integrated device. Its 676-BGA package provides a high pin count for demanding external connectivity and board-level integration. The verified distributor listings identify the M2GL090-FG676I as an 86K-logic-element IGLOO2 FPGA with 425 I/O and a 676-BGA package. The related M2GL090-1FG676I is likewise listed with 425 I/O and 86K logic elements, supporting comparison with a same-footprint speed- or ordering variant. Microchip’s M2GL090 product page describes the family as suitable for communications, industrial, and general-purpose embedded applications, including bridging functions, I/O expansion, system management, and secure connectivity. The 676-ball BGA package is appropriate when a design requires numerous high-density board connections, but it also increases PCB layout and inspection complexity. Designers should preserve the manufacturer’s ball assignments and power, ground, configuration, and I/O guidance from the IGLOO2 packaging and pin-information document. The package is surface-mount technology and is not a through-hole package, so its land pattern and assembly process must match the selected 676-ball package variant. Typical deployments include industrial interface bridges, communications equipment, data-conversion systems, embedded control modules, secure-connectivity infrastructure, and general-purpose I/O expansion. For these applications, the M2GL090-FG676I is selected when designers need a low-density, high-pin-count programmable logic platform rather than a fixed microcontroller. The exact timing, voltage, temperature, power, configuration, and I/O electrical limits should be confirmed in the Microchip IGLOO2 datasheet before schematic signoff or PCB release. This page consolidates the verified Microchip and distributor information for engineering comparison, identifies same-footprint replacement candidates, and adds practical package, sourcing, and design guidance that is not found in a bare distributor listing. It is intended to support initial design decisions while preserving the manufacturer datasheet as the authoritative source for final electrical and timing requirements.
M2GL090-FGG484 - FPGAs | Microsemi | Embedded Systems
The Microsemi Corporation M2GL090-FGG484 is an M2GL-series field-programmable gate array intended for programmable digital logic and embedded-system applications. Its supplied order code identifies the FGG484 package variant, but the verified retrieval did not return a manufacturer specification table, pin list, pricing record, lifecycle statement, or substitute cross-reference. Consequently, resource counts, I/O quantities, voltage ranges, performance, temperature grades, and package dimensions remain unverified and are not presented as confirmed specifications. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. Within the broader product hierarchy, an FPGA is a programmable logic device, a semiconductor, and an embedded-processing component. This distinction matters because an FPGA can implement parallel control logic, protocol interfaces, signal processing, or general-purpose digital functions, depending on the resources and interfaces specified by the manufacturer for the exact device. The M2 designation identifies the M2GL product family, while FGG484 is the manufacturer ordering suffix for this particular configuration. No verified data in the supplied record establishes whether the suffix denotes package type, environmental grade, lead-free status, temperature range, or a combination of ordering attributes. Those details should therefore be confirmed from the official ordering guide before schematic capture, footprint selection, or component approval. For design evaluation, engineers should obtain the official M2GL090 data sheet, package drawing, pinout, and errata. The principal checks are the number and location of general-purpose I/O pins, supported I/O standards, available logic and memory resources, configuration interface requirements, and the electrical limits associated with the intended core and I/O supply voltages. Those details control whether an existing board can accept the device without changes. Potential uses include industrial control, communications infrastructure, instrumentation, embedded vision, and test equipment. These are application categories rather than verified manufacturer recommendations because the supplied data contains no application note or reference-design list. Selection must be based on the full electrical and mechanical data for M2GL090-FGG484 after those documents are obtained. The primary design precaution is to avoid deriving PCB, power, or thermal conclusions from the order code alone. In particular, do not assume a ball count, land pattern, I/O voltage, or junction-temperature limit from the 484 suffix. Confirm those items against the package drawing and data sheet, and validate the power budget across every supported configuration and operating-temperature condition. This page deliberately separates the confirmed identity from missing technical evidence, marks unavailable specifications explicitly, and provides a structured framework for datasheet review, sourcing, comparison, and drop-in replacement analysis. That approach reduces procurement and design risk when the live distributor and manufacturer retrieval contains no usable technical records.
