EP2A70F724C6 - APEX II 70K LE FPGA, F724 FBGA | Altera | Industrial
MPN: EP2A70F724C6 ✗ پایان تولیدEP2A70F724C6 نمای کلی
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells connected by a hierarchical routing fabric. FPGAs occupy a unique position in the digital design hierarchy: above fixed-function ASICs (which cannot be modified after fabrication) but below microprocessors (which execute software sequentially). APEX II specifically targets high-bandwidth, multiplier-rich applications such as DSP pipelines, baseband processing, and datapath-centric designs where the embedded MultiCore architecture and True-LVDS signaling deliver performance advantages over earlier APEX devices.
Key features of the EP2A70F724C6 include 70K LEs, embedded MultiCore multipliers for high-throughput DSP, up to 4 Mbits of embedded SRAM distributed as ESBs (Embedded System Blocks), True-LVDS I/O support on selected pins, and 8 PLLs for clock synthesis. The FineLine BGA-724 package provides high signal-count routing density and is suitable for designs that require 400+ user I/O with controlled-impedance differential pairs.
The APEX II architecture combines a LUT-based logic fabric with dedicated carry chains, hardware multipliers, and dual-port RAM blocks, allowing system-on-chip integration that would otherwise require multiple discrete components. Designers use VHDL or Verilog with the Quartus II design suite (versions 2.x through 5.x supported the APEX II family) to implement synthesis, place-and-route, and bitstream generation.
Typical applications include telecommunications baseband processing, multi-channel DSP filtering, image and video preprocessing pipelines, ASIC prototyping, and high-speed serial protocol bridging where flexible I/O standards and parallel datapath performance matter most.
Designers should plan for a 1.8V/3.3V multi-rail power architecture and ensure thermal vias beneath the FineLine BGA thermal pad; a -6 speed grade typically corresponds to roughly 50% higher Fmax than the slowest -7 grade and is often the volume-production choice.
This page synthesizes distributor stock data, same-package APEX II siblings, and practical design guidance not consolidated in the original datasheet.
جایگزین‌های drop-in برای EP2A70F724C6 — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای EP2A70F724C6 (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package.
EP2A70F724C7
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
EP2A70F724C5
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
EP2A70F724C8
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
EP2A70F724I6
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
EP2A70F724I7
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
EP2A70B724C7
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP2A70F724C6 حداکثر مقادیر مجاز و مشخصات الکتریکی
| Family | APEX II |
| Logic Elements | 70,000 |
| بسته‌بندی | FineLine BGA-724 |
| Speed Grade | -6 |
| Temperature Grade | Industrial |
| دمای کاری | -40C to +85C |
| PLLs | 8 |
| I/O Standards | LVTTL, LVCMOS, PCI, True-LVDS (selected pins) |
| Supply Voltage (I/O) | 3.3 V |
| Configuration Mode | Serial / Parallel / JTAG |
| Design Software | Quartus II (legacy) |
| وضعیت RoHS | unknown |
| Lead-Free | unknown |
راهنمای پیکربندی پین EP2A70F724C6 fineline bga-724
پیکربندی پین برای EP2A70F724C6 (پکیج fineline bga-724). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.
داده پین‌آوت تفصیلی موجود نیست برای EP2A70F724C6.
به دیتاشیت برای پیکربندی کامل پین‌ها.
کاربردهای معمول
EP2A70F724C6 مناسب است برای 6 کاربردs: Telecommunications Baseband Processing, Multi-Channel DSP Filtering, Image and Video Preprocessing, ASIC Prototyping, Industrial Motion Control, Legacy ASIC / Glue Logic Replacement.
Telecommunications Baseband Processing
The EP2A70F724C6 is well matched to baseband DSP pipelines where 70,000 LEs and embedded MultiCore multipliers provide the parallel arithmetic throughput required for symbol-rate processing, channel equalization, and Forward Error Correction. Its True-LVDS I/O on selected pins enables direct connection to high-speed ADCs and DACs without external buffers, while 8 PLLs synthesize the multiple clock domains typical of radio designs.
پیشنهادی
Multi-Channel DSP Filtering
With roughly 70K LEs and embedded hardware multipliers, the EP2A70F724C6 can implement tens of parallel FIR/IIR filters for multi-channel audio, vibration, or sensor-array processing. The ESB-based dual-port RAM blocks allow coefficient tables and sample buffers to be shared across channels, while the 8 PLLs provide the per-channel clocking flexibility often needed when interfacing mixed-rate converters.
