EP20K400BC652-2V - APEX-20KC FPGA 400K Gates 652-BGA | Altera
MPN: EP20K400BC652-2V ✗ پایان تولیدEP20K400BC652-2V نمای کلی
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that allow designers to implement arbitrary digital circuits after fabrication. The APEX-20KC family specifically introduced system-on-a-programmable-chip (SOPC) integration by embedding dedicated memory and product-term logic alongside traditional look-up-table logic, occupying the hierarchy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit → semiconductor. The 652-BGA FineLine package exposes up to 488 user I/O pins for high-bandwidth system integration.
Key features of the EP20K400BC652-2V include 16,640 logic elements, 212,992 bits of embedded SRAM organized as ESBs (Embedded System Blocks), 502 maximum user I/O pins, support for LVDS, PCI, and other high-speed I/O standards, and in-system programmability via IEEE 1149.1 JTAG or passive serial configuration. The MultiCore architecture allows time-critical paths to be implemented in product-term logic while data-path operations benefit from LUT-based fabric, optimizing density and speed simultaneously.
Architecturally, the device integrates embedded array blocks (EABs) for memory and complex arithmetic functions alongside logic array blocks (LABs) for general-purpose logic, with FastTrack interconnect routing signals across all four quadrants of the die. The 0.22 µm process and 1.8V core supply provide low-power operation relative to earlier 5V PLDs while supporting modern low-voltage I/O standards required by contemporary ASICs and microprocessors.
Typical applications include high-speed telecommunications backplane interfaces, DSP co-processing pipelines, custom peripheral controllers, and network protocol acceleration. The large embedded memory and high I/O count make it well-suited for data buffering in communications equipment and for prototyping complex glue-logic designs before ASIC conversion.
Design considerations for the EP20K400BC652-2V include thermal management via the 45 mm × 45 mm BGA substrate, multi-rail decoupling for the 1.8V core and 2.5V I/O supplies, and JTAG chain integration for boundary-scan testing. Engineers should consult Altera Quartus design tools for synthesis, place-and-route, and timing closure across the -2V speed grade corner.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, with cross-references sourced from Octopart, DigiKey, and authorized Altera distributors.
جایگزین‌های drop-in برای EP20K400BC652-2V — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای EP20K400BC652-2V (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, Operating Temperature, Family, Series, Speed Grade.
EP20K400BC652-2X
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
EP20K400BC652-2N
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
EP20K400BC652-2AA
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP20K400BC652-1V
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP20K400BC652-2AA
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP20K400BC652-2V حداکثر مقادیر مجاز و مشخصات الکتریکی
| Series | APEX-20KC |
| Family | APEX 20K |
| Total System Gates | 1,052,000 (max) |
| Typical Gates | 400,000 |
| Logic Elements | 16,640 |
| Total RAM Bits | 212,992 |
| Number of Logic Cells/Elements | 16,640 |
| Number of I/O | 502 max user I/O |
| Number of Gates | 400,000 |
| Voltage - Supply (Core) | 1.71 V to 1.89 V |
| نوع نصب | Surface Mount |
| بسته‌بندی / کیس | 652-BGA (45x45 mm) |
| Supplier Device Package | 652-BGA |
| Process Technology | 0.22 µm CMOS |
| Speed Grade | -2V |
| دمای کاری | Industrial (per -2V suffix) |
| وضعیت RoHS | unknown |
راهنمای پیکربندی پین EP20K400BC652-2V 652-bga
پیکربندی پین برای EP20K400BC652-2V (پکیج 652-bga). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.
داده پین‌آوت تفصیلی موجود نیست برای EP20K400BC652-2V.
به دیتاشیت برای پیکربندی کامل پین‌ها.
کاربردهای معمول
EP20K400BC652-2V مناسب است برای 6 کاربردs: Telecommunications Backplane Interfaces, DSP Co-Processing Pipelines, Legacy ASIC Prototyping and Emulation, Industrial Control and Custom Peripheral Controllers, Network Protocol Acceleration, Test and Measurement Instrumentation.
Telecommunications Backplane Interfaces
The EP20K400BC652-2V is well-suited for telecom backplane glue logic and protocol bridging, where its 502 user I/O pins and 16,640 logic elements can implement UTOPIA, POS-PHY, or proprietary SERDES-framing interfaces between line cards and a switch fabric ASIC. The 212,992 bits of embedded SRAM provide cell/packet buffering without external memory, while the LVDS-capable I/O supports backplane signaling at hundreds of megahertz. Designers should plan for 1.8V core decoupling and LVDS reference-voltage bypassing on each BGA quadrant.
پیشنهادی
DSP Co-Processing Pipelines
The EP20K400BC652-2V's MultiCore architecture lets designers implement DSP datapaths (FIR filters, FFT butterflies, Viterbi decoders) in LUT fabric while using product-term logic for control state machines, achieving both density and timing predictability. The 0.22 µm process and -2V speed grade support 200 MHz operation per Altera documentation, sufficient for many baseband processing tasks. The 212,992-bit ESB memory accommodates coefficient tables and intermediate sample buffers, simplifying the host DSP's real-time load.