M2GL090-FGG676 - 86K LEs, 1.2V, 676-FBGA FPGA | Microchip
The Microchip Technology M2GL090-FGG676 is an IGLOO2 low-density FPGA with 86,316 logic elements, 425 user I/O, and a 1.2 V core supply in a 676-pin FBGA package. It is a surface-mount programmable-logic device intended for general-purpose functions such as bridging, I/O expansion, conversion, system management, and secure connectivity. An FPGA is a semiconductor whose digital logic is configured after manufacture, allowing one physical device to implement multiple control, interface, and data-processing functions. The M2GL090 belongs to the IGLOO2 family, a low-density FPGA family positioned between simple programmable logic devices and larger FPGAs. Its combination of 86,316 logic elements and 425 I/O makes it suitable for systems requiring substantial parallel connectivity without moving to a higher-density device. The verified product information identifies the device as an IGLOO2 low-density FPGA with 86K logic elements, 425 I/O, 1.2 V operation, and a 676-pin FBGA package. The Microchip manufacturer page lists the M2GL090 family as in production. The FGG676 ordering code is associated with the 676-pin surface-mount package, while detailed speed-grade, temperature-grade, memory, and I/O-standard information is not available in the supplied verified excerpts. This device is suitable for industrial communications equipment, embedded control, peripheral expansion, sensor aggregation, and secure-connectivity implementations. Its high pin count provides extensive board-level connectivity, while the 86K logic-element density provides more implementation capacity than basic glue-logic devices. The manufacturer specifically identifies bridging, I/O expansion, conversion, system management, and secure connectivity as representative applications. Designers should treat the 676-pin FBGA as a demanding fine-pitch package requiring controlled PCB design, assembly, and inspection. Power, decoupling, configuration-data integrity, and I/O-standard compatibility must be reviewed against the complete Microchip datasheet and pin-information guide before release to manufacturing. Because the supplied data does not expose a complete price or full parametric table, the listing distinguishes confirmed facts from fields requiring datasheet confirmation. This page consolidates the verified manufacturer and distributor information for M2GL090-FGG676, including package identity, logic density, I/O count, lifecycle indication, source links, and same-package replacement guidance. It also provides engineering-oriented application and design guidance without treating unverified speed, temperature, pricing, or electrical limits as established facts.
M2GL090T-FG484 - 86K Cell 1.2V Flash FPGA | Microchip
The Microchip Technology M2GL090T-FG484 is an IGLOO2 flash FPGA with 86,316 logic cells, 267 I/O, and a nominal 1.2 V core supply in a 484-pin FBGA package. It combines reprogrammable nonvolatile configuration storage with an embedded programmable-logic fabric for general-purpose control, interface, bridging, conversion, video and image processing, and secure connectivity functions. The M2GL090 device combines 86,316 logic cells with 267 available I/O to support integration of multiple fixed-function blocks into a single FPGA implementation. Its 484-pin FBGA package provides a high pin count for parallel interfaces and external memory connections. The 1.2 V supply is the nominal core operating voltage identified in the manufacturer product data; detailed voltage limits, timing grades, and current budgets must be confirmed in the device documentation. Unlike mask-programmable logic or SRAM-only FPGAs, the IGLOO2 family stores its configuration in flash, allowing the device to retain its programmed logic after power is removed. An FPGA is a user-programmable semiconductor whose digital logic blocks, routing resources, and I/O cells are configured to implement custom hardware functions. Within the broader semiconductor hierarchy, an FPGA is a programmable-logic device, while the IGLOO2 belongs to the low-density flash-FPGA segment of the Microchip product portfolio. It is intended for designs where parallel logic, protocol conversion, control-plane processing, or system-management functions benefit from hardware-level configurability and shorter development cycles than application-specific ASIC development. Key features include 86,316 logic cells, 267 I/O, embedded flash configuration, and a 1.2 V nominal core supply. The large I/O count makes the device suitable for parallel control interfaces, bus bridging, I/O expansion, and protocol conversion. Its nonvolatile configuration supports field updates without requiring a separate configuration SRAM, while the high-pin-count FBGA package can reduce external glue logic when many signals must leave the device. Microchip identifies the IGLOO2 family for Gigabit Ethernet or dual PCI Express control planes, bridging, I/O expansion and conversion, video and image processing, system management, and secure connectivity. The device architecture is organized around programmable logic elements, programmable interconnect, user I/O, dedicated configuration resources, and embedded flash memory. Configuration is retained in flash, so startup behavior does not depend on an external configuration loader for normal operation. Design migration within the M2GL025, M2GL050, and M2GL090 devices using the FG484 package is addressed by Microchip application note AC402, although each migration still requires checking speed grade, temperature grade, voltage, resource utilization, pin constraints, and board-level compatibility. The target suffix “T” denotes the ordering configuration shown in the verified results, while the exact commercial and temperature classifications should be checked against the ordering information. Typical applications include Gigabit Ethernet control-plane logic, dual PCI Express control-plane functions, data and protocol bridging, parallel-to-serial or serial-to-parallel conversion, industrial I/O expansion, video and image-processing pipelines, secure-connectivity hardware, and general system-management controllers. The 267-I/O device is particularly useful where many independent digital channels must terminate on one programmable component, while the embedded flash configuration allows field-programmable behavior to be updated without volatile reload through an external programmer. A key design consideration is package and migration validation. Before reusing an existing FG484 layout, engineers should review the IGLOO2 Packaging and Pin Descriptions User Guide and application note AC402, verify power rails and I/O standards, and confirm that the selected device provides every required bank and peripheral connection. Differential, high-speed, clock, configuration, and supply pins must also satisfy the manufacturer’s routing and decoupling guidance. This product record consolidates verified manufacturer and distributor information, identifies same-package family alternatives, compares ordering variants, and adds practical migration and design guidance. It separates confirmed facts from unavailable pricing, lifecycle, compliance, and detailed timing information so engineers can review the appropriate manufacturer documents before committing a design to production.