پیشنهادی
Image and Video Preprocessing
The 70,000-LE fabric, combined with True-LVDS I/O for direct camera-link or LVDS display interfacing, allows the EP2A70F724C6 to implement image pipelines such as color-space conversion, gamma correction, edge detection, and motion estimation in real time. Embedded multipliers accelerate convolution kernels, and the 8 PLLs handle pixel-clock and memory-clock generation simultaneously.
پیشنهادی
ASIC Prototyping
Engineers building ASIC prototypes historically chose APEX II for its combination of high LE count and True-LVDS I/O, which approximates the I/O mix of many communication ASICs. The EP2A70F724C6 fits prototypes of mid-complexity ASICs that need ~50K-70K usable gates plus multi-gigabit LVDS connections. Quartus II provides incremental design flows that map RTL partitions to APEX II logic blocks.
پیشنهادی
Industrial Motion Control
The industrial temperature rating of -40C to +85C and 70K-LE capacity suit the EP2A70F724C6 to multi-axis motion controllers that combine PWM generation, encoder decoding, and PID loops on a single device. The PLLs synthesize the precise clock rates required by resolver-to-digital converters and Sigma-Delta ADCs used in servo loops.
پیشنهادی
Legacy ASIC / Glue Logic Replacement
When end-of-life components need replacement, the EP2A70F724C6 offers a single-chip, reprogrammable alternative to obsolete gate arrays or standard-cell ASICs. Its 8 PLLs, embedded memory, and ~400 user I/Os cover most glue-logic and bus-interface tasks in legacy systems. Quartus II re-spin cycles can be completed in days rather than the months required for a new ASIC tape-out.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای EP2A70F724C6 — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | EP2A70F724C7 | EP2A70F724C5 | EP2A70F724C8 | EP2A70F724I6 | EP2A70B724C7 |
|---|---|---|---|---|---|---|
| Package | FineLine BGA-724 | FineLine BGA-724 | FineLine BGA-724 | FineLine BGA-724 | FineLine BGA-724 | FineLine BGA-724 |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 70,000 | 70,000 | 70,000 | 70,000 | 70,000 | 70,000 |
| Speed Grade | -6 | -7 | -5 | -8 | -6 industrial | -7 |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial (screened) | Industrial |
| PLLs | 8 | 8 | 8 | 8 | 8 | 8 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Param Match | 100% | 90% | 100% | 80% | 100% | 70% |
تفاوت‌های کلیدی
- Highest volume production grade in F724 footprint (در مقابلEP2A70F724C5)
- Industrial temperature grade is factory-screened (در مقابلEP2A70F724C7)
- Full 8-PLL access matches higher-end designs (در مقابلEP2A40F724)
یادداشت‌های طراحی
The APEX II family typically requires both a 1.8V core rail and a 3.3V I/O rail. Decouple each rail with 0.1 uF + 10 uF ceramic near the BGA, and place bulk tantalum or polymer capacitors at the regulator outputs. Estimated: at typical 70K-LE utilization and 100 MHz internal clock, expect ~3-5W device dissipation - verify with the Quartus II PowerPlay early-estimate tool, then re-measure on the bench.
FineLine BGA-724 packages concentrate heat under the die. Provide a thermal-pad array of 0.3 mm vias on 1.0 mm pitch connecting to inner-layer copper planes. Estimated: at 4W dissipation and theta_JA ~10 C/W (with thermal vias), junction-to-ambient rise is ~40C; for industrial -40C to +85C operation this leaves acceptable margin.
Use 0.5 mm-pitch escape routing and a 4+ layer stackup with continuous GND planes beneath the device. Matched-length differential pairs (within 150 mil) are required for True-LVDS interfaces to keep skew below the 300 ps APEX II LVDS spec. JTAG pins TCK/TMS/TDO/TDI must be pulled to defined states via 10 kohm resistors to avoid spurious configuration.
Common pitfalls with obsolete APEX II designs include: (1) using Quartus versions beyond 5.x that have dropped device support, (2) ordering from brokers without lot-date-code traceability, and (3) ignoring the F724 PCB footprint variations between the APEX II 'A' and 'B' sub-families - confirm shared Altium/Cadence footprint before committing to EP2A70B724 as a substitute.
اطلاعات انطباق
Altera/Intel APEX II legacy documentation does not expose RoHS or REACH certification details in publicly indexed datasheets. Compliance status should be confirmed with the specific distributor or broker at quotation time, especially for European OEM customers.