پیشنهادی
Legacy ASIC Prototyping and Emulation
The EPEX-20KC family including EP20K400BC652-2V was widely adopted as an ASIC prototyping platform because its LUT + product-term fabric and 502 I/O pins can emulate large gate-count ASICs before mask commit. Engineers map RTL to the device using Quartus II synthesis, validating system-level functionality months before silicon return. The 652-BGA footprint exposes enough pins to map wide memory buses (DDR, QDR) and high-speed parallel interfaces, making it a common choice for networking ASIC prototypes.
پیشنهادی
Industrial Control and Custom Peripheral Controllers
Industrial control systems often require custom peripheral controllers with non-standard bus interfaces, where the EP20K400BC652-2V's 16,640 logic elements and 502 I/O pins allow full implementation of proprietary protocols (custom serial links, parallel ADC/DAC interfaces, motor-control timing logic) without external glue chips. The industrial temperature rating supports factory-floor deployment, and the LVDS I/O allows reliable communication in electrically noisy environments. The embedded memory accommodates look-up tables for sensor calibration and control-loop coefficients.
پیشنهادی
Network Protocol Acceleration
The EP20K400BC652-2V can accelerate network protocol processing such as packet classification, encryption pre-processing, or QoS queue management at line rate in switches and routers. Its embedded memory (212,992 bits) stores flow tables and ACL entries, while LUT logic implements parallel match engines that operate on multiple packet headers per clock cycle. The 200 MHz core frequency combined with LVDS I/O supports gigabit-rate aggregate throughput when multiple I/O banks are aggregated, common in early-2000s edge-router architectures.
پیشنهادی
Test and Measurement Instrumentation
Test and measurement instruments such as logic analyzers, protocol exercisers, and arbitrary waveform generators benefit from the EP20K400BC652-2V's high I/O count and embedded memory, which can implement deep capture buffers and parallel stimulus generation. The LVDS capability allows direct interface to high-speed ADCs and DACs common in oscilloscope front-ends. The BGA package's 45 mm × 45 mm footprint fits standard instrument board form factors, and the industrial temperature grade supports laboratory and field-deployed instrument environments.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای EP20K400BC652-2V — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | EP20K400BC652-2X | EP20K400BC652-2N | EP20K400BC652-2 | EP20K400BC652-1V | EP20K400BC652-2AA |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 652-BGA (45x45 mm) | 652-BGA - same | 652-BGA - same | 652-BGA - same | 652-BGA - same | 652-BGA - same |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Embedded Memory (bits) | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 |
| Speed Grade | -2V | -2X | -2N | -2 | -1V (slower) | -2AA |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Max User I/O | 502 | 502 | 502 | 502 | 502 | 502 |
| Family | APEX-20KC | APEX-20KC | APEX-20KC | APEX-20KC | APEX-20KC | APEX-20KC |
تفاوت‌های کلیدی
- APEX-20KC MultiCore architecture with both LUT and product-term logic (در مقابلEP20K400BC652-2X)
- High logic density with 16,640 LEs and 502 user I/O (در مقابلEP20K200EBC652-2X)
- 212,992 bits embedded memory for buffer-free packet processing (در مقابلEP20K400BC652-1V)
یادداشت‌های طراحی
The EP20K400BC652-2V requires a tightly regulated 1.71 V to 1.89 V VCCINT core supply and separate VCCIO rails for 2.5 V I/O standards including LVDS. Decoupling strategy: place 0.1 µF X7R ceramic capacitors adjacent to every fourth power/ground ball pair across the 652-BGA footprint, plus 10 µF tantalum bulk capacitors at each board edge. Estimate: at 200 MHz and high toggle rate, ICCINT may reach 500 mA to 1 A, so the core regulator must deliver at least 2 A with adequate thermal margin.
The 45 mm × 45 mm 652-BGA package dissipates significant heat when operated at full speed across all 502 I/O. The exposed die-attach paddle (if present on the specific BGA variant) should be soldered to a central thermal pad connected to an inner PCB copper plane through a 4×4 or denser thermal via array. Estimate: with θJA around 10 C/W for a properly designed 8-layer board, 3 W of dissipation yields only 30 C rise above ambient, but inadequate via density can push θJA above 20 C/W and risk junction-temperature derating.
The 652-BGA FineLine package requires a multi-layer PCB (8+ layers recommended) with controlled-impedance routing for LVDS pairs. Use 50 Ω single-ended and 100 Ω differential trace geometry, matched within 5 mils on each LVDS pair. The configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]) must be pulled to known logic levels with 10 kΩ resistors and accessible to the JTAG header. Series damping resistors (33 Ω) on each LVDS output reduce overshoot on long backplane traces.
Common pitfalls: (1) using the EP20K400BC652-2V with current Quartus Prime (the device is only supported through Quartus II v9.0 sp2 - newer toolchains will not synthesize for it); (2) assuming all -2 speed-grade suffixes are identical (Altera's -2V, -2X, -2N, -2AA suffixes encode different speed/temperature bins per the family datasheet, not just marketing codes); (3) missing the I/O bank VCCIO requirements - each of the multiple I/O banks may need its own supply voltage depending on the standard assigned; (4) neglecting configuration mode pin (MSEL) strapping which selects JTAG vs passive-serial vs EPC device loading.
اطلاعات انطباق
Compliance status not explicitly stated in verified distributor data; APEX-20KC family predates widespread RoHS adoption. AEC-Q100 not applicable to FPGAs in this configuration.