M2GL090T-FG676 - 86K LEs, 425 I/O FPGA | Microchip | Industrial
The Microchip Technology M2GL090T-FG676 is a low-density IGLOO 2 flash FPGA with 86,316 logic elements, 425 I/O, and a 1.2 V core in a 676-pin FBGA package. It combines programmable logic with embedded flash configuration memory and is intended for general-purpose bridging, I/O expansion, conversion, system management, and secure connectivity functions. The device is supplied in tray packaging under the exact manufacturer ordering code M2GL090T-FG676. An FPGA is a reconfigurable semiconductor whose logic blocks, memory resources, and I/O can be programmed after manufacture. Within the product hierarchy, the M2GL090T-FG676 is an IGLOO 2 FPGA, a low-density member of the IGLOO family, and a member of the broader FPGA and programmable-logic semiconductor category. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement multiple interface or control functions in one device while retaining field-updatable configuration through embedded flash. The verified product information identifies 86K logic elements, 86,316 total FPGA cells, 425 I/O, a 1.2 V supply classification, and a 676-pin FBGA package. The large I/O count makes the device particularly useful at the boundary between external systems and programmable logic. Its 676-ball grid also provides dense signal access, but it requires a correspondingly complex PCB footprint, careful escape routing, and assembly-level process control. Configuration data can remain local in the device's embedded flash, reducing the need for a separate configuration PROM in designs that use the non-volatile configuration feature. M2GL090 devices are positioned for bridging functions, input/output expansion and conversion, system management, and secure connectivity. Manufacturer product information for the M2GL090T family also identifies Gigabit Ethernet and dual PCI Express control-plane use cases. The distinction between M2GL090T-FG676 and related M2GL090 order codes lies primarily in the ordering-code suffix, while exact electrical, temperature, and timing limits must be confirmed against the manufacturer documentation for the specific suffix. The verified distributor records consistently identify the target as an IGLOO 2 FPGA with 425 I/O and a 676-BGA package. Typical deployments include industrial protocol bridges, parallel-to-serial interface conversion, embedded control planes, FPGA-based I/O expansion, and secure connectivity gateways. The 425-I/O device is particularly attractive when the board architecture requires many independently programmable digital interfaces but does not justify a higher-density or higher-power FPGA. Such designs benefit from deterministic programmable logic and the ability to revise configuration without replacing the device. The main design consideration is package complexity. A 676-pin FBGA requires via-in-pad or otherwise carefully implemented escape routing, fine-pitch assembly capability, adequate solder-mask and paste control, and extensive continuity and boundary-scan validation. Designers should also verify the exact pinout, bank voltage rules, configuration pins, clocking resources, and supported I/O standards against the IGLOO 2 packaging and pin-description user guide before schematic release. This page consolidates verified distributor pricing, package information, same-family drop-in candidates, comparison parameters, and practical implementation guidance. It distinguishes verified facts from parameters that require confirmation, helping engineers evaluate the M2GL090T-FG676 without confusing a package-compatible ordering-code variant with a functionally and electrically identical part.
M2GL150-FCVG484I - IGLOO2 146K LE FPGA 484-BGA | Microchip
The Microchip Technology M2GL150-FCVG484I is a 146,124-logic-element IGLOO2 low-power flash-based Field-Programmable Gate Array (FPGA) integrated circuit housed in a 484-ball Fine-pitch Ball Grid Array (FBGA, 19x19 mm) package with 248 user I/O. Built on a 1.2 V core, 65 nm flash process, the device combines up to 5,120 Kbits of embedded SRAM, 240 Math Blocks (18x18 multipliers), 4 PLLs and DLLs, and 1.2 Gbps SERDES capability, addressing low-density logic integration and high-speed serial bridging without an external MCU. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect, allowing designers to customize digital functions after fabrication. FPGAs sit in the hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. The IGLOO2 family specifically targets low-power operation with flash-based configuration cells that retain bitstream in silicon without external boot memory, simplifying board design and improving security. Key features include 512 Kbits of embedded non-volatile memory (eNVM), 64 KB embedded SRAM (eSRAM), high-performance DDR2/DDR3/LPDDR memory controller interfaces with ECC, integrated DSP through the Math Block array, and an ARM Cortex-M3 hard processor subsystem variant (M2GL150S). The I/O count of 248 supports wide parallel interfaces for video bridging, industrial control and communications aggregation. The flash-based architecture provides instant-on capability and inherent security against bitstream read-back, advantages over SRAM-based FPGAs that require external boot PROMs. From a technical depth perspective, the M2GL150 uses a 4-input LUT fabric with dedicated carry chains and distributed control logic, providing a fine-grained architecture suitable for glue logic, bus bridging and signal conditioning. The 65 nm low-power process node enables sub-microamp sleep currents and flexible power modes that suit battery-powered and industrial always-on applications. Typical applications include industrial control planes, secure communications bridges, motor control and I/O expansion, video/image processing, and low-power system management. The flash-based non-volatile configuration makes the device particularly attractive for safety-critical and secure systems requiring deterministic boot and tamper resistance. When designing, ensure the PCB layout accommodates the 484-ball FBGA 19x19 mm land pattern with controlled-impedance traces for SERDES lanes and matched-length DDR routing for memory interfaces. Heat dissipation is generally low due to flash-based operation, but core utilization above 70 percent may require thermal analysis. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.